乳液聚合物胶粘剂分子设计中的工艺过程考虑

对乳液聚合物胶粘剂分子设计中的工艺过程,如乳化剂的选择、温度的控制、加料方式、按基化处理及交俄反应的控制等,进行了详细的讨论。并提出了能满足理想的乳液聚合物胶粘剂分子设计的工艺选择的一些依据。     

聚氨酯胶粘剂的分子设计

为了快速合理确定制备聚氨酯胶粘剂的方案．可以根据聚氨酯胶粘剂的目标性能，进行分子设计。本文从二方面考虑，即根据聚氨酯胶粘剂的本体性质和使用性质进行分子设计，以满足不同基材和使用条件的要求。     

竞聚率在乳液胶粘剂分子设计中的应用

对于单体竞聚率分四种类型对共聚乳液胶粘剂的结构与性能作了分析,提出根据不同的竞聚率的单体采用不同的分子设计方案以获得理想的乳液胶粘剂。     

有机硅偶联剂在聚合物胶粘剂中的应用

有机硅偶联剂在聚合物胶粘剂中的应用廖俊，张治民，张先亮，张彦谦（武汉大学化工厂，武汉市，４３００７２）１前言目前，以化学工业为基础的胶粘剂工业得到了迅速发展，已在国民经济中产生越来越重要的作用。随着高分子材料的应用，对胶粘剂的性能及粘接技术提出了新的...     

新型聚合物胶粘剂

蚌壳使用强力粘合剂紧紧地粘附在岩石、船壳和码头上，这种粘合剂具有抗水性，并能粘附不规则物体。在蚌类强力粘附力的启发下，美国西北大学研究人员设计出一种新型聚合物胶粘剂，它可粘附在石头、木材、塑料和钢材等任何材料上。专家称，不同于其他大多数类似功能材料的制作方法，这种胶粘剂主要优点在于更易制作，而且应用非常广泛。     

分子设计和新聚合物结构

本文简述聚合物分子设计的含义、发展和应用,表明分子设计在研制新型聚合物中具有极重要的作用。并根据分子设计原理着重介绍一些高韧性、耐热环氧树脂分子结构的特征。     

液晶聚合物分子设计研究进展

综述了液晶聚合(物LCP)分子设计的一般原则,着重介绍了主链型热致LCP、主链型溶致LCP及侧链LCP的分子结构和分子设计并,列举了国内外各类型LCP的分子设计实例。     

SU聚合物胶粘剂

1前言所谓“SU聚合物”,就是“分子结构为硅酮和聚氨酯成分的杂化结构,并且有甲硅烷基活性基团的聚氨酯聚合物”。这是一种针对含NCO基的单组分聚氨酯固化时间长、易发泡、贮存稳定性差等缺点而研发的新型聚合物,它与聚氨酯相比对环境更友好、固化速度更快。本文介绍由SU聚合物     

有机氟聚合物胶粘剂的应用

有机氟聚合物胶粘荆具有耐热性好、耐氧化性和耐化学性突出等特点.有机氟聚合物表面自由能低,并具有耐水性、耐油性和耐沾污性,使其具有特殊的应用.本文综述了有机氟聚合物胶粘剂的应用状况.     

热熔胶粘剂用接枝聚合物的合成及性能

本文介绍了在有机过氧化物存在下,合成接枝聚合物的方法,以及接枝物用作热熔胶、热熔密封胶和热熔压敏胶粘剂的基体聚合物的性能和应用。     

水乳型压敏胶的分子设计考虑

本文就压敏胶的特点、施胶工艺特点及共聚单体特性和聚合工艺等方面对水乳型压敏胶的分子设计作了较为详尽的分析，提示了水乳型压敏胶分子设计的一些依据。     

Development of a Computer Program for the Design of Adhesive Joints

Adhesive joints are increasingly being used due to their improved mechanical performance and a better understanding of the mechanics of failure. To predict the joint strength, one must have the stress distribution and a suitable failure criterion. The literature contains many closed-form solutions for the stress distribution. However, the models are sometimes difficult to implement and use. The objective of the present work was to compile existing models of increasing complexity into user friendly software. Three main situations were considered: elastic adherends and adhesive, elastic adherends with nonlinear adhesive and nonlinear analyses for both adherends and adhesive. The adherends were both isotropic (metals) and anisotropic (composites). The joints considered are the single and double lap joints for most of the models. However, a sandwich model initially proposed by Crocombe can be used for any type of joint provided the boundary conditions are known. For each model proposed the compatible failure criteria are included to enable the user not only to have the stress distribution but also the failure load for a given joint/load scenario. Experimental tests corresponding to the three cases described above were carried out to validate the models implemented.     

MALDI-TOF-MS分析技术及在聚合物表征中的应用

基质辅助激光解吸电离飞行时间质谱(MALDI-TOF-MS)作为一种高效、精确的分析方法,已经在生物、化学、生命科学等很多领域得到了广泛应用。本文着重阐述了MALDI-TOF-MS的构造、性能特征,以及在聚合物分析中的应用。     

高岭土合成无粘结剂A型分子筛的探索性研究

对高岭土进行了物性分析，并进行了以高岭土为原料合成高强度，高性能的无粘结剂Ａ型分子筛的探索性试验，同时考察了反应时间对结晶度的影响。     

分子印迹和单分散聚合物微球的研究进展

阐述了分子印迹的概念,发展历史,印迹的原理以及分子印迹在分离、催化、传感器等方面的应用。在分子印迹聚合物的传统制备方法和存在的问题中引出分散聚合。简述了传统制备聚合物微球的一些方法特点和分散聚合法的优越性。最后讨论了用分散聚合制备分子印迹聚合物微球可能存在的一些困难。     

Effect of Adhesive Thickness on Joint Strength: A Molecular Dynamics Perspective

Recent studies suggest that adhesion in thin joints depends on several factors including temperature, interface toughness, strain rate, surface roughness of adherends, bondline thickness of adhesives, and many others. Influence of thickness on joint properties is surprising but experimentally well documented without reasonable explanations. In this study, we attempt to address the mechanical behavior of polymer adhesives by molecular dynamics (MD) simulation. We show that interfacial strength of the joints in tensile, shear, or combined loading significantly depends on the coupling strength between adhesives and adherends. Failure of joints is always at the interface when coupling strength is weaker. With stronger interfaces, cohesive failure occurs by cavitation or by bulk shear depending on the loading condition. When joints are loaded in tension, it requires an exceedingly stronger interface to realize pure shear failure, otherwise failure is through interface slip. Under a mixed mode condition, interface slip is difficult to avoid. As long as failure is not at the interface alone, the yield strength of joints improves significantly with the reduction of thickness. Increase in bulk density and change in polymer configurations with the reduction of adhesive thickness are believed to be the two key factors in improving mechanical behavior of adhesives.