复合助剂CaF2-Y2O3对AlN-BN复合陶瓷显微结构和热导性能的影响

用热压法制备了AlN-BN复合陶瓷材料,添加CaF2和Y2Os为烧结助剂,研究了烧结助剂的种类、含量以及不同保温时间对复合材料的物相组成、显微结构和热导率的影响.添加复合助剂(1～3)wt%Y2O3-3wt?F2的试样在保温过程中晶界相挥发明显,净化了复合材料的晶界,减少了复合材料中AlN晶格缺陷,获得了纯净的AlN-BN复合陶瓷.与单独添加CaF2助剂的试样相比,添加复合助剂的试样的介电性能没有明显下降,随复合助剂(1～3)wt%Y2O3-3wt?F2中Y2O3含量的增加,AlN-BN复合陶瓷的热导率显著提高.添加复合助剂3wt%Y2Os-3wt?F2的试样在1850℃下保温3h获得的热导率为132.7W·m-1·K-1.     

AIN-Mo复合陶瓷的介电性能研究

以AlN和Mo为原料,采用放电等离子体烧结技术(SPS)制备了AlN-Mo复合衰减材料.运用XRD、金相显微镜、介电频谱等测试手段对复合衰减陶瓷的相组成、显微组织、复介电常数和电阻率进行表征,研究了提高渗流阁值的方法和影响复合陶瓷介电性能的因素.结果表明,添加体积分数1%的Ni可以使复合陶瓷的渗流阈值达到23%(体积分数);复合陶瓷的介电常数、损耗随Mo含量的增加而增大,同一组分复合陶瓷的介电性能可通过改变导电相的分布状态实现可控调节,并从复合陶瓷的显微组织、电阻率及介电理论上对上述结果予以解释.     

低熔点金属Fe对AlN-Mo复合陶瓷性能的影响

以氮化铝粉、钼粉为原料,采用放电等离子烧结(SPS)技术制备了AlN-18%Mo复合陶瓷。采用X射线衍射(X-ray diffraction,XRD)仪、扫描电镜(Scanning electron microscope,SEM)、介电频谱(Dielectric frequencyspectrum)分析研究了低熔点金属Fe对复合陶瓷导电性能及介电性能的影响。结果表明,随着低熔点金属Fe含量的增加,复合陶瓷的渗流转变温度逐渐降低,添加1%(体积分数)Fe,AlN-18%(体积分数)Mo复合陶瓷的渗流转变温度降低了90℃;随着低熔点金属Fe含量的增加,AM18复合陶瓷的介电常数、损耗逐渐增加,并从复合材料的显微结构及介电理论方面对以上结果给予解释。     

AlN—Mo复合陶瓷的介电性能研究

以AlN和Mo为原料,采用放电等离子体烧结技术（SPS）制备了AlN-Mo复合衰减材料。运用XRD、金相显微镜、介电频谱等测试手段对复合衰减陶瓷的相组成、显微组织、复介电常数和电阻率进行表征,研究了提高渗流阈值的方法和影响复合陶瓷介电性能的因素。结果表明,添加体积分数1％的Ni可以使复合陶瓷的渗流阈值达到23％（体积分数）;复合陶瓷的介电常数、损耗随Mo含量的增加而增大,同一组分复合陶瓷的介电性能可通过改变导电相的分布状态实现可控调节,并从复合陶瓷的显微组织、电阻率及介电理论上对上述结果予以解释。     

CaO-TiO_2烧结助剂对SiC基复相材料烧结性能的影响

以质量分数30%Al2O3-70%SiC为基,外加2%~10%CaO-TiO2复合烧结助剂,制备了一系列SiC基复相材料。研究了不同的烧成温度和CaOTiO2含量对该复相材料烧结性能的影响。研究结果表明,1 400~1 500℃,随着烧结温度升高,烧结致密性明显提高。烧结温度为1 450℃时,试样基本致密。当烧结助剂达到10%(质量分数)时,显气孔率降至0.15%,陶瓷烧结致密。烧结助剂CaO-TiO2,α-Al2O3和方石英反应,在1 200℃已经生成CaAl2Si2O8,在1 300℃以后才开始生成CaTiSiO5,促进6H-SiC进一步氧化。烧结过程中,CaAl2Si2O8转化为玻璃相,在促进莫来石生成的同时也使试样致密。在1 500℃,复合材料的主晶相为6H-SiC和莫来石。     

CaF2烧结助剂对热压烧结AlN-BN陶瓷复合材料的影响

用热压工艺制备了AlN-BN复合陶瓷材料,研究了不同含量CaF2烧结助剂对致密化、介电和热导性能的影响.研究表明:CaF2添加剂可促进材料致密化,净化材料晶界,优化材料的综合性能.热压1850℃保温3h可获得高致密度的烧结体,添加3wt%～4wt%的CaF2,可获得98.53%～98.54%的相对密度.制备的AlN-BN复合材料其介电常数在7.29～7.60之间,介电损耗值最小为6.28×10-4,添加3wt%的CaF2获得的热导率为110W·m-1·K-1.     

TiB2-TiN复合陶瓷刀具材料的显微结构和力学性能研究

热压烧结制备了不同TiN含量的复合陶瓷刀具材料TiB2-TiN-(Ni, Mo),对其性能测试表明,随着TiN含量的增加,材料的抗弯强度和断裂韧度逐渐提高,但是材料的硬度在TiN的含量达到40%(体积分数)时却大幅度降低.利用X衍射(XRD)、扫描电镜(SEM)和能谱(EDAX)分析了复合材料的物相和显微组织,结果表明,烧结过程中生成了MoNi相;随TiN含量增加,材料从以沿晶断裂为主转变为同时有沿晶断裂和穿晶断裂的断裂模式;裂纹扩展过程中有金属颗粒桥连现象.分析认为,材料的主要增韧机制是延性相颗粒桥连和裂纹偏转.     

高石墨含量鳞片石墨/铜复合材料的微观结构和性能(英文)

通过真空热压烧结制备出高石墨含量的鳞片石墨/铜复合材料。研究了高石墨含量对鳞片石墨/铜复合材料微观结构和性能的影响。结果表明,随着石墨体积分数的增加(72. 08 vol.%～93. 34 vol.%),复合材料的密度降低(4. 07～2. 63 g cm~(-3));电导率降低(14. 71%～2. 45%国际退火铜标准);面向热导率先增加后降低,在石墨体积分数为82. 6%时,面向热导率达到最大值为663. 73 W m~(-1)K~(-1);面向热膨胀系数降低(6. 6×10~(-6)～2. 2×10~(-6)K~(-1));抗弯强度降低(42. 48～14. 63 MPa),抗压强度降低(45. 75～20. 46 MPa)。鳞片石墨在复合材料中高度取向排列,分布均匀。并对预测复合材料的热导率模型进行修正,发现测量结果和模型预测结果相吻合。     

放电等离子烧结制备透明AlN陶瓷

采用放电等离子烧结(spark plasma sintering,SPS)技术,添加不同含量CaF2为烧结助剂,成功制备了透明氮化铝(AlN)陶瓷.SPS技术具有烧结快速,烧结体致密度高的特点,是制备透明AlN的有效方法.CaF2的加入量的提高,有利于烧结体的致密度和透过率的提高.当CaF2加入量为3%(质量分数)时,烧结体致密度不再继续提高,但仍有利于透过率的提高,此时烧结体透过率最高为54.7%.SEM、XRD、TEM和EDX结果表明烧结体具有很高的致密度、纯度,均匀的晶粒形状和尺寸,晶界及三角晶界处观察不到第二相的存在,从而保证了烧结体良好的光学性能.     

温度和助剂含量对放电等离子烧结SiC陶瓷的影响EI北大核心

采用Al_(2)O_(3)-Y_(2)O_(3)-CaO作为烧结助剂制备SiC陶瓷,通过阿基米德排水法、XRD、SEM、TEM及维氏硬度测试等方法,探究烧结温度及烧结助剂含量对SiC陶瓷相对密度、物相结构、微观形貌和力学性能的影响。结果表明:在1300~1800℃下,SiC陶瓷相对密度、硬度以及断裂韧性都呈现出先增加后降低的趋势,在1700℃达到最大值;1700~1800℃发生了β-SiC向α-SiC的相变;减少烧结助剂含量会增加晶界结合强度,提升硬度,并抑制晶粒生长;在1700℃和7%(质量分数)烧结助剂含量的条件下,获得了最佳的烧结效果,相对密度、硬度和断裂韧度分别为97.9%,23.3 GPa和4.1 MPa·m^(1/2)。     

基体中Ti元素含量对金刚石/Cu-Ti复合材料热导率的影响

采用真空热压法制备了金刚石体积分数为63%的金刚石/Cu-Ti复合材料,研究了基体中Ti含量对金刚石/Cu-Ti复合材料界面显微结构和热导率的影响。随着Ti含量的增加,金刚石/Cu-Ti复合材料热导率先增加后减小。当基体中Ti含量为1.1wt%时热导率最高,为511 W/（m·K）。Ti含量小于1.1wt%时,烧结过程中两相界面间生成的碳化物数量和面积随Ti含量的增加而增加,优化了界面结合,提高了界面结合强度,增加了界面传热通道数量,使金刚石/Cu-Ti复合材料导热性能提高。Ti含量的增加同时伴随着碳化物热阻增加和基体导热性能的恶化。过量的Ti元素使低导热性能的碳化物层厚度增加,碳化物层本身热阻增加,界面热导降低,金刚石/Cu-Ti复合材料导热性能下降。     

A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal–matrix composites

Copper–matrix composites were made by powder metallurgy (PM). The reinforcements were molybdenum particles, silicon carbide whiskers and titanium diboride platelets. The coated filler method, which involves a reinforcement coated with the matrix metal, was used. In contrast, conventional PM uses the admixture method, which involves a mixture of matrix powder and reinforcement. For all the composite systems, the coated filler method was found to be superior to the admixture method in providing composites with lower porosity, greater hardness, higher compressive yield strength, lower coefficient of thermal expansion (CTE), higher thermal conductivity and lower electrical resistivity, though the degree of superiority was greater for high than low reinforcement contents. In the coated filler method, the coating on the reinforcement separated reinforcement units from one another and provided a cleaner interface and stronger bond between reinforcement and matrix than the admixture method could provide. The highest reinforcement content attained in dense composites (<5% porosity) made by the coated filler method was 70 vol% Mo, 60 vol% TiB2 and 54 vol% SiC. The critical reinforcement volume fraction above which the porosity of composites made by the admixture method increases abruptly is 60% Mo, 42% TiB2 and 33% SiC. This fraction increases with decreasing aspect ratio of the reinforcement. Among Cu/Mo, Cu/TiB2 and Cu/SiC at the same reinforcement volume fraction (50%), Cu/Mo gave the lowest CTE, highest thermal conductivity and lowest electrical resistivity, while Cu/SiC gave the greatest hardness and Cu/TiB2 and Cu/SiC gave the highest compressive yield strength. Compared to Cu/SiC, Cu/TiB2 exhibited much higher thermal conductivity and much lower electrical resistivity. This revised version was published online in November 2006 with corrections to the Cover Date.     

AlN添加量对BN基复合陶瓷热学性能与抗热震性的影响

以BN、SiO₂、AlN为原料, 采用热压工艺制备出BN基复合陶瓷。研究了AlN添加量对复合陶瓷热学与抗热震性能的影响。结果表明: 随着AlN添加量的增加, 复合陶瓷的热膨胀系数呈现先降低后升高的趋势。当AlN的添加量为5vol%时, 复合陶瓷的平均热膨胀系数最小, 为2.22×10^-6/K; 复合陶瓷的热导率则随着AlN添加量的增加呈先升高后降低的趋势, 当AlN的添加量为10vol%时达到最大值。未添加AlN的复合陶瓷热震后的残余强度随着热震温差的增大而升高; 随着AlN的引入, 复合陶瓷热震后的残余强度呈下降的趋势。对于添加5vol%AlN的复合陶瓷, 经1100℃热震后其残余强度为219.7 MPa, 强度保持率为88.9%, 抗热震性良好。     

Hot-pressed AlN-Cu metal matrix composites and their thermal properties

AlN-Cu metal matrix composites containing AlN volume fractions between 0.1 and 0.5 were fabricated firstly by liquid phase sintering of AlN using Y₂O₃ as a sintering aid and then by hot pressing the powder mixtures of sintered AlN and Cu at 1050°C with a pressure of 40 MPa under flowing nitrogen. With Y₂O₃ additions of 1.5 to 10 wt%, the densification of AlN could be achieved by liquid phase sintering at 1900°C for 3 h and subsequently slow cooling. The sintered AlN showed a maximum thermal conductivity of 166 W/m/K at a Y₂O₃ level of 6 wt%. Dense AlN-Cu composites with AlN contents up to 40 vol% were achieved by hot pressing. The thermal conductivity and the coefficient of the thermal expansion (CTE) of the composites decreased with increasing AlN volume fractions, giving typical values of 235 W/m/K and 12.6 × 10^–6/K at an AlN content of 40 vol%.     

金属Mo对AlN基复相材料性能的影响

以氮化铝、金属Mo 为原料,Y₂O₃为烧结助剂,氮气氛下、1800～1900℃热压烧结制备Mo/AlN 复相材料。利用 XRD、SEM对材料的相组成、显微结构进行表征,四探针法测试复相材料的电阻率,微带线法测试2～20 GHz频率范围内材料的微波衰减特性,探讨了渗流现象与衰减特性之间的内在联系。结果表明;当 Mo 添加量为4. 56 vol %～15. 03 vol %,材料呈现宽频衰减特性,且随着 Mo 含量和烧结温度的增加衰减量增大;当Mo 添加量为16. 18 vol %～24. 88 vol %,材料仅在 6、10、14、18 GHz? 4个频率点出现了明显的谐振峰。根据渗流模型对电阻率数据进行拟合,得到导电相渗流阈值V_c和相应电阻率分别为14. 87 vol %和11. 59 Ω·m。当Mo 体积分数V >V_c时 , 复相材料的衰减特性由宽频向选频转变。      

中间相碳微球/氰酸酯树脂复合材料的导电导热性能

选取M22、M15和M23三种不同粒径中间相碳微球（MCMBs）作为填料,分别以10vol%、25vol%、40vol%和50vol%体积分数填充氰酸酯树脂（CE）制备了MCMBs/CE复合材料,通过SEM、XRD、拉曼光谱仪、导热仪、体积电阻仪分析了不同粒径的MCMBs/CE复合材料的性能。结果表明:三种球形粉体都具有石墨化结构,其中M22粉体球形度最好、石墨化程度最高（I_D/I_G=0.23）、体积电阻率最小。三种MCMBs粉体制备的MCMBs/CE复合材料的吸水性、导热性和导电性均随填充量的增加而增大,冲击强度则先增大后减小。其中以M22在40vol%填充率下所得MCMBs/CE复合材料的综合性能最优,吸水率为0.45%,冲击强度为23.6 kJ/m2,热导率达1.28 W/（m·K）,体积电阻率达1.5 Ω·cm。      

Processing and bioactivity of 45S5 Bioglass®-graphene nanoplatelets composites

Well dispersed 45S5 Bioglass^® (BG)-graphene nanoplatelets (GNP) composites were prepared after optimising the processing conditions. Fully dense BG nanocomposites with GNP loading of 1, 3 and 5 vol% were consolidated using Spark plasma sintering (SPS). SPS avoided any structural damage of GNP as confirmed using Raman spectroscopy. GNP increased the viscosity of BG-GNP composites resulting in an increase in the sintering temperature by ~50 °C compared to pure BG. Electrical conductivity of BG-GNP composites increased with increasing concentration of GNP. The highest conductivity of 13 S/m was observed for BG-GNP (5 vol%) composite which is ~9 orders of magnitude higher compared to pure BG. For both BG and BG-GNP composites, in vitro bioactivity testing was done using simulated body fluid for 1 and 3 days. XRD confirmed the formation of hydroxyapatite for BG and BG-GNP composites with cauliflower structures forming on top of the nano-composites surface. GNP increased the electrical conductivity of BG-GNP composites without affecting the bioactivity thus opening the possibility to fabricate bioactive and electrically conductive scaffolds for bone tissue engineering.     

The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles

Amino-functionalized nano-aluminum nitride (nano-AlN) particles were doped onto the surfaces of chlorinated multi-walled carbon nanotubes (MWCNTs) to act as fillers in thermally conducting composites. These synthesized materials were embedded in epoxy resin. Then, the untreated micro-aluminum nitride (micro-AlN) particles were added to this resin, whereby the composites filled with nano-AlN-doped MWCNTs (0, 0.5, 1, 1.5, 2 wt%) and micro-AlN (25.2, 44.1, 57.4 vol%) were fabricated. As a result, the thermal diffusivity and conductivity of all composites continuously improved with increasing nano-AlN-doped MWCNT content and micro-AlN filler loading. The thermal conductivity reached its maximum, which was 31.27 times that of the epoxy alone, when 2 wt% nano-AlN-doped MWCNTs and 57.4 vol% micro-AlN were added to the epoxy resin. This result is due to the high aspect ratio of the MWCNTs and the surface polarity of the doped nano-AlN and micro-AlN particles, resulting in the improved thermal properties of the epoxy composite.     

放电等离子烧结制备Diamond/Al复合材料

采用放电等离子烧结法（SPS）制备了Diamond/Al复合材料,研究了金刚石粒径、成分配比、工艺参数等对复合材料的导热性能的影响。结果表明,SPS可以得到导热性能较好的Diamond/Al复合材料,致密度是影响该材料导热性能的最重要因素。在实验确定的金刚石体积分数50%,金刚石粒径70 μm,温度550℃、压力30 MPa的工艺条件下,所制备的材料致密度较高,热导率为182 W/(m·K),比相同条件下纯铝粉烧结体的热导率提高了34.8%,表明金刚石的添加对烧结铝基材料导热性能有明显的改善作用。      

Y_2W_3O_(12)/Ni复合材料的制备及热膨胀性能

为研究Ni基Y2W3O12复合材料的热学性能,首先,采用二次焙烧法制备了负膨胀材料Y2W3O12;然后,将Y2W3O12与金属Ni进行混合,并在1 200℃、50 MPa的条件下热压烧结制得40vol%Y2W3O12/Ni复合材料;最后,对复合材料的成分及热膨胀性能进行了研究。结果表明:在热压烧结过程中,由于Ni的还原性比W差,相对于对比试样40vol%Y2W3O12/Cr复合材料中发生的复杂化学反应,40vol%Y2W3O12/Ni复合材料的两相之间并未发生反应,使40vol%Y2W3O12/Ni复合材料保持了较低的热膨胀系数;经数次循环退火释放热应力及去除Y2W3O12相的结晶水后,40vol%Y2W3O12/Ni复合材料在170~800℃温度范围内的热膨胀系数趋于稳定,约为3.4×10-6 K-1,与理论设计值4.0×10-6 K-1相近。