Electrodeposition of <Emphasis Type="Italic">p</Emphasis>-Type Sb<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te<Subscript><Emphasis Type="Italic">y</Emphasis></Subscript> Thermoelectric Films

Thermoelectric Sb _x Te _y films were potentiostatically electrodeposited in aqueous nitric acid electrolyte solutions containing different concentrations of TeO₂. Stoichiometric Sb _x Te _y films were obtained by applying a voltage of −0.15 V versus saturated calomel electrode (SCE) using a solution consisting of 2.4 mM TeO₂, 0.8 mM Sb₂O₃, 33 mM tartaric acid, and 1 M HNO₃. The nearly stoichiometric Sb₂Te₃ films had a rhombohedral structure, R[`3]m R\bar{3}m , with a preferred orientation along the (015) direction. The films had hole concentration of 5.8 × 10¹⁸/cm³ and exhibited mobility of 54.8 cm²/Vs. A more negative potential resulted in higher Sb content in the deposited Sb _x Te _y films. Furthermore, it was observed that the hole concentration and mobility decreased with increasingly negative deposition potential, and eventually showed insulating properties, possibly due to increased defect formation. The absolute value of the Seebeck coefficient of the as-deposited Sb₂Te₃ thin film at room temperature was 118 μV/K.     

Tailoring Interfacial Charge Transfer for Optimizing Thermoelectric Performances of MnTe-Sb2Te3 Superlattice-Like Films

Interfacial charge transfer has a vital role in tailoring the thermoelectric performance of superlattices (SLs), which, however, is rarely clarified by experiments. Herein, based on epitaxially grown p-type (MnTe)_x(Sb₂Te₃)_y superlattice-like films, synergistically optimized thermoelectric parameters of carrier density, carrier mobility, and Seebeck coefficient are achieved by introducing interfacial charge transfer, in which effects of hole injection, modulation doping, and energy filtering are involved. Carrier transport measurements and angle-resolved photoemission spectroscopy (ARPES) characterizations reveal a strong hole injection from the MnTe layer to the Sb₂Te₃ layer in the SLs, originating from the work function difference between MnTe and Sb₂Te₃. By reducing the thickness of MnTe less than one monolayer, all electronic transport parameters are synergistically optimized in the quantum-dots (MnTe)_x(Sb₂Te₃)₁₂ superlattice-like films, leading to much improved thermoelectric power factors (PFs). The (MnTe)_0.1(Sb₂Te₃)₁₂ obtains the highest room-temperature PF of 2.50 mWm⁻¹K⁻², while the (MnTe)_0.25(Sb₂Te₃)₁₂ possesses the highest PF of 2.79 mWm⁻¹K⁻² at 381 K, remarkably superior to the values acquired in binary MnTe and Sb₂Te₃ films. This research provides valuable guidance on understanding and rationally tailoring the interfacial charge transfer of thermoelectric SLs to further enhance thermoelectric performances.     

Thickness-dependent optoelectronic properties of CuCr0.93Mg0.07O2 thin films deposited by reactive magnetron sputtering

CuCr_0.93Mg_0.07O₂ thin films were successfully deposited by DC reactive magnetron sputtering at 1123 K from metallic targets. The influence of film thickness on the structural and optoelectronic properties of the films was investigated. X-ray diffraction (XRD) results revealed that all the films had a delafossite structure with no other phases. The optical and electrical properties were investigated by UV–VIS spectrophotometer and Hall measurement, respectively. It was found that the optoelectronic properties exhibited a thickness-dependent behavior. The optical band gap and the average transmittance of the films showed a monotonous decrease with respect to the increase in thickness. The average transmittance in the visible region decreased from 67% to 47% as the thickness increased from ~70 nm to ~280 nm. Simultaneously, the conductivity of the films fell from 1.40 S∙cm⁻¹ to 0.27 S∙cm⁻¹. According to Haacke's figure of merit (FOM), a film with a maximum FOM value of about 1.72×10⁻⁷ Ω⁻¹ can be achieved when the thickness is about 70 nm (σ≈ 1.40 S·cm⁻¹ and T_av. ≈67%).     

Characteristics of chalcogenide nonvolatile memory nano-cell-element based on Sb2Te3 material

Phase-change nonvolatile memory cell elements composed of Sb₂Te₃ chalcogenide have been fabricated by using the focused ion beam method. The contact size between the Sb₂Te₃ phase change film and electrode film in the cell element is 2826 nm² (diameter: 60 nm). The thickness of the Sb₂Te₃ chalcogenide film is 40 nm. The threshold switching current of about 0.1 mA was obtained. A RESET pulse width as short as 5 ns and the SET pulse width as short as 22 ns for Sb₂Te₃ chalcogenide can be obtained. At least 1000 cycle times with a RESET/SET resistance ratio >30 times is achieved for Sb₂Te₃ chalcogenide C-RAM cell element.     

Improvement of Thermoelectric Power Factor of Hydrothermally Prepared Bi<Subscript>0.5</Subscript>Sb<Subscript>1.5</Subscript>Te<Subscript>3</Subscript> Compared with its Solvothermally Prepared Counterpart

We report on the successful hydrothermal synthesis of Bi_0.5Sb_1.5Te₃, using water as the solvent. The products of the hydrothermally prepared Bi_0.5 Sb_1.5Te₃ were hexagonal platelets with edges of 200–1500 nm and thicknesses of 30–50 nm. Both the Seebeck coefficient and electrical conductivity of the hydrothermally prepared Bi_0.5Sb_1.5Te₃ were larger than those of the solvothermally prepared counterpart. Hall measurements of Bi_0.5Sb_1.5Te₃ at room temperature indicated that the charge carrier was p-type, with a carrier concentration of 9.47 × 10¹⁸ cm⁻³ and 1.42 × 10¹⁹ cm⁻³ for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively. The thermoelectric power factor at 290 K was 10.4 μW/cm K² and 2.9 μW/cm K² for the hydrothermally prepared Bi_0.5Sb_1.5Te₃ and solvothermally prepared sample, respectively.     

Electrodeposition of Bi<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Sb<Subscript>2−<Emphasis Type="Italic">x</Emphasis></Subscript>Te<Subscript><Emphasis Type="Italic">y</Emphasis></Subscript> Thermoelectric Films from DMSO Solution

The electrochemical behavior of nonaqueous dimethyl sulfoxide solutions of Bi^III, Te^IV, and Sb^III was investigated using cyclic voltammetry. On this basis, Bi _x Sb_2−x Te _y thermoelectric films were prepared by the potentiodynamic electrodeposition technique in nonaqueous dimethyl sulfoxide solution, and the composition, structure, morphology, and thermoelectric properties of the films were analyzed. Bi _x Sb_2−x Te _y thermoelectric films prepared under different potential ranges all possessed a smooth morphology. After annealing treatment at 200°C under N₂ protection for 4 h, all deposited films showed p-type semiconductor properties, and their resistances all decreased to 0.04 Ω to 0.05 Ω. The Bi_0.49Sb_1.53Te_2.98 thermoelectric film, which most closely approaches the stoichiometry of Bi_0.5Sb_1.5Te₃, possessed the highest Seebeck coefficient (85 μV/K) and can be obtained under potentials of −200 mV to −400 mV.     

Fabrication of Microstructured thermoelectric Bi2Te3 thin films by seed layer assisted electrodeposition

In this work, bismuth telluride (Bi₂Te₃) thin films have been fabricated on Bi₂Te₃/ITO substrates by constant potential electrochemical deposition at room temperature. Bi₂Te₃ seed layers with different thicknesses (2 nm, 4 nm and 6 nm) were deposited onto ITO substrates using molecular beam epitaxy (MBE) method. The SEM images show that the morphology of Bi₂Te₃ thin films can be controlled not only by the deposition potential, but also the thickness of seed layer. Moreover, the morphologies of Bi₂Te₃ thin films with different thickness of seed layers tend to be similar and contain two-layer structure along the vertical direction after prolonged deposition time. Due to the two layers structure, Bi₂Te₃ thin films have shown different electrical conductivity performances. At room temperature, Bi₂Te₃ thin films with 4 nm-thick seed layer possess the maximum electrical conductivity value of 617.9 s cm^-1.     

Synthesis of samarium telluride thin films by successive ionic layer adsorption and reaction (SILAR) method for supercapacitor application

The present paper deals with synthesis of samarium telluride (Sm₂Te₃) thin films using simple and low cost successive ionic layer adsorption and reaction (SILAR) method for supercapacitor application. The Sm₂Te₃ thin films are characterized by X-ray diffraction (XRD) for structural determination, energy dispersive analysis of X-ray (EDAX) for elemental composition, field emission scanning electron microscopy (FE-SEM) for surface morphological study and contact angle measurement for wettability study. The Sm₂Te₃ exhibits orthorhombic crystal structure with cloud like surface morphology. The film surface showed lyophilic behavior with contact angle of 5.7° for propylene carbonate (PC). Further, electrochemical measurements are carried out in LiClO₄–PC electrolyte using cyclic voltammetry (CV), galvanostatic charge discharge and electrochemical impedance spectroscopy (EIS) techniques. The Sm₂Te₃ film showed maximum specific capacitance and energy density of 144 F g⁻¹ and 10 W h kg⁻¹ respectively. The EIS study showed negligible change in resistive parameters after 1000 electrochemical cycles.     

Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering

Antimony and tellurium were deposited on BK7 glass using direct-current magnetron and radiofrequency magnetron cosputtering. Antimony telluride thermoelectric thin films were synthesized with a heated substrate. The effects of substrate temperature on the structure, surface morphology, and thermoelectric properties of the thin films were investigated. X-ray diffraction patterns revealed that the thin films were well crystallized. c-Axis preferred orientation was observed in thin films deposited above 250°C. Scanning electron microscopy images showed hexagonal crystallites and crystal grains of around 500 nm in thin film fabricated at 250°C. Energy-dispersive spectroscopy indicated that a temperature of 250°C resulted in stoichiometric Sb₂Te₃. Sb₂Te₃ thin film deposited at room temperature exhibited the maximum Seebeck coefficient of 190 μV/K and the lowest power factor (PF), S ² σ, of 8.75 × 10⁻⁵ W/mK². When the substrate temperature was 250°C, the PF increased to its highest value of 3.26 × 10⁻³ W/mK². The electrical conductivity and Seebeck coefficient of the thin film were 2.66 × 10⁵ S/m and 113 μV/K, respectively.     

Deposition of thin Bi2Te3 and Sb2Te3 films by pulsed laser ablation

Bi₂Te₃ and Sb₂Te₃ films were obtained by pulsed laser ablation. The films were deposited in vacuum (1 × 10⁻⁵ Torr) on single crystal substrates of Al₂O₃ (0001), BaF₂ (111), and fresh cleavages of KCl or NaCl (001) heated to 453–523 K. The films were 10–1500 nm thick. The structures of the bulk material of targets and films were studied by X-ray diffractometry and transmission high-energy electron diffraction, respectively. Electrical properties of the films were measured in the temperature range of 77–300 K. It is shown that the films possess semiconductor properties. Several activation portions are observed in the temperature dependences of resistivity; the energies of activation portions depend on the film thickness and crystallite size.     

Enhanced Thermoelectric Properties of Antimony Telluride Thin Films with Preferred Orientation Prepared by Sputtering a Fan-Shaped Binary Composite Target

p-Type antimony telluride (Sb₂Te₃) thermoelectric thin films were deposited on BK7 glass substrates by ion beam sputter deposition using a fan-shaped binary composite target. The deposition temperature was varied from 100°C to 300°C in increments of 50°C. The influence of the deposition temperature on the microstructure, surface morphology, and thermoelectric properties of the thin films was systematically investigated. x-Ray diffraction results show that various alloy composition phases of the Sb₂Te₃ materials are grown when the deposition temperature is lower than 200°C. Preferred c-axis orientation of the Sb₂Te₃ thin film became obvious when the deposition temperature was above 200°C, and thin film with single-phase Sb₂Te₃ was obtained when the deposition temperature was 250°C. Scanning electron microscopy reveals that the average grain size of the films increases with increasing deposition temperature and that the thin film deposited at 250°C shows rhombohedral shape corresponding to the original Sb₂Te₃ structure. The room-temperature Seebeck coefficient and electrical conductivity range from 101 μV K^?1 to 161 μV K^?1 and 0.81 × 10³ S cm^?1 to 3.91 × 10³ S cm^?1, respectively, as the deposition temperature is increased from 100°C to 300°C. An optimal power factor of 6.12 × 10^?3 W m^?1 K^?2 is obtained for deposition temperature of 250°C. The thermoelectric properties of Sb₂Te₃ thin films have been found to be strongly enhanced when prepared using the fan-shaped binary composite target method with an appropriate substrate temperature.     

Flexible Carbon Dots-Intercalated MXene Film Electrode with Outstanding Volumetric Performance for Supercapacitors

2D MXenes have emerged as promising supercapacitor electrode materials due to their metallic conductivity, pseudo-capacitive mechanism, and high density. However, layer-restacking is a bottleneck that restrains their ionic kinetics and active site exposure. Herein, a carbon dots-intercalated strategy is proposed to fabricate flexible MXene film electrodes with both large ion-accessible active surfaces and high density through gelation of calcium alginate (CA) within the MXene nanosheets followed by carbonization. The formation of CA hydrogel within the MXene nanosheets accompanied by evaporative drying endow the MXene/CA film with high density. In the carbonization process, the CA-derived carbon dots can intercalate into the MXene nanosheets, increasing the interlayer spacing and promoting the electrolytic diffusion inside the MXene film. Consequently, the carbon dots-intercalated MXene films exhibit high volumetric capacitance (1244.6 F cm⁻³ at 1 A g⁻¹), superior rate capability (662.5 F cm⁻³ at 1000 A g⁻¹), and excellent cycling stability (93.5% capacitance retention after 30 000 cycles) in 3 m H₂SO₄. Additionally, an all-solid-state symmetric supercapacitor based on the carbon dots-intercalated MXene film achieves a high volumetric energy density of 27.2 Wh L⁻¹. This study provides a simple yet efficient strategy to construct high-volumetric performance MXene film electrodes for advanced supercapacitors.     

Sb2Te3 and Bi2Te3 Thin Films Grown by Room-Temperature MBE

Sb₂Te₃ and Bi₂Te₃ thin films were grown on SiO₂ and BaF₂ substrates at room temperature using molecular beam epitaxy. Metallic layers with thicknesses of 0.2?nm were alternately deposited at room temperature, and the films were subsequently annealed at 250°C for 2?h. x-Ray diffraction and energy-filtered transmission electron microscopy (TEM) combined with high-accuracy energy-dispersive x-ray spectrometry revealed stoichiometric films, grain sizes of less than 500?nm, and a texture. High-quality in-plane thermoelectric properties were obtained for Sb₂Te₃ films at room temperature, i.e., low charge carrier density (2.6?×?10¹⁹?cm^?3), large thermopower (130???V?K^?1), large charge carrier mobility (402?cm²?V^?1?s^?1), and resulting large power factor (29???W?cm^?1?K^?2). Bi₂Te₃ films also showed low charge carrier density (2.7?×?10¹⁹?cm^?3), moderate thermopower (?153???V?K^?1), but very low charge carrier mobility (80?cm²?V^?1?s^?1), yielding low power factor (8???W?cm^?1?K^?2). The low mobilities were attributed to Bi-rich grain boundary phases identified by analytical energy-filtered TEM.     

Effect of substrate temperature on structural,morphological, optical and electrical properties of MnIn2S4 thin films prepared by nebulizer spray pyrolysis technique

Manganese indium sulphide (MnIn₂S₄) thin films were deposited using an aqueous solution of MnCl₂, InCl₃ and (NH₂)₂CS in the molar ratio 1:2:4 by simple chemical spray pyrolysis technique. The thin film substrates were annealed in the temperature range between 250 and 350 °C to study their various physical properties. The structural properties as studied by X-ray diffraction showed that MnIn₂S₄ thin films have cubic spinel structure. The formation of cube and needle shaped grains was clearly observed from FE-SEM analysis. The energy dispersive spectrum (EDS) predicts the presence of Mn, In and S in the synthesized thin film. From the optical studies, it is analyzed that the maximum absorption co-efficient is in the order between 10⁴ and 10⁵ cm⁻¹ and the maximum transmittance (75%) was noted in the visible and infrared regions. It is noted that, the band gap energy decreases (from 3.20 to 2.77 eV) with an increase of substrate temperature (from 250 to 350 °C). The observations from photoluminescence studies confirm the emission of blue, green, yellow and red bands which corresponds to the wavelength range 370–680 nm. Moreover, from the electrical studies, it is observed that, as the substrate temperature increases the conductivity also increases in the range 0.29–0.41×10⁻⁴ Ω⁻¹ m⁻¹. This confirms the highly semiconducting nature of the film. The thickness of the films was also measured and the values ranged between 537 nm (250 °C) to 483 nm (350 °C). This indicates that, as the substrate temperature increases, the thickness of the film decreases. From the present study, it is reported that the MnIn₂S₄ thin films are polycrystalline in nature and can be used as a suitable ternary semiconductor material for photovoltaic applications.     

Controllable thin-film morphology and structure for 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene (C8BTBT) based organic field-effect transistors

Organic field-effect transistors (OFETs) based on organic semiconductor material 2,7-dioctyl[1]benzothieno[3,2-b] benzothiophene (C8BTBT) as the active layer were fabricated by using organic molecular beam deposition (OMBD) and solution-processed methods, in which the C8BTBT thin-film morphology could be well controlled. In OMBD method, C8BTBT thin-film morphology could be controlled by the thickness of organic semiconductor layer and the deposition rate, of which the high-quality C8BTBT thin film was obtained at a thickness of about 20 nm and at a deposition rate of 1.2 nm/min, resulting in an obvious mobility improvement from 2.8 × 10⁻³ cm² V⁻¹ s⁻¹ to 1.20 cm² V⁻¹ s⁻¹. While in the solution-processing, C8BTBT thin-film morphology and thickness are related to the spin-coating speed and the substrate position in spin coater, i.e., in-centre and off-centre position. The off-centre spin-coating with an optimized speed produced large-size domain C8BTBT thin film and accordingly resulted in a mobility of 1.47 cm² V⁻¹ s⁻¹. Furthermore, an additive polystyrene (PS) was added into C8BTBT solution could further improve the thin-film morphology with more metal-stable phase as well as improve the interface contact with the substrate SiO₂, resulting in the highest mobility up to 3.56 cm² V⁻¹ s⁻¹. The research suggested that C8BTBT-based OFETs with the mobility over 1.20 cm² V⁻¹ s⁻¹ could be fabricated by using both OMBD and solution-processed methods through the thin-film morphology and structure optimization, which shows the potential applications in high-performance flexible and printed electronics.     

Deposition of Bismuth Telluride Thick Film by Solidification under Centrifugal Pressure

Bismuth telluride alloys—Bi_0.5Sb_1.5Te₃ and Bi_1.8Sb_0.2Te_3.33Se_0.17—have been deposited on polycrystalline zirconia via solidification under centrifugal pressure. The crystal growth under centrifugal pressure was a process in which the starting powders charged in the groove patterns of the substrates were first melted and then solidified under centrifugal acceleration of 10⁴ m/s². This new process offers c-axis-oriented films with a thickness of more than 100 μm. A mirror-like surface is another characteristic feature of these films. Owing to their orientation, reasonable power factors such as 4.2 mW/m K² and 2.7 mW/m K² (in plane) were obtained for p- and n-type films, respectively.     

Crystallization properties of Sb-rich GeSbTe alloys by in-situ morphological and electrical analysis

Phase Change Memory (PCM) operation relies on the reversible transition between two stable states (amorphous and crystalline) of a chalcogenide material, mainly of composition Ge₂Sb₂Te₅ (GST). In Wall type PCM cells, cycling endurance induces a gradual change of the cell electrical parameters caused by variations in the chemical composition of the active volume. The region closer to the GST-heater contact area, becomes more Sb rich and Ge depleted. The new alloy has usually different thermal characteristics for the phase transitions that influence the electrical behavior of the cell. In this study we analyze the morphological, structural and electrical properties of two Sb-rich non-stoichiometric alloys: Ge₁₄Sb₃₅Te₅₁ and Ge₁₄Sb₄₉Te₃₇, at their amorphous and crystalline phase. Experiments have been performed in non-patterned blanket films and, to simulate the device size, in amorphous regions of 20 nm, 50 nm and 100 nm diameter respectively. The amorphous Ge₁₄Sb₃₅Te₅₁ film crystallizes in the meta-stable face centered cubic structure at 150 °C and in the rhombohedral phase at 175 °C, behavior characteristic of the Ge₁Sb₂Te₄ composition. The average grain size is of about 100 nm after an annealing at 400 °C. The Ge₁₄Sb₄₉Te₃₇ film crystallizes only in the hexagonal phase, with an average grain size of about 60 nm after annealing at 400 °C. The X-ray fluorescence analysis shows a non uniform distribution of the constituent atoms and in particular a Ge signal decrement and a Sb enrichment at grain boundaries. The in situ annealing of amorphous nano-areas (RESET state under a thermal stress) indicates a fast re-crystallization speed for Ge₁₄Sb₃₅Te₅₁, 80 pm/s at 90 °C, and a lower speed for Ge₁₄Sb₄₉Te₃₇, at 130 °C a grain growth velocity of 50 pm/s has been measured. The different behavior of the two alloys is discussed in terms of structural vacancies filling by the Sb atoms in excess and by their segregation at grain boundaries. The influence of the obtained results on the device characteristics is discussed.     

Investigations on phosphorus doped amorphous/nanocrystalline silicon films deposited by a filtered cathodic vacuum arc technique in the presence of hydrogen gas

Phosphorus doped amorphous/nanocrystalline silicon (a-Si:H/nc-Si:H) thin films have been deposited by a filtered cathodic vacuum arc (FCVA) technique in the presence of hydrogen gas at different substrate temperatures (T_s) ranging from room temperature (RT) to 350 °C. The films have been characterized by using X-ray diffraction (XRD), Raman spectroscopy, Fourier transform infrared (FTIR) spectroscopy, dark conductivity (σ_D), activation energy (ΔE), optical band gap (E_g) and secondary ion mass spectroscopy. The XRD patterns show that RT grown film is amorphous in nature but high temperature (225 and 350 °C) deposited films exhibit nanocrystalline structure with (111) and (220) crystal orientations. The crystallite size of higher temperature grown silicon film evaluated was between 13 and 25 nm. Raman spectra reveal the amorphous nature of the film deposited at RT, whereas higher temperature deposited films show crystalline nature. The crystalline volume fraction of the silicon film deposited at higher temperatures (225 and 350 °C) was estimated to be 58 and 72%. With the increase of T_s, the bonding configuration changes from mono-hydride to di-hydride as revealed by the FTIR spectra. The values of σ_D, ΔE and E_g of silicon films deposited at different T_s were found to be in the range of 5.37×10⁻⁴–1.04 Ω⁻¹ cm⁻¹, 0.05–0.45 eV and 1.42–1.83 eV, respectively. Photoconduction of 3.5% has also been observed in n-type nc-Si:H films with the response and recovery times of 9 and 12 s, respectively. A n-type nc-Si:H/p-type c-Si heterojunction diode was fabricated which showed the diode quality factor between 1.6 and 1.8.     

Properties of fluorine-doped SnO2 thin films by a green sol–gel method

Fluorine doped tin oxide (FTO) films were fabricated on a glass substrate by a green sol–gel dip-coating process. Non-toxic SnF₂ was used as fluorine source to replace toxic HF or NH₄F. Effect of SnF₂ content, 0–10 mol%, on structure, electrical resistivity, and optical transmittance of the films were investigated using X-ray diffraction, Hall effect measurements, and UV–vis spectra. Structural analysis revealed that the films are polycrystalline with a tetragonal crystal structure. Grain size varies from 43 to 21 nm with increasing fluorine concentration, which in fact critically impacts resultant electrical and optical properties. The 500 °C-annealed FTO film containing 6 mol% SnF₂ shows the lowest electrical resistivity 7.0×10⁻⁴ Ω cm, carrier concentration 1.1×10²¹ cm⁻³, Hall mobility 8.1 cm²V⁻¹ s⁻¹, optical transmittance 90.1% and optical band-gap 3.91 eV. The 6 mol% SnF₂ added film has the highest figure of merit 2.43×10⁻² Ω⁻¹ which is four times higher than that of un-doped FTO films. Because of the promising electrical and optical properties, F-doped thin films prepared by this green process are well-suited for use in all aspects of transparent conducting oxide.     

Thermal Stability of Ge<Subscript>2</Subscript>Sb<Subscript>2</Subscript>Te<Subscript>5</Subscript> in Contact with Ti and TiN

The thermal stability of a Ge₂Sb₂Te₅ chalcogenide layer in contact with titanium and titanium nitride metallic thin films has been investigated mainly using x-ray diffraction and elastic nuclear backscattering techniques. Without breaking vacuum, Ti and TiN have been deposited on Ge₂Sb₂Te₅ material using magnetron sputtering. Thermal treatments have been performed in a 10⁻⁷ mbar vacuum furnace. On annealing up to 450°C, the TiN metallic film does not interact with the chalcogenide film, but at the same time adhesion problems and instabilities in contact resistance arise. To improve the adhesion and eventually stabilize the contact resistance, an interfacial Ti layer has been considered. At 300°C, a TiTe₂ compound is formed by interacting with Te segregated from the Ge₂Sb₂Te₅ layer. At higher temperatures, the Ti layer decomposes the chalcogenide film, forming several compounds tentatively identified as GeTe, Ge₃Ti₅, Ge₅Ti₆, TiTe_2,, and Sb₂Te₃. It has been found that the properties of the Ge₂Sb₂Te₅ film can be retained by controlling the decomposition rate of the chalcogenide layer, which is achieved by providing a limited supply of Ti and/or by depositing a Te-rich Ge₂Sb₂Te₅ film.