20.1%‐efficient crystalline silicon solar cell with amorphous silicon rear‐surface passivation

We have developed a crystalline silicon solar cell with amorphous silicon (a‐Si:H) rear‐surface passivation based on a simple process. The a‐Si:H layer is deposited at 225°C by plasma‐enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a‐Si:H‐passivated rear. The base contacts are formed by COSIMA (contact formation to a‐Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a‐Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5 ±0.2 mΩ cm² on low‐resistivity (0.5 Ω cm) p‐type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20.1% under one‐sun standard testing conditions for a 4 cm² large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation. Copyright © 2005 John Wiley & Sons, Ltd.     

Optimizing annealing steps for crystalline silicon solar cells with screen printed front side metallization and an oxide‐passivated rear surface with local contacts

Silicon solar cells that feature screen printed front contacts and a passivated rear surface with local contacts allow higher efficiencies compared to present industrial solar cells that exhibit a full area rear side metallization. If thermal oxidation is used for the rear surface passivation, the final annealing step in the processing sequence is crucial. On the one hand, this post‐metallization annealing (PMA) step is required for decreasing the surface recombination velocity (SRV) at the aluminum‐coated oxide‐passivated rear surface. On the other hand, PMA can negatively affect the screen printed front side metallization leading to a lower fill factor. This work separately analyzes the impact of PMA on both, the screen printed front metallization and the oxide‐passivated rear surface. Measuring dark and illuminated IV‐curves of standard industrial aluminum back surface field (Al‐BSF) silicon solar cells reveals the impact of PMA on the front metallization, while measuring the effective minority carrier lifetime of symmetric lifetime samples provides information about the rear side SRV. One‐dimensional simulations are used for predicting the cell performance according to the contributions from both, the front metallization and the rear oxide‐passivation for different PMA temperatures and durations. The simulation also includes recombination at the local rear contacts. An optimized PMA process is presented according to the simulations and is experimentally verified. The optimized process is applied to silicon solar cells with a screen printed front side metallization and an oxide‐passivated rear surface. Efficiencies up to 18.1% are achieved on 148.8 cm² Czochralski (Cz) silicon wafers. Copyright © 2009 John Wiley & Sons, Ltd.     

Surface passivation of high‐efficiency silicon solar cells by atomic‐layer‐deposited Al2O3

Atomic‐layer‐deposited aluminium oxide (Al₂O₃) is applied as rear‐surface‐passivating dielectric layer to passivated emitter and rear cell (PERC)‐type crystalline silicon (c‐Si) solar cells. The excellent passivation of low‐resistivity p‐type silicon by the negative‐charge‐dielectric Al₂O₃ is confirmed on the device level by an independently confirmed energy conversion efficiency of 20·6%. The best results are obtained for a stack consisting of a 30 nm Al₂O₃ film covered by a 200 nm plasma‐enhanced‐chemical‐vapour‐deposited silicon oxide (SiO_x) layer, resulting in a rear surface recombination velocity (SRV) of 70 cm/s. Comparable results are obtained for a 130 nm single‐layer of Al₂O₃, resulting in a rear SRV of 90 cm/s. Copyright © 2008 John Wiley & Sons, Ltd.     

Silica nanospheres as back surface reflectors for crystalline silicon thin‐film solar cells

In this paper, fabrication of a non‐continuous silicon dioxide layer from a silica nanosphere solution followed by the deposition of an aluminium film is shown to be a low‐cost, low‐thermal‐budget method of forming a high‐quality back surface reflector (BSR) on crystalline silicon (c‐Si) thin‐film solar cells. The silica nanosphere layer has randomly spaced openings which can be used for metal‐silicon contact areas. Using glass/SiN/p⁺nn⁺ c‐Si thin‐film solar cells on glass as test vehicle, the internal quantum efficiency (IQE) at long wavelengths (>900 nm) is experimentally demonstrated to more than double by the implementation of this BSR, compared to the baseline case of a full‐area Al film as BSR. The improved optical performance of the silica nanosphere/aluminium BSR is due to reduced parasitic absorption in the Al film. Copyright © 2007 John Wiley & Sons, Ltd.     

Ultra‐low concentration Na2CO3/NaHCO3 solution for texturization of crystalline silicon solar cells

In this work, a novel diluted carbonate/bicarbonate solution was applied for texturization of monocrystalline silicon for solar cells. The content of reactants in the solution was decreased 20 times with respect to the previously optimum found by our group and 12 times with respect to the lowest values reported in the literature as optimum. The use of this low‐cost and nonhazardous solution, free of additives as isopropyl alcohol, can reduce costs in solar cell processing. Copyright © 2011 John Wiley & Sons, Ltd.     

High‐quality surface passivation of silicon solar cells in an industrial‐type inline plasma silicon nitride deposition system

We have studied the surface passivation of silicon by deposition of silicon nitride (SiN) in an industrial‐type inline plasma‐enhanced chemical vapor deposition (PECVD) reactor designed for the continuous coating of silicon solar cells with high throughput. An optimization study for the passivation of low‐resistivity p‐type silicon has been performed exploring the dependence of the film quality on key deposition parameters of the system. With the optimized films, excellent passivation properties have been obtained, both on undiffused p‐type silicon and on phosphorus‐diffused n⁺ emitters. Using a simple design, solar cells with conversion efficiencies above 20% have been fabricated to prove the efficacy of the inline PECVD SiN. The passivation properties of the films are on a par with those of high‐quality films prepared in small‐area laboratory PECVD reactors. Copyright © 2004 John Wiley & Sons, Ltd.     

Low‐temperature formation of local Al contacts to a‐Si:H‐passivated Si wafers

We have passivated boron‐doped, low‐resistivity crystalline silicon wafers on both sides by a layer of intrinsic, amorphous silicon (a‐Si:H). Local aluminum contacts were subsequently evaporated through a shadow mask. Annealing at 210°C in air dissolved the a‐Si:H underneath the Al layer and reduces the contact resistivity from above 1 Ω cm² to 14·9 m Ω cm². The average surface recombination velocity is 124 cm/s for the annealed samples with 6% metallization fraction. In contrast to the metallized regions, no structural change is observed in the non‐metallized regions of the annealed a‐Si:H film, which has a recombination velocity of 48 cm/s before and after annealing. Copyright © 2004 John Wiley & Sons, Ltd.     

Experimental and simulated analysis of front versus all‐back‐contact silicon heterojunction solar cells: effect of interface and doped a‐Si:H layer defects

Front silicon heterojunction and interdigitated all‐back‐contact silicon heterojunction (IBC‐SHJ) solar cells have the potential for high efficiency and low cost because of their good surface passivation, heterojunction contacts, and low temperature fabrication processes. The performance of both heterojunction device structures depends on the interface between the crystalline silicon (c‐Si) and intrinsic amorphous silicon [(i)a‐Si:H] layer, and the defects in doped a‐Si:H emitter or base contact layers. In this paper, effective minority carrier lifetimes of c‐Si using symmetric passivation structures were measured and analyzed using an extended Shockley–Read–Hall formalism to determine the input interface parameters needed for a successful 2D simulation of fabricated baseline solar cells. Subsequently, the performance of front silicon heterojunction and IBC‐SHJ devices was simulated to determine the influence of defects at the (i)a‐Si:H/c‐Si interface and in the doped a‐Si:H layers. For the baseline device parameters, the difference between the two device configurations is caused by the emitter/base contact gap recombination and the back surface geometry of IBC‐SHJ solar cell. This work provides a guide to the optimization of both types of SHJ device performance, predicting an IBC‐SHJ solar cell efficiency of 25% for realistic material parameters. Copyright © 2013 John Wiley & Sons, Ltd.     

Optimization of anti‐reflection moth‐eye structures for use in crystalline silicon solar cells

An anti‐reflection (AR) moth‐eye structure made of acrylic resin and deposited on a polyethylene terephthalate (PET) substrate was optimized in the wavelength range from 400 to 1170 nm; crystalline silicon (c‐Si) solar cells function efficiently in this wavelength range. The rigorous coupled wave analysis (RCWA) method was used for optical simulation, and the Taguchi method was used for efficient optimization. The simulation results showed that the reflectance of the optimized structure over the above‐mentioned wavelength range was less than 0.87% and that a minimal reflectance of 0.1% was observed at 400 nm. Experimental results showed that the reflectance of a fabricated moth‐eye structure was less than 1.0% in the wavelength range and that a minimal reflectance of 0.55% was observed at 700 nm. A c‐Si solar cell, which was enclosed in a polyvinyl butyral (PVB) layer of uniform thickness, was coated with the fabricated moth‐eye film, and it was observed that the moth‐eye film increased electric generation (EG) up to 15%, depending on the incident angle. Further, a daily increase in EG of up to 8.7% was estimated on a clear summer day in Japan when the moth‐eye film was used. Copyright © 2010 John Wiley & Sons, Ltd.     

Improved conversion efficiency of a‐Si:H/µc‐Si:H thin‐film solar cells by using annealed Al‐doped zinc oxide as front electrode material

In recent years, zinc oxide has been investigated as a front electrode material in hydrogenated amorphous silicon/hydrogenated microcrystalline silicon (a‐Si:H/µc‐Si:H) tandem solar cells. Such as for other transparent conducting oxide materials and applications, a proper balancing of transparency and conductivity is necessary. The latter is directly related to the density and the mobility of charge carriers. A high density of charge carriers increases conductivity but leads to a higher absorption of light in the near‐infrared part of the spectrum due to increased free‐carrier absorption. Hence, the only way to achieve high conductivity while keeping the transparency as high as possible relies on an increase of carrier mobility. The carrier density and the mobility of sputtered Al‐doped zinc oxide (ZnO:Al) can be tailored by a sequence of different annealing steps. In this work, we implemented such annealed ZnO:Al films as a front electrode in a‐Si:H/µc‐Si:H tandem solar cells and compared the results with those of reference cells grown on as‐deposited ZnO:Al. We observed an improvement of short‐circuit current density as well as open‐circuit voltage and fill factor. The gain in current density could be attributed to a reduction of both sub‐band‐gap absorption and free‐carrier absorption in the ZnO:Al. The higher open‐circuit voltage and fill factor are indicators of a better device quality of the silicon for cells grown on annealed ZnO:Al. Altogether, the annealing led to an improved initial conversion efficiency of 12.1%, which was a gain of +0.7% in absolute terms. Copyright © 2013 John Wiley & Sons, Ltd.     

Extremely low surface recombination velocities on low‐resistivity n‐type and p‐type crystalline silicon using dynamically deposited remote plasma silicon nitride films

Extremely low upper‐limit effective surface recombination velocities (S_eff.max) of 5.6 and 7.4 cm/s, respectively, are obtained on ~1.5 Ω cm n‐type and p‐type silicon wafers, using silicon nitride (SiN_x) films dynamically deposited in an industrial inline plasma‐enhanced chemical vapour deposition (PECVD) reactor. SiN_x films with optimised antireflective properties in air provide an excellent S_eff.max of 9.5 cm/s after high‐temperature (>800 °C) industrial firing. Such low S_eff.max values were previously only attainable for SiN_x films deposited statically in laboratory reactors or after optimised annealing; however, in our case, the SiN_x films were dynamically deposited onto large‐area c‐Si wafers using a fully industrial reactor and provide excellent surface passivation results both in the as‐deposited condition and after industrial‐firing, which is a widely used process in the photovoltaic industry. Contactless corona‐voltage measurements reveal that these SiN_x films contain a relatively high positive charge of (4–8) × 10¹² cm⁻² combined with a relatively low interface defect density of ~5 × 10¹¹ eV⁻¹ cm⁻². Copyright © 2012 John Wiley & Sons, Ltd.     

Performance enhancement of multicrystalline silicon solar cells and modules using double‐layered SiNx:H antireflection coatings

Silicon nitride coating deposited by the plasma‐enhanced chemical vapor deposition method is the most widely used antireflection coating for crystalline silicon solar cells. In this work, we employed double‐layered silicon nitride coating consisting of a top layer with a lower refractive index and a bottom layer (contacting the silicon wafer) with a higher refractive index for multicrystalline silicon solar cells. An optimization procedure was presented for maximizing the photovoltaic performance of the encapsulated solar cells or modules. The dependence of their photovoltaic properties on the thickness of silicon nitride coatings was carefully analyzed. Desirable thicknesses of the individual silicon nitride layers for the double‐layered coatings were calculated. In order to get statistical conclusions, we fabricated a large number of multicrystalline silicon solar cells using the standard production line for both the double‐layered and single‐layered antireflection coating types. On the cell level, the double‐layered silicon nitride antireflection coating resulted in an increase of 0.21%, absolute for the average conversion efficiency, and 1.8 mV and 0.11 mA/cm² for the average open‐circuit voltage and short‐circuit current density, respectively. On the module level, the cell to module power transfer factor was analyzed, and it was demonstrated that the double‐layered silicon nitride antireflection coating provided a consistent enhancement in the photovoltaic performance for multicrystalline silicon solar cell modules than the single‐layered silicon nitride coating. Copyright © 2015 John Wiley & Sons, Ltd.     

Bulk passivation of multicrystalline silicon solar cells induced by high‐rate‐deposited (> 1 nm/s) silicon nitride films

Silicon nitride (a‐SiN_x:H) films deposited by the expanding thermal plasma at high rate (> 1 nm/s) have been studied for application as anti‐reflection coatings for multicrystalline silicon (mc‐Si) solar cells. Internal quantum efficiency measurements have revealed that bulk passivation is achieved after a firing‐through process of the a‐SiN_x:H as deposited from NH₃/SiH₄ and N₂/SiH₄ plasmas. However, the a‐SiN_x:H films deposited from N₂/SiH₄ show a lower passivation quality than those deposited from NH₃/SiH₄. This has been attributed to a poorer thermal stability of the films deposited from the N₂/SiH₄ plasma, resulting in structural changes within the film during the firing step. Copyright © 2002 John Wiley & Sons, Ltd.     

Industrial high‐rate (∼5 nm/s) deposited silicon nitride yielding high‐quality bulk and surface passivation under optimum anti‐reflection coating conditions

High‐quality surface and bulk passivation of crystalline silicon solar cells has been obtained under optimum anti‐reflection coating properties by silicon nitride (a‐SiN_x:H) deposited at very high deposition rates of ∼5 nm/s. These a‐SiN_x:H films were deposited using the expanding thermal plasma (ETP) technology under regular processing conditions in an inline industrial‐type reactor with a nominal throughput of 960 solar cells/hour. The low surface recombination velocities (50–70 cm/s) were obtained on p‐type silicon substrates (8·4 Ω cm resistivity) for as‐deposited and annealed films within the broad refractive index range of 1·9–2·4, which covers the optimum bulk passivation and anti‐reflection coating performance reached at a refractive index of ∼2·1. Copyright © 2005 John Wiley & Sons, Ltd.     

Improved micromorph solar cells by means of mixed‐phase n‐doped silicon oxide layers

A good light trapping scheme is necessary to improve the performance of amorphous/microcrystalline silicon tandem cells. This is generally achieved by using a highly reflective transparent conducting oxide/metal back contact plus an intermediate reflector between the component cells. In this work, the use of doped silicon oxide as alternative n‐layer in micromorph solar cells is proposed as a means to obtain high current values using a simple Ag back contact and no extra reflector between the component cells n‐doped silicon oxide layers with a wide range of optical and electrical properties have been prepared. The influence of different deposition regimes on the material properties has been studied. The main findings are the following: (i) when carbon dioxide is added to the gas mixture, sufficiently high hydrogen dilution is necessary to widen the transition region from highly conductive microcrystalline‐like films to amorphous material characterized by low electrical conductivity; (ii) lower refractive index values are found with lower deposition pressure. Optimal n‐doped silicon oxide layers have been used in both component cells of micromorph devices, adopting a simple Ag back contact. Higher current values for both cells are obtained in comparison with the values obtained using standard n‐doped microcrystalline silicon, whereas similar values of fill factor and open circuit voltage are measured. The current enhancement is particularly evident for the bottom cell, as revealed by the increased spectral response in the red/infrared region. The results prove the high potential of n‐doped silicon oxide as ideal reflector for thin‐film silicon solar cells. Copyright © 2011 John Wiley & Sons, Ltd.     

Optimal design of periodic surface texture for thin‐film a‐Si:H solar cells

Optical analysis of hydrogenated amorphous silicon (a‐Si:H) solar cells with a periodic texture applied to the interfaces was carried out by two‐dimensional optical simulator. The optical simulator solves the electromagnetic wave equations by means of finite element method using triangular elements for the discretization of space. The periodic texture with rectangular‐like shape acts as a diffraction grating which scatters light into selective angles and thus gives a potential for significant prolongation of optical paths in thin absorber layers of the cells. Optimization of the geometrical parameters (period, height and duty‐cycle) of the periodic texture was carried out in order to obtain the highest photocurrent from a‐Si:H solar cells. The a‐Si:H solar cell with the optimal periodic texture parameters (period of 300 nm, height of 300 nm and duty cycle of 50%) and the absorber layer thickness of 300 nm generates up to 35% more photocurrent in comparison to the cell with flat interfaces. The optical analysis demonstrates that the optimal periodic texture in the a‐Si:H solar cell results in the best trade‐off between the antireflection effect at front interfaces, light scattering efficiency and the absorption losses at realistic metal back contact. Copyright © 2010 John Wiley & Sons, Ltd.     

Preparation and measurement of highly efficient a‐Si:H single junction solar cells and the advantages of μc‐SiOx:H n‐layers

Reducing the optical losses and increasing the reflection while maintaining the function of doped layers at the back contact in solar cells are important issues for many photovoltaic applications. One approach is to use doped microcrystalline silicon oxide (μc‐SiO_x:H) with lower optical absorption in the spectral range of interest (300 nm to 1100 nm). To investigate the advantages, we applied the μc‐SiO_x:H n‐layers to a‐Si:H single junction solar cells. We report on the comparison between amorphous silicon (a‐Si:H) single junction solar cells with either μc‐SiO_x:H n‐layers or non‐alloyed silicon n‐layers. The origin of the improved performance of a‐Si:H single junction solar cells with the μc‐SiO_x:H n‐layer is identified by distinguishing the contributions because of the increased transparency and the reduced refractive index of the μc‐SiO_x:H material. The solar cell parameters of a‐Si:H solar cells with both types of n‐layers were compared in the initial state and after 1000 h of light soaking in a series of solar cells with various absorber layer thicknesses. The measurement procedure for the determination of the solar cell performance is described in detail, and the measurement accuracy is evaluated and discussed. For an a‐Si:H single junction solar cell with a μc‐SiO_x:H n‐layer, a stabilized efficiency of 10.3% after 1000 h light soaking is demonstrated. Copyright © 2015 John Wiley & Sons, Ltd.     

Towards thinner and low bowing silicon solar cells: form the boron and aluminum co‐doped back surface field with thinner metallization film

Using thinner wafers can largely reduce the cost of silicon solar cells. One obstacle of using thinner wafers is that few methods can provide good dopant concentration for the back surface field (BSF) and good ohmic contact while generated only in low bowing. In this paper, we have demonstrated the screening–printing B and Al (B/Al) mixture metallization film technique, making use of the screen‐printing technique and the higher solubility of B in silicon to form a B/Al‐BSF. This technique can raise the carrier concentration in the BSF by more than one order of magnitude and reduce the back surface recombination at a low firing temperature (≤800 °C). We have also shown that through the new technique, the metallization paste thickness at the rear could be reduced largely, which however did not degrade the solar cell efficiency. All these efforts are aiming for pushing forward the application of thinner wafers. Copyright © 2011 John Wiley & Sons, Ltd.     

N‐type solar‐grade silicon purified via the metallurgical route: characterisation and fabrication of solar cells

This study focuses on the characterisation and the fabrication of solar cells using n‐type multicrystalline silicon purified via the metallurgical route. Electrical and chemical analyses were performed on wafers taken from several positions along the crystallised ingot. The impact of the fabrication processing steps was investigated via effective carrier lifetime measurements. Solar cells were processed, and their efficiencies were found to be dependent on the position of the wafer along the ingot height, that is, the wafer's resistivity. A maximum conversion efficiency of 15.0% was obtained on cells from the bottom part of the ingot. In this study, the minimum resistivity value of 0.4 Ω cm resistivity is given in order to reach adequate cell efficiency. Light‐soaking experiments were then performed on the fabricated cells. No significant variations of the cell performances were observed even after 110 h at 60 °C, meaning that the fabricated cells are stable under illumination. Copyright © 2012 John Wiley & Sons, Ltd.     

Deposition of intrinsic hydrogenated amorphous silicon for thin‐film solar cells – a comparative study for layers grown statically by RF‐PECVD and dynamically by VHF‐PECVD

Hydrogenated amorphous silicon (a‐Si:H) is conventionally deposited using static plasma‐enhanced chemical vapor deposition (PECVD) processes. In this work, a very high frequency (VHF) dynamic deposition technique is presented, on the basis of linear plasma sources. This configuration deploys a simple reactor design and enables continuous deposition processes, leading to a high throughput. Hence, this technique may facilitate the use of flexible substrates. As a result, the production costs of thin‐film silicon solar cells could be reduced significantly. We found a suitable regime for the homogeneous deposition of a‐Si:H layers for growth rates from 0.35–1.1 nm/s. The single layer properties as well as the performance of corresponding a‐Si:H solar cells are investigated and compared with a state‐of‐the‐art radio frequency (RF) PECVD regime. By analyzing the Fourier transform infrared spectroscopy spectra of single layers, we found an increasing hydrogen concentration with deposition rate for both techniques, which is in agreement with earlier findings. At a given growth rate, the hydrogen concentration was at the same level for intrinsic layers deposited by RF‐PECVD and VHF‐PECVD. The initial efficiency of the corresponding p–i–n solar cells ranged from 9.6% at a deposition rate of 0.2 nm/s (RF regime) to 8.9% at 1.1 nm/s (VHF regime). After degradation, the solar cell efficiency stabilized between 7.8% and 5.9%, respectively. The solar cells incorporating intrinsic layers grown dynamically using the linear plasma sources and very high frequencies showed a higher stabilized efficiency and lower degradation loss than solar cells with intrinsic layers grown statically by RF‐PECVD at the same deposition rate. Copyright © 2012 John Wiley & Sons, Ltd.