INTERACTION BETWEEN Cu AND LIQUID Sn (Ⅱ) SEM Observation of Intermetallic Growth

用扫描电镜(SEM)研究了Cu与液态Sn的相互作用。观察到了350℃时Cu_6Sn_5的生长突跃和Sn层中化合物生长的形态。以及Sn-Pb合金中随Pb含量增加Cu_6Sn_5生长趋势减弱。     

INTERACTION BETWEEN Cu AND LIQUID Sn—Also on Physical Meaning of Wetting Curve

The interaction between Cu and liquid Sn was studied by microstructure observation.Thecurve of the dipping time with related to dissolving and diffusion of Cu in liquid Sn is given.The Cu dissolves rapidly in liquid Sn at the beginning,then an intermetallic compoundCu_6Sn_5 forms,and the dissolving follows to slow down.At temperature up to 350℃,the hardfeather-like Cu_6Sn_5 is sharply growing up and speads through the dipped Sn laver.The wayto inhibit the growth of the intermetallic compound Cu_6Sn_5 was also approached.Thus,on theabove mentioned basis,the physical meaning of the wetting curve traced by the meniscographwettability tester has been derived as film detaching,Cu dissolying and Cu_6Sn_5 growing.     

INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve

用显微结构方法研究了Cu与液态Sn的相互作用;作出了浸沾时间与Cu溶解扩散的关系图。温度升高至350℃时金属间化合物Cu_6Sn_5的生长有突跃,以羽毛状迅速生长并突破沾Sn层。研究了抑制金属间化合物生长的各种方法。根据上述研究,详细讨论了meniscograph方法所得润湿曲线的物理意义。     

KINETICS OF INTERACTION BETWEEN PbS AND PbO·SiO_2

本文研究了T=900—1100℃时,PbS和PbO·SiO_2的交互反应。得出函数F(α)=(0.5-α)/((1-α)~(5/3))与t的直线关系。认为反应前期是化学控制,反应后期是扩散控制,计算出化学反应活化能ΔE=140kJ/mol,扩散活化能ΔE_D=105.8kJ/mol。     

THERMODYNAMIC PROPERTIES OF Al-Ce-Pb(or Sn) LIQUID SOLUTIONS

Thermodynamic properties of Al-Ce-Pb and Al-Ce-Sn liquid systems were studied by direct equilibrium method at 800℃. The results obtained include: equilibrium products, their standard Gibbs energies of formation, equilibrium constants of reactions and activity interaction coefficients between Ce and Pb or Sn in liquid aluminum.     

IN-SITU OBSERVATION OF NUCLEATION AND GROWTH OF HIGH-TEMPERATURE δ PHASE DURING AUSTENITE → FERRITE+LIQUID PHASE TRANSFORMATION IN AN AISI304 STAINLESS STEEL

利用共焦激光扫描显微镜原位观察AISI304不锈钢加热过程中高温占相的形核与生长．结果表明，130m-1400℃之间δ相在，γ晶界处优先析出，而δ相在γ晶粒内“爆炸”形成需在1410℃以上；δ相形成主要受控于Ni原子的扩散；提高升温速率有利于δ晶粒细化，促使δ／γ平界面失稳并出现二次枝晶．δ相析出时以非小平面为主，另可见少量的小平面δ晶体；随着相变进行，小平面状δ相呈现出边缘钝化、向非小平面转变的趋势．利用平直界面稳定临界扰动理论探讨了δ相生长界面失稳的机制，并从结晶动力学对δ相生长方式转变的原因进行了分析．     

EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu

The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found that at a heating rate of 5℃/min, Sn-6.SZn exhibited no melting range. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests exhibited that Sn-6.5Zn has significantly better wettability on Cu than Sn-9Zn. The reaction layers formed during the spreading tests were examined. When the Zn concentration fell between 2.5wt%-9wt%, two reaction layers were formed at the interface, a thick and flat Cu5Zn8 adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. Only a Cu0Sn5 layer was formed when the Zn concentration decreased to 0.5wt%. The total thickness of the reaction layer（s） between the alloy and Cu was found to increase linearly with the Zn concentration.     

RELATIONS BETWEEN INTERFACE OF CF/Al-4.5 Cu COMPOSITE AND SOLIDIFICATION PROCESSING

ＲＥＬＡＴＩＯＮＳＢＥＴＷＥＥＮＩＮＴＥＲＦＡＣＥＯＦＣＦ／Ａｌ４．５ＣｕＣＯＭＰＯＳＩＴＥＡＮＤＳＯＬＩＤＩＦＩＣＡＴＩＯＮＰＲＯＣＥＳＳＩＮＧ①ＣｈｕＳｈｕａｎｇｊｉｅ，ＷｕＲｅｎｊｉｅＲｅｓｅａｒｃｈＩｎｓｔｉｔｕｔｅｏｆＣｏｍｐｏｓｉｔｅＭ...     

KINETICS OF INTERACTION BETWEEN Cu_2S AND Cu_2O IN SOLID STATE UNDER NONISOTHERMAL CONDITION

ＫＩＮＥＴＩＣＳＯＦＩＮＴＥＲＡＣＴＩＯＮＢＥＴＷＥＥＮＣｕ２ＳＡＮＤＣｕ２ＯＩＮＳＯＬＩＤＳＴＡＴＥＵＮＤＥＲＮＯＮＩＳＯＴＨＥＲＭＡＬＣＯＮＤＩＴＩＯＮ①ＳｏｎｇＮｉｎｇ，ＬｉｕＣｈｕｎｐｅｎｇＤｅｐａｒｔｍｅｎｔｏｆＭｅｔａｌｕｒｇｙ，Ｋｕｎｍ...     

CALCULATION OF THE EXCHANGE INTERACTION CONSTANT BETWEEN RARE-EARTH AND TRANSITION METAL SUBLATTICESIN R_2Fe_(17_x)Al_x(R=Tb, Gd AND Dy)COMPOUNDS

An approximate calculation of the exchange interaction constant JRT between the rare-earth sublattice and the transition metal sublattice in R2Fe17-xAlx (R=Tb, Gd, and Dy) compounds is given by the molecular-field model and the results of neutron diffraction. The calculated values, -JR,T/k, for Dy2Fe17-xAlx (x=5, 6, 7 and 8), Tb2Fe10Al7, Gd2Fe17-xAlx (x = 7, 8) compounds are 8.62K, 8.64K, 9.52K, 10.34K and 10.66K, 10.65K, and 9.85K, respectively, they are in agreement with the experimental values, -JR,T/k, of Dy2Fe17-xAlx (x=5, 6, 7 and 8), Tb2Fe10Al7 and Gd2Fe17-xAlx (x=7, 8) compounds, which are 8.77K, 9.25K, 10.1K, 10.9K and 10.35K, 10.1K, and 10.3K, respectively. The origins of the difference between the calculated and the experimental results are discussed.     

Cu与液态Sn的相互作用(Ⅱ)——金属间化合物生长的SEM观察

用扫描电镜(SEM)研究了Cu与液态Sn的相互作用。观察到了350℃时Cu_6Sn_5的生长突跃和Sn层中化合物生长的形态。以及Sn-Pb合金中随Pb含量增加Cu_6Sn_5生长趋势减弱。     

GROWTH OF Bi(Pb)-Sr-Ca-Cu-O SUPERCONDUCTING WHISKERS

Amorphous Bi(Pb)-Sr-Ca-Cu-O strips of types(1112)and(2212)were made by means ofnon-equilibrium solidification of melt-quenching method,On the surface of glassy strip,theflexible(2212)superconducting whiskers have been obtained.The growth and feature ofsuperconducting whiskers were studied in detail.     

IN SITU TEM OBSERVATION OF AMORPHOUS Nd_xFe_(1-x)THIN FILMS AND THEIR CRYSTALLIZATION

The room temperature stability and crystallization of amorphous Nd_xFe_(1-x)thin filmswith x=0.06—0.90,prepared by flash evaporation at 77 K,were investigated by X-raydiffraction and TEM observation.The amorphous Nd_xFe_(1-x)films are stable at roomtemperature when 0.19相似文献   

EFFECT OF POTENTIAL ON INTERACTION BETWEEN STRESS CORROSION CRACKING AND CORROSION FATIGUE OF AUSTENITIC STAINLESS STEEL IN BOILING 42% MgCl_2 SOLUTION

The environment-sensitive fracture behaviour of 0Cr18Ni9Ti austenitic stainless steel inboiling 42% MgCl_2 under the specific load of low frequency and high mean stress was inves-tigated from the relations and differences of crack growth rates and fractographs betweenstress corrosion fatigue and stress corrosion cracking.The interaction between stress corro-sion cracking and corrosion fatigue was also studied from fracture characteristics with empha-sis on the effects of applied potential on the interaction.     

INTERACTION BETWEEN CREEP AND FATIGUE OF A NICKELBASED SUPERALLOY IN738LC AT ELEVATED TEMPERATURE—DECREASING OF CYCLIC LIFE WITH INCREASING CREEP DEFORMATION

１ＩｎｔｒｏｄｕｃｔｉｏｎＴｈｅｉｎｔｅｒａｃｔｉｏｎｂｅｔｗｅｅｎｃｒｅｅｐａｎｄｆａｔｉｇｕｅｃａｎｂｅｏｃｃｕｒｅｄｉｆｔｈｅｍａｔｅｒｉａｌｉｓｕｎｄｅｒｃｒｅｅｐｆａｔｉｇｕｅｌｏａｄｉｎｇ．Ｔｈｅｃｒｅｅｐｄｅｆｏｒｍａｔｉｏｎｕｓｕ...     

IN SITU TEM OBSERVATION OF AMORPHOUS Nd_χFe_(1-χ) THIN FILMS AND THEIR CRYSTALLIZATION

用X射线衍射和透射电镜研究了用闪蒸法(Flash evaporation)在77K制备的Nd_xFe_(1-x)(X=0.06-0.90)非晶薄膜的室温稳定性及其晶化过程 当0.19相似文献   

THERMODYNAMICS AND PHASE EQUILIBRIUM OF Cu－Y－O，Cu－Y－S，Cu－Y－O－S LIQUID SOLUTIONS

ＴＨＥＲＭＯＤＹＮＡＭＩＣＳＡＮＤＰＨＡＳＥＥＱＵＩＬＩＢＲＩＵＭＯＦＣｕ－Ｙ－Ｏ，Ｃｕ－Ｙ－Ｓ，Ｃｕ－Ｙ－Ｏ－ＳＬＩＱＵＩＤＳＯＬＵＴＩＯＮＳ￥Ｄｕ，Ｔｉｎｇ；Ｌｉ，Ｇｕｏｄｏｎｇ（ＣｅｎｔｒａｌＩｒｏｎａｎｄＳｔｅｅｌＲｅｓｅａｒｃｈｉｎｓｔｉｔ...     

EFFECTS OF Cu and Mg ON MICROSTRUCTURE AND PROPERTIES OF -Al(3－4 Wt%)Li AL

ＥＦＦＥＣＴＳＯＦＣｕａｎｄＭｇＯＮＭＩＣＲＯＳＴＲＵＣＴＵＲＥＡＮＤＰＲＯＰＥＲＴＩＥＳＯＦ－Ａｌ（３－４Ｗｔ％）ＬｉＡＬＬＯＹＳＣ．Ｇ．Ｊｉａｏ;Ｇ．Ｆ．ＹｕａｎｄＭ．Ｇ．Ｙａｎ（ＩｎｓｔｉｔｕｔｅｏｆＡｅｒｏｎａｕｔｉｃａｌＭａｔｅｒｉａｌｓ,...     

MICROSTRUCTURE OF INTERFACE BETWEEN Y-MODIFIED REACTIVE ION PLATED Ti(Y)N COATING AND SUBSTRATE STEEL A3

The fine rnicrostrueture of the Y-modified ion plated Ti(Y)N coating/substrate steel A3system has been examined by means of TEM and microdiffraction technique.It was revealedthat the interface consists of 3 sublayers,i.e.α-Fe+Y_6Fe_(23),Ti+Y+FeTi and Ti_2N+YN+Ti_xN_y.The thicknesses of them are about 200,50 and 120 nm respectively.The phases inthe transition area seem to have certain orientation relations.The mechanism of interfaceformation has also been discussed.     

FORMATION AND CHANGE OF AuSn4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au／Ni／Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING

Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) during laser and infrared reflow soldering were studied.During laser reflow soldering process,a thin layer of AuSn4 was observed at the interface of the solder bumps,its morphology was strongly dependent on the laser reflow power and heating time.The solder bumps formed by the first laser reflow was reflowed again to form the solder joints.The AuSn4 compounds formed in the first laser reflow process dissolved into the bulk solder after the secondary infrared reflow process.The needle-like AuSn4 changed into rodlike,and distributed inside the solder near the solder/pad interface.