Plasma panel‐based radiation detectors

The plasma panel sensor (PPS) is a gaseous micropattern radiation detector under current development. It has many operational and fabrication principles common to plasma display panels. It comprises a dense matrix of small, gas plasma discharge cells within a hermetically sealed panel. As in plasma display panels, it uses nonreactive, intrinsically radiation‐hard materials such as glass substrates, refractory metal electrodes, and mostly inert gas mixtures. We are developing these devices primarily as thin, low‐mass detectors with gas gaps from a few hundred microns to a few millimeters. The PPS is a high gain, inherently digital device with the potential for fast response times, fine position resolution (<50‐µm RMS) and low cost. In this paper, we report on prototype PPS experimental results in detecting betas, protons, and cosmic muons, and we extrapolate on the PPS potential for applications including the detection of alphas, heavy ions at low‐to‐medium energy, thermal neutrons, and X‐rays.     

Thermal transfer for flat‐panel‐display manufacturing

Abstract— Photolithography is currently the predominant patterning method in the flat‐panel‐display (FPD) industry. Thermal lithography is a novel approach offering superior process control, a completely dry process, and considerable cost savings. Thermal imaging is now the dominant imaging method in computer‐to‐plate applications in the printing industry, with over 6000 installations world‐wide. Two applications, in which this technology could be applied in the FPD industry, will be discussed in detail: color filters for liquid‐crystal displays (LCDs) and barrier ribs for LCDs and organic light‐emitting‐diode (OLED) displays.     

Photoconductor‐based (direct) large‐area x‐ray imagers

Abstract— A brief overview of the present status of active‐matrix flat‐panel direct x‐ray imagers (D‐AMFPI) is given. The spatial resolutions of direct and indirect imagers are compared, and it is pointed out that the lack of light scattering greatly improves resolution. Furthermore, the resolution does not degrade as layers of the x‐ray detector materials become thicker for better x‐ray absorption at higher x‐ray energies, opposite to that of indirect imagers. Different direct x‐ray conversion materials are compared, how the physical properties influence the x‐ray detection efficiency, and imager stability are discussed. Ghosting and image‐lag properties are also weighted. A few x‐ray‐sensitive photoconductor materials produce very‐high x‐ray conversion efficiency, which could be advantageous for low‐dose fluoroscopy to overcome the noise of the readout electronics. Last, but not least, the manufacturing advantage of the direct imagers is emphasized. The direct imagers do not need p‐i‐n photodiodes, so the a‐Si TFT matrices for these arrays can be manufactured at any LCD manufacturing sites and not only at a few, very specialized companies where the p‐layers for the photodiodes can be deposited.     

Reduced dc offset and faster dynamic response in a carbon‐nanotube‐impregnated liquid‐crystal display

Abstract— Liquid crystals have been extensively employed in photonic devices, especially in current flat‐panel displays. Demands on high‐quality electro‐optical performance of liquid‐crystal displays have continued to impel delicate molecular designs, chemical syntheses, as well as advanced cell‐manufacturing processes, leading to a reduced dc offset and faster intrinsic response in the devices. Here, a novel approach toward the reduction of the residual dc and response time is reported based on carbon‐nanotube doping. It is demonstrated that a minute amount of carbon nanotubes as a dopant can suppress the unwanted ion effect, invariably lower the rotational viscosity, and modify other physical properties of the liquid crystals, giving the approach an opportunity in display applications.     

Low‐cost manufacturing of patterned films with nano‐precision for display applications

Abstract— Much attention has been given to methodologies for patterning optical films with nanoscale precision at the scale and economics required by the flat‐panel‐display industry. By using Fluorocur® mold materials, the PRINT® (Pattern Replication in Nonwetting Template) technology enables low‐cost manufacturing of precise microscale and nanoscale features with single‐nanometer precision from virtually any material.     

Large‐area FEDs with carbon‐nanotube field emitter

Abstract— Application of carbon nanotubes (CNTs) as field emitters for large‐area FED panels is described. In 1998, we presented the first experimental devices: light‐source tubes for outdoor large‐area displays and a diode‐type flat‐panel display, both with screen‐printed CNT cathodes. The fisrt practical high‐luminance color CNT‐FED panel was built in 1999. It employed the new triode‐structure panel was x‐y addressable. The CNT‐FED structure was further optimized for large‐area display panels by improving the luminous uniformity. This paper also describes the design and performance of a new, experimental, 40‐in.‐diagonal panel, which showed that the CNT‐FED technology is suitable for use in large‐area displays.     

Sensor applications of thin‐film devices originating in display technologies

Thin‐film devices are widely utilized for flat‐panel displays, and the essential advantages of the thin‐film devices are generally large‐area production, various‐material substrate, layered structure, etc. Appropriate applications are flat‐panel displays, and other applications where the abovementioned advantages are available and the disadvantages are acceptable are sensor applications. Moreover, if the sensor devices can be made by thin‐film devices that have been already utilized for flat‐panel displays, they can be made without additional cost. Therefore, thin‐film devices are again promising for sensor applications especially for interactive displays. We are investigating sensor applications of thin‐film devices. Particular in this journal paper, we review sensor applications of thin‐film devices originating in display technologies. The various sensors are visible‐light sensor, infrared‐light sensor, temperature sensor, magnetic‐field sensor, etc. Many research results from many research organizations as well as our research laboratory are introduced.     

Clamped‐inverter circuit architecture for luminescent‐period‐control driving of active‐matrix OLED displays

Abstract— An innovative pixel‐driving technology for high‐performance active‐matrix OLED flat‐panel displays is described. Called “clamped‐inverter circuit architecture,” it uses luminescent‐period‐control driving to reduce the inter‐pixel non‐uniformity caused by the device‐to‐device variability of low‐temperature poly‐Si TFTs. A prototype full‐color display shows a luminous deviation of less than 1.6%, which corresponds to only the LSB‐error in 6‐bit gray‐scale.     

High‐efficiency p‐i‐n organic light‐emitting diodes with long lifetime

Abstract— High‐performance organic light‐emitting diodes (OLEDs) are promoting future applications of solid‐state lighting and flat‐panel displays. We demonstrate here that the performance demands for OLEDs are met by the PIN (p‐doped hole‐transport layer/intrinsically conductive emission layer/n‐doped electron‐transport layer) approach. This approach enables high current efficiency, low driving voltage, as well as long OLED lifetimes. Data on very‐high‐efficiency diodes (power efficiencies exceeding 70 lm/W) incorporating a double‐emission layer, comprised of two bipolar layers doped with tris(phenylpyridine)iridium [Ir(ppy)₃], into the PIN architecture are shown. Lifetimes of more than 220,000 hours at a brightness of 150 cd/m² are reported for a red PIN diode. The PIN approach further allows the integration of highly efficient top‐emitting diodes on a wide range of substrates. This is an important factor, especially for display applications where the compatibility of PIN OLEDs with various kinds of substrates is a key advantage. The PIN concept is very compatible with different backplanes, including passive‐matrix substrates as well as active‐matrix substrates on low‐temperature polysilicon (LTPS) or, in particular, amorphous silicon (a‐Si).     

System design for a wide‐color‐gamut TV‐sized AMOLED display

Abstract— By using current technology, it is possible to design and fabricate performance‐competitive TV‐sized AMOLED displays. In this paper, the system design considerations are described that lead to the selection of the device architecture (including a stacked white OLED‐emitting unit), the backplane technology [an amorphous Si (a‐Si) backplane with compensation for TFT degradation], and module design (for long life and low cost). The resulting AMOLED displays will meet performance and lifetime requirements, and will be manufacturing cost‐competitive for TV applications. A high‐performance 14‐in. AMOLED display was fabricated by using an in‐line OLED deposition machine to demonstrate some of these approaches. The chosen OLED technologies are scalable to larger glass substrate sizes compatible with existing a‐Si backplane fabs.     

Design of carbon nanotubes for large‐area electron field‐emission cathodes

Abstract— Electron field‐emission displays offer a viable option for the next generation of flat‐panel screens. Boasting high‐quality images in terms of good color saturation, fast refresh rate, and high brightness, these displays have the potential to offer above and beyond what the current market leaders, LCD and plasma. However, for the realization of such a new display disrupting the incumbent LCD and plasma displays, not only does the image quality need to be better, but fabrication costs and suitable manufacturing processes need to be in place at reduced cost. Many viable cathode materials have been proposed in recent years, one of which being the use of carbon nanotubes (CNTs) in various forms (aligned growth, screen printing, and polymer matrix). In this review, a series of recent experiments investigating the field‐emission characteristics of carbon‐nanotube systems for possible use in the display industry is presented.     

Laser‐induced full body cleavage of flat‐panel‐display glass

Abstract— Of the two types of thermal‐stress processes for glass, i.e., surface scribing and full body cleavage, the latter is not presently applied in commercial manufacturing due to the technical difficulties, notwithstanding its various advantages. These difficulties, which were pointed out by Kondratenko and were refered to as size effect, consist of a reduced processing speed in a large glass plate and the positional inaccuracy when cleaving close to edges of a glass plate. The result of the investigation aimed to solve these problems, which can pave the way to the commercial application of full body cleavage in the manufacturing of flat‐panel‐display (FPD) devices, is reported.     

Active‐matrix technology for high‐efficiency OLED displays

Organic light‐emitting device (OLED) technology has recently been shown to demonstrate excellent performance and cost characteristics for use in numerous flat‐panel‐display (FPD) applications. Universal Display Corp. (UDC), together with its academic partners at Princeton University and the University of Southern California, are developing high‐efficiency electrophosphorescent OLEDs, based on triplet emission. These material systems show good lifetimes, and are well suited for the commercialization of low‐power‐consumption full‐color active‐matrix OLED displays. Their very high conversion efficiencies may even allow them to be driven by amorphous‐silicon backplanes, and in this paper we consider design guidelines for an amorphous‐silicon pixel to minimize display non‐uniformities due to threshold voltage variations.     

Confined‐error‐diffusion algorithm for flat‐panel display

Abstract— The reduction of a structural pattern at specific gray levels caused by digital halftone methods is the subject of this paper. This problem is more severe in some flat‐panel displays because their black levels typically are brighter than other display blocks. A patented halftone algorithm, confined error diffusion (CED), that confines the error‐carry within the dither mask is described and extended. First, the CED algorithm that dynamically applies random error diffusion or the ordered‐dither method, depending upon image content, is described in detail. Finally, we propose an advanced CED algorithm for improving the gradation characteristics of the CED algorithm. The performance of the proposed algorithms is compared to the experimental results for natural test images. In order to verify the halftone quality, a structural similarity measure for color images by taking into account the interrelation between color channels is proposed, and the results based on the proposed method, the color similarity measure method, is given.     

Vein detection with near‐infrared organic photodetectors for biometric authentication

We combine a low dark current and high‐detectivity near‐infrared (NIR)‐sensitive organic photodetector with a high‐resolution 508 pixels per inch (ppi) oxide thin‐film transistor (TFT) backplane to create a large‐area thin NIR detector, using processes that are compatible with flat‐panel display fabrication. The detector is characterized showing high uniformity and linearity. With the use of a NIR light source, the detector is capable of imaging the (pattern of) veins under the skin in reflection, leading to improved biometric authentication.     

Current manufacturing technologies for TFT‐LCDs

Abstract— TFT‐LCD panels for notebook‐PC applications requires a thin and light form factor, low power consumption, and good display quality, whereas the desktop monitor has different requirements such as large panel size, wide viewing angle, high resolution, brightness, etc. However, for the fifth‐generation of mass production, current panel technologies have to improve in order to cope with these requirements. In this article, various approaches to the manufacturing technologies of next‐generation TFT‐LCDs are discussed.     

Development of field‐emission displays

Abstract— FEDs are one of the attractive flat‐panel displays that realize high‐quality motion images and low power consumption. FEDs are constructed by using three elemental technologies: micro‐ or nano‐fabrication technology of emitters, opto‐electronic semiconductor technology of anode patterns, and vacuum packaging technology. Each of the three elemental technologies is essential to realize FEDs. The present status of each three technologies, especially the improvement of Spindt‐type field emitters, the trend of flat vacuum packages, and development of phosphors for FEDs is described in this paper.     

New technologies for advanced LCD‐TV performance

Abstract— Samsung intends to be the world leader in LCD‐TV through a combination of superior product technology, advanced process execution, and aggressive capitalization. This paper explores and updates Samsung's latest developments toward its goal of ultimate LCD‐TV performance and market leadership. Samsung's development of Super PVA (S‐PVA) represents a key performance achievement. S‐PVA is a new technology which enables screen quality advantages over S‐IPS and MVA, including high transmittance, >1000:1 contrast ratio, and wide angle of view with no off‐axis image inversion. This new technology is described in detail. This paper also addresses the other remaining performance issues facing LCD‐TV, including Samsung's plans for addressing these challenges. Until recently, inter‐gray response time and associated motion blur were significant issues for achieving quality LCD‐TV images. Samsung has invented DCC‐II technology to achieve sub‐10‐msec response time, and this achievement is described. Other technology advancements, including next‐generation color performance and ultra‐low black performance, are discussed. Samsung has announced the development of a 57‐in. full‐HD (1920 × 1080) LCD‐TV panel, the world's largest, based on S‐PVA technology. This product represents the culmination of many technical breakthroughs, and is discussed herein. Samsung's LCD manufacturing strategy, which includes the world's first generation 7 LCD fab, is also described.     

Organic‐polymer thin‐film transistors for active‐matrix flat‐panel displays?

Abstract— Organic‐polymer‐based thin‐film transistors (OP‐TFTs) look very promising for flexible, large‐area, and low‐cost organic electronics. In this paper, we describe devices based on spin‐coated organic polymer that reproducibly exhibit field‐effect mobility values around 5 × 10^?3 cm²/V‐sec. We also address fabrication, performance, and stability issues that are critical for the use of such devices in active‐matrix flat‐panel displays.     

Temporary bond—debond technology for high‐performance transistors on flexible substrates

Abstract— A processing technology based upon a temporary bond—debond approach has been developed that enables direct fabrication of high‐performance electronic devices on flexible substrates. This technique facilitates processing of flexible plastic and metal‐foil substrates through automated standard semiconductor and flat‐panel tool sets without tool modification. The key to processing with these tool sets is rigidifying the flexible substrates through temporary bonding to carriers that can be handled in a similar manner as silicon wafers or glass substrates in conventional electronics manufacturing. To demonstrate the power of this processing technology, amorphous‐silicon thin‐film‐transistor (a‐Si:H TFT) backplanes designed for electrophoretic displays (EPDs) were fabricated using a low‐temperature process (180°C) on bonded‐plastic and metal‐foil substrates. The electrical characteristics of the TFTs fabricated on flexible substrates are found to be consistent with those processed with identical conditions on rigid silicon wafers. These TFTs on plastic exhibit a field‐effect mobility of 0.77 cm²/V‐sec, on/off current ratio >10⁹ at Vds = 10 V, sub‐threshold swing of 365 mV/dec, threshold voltage of 0.49 V, and leakage current lower than 2 pA/μm gate width. After full TFT‐array fabrication on the bonded substrate and subsequent debonding, the flexible substrate retains its original flexibility; this enables bending of the EPD display without loss in performance.