共查询到20条相似文献,搜索用时 93 毫秒
1.
半导体制造技术突破了一个又一个看似不可能实现的障碍.相应地,也推动了IC测试技术的发展,同时对IC测试的的各方面也提出了新的要求.本刊就此进行了探讨. 相似文献
2.
在当今的网络时代,各种无线网络技术十分活跃,5GHz无线LAN,可保证高质量和高速度接入Internet。美国和欧洲的标准化机构,都已分别制定出IEEE802.11a和ETSI(European Telecommunication Standards Institute)HiperLan2标准;这些标准无线LAN允许在5.15~5.35GHz频段里实现高达54Mbit/s的数据传送速度,为人们随时随地可靠访问Internet提供方便。 相似文献
3.
介绍了CMOS IC的静电放电微电子测试结构,叙述了双极-MOS兼容的闭锁效应和闭锁滞后现象的微电子测试结构,并对测试结果进行了讨论。 相似文献
5.
专用芯片的测试通常对于一般用户是不可能的,但又是非常必要的,本文讲述了以ALL-03通用编程器为基础对某些专用芯片进行测试的原理和方法。 相似文献
6.
7.
8.
集成电路自动测试系统已经进入1GHz的频率范围,例如微处理器的时钟频率超过1GHz,光纤网络收发器频率在1~10GHz之间,千兆位以太网正式启用,卫星直播电视和扩频通信都在1GHz以上,移动电话收发频率也超过1GHz。换句话说,模拟和数字集成电路和混合电路都需要1GHz以上自动测试系统。过去提及集成电路自动测试系统,大都着重测试器本身的电气 相似文献
9.
任何一种电子产品(从PC到因特网设备)都离不开体积更小、功能更强的芯片。正是芯片推动着飞速的发展,同时,它也推动着IC电子设计自动化和测试技术的发展,但是测试不可避免地要滞后于IC的开发。 系统级芯片(或系统集成芯片)测试是一个费时间的过程。要完成测试,要降低测试成本,需要生成数千测试图形和矢量,还要达到足够高的故障复盖率才行。随 相似文献
10.
11.
从IC China 2005看产品最新动态 总被引:1,自引:0,他引:1
中国IC产业正处于高速成长期,在近几年的发展中,产业规模迅速扩大,技术水平快速提升,产业化不断取得突破.与过去相比,中国IC产业在规模和技术上都已跨上了一个新台阶,IC China 2005的召开成为了中国IC产业的一次盛会. 相似文献
12.
作为可靠性试验的一个主要项目,额定功率试验对于扬声器生产企业来说是其研发设计及品质控制的重要一环.如何正确、高效地进行扬声器的功率试验是每一个生产企业必须重视的.原有国标的对试验的具体实现方法已经远远跟不上形势的发展,新的实现方法孕育而生. 相似文献
13.
LCD技术的发展已历经两代,第一代技术以小型化、轻量化和薄型化为主攻方向,主要应用对象是笔记本电脑;第二代技术则以高亮度、高色再现性和宽视角为代表,主要应用领域是电视机和监视器。目前的发展阶段介于第二代和第三代之间,其技术开发的重点是:突破LCD自身的各种局限性,提高其作为多媒体电视显示器的动画显示性能,并大力简化制造工艺以确保其在价格上具有竞争力。本文将对近期LCD技术的一些主要动向做简要介绍。 相似文献
14.
IPTV的关键技术及发展趋势 总被引:1,自引:0,他引:1
互联网多媒体通信技术是多媒体技术、计算机技术、通信技术和网络技术等多种信息学科相互结合和发展的产物。IPTV综合利用了计算机技术,网络技术和视频图像处理技术等多种技术,实现了为终端用户提供多种视觉体验的增值服务。文章首先介绍了IPTV的基本概念和特点,分析了IPTV的关键技术及IPTV的发展趋势。 相似文献
15.
It is shown that extremely high single-stuck fault coverage is necessary for high-quality products. Even 100% single-stuck fault coverage may not guarantee adequate quality. Results are presented that extend previous work and show that for high required IC quality, process yield has a negligible effect on required test thoroughness. The extensions consist of: removing the assumption of a one-to-one correspondence between chip defects and single-stuck faults; demonstrating that for high quality levels the dependence of quality on test coverage is linear rather than exponential and that for high yields, the dependence of quality on yield is also linear; and showing that the yield used in the calculations should be functional rather than die yield. The theoretical results are compared with data obtained from measurements at a production IC facility 相似文献
16.
不同于传统的太赫兹组件,基于硅基的太赫兹系统在大规模使用情况下具有成本低,尺寸小,集成度高,操作性强,更容易实现大阵列等特点。近10年来,随着硅基半导体技术的快速发展和硅基工艺晶体管的截止频率提升,硅基太赫兹系统芯片的设计发展迅猛。本文将主要从硅基太赫兹源、硅基太赫兹成像芯片、硅基太赫兹通信芯片、硅基太赫兹雷达芯片四个方面对当前的硅基太赫兹系统芯片的研究现状和发展趋势进行综述。 相似文献
17.
The new line in IC design 总被引:1,自引:0,他引:1
If deep submicron ICs are to excel in yields and performance, the design process must focus throughout on their interconnects. A new design process grapples with the problem. Design For interconnectivity, as it is called, ensures that interconnection information is available throughout the design process, so that the circuitry may be optimized around it at every stage. The availability of this information proves the key to achieving yield and performance goals in deep submicron designs. The novel process involves predicting, at an early stage in logic design, the probable paths of interconnects and any problems likely to ensue. Later on, it tackles device layout and performance verification one small step at a time. To do this, the front-end logic designers need tools to gather the proper information without plunging into the intricacies of physical design, while the back-end physical designers need tools with which to surmount interconnect issues. Moreover, technologies are required to produce globally optimized results by linking logical and physical design tools more closely 相似文献
18.
Reliability aspects are of extreme importance for assembly and packaging, which has become a limiting factor for both cost and performance of electronic systems. On the one hand reliability can be negatively influenced by modern front-end and packaging technology, on the other hand new applications and corresponding field requirements can result in the need for new reliability tests e.g. for mobile devices. Today the three main package trends for mobile devices towards ongoing miniaturization and higher system integration are ball grid array type packages, leadless packages, and wafer level type packages. We present reliability implications based on examples of failures in these modern packaging technologies. We highlight the importance of design for reliability based on results of simulations for a leadless package. For the future it is necessary that test conditions must follow the field requirements to guarantee optimum reliability results. 相似文献
19.
20.