0.18 /spl mu/m 3-6 GHz CMOS broadband LNA for UWB radio

A 3-6 GHz CMOS broadband low noise amplifier (LNA) for ultra-wideband (UWB) radio is presented. The LNA is fabricated with the 0.18 /spl mu/m 1P6M standard CMOS process. Measurement of the CMOS LNA is performed using an FR-4 PCB test fixture. From 3 to 6 GHz, the broadband LNA exhibits a noise figure of 4.7-6.7 dB, a gain of 13-16 dB, and an input/output return loss higher than 12/10 dB, respectively. The input P/sub 1 dB/ and input IP3 (IIP3) at 4.5 GHz are about -14 and -5 dBm, respectively. The DC supply is 1.8 V.     

A parallel structure for CMOS four-quadrant analog multipliers andits application to a 2-GHz RF downconversion mixer

A parallel structure for a CMOS four-quadrant analog multiplier is proposed and analyzed. By applying differential input signals to a set of combiners, the multiplication function can be implemented. Based on the proposed structure, a low-voltage high-performance CMOS four-quadrant analog multiplier is designed and fabricated by 0.8 μm N-well double-poly-double-metal CMOS technology. Experimental results have shown that, under a single 1.2 V supply voltage, the circuit has 0.89% linearity error and 1.1% total harmonic distortion under the maximum-scale input 500 mV_p-p at both multiplier inputs. The -3 dB bandwidth is 2.2 MHz and the DC current is 2.3 mA. By using the proposed multiplier as a mixer-core and connecting a newly designed output buffer, a CMOS RF downconversion mixer is designed and implemented by 0.5 μm single-poly-double-metal N-well CMOS technology. The experimental results have shown that, under 3 V supply voltage and 2 dBm LO power, the mixer has -1 dB conversion gain, 2.2 GHz input bandwidth, 180 MHz output bandwidth, and 22 dB noise figure. Under the LO frequency 1.9 GHz and the total DC current 21 mA, the third-order input intercept point is +7.5 dBm and the input 1 dB compression point is -9 dBm     

Design of a fully differential CMOS LNA for 3.1-10.6 GHz UWB communication systems

A fully differential complementary metal oxide semiconductor （CMOS） low noise amplifier （LNA） for 3.1-10.6 GHz ultra-wideband （UWB） communication systems is presented. The LNA adopts capacitive cross-coupling common-gate （CG） topology to achieve wideband input matching and low noise figure （NF）. Inductive series-peaking is used for the LNA to obtain broadband flat gain in the whole 3.1-10.6 GHz band. Designed in 0.18 um CMOS technology, the LNA achieves an NF of 3.1-4.7 dB, an Sll of less than -10 dB, an S21 of 10.3 dB with ±0.4 dB fluctuation, and an input 3rd interception point （IIP3） of -5.1 dBm, while the current consumption is only 4.8 mA from a 1.8 V power supply. The chip area of the LNA is 1×0.94 mm^2.     

3-D CMOS Circuits Based on Low-Loss Vertical Interconnects on Parylene-N

parylene-N is used as a dielectric layer to create ultra low-loss 3-D vertical interconnects and coplanar waveguide (CPW) transmission lines on a CMOS substrate. Insertion loss of 0.013 dB for a 3-D vertical interconnect through a 15-$mu$ m-thick parylene-N layer and 0.56 dB/mm for a 50- $Omega$ CPW line on the parylene-N layer (compared to 1.85 dB/mm on a standard CMOS substrate) are measured at 40 GHz. L-shaped, U-shaped, and T-junction CPW structures are also fabricated with underpasses that eliminate the discontinuities arisen from the slot-line mode and are characterized up to 40 GHz. A 3-D low-noise amplifier using these post-processed structures on a 0.13-$mu$ m CMOS technology is also presented along with the investigation of parasitic effects for accurate simulation of such a 3-D circuit. The 3-D circuit implementation reduces the attenuation per unit length of the transmission lines, while preserving the CMOS chip area (in this specific design) by approximately 25%. The 3-D amplifier measures a gain of 13 dB at 2 GHz with 3-dB bandwidth of 500 MHz, noise figure of 3.3 dB, and output 1-dB compression point of ${+}$ 4.6 dBm. Room-temperature processing, simple fabrication, low-loss performance, and compatibility with the CMOS process make this technology a suitable choice for future 3-D CMOS and BiCMOS monolithic microwave integrated circuit applications that currently suffer from high substrate loss and crosstalk.      

Millimeter-wave CMOS design

This paper describes the design and modeling of CMOS transistors, integrated passives, and circuit blocks at millimeter-wave (mm-wave) frequencies. The effects of parasitics on the high-frequency performance of 130-nm CMOS transistors are investigated, and a peak f/sub max/ of 135 GHz has been achieved with optimal device layout. The inductive quality factor (Q/sub L/) is proposed as a more representative metric for transmission lines, and for a standard CMOS back-end process, coplanar waveguide (CPW) lines are determined to possess a higher Q/sub L/ than microstrip lines. Techniques for accurate modeling of active and passive components at mm-wave frequencies are presented. The proposed methodology was used to design two wideband mm-wave CMOS amplifiers operating at 40 GHz and 60 GHz. The 40-GHz amplifier achieves a peak |S/sub 21/| = 19 dB, output P/sub 1dB/ = -0.9 dBm, IIP3 = -7.4 dBm, and consumes 24 mA from a 1.5-V supply. The 60-GHz amplifier achieves a peak |S/sub 21/| = 12 dB, output P/sub 1dB/ = +2.0 dBm, NF = 8.8 dB, and consumes 36 mA from a 1.5-V supply. The amplifiers were fabricated in a standard 130-nm 6-metal layer bulk-CMOS process, demonstrating that complex mm-wave circuits are possible in today's mainstream CMOS technologies.     

超低压CMOS混频器比较设计及特性分析

讨论并设计了基于PMOS衬底驱动技术和CMOS准浮栅技术的两种超低压CMOS混频器电路,并对混频器的特性进行了比较分析。在电源电压为O．8V,本征频率和射频频率分别是20MHz、100MHz和1GHz、2,4GHz的输入正弦信号时,衬底驱动混频器的转换增益为-17.95dB和-8．5dB,三阶输入截止点的值为33.2dB和28．4dB;在0．6V的单电源电压下,输入正弦信号分别为频率为20MHz、100MHz和1GHz、2．4GHz时,准浮栅混频器的转换增益为-14．23dB和-21．8dB,三阶输入截止点的值为35．9dB和34．6dB。仿真结果比较显示,衬底驱动混频器具有更高的转换增益,而准浮栅混频器具有更好的频域特性和低压特性。而且它们在频率较低时的性能更好。     

A fully monolithic 260-/spl mu/W, 1-GHz subthreshold low noise amplifier

A micro-power complementary metal oxide semiconductor (CMOS) low-noise amplifier (LNA) is presented based on subthreshold MOS operation in the GHz range. The LNA is fabricated in an 0.18-/spl mu/m CMOS process and has a gain of 13.6 dB at 1 GHz while drawing 260 /spl mu/A from a 1-V supply. An unrestrained bias technique, that automatically increases bias currents at high input power levels, is used to raise the input P1dB to -0.2 dBm. The LNA has a measured noise figure of 4.6 dB and an IIP3 of 7.2 dBm.     

Micromachined V-band CMOS bandpass filter with 2 dB insertion loss

A low-insertion-loss V-band CMOS bandpass filter is demonstrated. The proposed filter architecture has the following features: the low-frequency transmission-zero (vz1) and the high-frequency transmission-zero (vz2) can be tuned by the series-feedback capacitor Cs and the parallelfeedback capacitor Cp, respectively. To reduce the substrate loss, the CMOS process compatible backside inductively-coupled-plasma (ICP) deep trench technology is used to selectively remove the silicon underneath the filter. After the ICP etching, this filter achieved insertion loss (1/S21) lower than 3 dB over the frequency range 52.5?76.8 GHz. The minimum insertion loss was 2 dB at 63.5 GHz, the best results reported for a V-band CMOS bandpass filter in the literature.     

A 0.18μm CMOS GAIN-SWITCHED LNA AND MIXER WITH LARGE DYNAMIC RANGE

A 2.4GHz 0.18μm CMOS gain-switched single-end Low Noise Amplifier(LNA) and a passive mixer with no external balun for near-zero-IF(Intermediate Frequency)/RF(Radio Frequency) applications are described.The LNA,fabricated in the 0.18μm 1P6M CMOS technology,adopts a gain-switched technique to increase the linearity and enlarge the dynamic range.The mixer is an IQ-based passive topology.Measurements of the CMOS chip are performed on the FR-4 PCB and the input is matched to 50Ω.Combining LNA and mixer,the front...     

A 0.18μm CMOS gain-switched LNA and mixer with large dynamic range

A 2.4GHz 0.18μm CMOS gain-switched single-end Low Noise Amplifier （LNA） and a passive mixer with no external balun for near-zero-IF （Intermediate Frequency）/RF （Radio Frequency） applications are described. The LNA, fabricated in the 0.18μm 1P6M CMOS technology, adopts a gain-switched technique to increase the linearity and enlarge the dynamic range. The mixer is an IQ-based passive topology. Measurements of the CMOS chip are performed on the FR-4 PCB and the input is matched to 50Ω. Combining LNA and mixer, the front-end measured performances in high gain state are： -15dB of Sll, 18.5dB of voltage gain, 4.6dB of noise figure, 15dBm of IIP3, 85dBm to -10dBm dynamic range. The full circuit drains 6mA from a 1.8V supply.     

1.5-V CMOS exponential current generator

A new low-voltage CMOS exponential current generator is proposed in this work. MOS transistors in weak-inversion region and a master?Cslave technique for the temperature compensation were used. The circuit was fabricated with standard CMOS 0.35???m process using a single supply voltage of 1.5?V. Experimental results validate the theoretical analysis and verify the effectiveness of the proposed structure. A 40?dB range linearly in dB controlled output current with less than 1.5?dB linearity error was achieved. The structure features ±1 and ±3?dB deviations for ±10% supply voltage and 80°C temperature variations, respectively.     

A sub-1-dB NF±2.3-kV ESD-protected 900-MHz CMOS LNA

A sub-1-dB noise figure HBM ESD-protected [-3 kV, 2.3 kV] low noise amplifier (LNA) has been integrated in a 0.35-μm RF CMOS process with on-chip inductors. The sensitivity of the LNA performances to the spread of parasitics associated with package and bondwire has been attenuated by using an inductive on-chip source degeneration. At 920 MHz and P_dc=8.6 mW, the LNA features: noise figure NF=1 dB, input return loss=-8.5 dB, output return loss=-27 dB, power gain G _p=13 dB, input IIP3=-1.5 dBm. At a power dissipation of 5 mW and 17.6 mW, a NF respectively equal to 1.2 dB and 0.85 dB is measured. The CMOS LNA takes 12 pins of a TQFP48 package, an area of 1.0×0.66 mm² (bondwire pads excluded) and it is the first HBM ESD-protected [-3 kV, 2.3 kV] CMOS LNA to break the 1-dB NF barrier     

A 10-b, 100-MS/s CMOS A/D converter

A new architecture for a CMOS A/D converter overcomes many of the known problems in the parallel operation of multiple pipelined stages. The input signal is sampled in one channel, and after quantization to 4 b, the residue is distributed into many channels. A prototype implemented in 1-μm CMOS achieves 60 dB signal-to-noise plus distortion ratio (SNDR) at low conversion rates, with a resolution bandwidth of greater than 20 MHz. The SNDR drops by 3 dB at a 95 MHz conversion rate, and the bandwidth remains the same     

1.8GHz 0.35mm CMOS低噪声放大器的实现

介绍了一种频率为1.8GHz的低噪声放大器(LNA)的设计方案,采用TSMC 0.35μm CMOS工艺实现,增益为25dB,噪声系数2.56dB,功耗≤10mW,IIP3为-25dB或5dBm。     

Ultra-wideband CMOS low noise amplifier

A two-stage ultra-wideband CMOS low noise amplifier (LNA) is proposed. The first stage is optimised for wideband input matching and low noise figure, while the second stage is optimised to extend the -3 dB bandwidth of the overall amplifier. The combination of stages can provide lower noise figure and wider bandwidth simultaneously over that of previously reported feedback-based CMOS amplifiers. The implemented LNA shows a peak gain of 13.5 dB, more than 8.5 dB of input return loss, and a noise figure of 2.5-7.4 dB over a -3 dB bandwidth from 2 to 9 GHz with DC power consumption of 25.2 mW.     

A 270 MHz, 1 Vpk-pk, Low-Distortion Variable Gain Amplifier in a 0.35 μm CMOS Process

A fully balanced CMOS Variable Gain Amplifier (VGA) based on current-mode techniques suitable for high frequency applications and large signals is presented. The VGA consists of an analog multiplier, current gain stages, and resistive loads. A frequency compensation scheme based on a capacitive feed-forward technique increases the bandwidth by more than 60%. Common-Mode Feed-Forward (CMFF) techniques are used to minimize dc offsets. The gain can be programmed from 0 to 42 dB with ?3 dB bandwidth greater than 270 MHz; a gain calibration scheme for precise gain control applications is included. The Third Harmonic Distortion (HD3) is less than ?55 dB for differential input and output voltages of 1 V_pk-pk. The VGA was fabricated in a standard 0.35 μm CMOS process, and consumes around 54 mW from a single power supply of 2.7 V.     

Design a novel 5.8 GHz wideband low noise amplifier in CMOS technology for WLAN applications

A novel complementary metal-oxide semiconductor (CMOS) low noise amplifier (LNA) was designed in this paper for wireless local area network (WLAN) applications in the 5.8?GHz ISM band. The LNA presents low voltage and low power dissipation design integrated in TSMC 0.18?µm standard CMOS technology and achieves a gain of 15.2?dB, a noise figure of 2.5?dB and an IIP3 of ?6.5?dBm with input return loss ?38.5?dB, output return loss of ?46.1?dB while dissipating just 4.96 mW from a 1V supply voltage.     

一种新型的基于GSM1900标准的1.9GHz CMOS混频器

介绍了一种0.18μm CMOS工艺基于GSM1900(PCS1900)标准低中频接收机中的混频器.该混频器采用了一种新型的折叠式吉尔伯特单元结构.在3.3V电源电压、中频频率为100kHz的情况下,该混频器达到了6dB的转换增益,18.5dB的噪声系数(1MHz中频)和11.5dBm IIP3的高线性度,同时仅消耗7mA电流.     

Design and analysis for a miniature CMOS SPDT switch using body-floating technique to improve power performance

A low insertion-loss single-pole double-throw switch in a standard 0.18-/spl mu/m complementary metal-oxide semiconductor (CMOS) process was developed for 2.4- and 5.8-GHz wireless local area network applications. In order to increase the P/sub 1dB/, the body-floating circuit topology is implemented. A nonlinear CMOS model to predict the switch power performance is also developed. The series-shunt switch achieves a measured P/sub 1dB/ of 21.3 dBm, an insertion loss of 0.7 dB, and an isolation of 35 dB at 2.4 GHz, while at 5.8 GHz, the switch attains a measured P/sub 1dB/ of 20 dBm, an insertion loss of 1.1 dB, and an isolation of 27 dB. The effective chip size is only 0.03 mm/sup 2/. The measured data agree with the simulation results well, including the power-handling capability. To our knowledge, this study presents low insertion loss, high isolation, and good power performance with the smallest chip size among the previously reported 2.4- and 5.8-GHz CMOS switches.     

A 2.7-V 900-MHz CMOS LNA and mixer

A CMOS low-noise amplifier (LNA) and a mixer for RF front-end applications are described. A current reuse technique is described that increases amplifier transconductance for the LNA and mixer without increasing power dissipation, compared to standard topologies. At 900 MHz, the LNA minimum noise figure (NF) is 1.9 dB, input third-order intercept point (IIP3) is -3.2 dBm and forward gain is 15.6 dB. With a 1-GHz local oscillator (LO) and a 900-MHz RF input, the mixer minimum double sideband noise figure (DSB NF) is 5.8 dB, IIP3 is -4.1 dBm, and power conversion gain is 8.8 dB. The LNA and mixer, respectively, consume 20 mW and 7 mW from a 2.7 V power supply. The active areas of the LNA and mixer are 0.7 mm×0.4 mm and 0.7 mm×0.2 mm, respectively. The prototypes were fabricated in a 0.5-μm CMOS process