SiC_f/Ti6Al4V/Cu复合材料的界面行为及力学性能

采用箔-纤维-箔法制备SiC_f/Ti6Al4V/Cu复合材料,研究Ti6Al4V在连续SiC纤维增强Cu基复合材料中作界面改性涂层时的界面反应结合特征.利用光学显微镜、扫描电镜和能谱仪分析复合材料显微组织、断口形貌以及SiC_f/Ti6Al4V界面和Ti6A14WCu界面的反应扩散特征.结果表明:该复合材料的抗拉强度并没有显著提高;SiC_f/Ti6Al4V界面反应非常微弱;而Ti6Al4V/Cu界面反应非常明显,主要是Ti原子与Cu原子之间的反应,反应层厚度约为20 μm;反应产物主要呈4层分布,分别为CuTi_2、CuTi、Cu_4Ti_3和Cu_4Ti.     

Cu/Mo双涂层改性SiCf/Ti6Al4V复合材料的界面与性能

采用箔-纤维-箔(FFF)法分别制备无涂层、C涂层和Cu/Mo双涂层改性的SiCf/Ti6Al4V复合材料,对制备态复合材料的力学性能和界面微观组织进行对比分析,进一步研究不同真空热暴露处理对Cu/Mo双涂层改性复合材料的界面微区的影响规律。结果表明,制备态下Cu/Mo涂层比C涂层较好地改善了复合材料的界面组织和性能,且对基体和纤维中元素扩散均具有一定的阻挡作用;求得900℃下SiCf/Cu/Mo/Ti6Al4V界面反应的生长动力学公式为H=1.380t1/2+5.397。     

挤压铸造制备Ti_f/5A06Al复合材料的组织与性能

针对金属基复合材料中增强相与基体合金界面问题,利用金属与金属间的界面结合特性,以Ti-6Al-4V纤维为增强相,通过挤压铸造制备了Tif/5A06Al复合材料并进行了退火处理。采用SEM和TEM等手段分析了Tif/5A06Al复合材料的基体组织、Ti-Al界面结构与界面反应。结果表明,采用挤压铸造工艺可以获得组织致密、界面结合良好的Tif/5A06Al复合材料。Tif/5A06Al复合材料基体中存在位错,Ti-6Al-4V纤维与铝基体界面形成了TiAl层和呈不连续分布的TiAl3界面反应产物。Tif/5A06Al复合材料力学性能测试表明,其纵向抗拉强度为1 045 MPa,纵向伸长率为5.2%。     

SiC纤维增强钛基复合材料的界面研究

研究了两种纤维增强钛基复合材料(SCS-6/Ti-6Al-4V和SCS-6/TA6V)的界面.实验结果表明,两种复合材料中SiC纤维与基体合金均结合得较好,界面反应层较薄,其厚度分别为0.8和0.6μm.界面反应层随热处理时间的延长、热处理温度的升高而增厚.EDX分析结果表明,界面相中只含有Al,V,Si和Ti元素.     

SiCf/Ti-6Al-4V复合材料界面反应动力学

SiC纤维增强Ti基复合材料（SiCf／Ti）容易发生界面反应，从而影响其力学性能。开展界面反应和动力学的研究，对于SiCdTi复合材料的制备和服役具有指导意义。采用扫描电镜、透射电镜和X射线衍射分析了SICf／Ti-6Al—4V复合材料的界面反应及其动力学，发现SiC纤维的C涂层与Ti-6Al—4V反应形成粗晶粒的和细晶粒的TiC，长期高温热处理使得界面反应加剧，TiC层加厚，当C涂层完全消耗后，界面反应层中除了TiC外，还出现了Ti3SiC2。研究表明，界面反应层的加厚受元素扩散控制，服从抛物线规律，求出的动力学参数Q为268．8kJ／mol，k为0．0057m/s1/2。     

SiCf/Ti-6Al-4V复合材料的界面研究

采用扫描电镜、透射电镜和X射线衍射仪研究了用中国制备SiC纤维增强的Ti-6Al-4V复合材料的界面反应,发现在SiC纤维的C涂层和Ti-6Al-4V基体之间形成的界面反应产物为细晶粒和粗晶粒的TiC,而无C涂层的SiCf/Ti-6Al-4V的界面反应产物,从SiC纤维到Ti-6Al-4V基体,依次为细晶粒的TiC+Ti5Si3、粗晶粒的TiC和Ti3SiC2.还测量了界面反应区厚度并讨论了界面反应机理.     

真空热处理对Ti6Al4V基体/NiCrAlY涂层体系组织结构及元素扩散行为的影响

采用电弧离子镀(AIP)技术在Ti6Al4V基体表面沉积制备了NiCrAlY涂层. 通过金相观察(OM)、扫描电镜(SEM)与能谱(EDS)分析、 X射线衍射(XRD)分析以及显微硬度测试, 研究了真空热处理对NiCrAlY涂层组织性能的影响, 讨论了Ti6Al4V基体/NiCrAlY涂层界面元素扩散规律. 结果表明: 700.℃真空热处理后, NiCrAlY涂层中开始析出γ′-Ni3Al相, 这提高了涂层的表面硬度; 在700.℃温度下, Ti6Al4V基体/NiCrAlY涂层界面由外至内出现Ni3(Al,Ti)、 TiNi和Ti2Ni中间化合物层, 并随着温度提高, 界面处中间化合物层增厚; 700.℃时, 主要发生了镍、钛元素的扩散, 铬元素在870.℃开始发生扩散. 当温度提高到950.℃后, 由于镍元素大量向Ti6Al4V基体扩散引起涂层的退化失效.     

SiCf／Ti-6AI-4V复合材料的界面研究

采用扫描电镜、透射电镜和x射线衍射仪研究了用中国制备SiC纤维增强的Ti-6AI-4V复合材料的界面反应，发现在SiC纤维的C涂层和Ti-6AI-4V基体之间形成的界面反应产物为细晶粒和粗晶粒的TiC，而无C涂层的SiCf／Ti．6AI．4V的界面反应产物，从SiC纤维到Ti-6AI-4V基体，依次为细晶粒的TiC＋Ti5Si3、粗晶粒的TiC和Ti3SiC2。还测量了界面反应区厚度并讨论了界面反应机理。     

微米羟基磷灰石/钛复合粒子冷喷沉积行为

在不同加速气体温度和不同硬度基体上冷喷沉积单个微米羟基磷灰石/钛(mHA/Ti)复合粒子,获得加速气体温度与基体硬度对mHA/Ti复合粒子冷喷沉积行为的影响规律;运用冷喷涂技术制备mHA/Ti-Ti复合梯度涂层。采用扫描电子显微镜观察沉积后mHA/Ti复合粒子的表面形貌与结合形态及mHA/Ti-Ti涂层截面形貌,结合能谱分析沉积后mHA/Ti复合粒子和涂层中HA的Ca/P比。通过图像法测量涂层的平均厚度值。研究结果表明,当加速气体温度为300℃时,mHA/Ti复合粒子碰撞Ti6Al4V和316L不锈钢基体后发生了一定的塑性变形呈现中部隆起的扁平状,粒子周边出现了环形薄带。基体为HA/Ti涂层基体时,碰撞后mHA/Ti复合粒子呈现椭球状且部分嵌入至涂层基体中;随着加速气体温度升高至700℃,mHA/Ti复合粒子撞击Ti6Al4V和316L不锈钢基体后变形程度有所增加,且mHA/Ti复合粒子嵌入至HA/Ti涂层基体中深度有所增加,同时复合粒子在基体表面结合率增加。冷喷制备的mHA/Ti-Ti复合梯度涂层界面结合良好。通过对沉积后mHA/Ti复合粒子及涂层中HA的Ca/P比发现,冷喷沉积后mHA/Ti复合粒子及涂层中的Ca/P比与原始粉末中基本相同。     

不同温度下γ-NiCrAlTi/TiC/CaF2自润滑耐磨复合涂层的摩擦磨损性能

为提高Ti6Al4V合金的摩擦学性能,采用激光熔覆技术在Ti6Al4V表面制备出以Ti C为增强相、γ-Ni Cr Al Ti固溶体为增韧相、Ca F2为自润滑相的γ-Ni Cr Al Ti/Ti C/Ca F2自润滑耐磨复合涂层。分别在室温、300℃和600℃时测试了复合涂层和Ti6Al4V合金基体的干滑动磨损性能,并且讨论了其与对磨球的磨损机理。结果表明:从室温到600℃,γ-Ni Cr Al Ti/Ti C/Ca F2自润滑耐磨复合涂层的摩擦系数和磨损率均比Ti6Al4V合金基体显著降低,该复合涂层具有较好的自润滑耐磨性能;对偶件Si3N4陶瓷球的磨损也有一定程度的降低。600℃时,Ti6Al4V基体的磨损机理为氧化塑性变形,γ-Ni Cr Al Ti/Ti C/Ca F2磨损机理为润滑转移层的形成。     

C/Ti/Cu interfacial reaction in SiC<Subscript>f</Subscript>/Cu composites

Continuous SiC fiber reinforced copper matrix(SiCf/Cu) composites were prepared by fiber coating method,and Ti6Al4V interlayer was introduced as an interfacial modification coating to improve the interfacial bonding strength.The interfacial reaction characteristics were investigated by transmission electron microscopy(TEM).The results show that nearly all the titanium atoms reacted with the carbon coating of SiC fibers to form two layers of TiC.Also,a thin copper layer that is sandwiched between these two layers was detected.No Ti-Cu interfacial reaction product was observed.The formation process of the interfacial reaction along with its mechanism was discussed.     

热处理对金刚石/2024Al复合材料微观组织和热物理性能的影响

采用挤压铸造法制备粒径为5μm、体积分数为50%的金刚石/2024Al 复合材料。退火处理后对其金相组织界面反应、界面结合情况以及金刚石颗粒的内部缺陷进行观察与分析,并对其热物理性能进行测试与研究。结果表明,金刚石/2024Al 复合材料的组织致密,无明显的气孔、夹杂等缺陷;颗粒为不规则多边形,有棱角,分布比较均匀。透射电镜观察表明,部分金刚石颗粒内部有位错和层错存在,而2024Al 基体中的位错密度较大,金刚石/2024Al界面处有较多的界面反应物生成,可能为Al2Cu。复合材料在20~100°C温度区间内的平均热膨胀系数为8.5×10-6°C-1,退火处理的复合材料其热膨胀系数有一定程度的降低;随着温度的升高,复合材料的平均热膨胀系数也呈现增加的趋势。复合材料的热导率约为100 W/（m·K）,退火处理能够提高复合材料的热导率。     

Thermal properties of diamond/Al composites by pressure infiltration: comparison between methods of coating Ti onto diamond surfaces and adding Si into Al matrix

This study was pertained to the effects of Ti coating on diamond surfaces and Si addition into Al matrix on the thermal conductivity(TC) and the coefficient of thermal expansion(CTE) of diamond/Al composites by pressure infiltration.The fracture surfaces,interface microstructures by metal electro-etching and interfacial thermal conductance of the composites prepared by two methods were compared.The results reveal that Ti coating on diamond surfaces and only12.2 wt% Si addition into Al matrix could both improve the interfacial bonding and increase the TCs of the composites.But the Ti coating layer introduces more interfacial thermal barrier at the diamond/Al interface compared to adding 12.2 wt% Si into Al matrix.The diamond/Al composite with 12.2 wt% Si addition exhibits maximum TC of 534 W·m~(-1)·K~(-1)and a very low CTE of 8.9×10~(-6)K~(-1),while the coating Ti-diamond/Al composite has a TC of 514 W·m~(-1)·K~(-1)and a CTE of 11.0×10~(-6)K~(-1).     

Interface and thermal expansion of carbon fiber reinforced aluminum matrix composites

Two kinds of unidirectional PAN M40 carbon fiber(55%,volume fraction) reinforced 6061Al and 5A06Al composites were fabricated by the squeeze-casting technology and their interface structure and thermal expansion properties were investigated.Results showed that the combination between aluminum alloy and fibers was well in two composites and interface reaction in M40/5A06Al composite was weaker than that in M40/6061Al composite.Coefficients of thermal expansion(CTE) of M40/Al composites varied approximately from(1.45-2.68)×10-6 K-1 to(0.35-1.44)×10-6 K-1 between 20 °C and 450 °C,and decreased slowly with the increase of temperature.In addition,the CTE of M40/6061Al composite was lower than that of M40/5A06Al composite.It was observed that fibers were protruded significantly from the matrix after thermal expansion,which demonstrated the existence of interface sliding between fiber and matrix during the thermal expansion.It was believed that weak interfacial reaction resulted in a higher CTE.It was found that the experimental CTEs were closer to the predicted values by Schapery model.     

Microstructure and thermal expansion of Ti coated diamond/A1 composites

A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix, and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging. The surface structure of the Ti coated diamond particles was investigated by XRD and SEM. The interfacial characteristics and fracture surfaces were observed by SEM and EDS. The coefficient of thermal expansion(CTE) of 50% (volume fraction) Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO₂ layer, and the inner TiC layer is very stable and cannot be removed during infiltration process. Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism, and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix. The measured low CTEs (5.07×10⁻⁶−9.27×10⁻⁶K⁻¹) of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.     

SiC/Ti6Al4V复合材料界面反应产物的形成序列及扩散路径

通过SiC/Ti6Al4V钛基复合材料的制备及在不同条件下的热处理试验，利用SEM，EDS及XRD分析技术研究复合材料界面反应产物相的形成及反应元素的扩散路径。结果表明：反应元素如C，Ti，Si在界面反应层中出现浓度波动，合金元素Al并没有显著扩散进入界面反应产物层，而是在界面反应前沿堆积，其界面反应产物被确认为Ti3SiC2，TiCx，Ti5Si3C，和Ti3Si；在界面反应初期，存在着TiC＋Ti5Si3Cx双相区，当形成各界面反应产物单相区时，SiC／Ti6Al4V复合材料界面反应扩散的完整路径应为：SiC ｜ Ti3SiC2 ｜ Ti5Si3Cx ｜ TiCx ｜ Ti3Si｜ Ti6Al4V＋TiCx；界面反应产物层的生长受扩散控制，遵循抛物线生长规律，其生长激活能Q^k及k0分别为290.935 kJ·mol^-1,2.49× 10^-2 m·s^-1/2.