共查询到19条相似文献,搜索用时 140 毫秒
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采用注入隔离制造的AlGaN/GaN HEMTs器件 总被引:3,自引:0,他引:3
对Al Ga N/Ga N HEMT器件采用离子注入技术注入氦离子进行隔离,应用该技术制造出的器件在室温下具有很好的特性.器件的阈值电压在- 3V左右时,源漏间电流为几十n A.肖特基势垒的反向漏电流在- 1 0 V下约为几百n A.与采用干法刻蚀技术进行隔离的器件相比,采用离子注入技术不但可以获得全平面化的HEMTs器件而且还有效地抑制了场区漏电.研究还表明氦离子注入的温度稳定性大于70 0℃. 相似文献
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提出一种新的钝化技术--采用盐酸和氢氟酸混合预处理溶液(HF:HCI:H2O=1:4:20)对AIGaN/GaNHEMTs进行表面预处理后冉淀积Si3N4钝化,研究了新型钝化技术对AlGaN/GaN HEMTs性能的影响并分析其机理.与用常规方法钝化的器件相比,经过表面顶处理再钝化,成功地抑制了 AIGaN/GaN HEMTs肖特基特性的恶化,有效地增强抑制电流崩塌效应的能力,将GaN基HEMTs的输出功率密度提高到5.2W/mm,并展现良好的电学可靠性.通过X射线光电子谱(XPS)检测预处理前后的AIGaN表面,观察到经过预处理后的AIGaN表面氧元素的含量大幅度下降.表面氧元素的含量下降,能有效地降低表面态密度和表面电荷陷阱密度,被认为是提高AIGaN/GaN HEMTs性能的主要原因. 相似文献
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提出一种新的钝化技术--采用盐酸和氢氟酸混合预处理溶液(HF:HCI:H2O=1:4:20)对AIGaN/GaNHEMTs进行表面预处理后冉淀积Si3N4钝化,研究了新型钝化技术对AlGaN/GaN HEMTs性能的影响并分析其机理.与用常规方法钝化的器件相比,经过表面顶处理再钝化,成功地抑制了 AIGaN/GaN HEMTs肖特基特性的恶化,有效地增强抑制电流崩塌效应的能力,将GaN基HEMTs的输出功率密度提高到5.2W/mm,并展现良好的电学可靠性.通过X射线光电子谱(XPS)检测预处理前后的AIGaN表面,观察到经过预处理后的AIGaN表面氧元素的含量大幅度下降.表面氧元素的含量下降,能有效地降低表面态密度和表面电荷陷阱密度,被认为是提高AIGaN/GaN HEMTs性能的主要原因. 相似文献
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采用电感耦合等离子体(ICP)刻蚀系统,研究了氧等离子体表面处理对AlGaN/GaN HEMT欧姆接触电阻的影响。利用能量色散X射线光谱仪、光致发光谱和原子力显微镜以及电学测试设备对处理前后样品进行表征分析。结果表明,在最佳的氧等离子体处理条件(ICP功率250 W,射频功率60 W,压强0.8 Pa,氧气流量30 cm3/min,时间5 min)下,欧姆接触电阻为0.41Ω·mm,比参照样品接触电阻降低了约69%。分析认为经过氧等离子体处理后,在近表面处产生了一定数量的N空位缺陷,这些N空位表现为浅能级施主掺杂,有利于欧姆接触的形成。通过采用氧等离子体表面处理工艺制备的AlGaN/GaN HEMT,在+2 V的栅极偏压下获得了0.77 A/mm的最大漏极饱和电流。 相似文献
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研究了溶液表面处理对AlGaN欧姆接触的影响及机理。用氟硝酸(HNO3+HF)、稀盐酸(HCl)和硫代乙酰胺(CS3CSNH2)溶液处理AlGaN表面后,Ti/Al/Ti/Au电极的比接触电阻率有显著的降低。样品表面Ga3d与O1s的X射线光电子能谱(XPS)测试结果显示:氧元素含量明显降低,表明这三种溶液可以有效地去除AlGaN表面氧化层,其中CS3CSNH2效果最佳;Ga3d峰位在表面处理后发生蓝移现象,相当于AlGaN表面处的费米能级向导带一侧移动,使电子在隧穿过程中的有效势垒高度降低。以上两个因素均对优化AlGaN/GaN欧姆接触有十分重要的意义。 相似文献
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研究了调制掺杂 Alx Ga1 - x N/Ga N表面 Pt肖特基接触的制备工艺 ,并对其进行了 I-V测量。通过改变对样品表面的处理工艺 ,研究了表面处理对调制掺杂 Alx Ga1 - x N/Ga N表面 Pt肖特基结接触特性的影响 ,在 n型掺杂浓度为 7.5× 1 0 1 7cm- 3的 Al0 .2 2 Ga0 .78N样品表面 ,制备得到了势垒高度为 0 .94e V、理想因子为 1 .4的 Pt肖特基接触。这与国外报道的结果接近 (=1 .2 e V,n=1 .1 1 [1 ] ) 相似文献
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Surface treatment plays an important role in the process of making high performance AlGaN/GaN HEMTs. A clean surface is critical for enhancing device performance and long-term reliability. By experimenting with different surface treatment methods, we find that using UV/ozone treatment significantly influences the electrical properties of Ohmic contacts and Schottky contacts. According to these experimental phenomena and Xray photoelectron spectroscopy surface analysis results, the effect of the UV/ozone treatment and the reason that it influences the Ohmic/Schottky contact characteristics of AlGaN/GaN HEMTs is investigated. 相似文献
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Yuan Tingting Liu Xinyu Zheng Yingkui Li Chengzhan Wei Ke Liu Guoguo 《半导体学报》2009,30(12):124001-124001-3
Surface treatment plays an important role in the process of making high performance AIGaN/GaN HEMTs. A clean surface is critical for enhancing device performance and long-term reliability. By experiment-ing with different surface treatment methods, we find that using UV/ozone treatment significantly influences the electrical properties of Ohmic contacts and Schottky contacts. According to these experimental phenomena and X-ray photoelectron spectroscopy surface analysis results, the effect of the UV/ozone treatment and the reason that it influences the Ohmic/Schottky contact characteristics of A1GaN/GaN HEMTs is investigated. 相似文献
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工艺制作源漏电极为Ti/Al/Ti/Au,并在氮气气氛中对其进行快速退火,研究不同退火条件对欧姆接触的影响。具体实验过程如下:将溅射好源漏电极的外延片分为5部分,其中3片分别在700℃,750℃和800℃下快速退火30s,并相互对比得出最佳退火温度,实验结果发现750℃条件下欧姆接触最好;其余2片在750℃下分别退火25s和40s,并与前边实验750℃ 30s情况下欧姆接触比较,得出最佳退火时间为30s。我们使用传输线模式计算出电极与外延片的欧姆接触电阻率,在750℃ 30s的快速退火条件下得到最低欧姆接触电阻率为0.54 Ω mm,与其余条件下结果比较具有较好的表面形貌和边缘。从实验中我们也得到随着退火温度和退火时间的提高,欧姆接触电阻率先降低到达最低点然后开始升高的现象,为寻找GaN HEMT欧姆接触最佳条件提供了一定依据。 相似文献
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T. LalinskýG. Vanko A. VinczeŠ. Haš?ík J. Osvald D. DonovalM. Tomáška I. Kosti? 《Microelectronic Engineering》2011,88(2):166-169
The effect of fluorine interface redistribution on dc and microwave performances of SF6 plasma-treated AlGaN/GaN high-electron mobility transistors (HEMTs) was investigated. Selective SF6 plasma treatment of the AlGaN/GaN HEMT gate interface yielded increases in the current gain cut-off frequency (fT) and maximum frequency of oscillation (fmax) of almost 60%. Annealing induced fluorine interface redistribution showed a low impact on the electron drift mobility and a negligible impact on the peak transconductance of the HEMTs. A large impact of the fluorine interface redistribution was observed for the threshold voltage and sheet carrier concentration of two-dimensional electron gas (2DEG). Consequently, it led to a decrease in the fT and fmax values, but the values were still higher than those of conventional reference HEMTs. 相似文献
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高性能1mm AlGaN/GaN功率HEMTs研制 总被引:3,自引:4,他引:3
报道了基于蓝宝石衬底的高性能1mm AlGaN/GaN HEMTs功率器件.为了提高微波功率器件性能,采用新的欧姆接触和新型空气桥方案.测试表明,器件电流密度为0.784A/mm,跨导197mS/mm,击穿电压大于40V,截止态漏电较小,1mm栅宽器件的单位截止频率达到20GHz,最大振荡频率为28GHz,功率增益为11dB,功率密度为1.2W/mm,PAE为32%,两端口阻抗特性显示了在微波应用中的良好潜力. 相似文献
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The gate forward leakage current in AlGaN/GaN high electron mobility transistors(HEMTs) is investigated. It is shown that the current which originated from the forward biased Schottky-gate contributed to the gate forward leakage current.Therefore,a fluorine-plasma surface treatment is presented to induce the negative ions into the AlGaN layer which results in a higher metal-semiconductor barrier.Consequently,the gate forward leakage current shrinks.Experimental results confirm that the gate forward leakage current is decreased by one order magnitude lower than that of HEMT device without plasma treatment.In addition,the DC characteristics of the HEMT device with plasma treatment have been studied. 相似文献