超细晶工业纯钛的变形、应变速率敏感性和激活体积

在温度为250~450 ℃、应变速率为1×10-4-1 s-1的条件下,对超细晶工业纯钛进行变速率压缩实验,计算超细晶工业纯钛的应变速率敏感性因子和激活体积,并研究超细晶工业纯钛的变形行为。研究结果表明：超细晶工业纯钛在稳态变形阶段存在流变软化效应,这是受变形过程中大角度晶界和位错活动所控制的。超细晶工业纯钛的应变速率敏感性因子和激活体积在数值上都相对较低,应变速率敏感性随着变形温度的升高而增加,但激活体积独立于变形温度。应变速率敏感性和激活体积的数值表明晶粒内部位错之间的交互作用几乎不发生,而位错与晶界之间的交互作用显著影响超细晶工业纯钛的塑性变形。     

超细晶工业纯钛的变形、应变速率敏感性和激活体积（英文）

在温度为250～450℃、应变速率为1×10~(-4)～1s~(-1)的条件下,对超细晶工业纯钛进行变速率压缩实验,计算超细晶工业纯钛的应变速率敏感性因子和激活体积,并研究超细晶工业纯钛的变形行为。结果表明:超细晶工业纯钛在稳态变形阶段存在流变软化效应,这是受变形过程中大角度晶界和位错活动所控制的。超细晶工业纯钛的应变速率敏感性因子和激活体积在数值上都相对较低,应变速率敏感性随着变形温度的升高而增加,但激活体积独立于变形温度。应变速率敏感性和激活体积的数值表明晶粒内部位错之间几乎无交互作用,而位错与晶界之间的交互作用显著影响超细晶工业纯钛的塑性变形。     

不同温度和应变速率下超细晶铝的力学行为

以99.9%的高纯铝为实验材料,利用等径通道转角挤压技术制备超细晶铝,研究其在77~473 K温度范围内的准静态和动态压缩力学性能,并研究晶粒细化对纯铝应变硬化行为及其温度和应变率敏感性的影响。结果表明:晶粒细化导致准静态压缩时纯铝应变硬化能力丧失,甚至在较高实验温度下出现应变软化。此外,材料力学行为的温度和应变率敏感性也显著升高。随着实验温度的升高,材料力学行为的应变率敏感性显著增大。     

常温下超细晶纯钛的制备及其力学性能

在等径通道角挤压法(ECAP)的基础上,通过对挤压试样的设计,提出一种铜包裹着钛棒的ECAP法,最终成功地制备了1、2、4道次超细晶钛,采用这种方法可以在很小的挤压力下实现UFG-Ti的制备。不但有效抑制了钛棒的碎裂,还避免了挤压杆失稳。通过光学显微镜(OM)、扫描电镜(SEM)、透射电镜(TEM)观察了各道次UFG-Ti的微观组织,并利用显微硬度计研究了其硬度变化。利用万能试验机和SHPB系统在不同应变率下进行了压缩试验。结果表明,常温下ECAP处理后纯钛的晶粒明显细化,力学性能显著提高,在准静态和动态压缩载荷作用下其流动应力(10%应变处)分别提升了71%和86%。最后研究了UFG-Ti的应变率敏感性,发现UFG-Ti的流动应力对应变率具有较低的依赖性。     

纯度对ECAP制备超细晶铜疲劳性能的影响

采用应力比R=–1的对称加载疲劳试验,研究了ECAP制备的超细晶高纯铜(HPCu)、低纯铜(LPCu)的疲劳行为,分析了循环应力-应变响应、疲劳寿命和疲劳前后晶粒取向分布,讨论了纯度与超细晶材料疲劳稳定性的关系。结果表明:在任何应力幅下,获得的超细晶低纯铜的寿命都大于ECAP变形前的粗晶铜;在相同应力幅下,循环周次提高1.6~2.0倍。而超细晶高纯铜的疲劳曲线,表现出不同的特性,在高应力幅下,超细晶高纯铜具有较高的疲劳寿命,但在低应力幅下,超细晶高纯铜循环周次下降,疲劳寿命低。在应力控制条件下,随应力幅的降低,超细晶纯铜的循环应力-应变响应从循环软化逐渐过渡为循环硬化。杂质的存在能有效阻止疲劳过程中晶粒的转动和位错的运动,降低其回复软化,减小相邻晶粒间取向差变化,使超细晶低纯铜与超细晶高纯铜相比有较大的循环硬化指数n和循环硬化系数K,具有较好的疲劳稳定性。     

120°模具室温ECAP制备工业纯钛的热压缩变形行为

在Gleeble-1500热模拟机上对室温120°模具等径弯曲通道变形(ECAP)制备的平均晶粒尺寸为200nm的工业纯钛(CP-Ti)进行等温变速压缩实验,研究超细晶(UFG)工业纯钛在变形温度为298～673K和应变速率为10-3～100s-1条件下的流变行为。利用透射电子显微镜分析超细晶工业纯钛在不同变形条件下的组织演化规律。结果表明:流变应力在变形初期随应变的增加而增大,出现峰值后逐渐趋于平稳;峰值应力随温度的升高而减小,随应变速率的增大而增大;随变形温度的升高和应变速率的降低,应变速率敏感性指数m增加,晶粒粗化,亚晶尺寸增大,再结晶晶粒数量逐渐增加;超细晶工业纯钛热压缩变形的主要软化机制随变形温度的升高和应变速率的降低由动态回复逐步转变为动态再结晶。     

应变比对复合细化超细晶纯钛低周疲劳行为的影响

采用等径通道弯曲挤压(Equal Channel Angular Pressing, ECAP)+旋锻(Rotary Swaging, RS)技术制备超细晶纯钛,细化后晶粒尺寸达到纳米级。在室温下对超细晶纯钛实施应变比分别为-1、-0.5、0.5的应变控制低周疲劳试验,通过TEM对微观组织观察。研究了应变比对材料循环硬化软化特性、循环应力应变关系及疲劳寿命的影响。研究结果表明,应变比增大使得超细晶纯钛循环硬化现象更为显著,应变比越大超细晶纯钛低周疲劳寿命越低。低周疲劳高应变比情况下亚晶晶粒尺寸小,数量多,阻碍位错运动,使得材料发生循环硬化。     

复合细化超细晶纯锆动态再结晶模型研究（英文）

采用Gleeble-3800热模拟试验机对晶粒尺寸为200～250nm的复合细化超细晶纯锆在变形温度为300～450℃,应变速率为0.001～0.05 s-1的范围内进行单向热压缩实验。结果表明:热加工参数对超细晶纯锆流动应力影响很大。通过实验数据以及显微组织分析可知,在较高的变形温度和较低的应变速率下更容易发生动态再结晶;构建了超细晶纯锆的临界应变模型,得出其温度补偿应变速率因子Z与εc (临界应变),σc (临界应力),εp (峰值应变)和σp (峰值应力)间的关系;建立了超细晶纯锆动态再结晶体积分数模型,可以看出其动态再结晶发生的阶段为应变0.1～0.45。     

120°模具室温ECAP制备工业纯钛的压缩变形本构关系

在Gleeble-1500热模拟机上对120°模具室温Bc方式ECAP变形8道次制备的平均晶粒尺寸约为200 nm的工业纯钛进行等温变速压缩实验,研究超细晶工业纯钛在变形温度为298~673 K和应变速率为1×10-4~1×100s-1条件下的流变应力行为。结果表明:变形温度和应变速率均对流变应力具有显著影响,峰值应力随变形温度的升高和应变速率的降低而降低;流变应力在变形初期随应变的增加而增大,出现峰值后逐渐趋于平稳,呈现稳态流变特征。采用双曲正弦模型确定了超细晶工业纯钛的变形激活能Q=104.46 kJ/mol和应力指数n=23,建立了相应的变形本构关系。     

不同温度下超细晶铜的准静态压缩力学行为

利用电子万能实验机对超细晶铜(UFG-Cu)进行温度范围为77～573 K的准静态压缩实验(应变率为1×10-3s-1),研究温度对材料流动应力和应变硬化行为的影响.结果表明:与退火粗晶铜相比,超细晶铜在压缩过程中的流动应力显著增大,但是由于材料的位错密度已经饱和,其应变硬化能力却几乎丧失,应变硬化率对应变和温度的依赖...     

罐用铝材高温流变应力行为的研究

用热模拟试验方法对压力罐用铝材(简称"铝原块")进行热压缩变形,探讨了熔体处理和变形条件对该材料高温流变应力行为的影响.结果表明:经不同熔体处理的铝原块均存在稳态流变特征;应变速率达10.00s-1时,流变曲线上均出现峰值应力,即该材料出现了动态再结晶;稳态变形阶段的流变应力与应变速率或变形温度分别满足双曲正弦函数关系和Arrhenius关系;与未处理的、常规处理的铝原块相比,经高效熔体处理的铝原块的真应力值及进入稳态阶段所对应的真应变值均较小,热变形激活能也有较明显的降低;此外还求出经高效熔体处理的铝原块的高温流变应力方程.     

Research on flow stress of spray formed 70Si30Al alloy under hot compression deformation

1. Introduction New spray formed 70Si30Al alloy developed for electronic packaging application has excellent physical characteristics [1-5], which include low coefficiency of thermal expansion (6.8 × 10?6/K), high thermal conductivity (120 W/(m?K)), and low density (2.4 g/cm3), therefore, the exploitation and application of the alloy have an extensive prospect. To evaluate the deformation characteristics of spray formed 70Si30Al and to determine the appropriate hot deformation procedure of …     

Research on flow stress of spray formed 70Si30Al ahoy under hot compression deformation

The flow stress of spray formed 70Si30Al alloy was studied by hot compression on a Gleeble- 1500 test machine. The experimental results indicated that the flow stress depends on the strain rate and the deformation temperature. The flow stress increases with an increase in strain rate at a given deformation temperature. The flow stress decreases with the deformation temperature increasing at a given strain rate. The relational expression among the flow stress, the swain rate, and the deformation temperature satisfies the Arrhenius equation. The deformation activation energy of 70Si30Al alloy during hot deformation is 866.27 kJ/mol from the Arrhenius equation.     

Compressive response and microstructural evolution of in-situ TiB2 particle-reinforced 7075 aluminum matrix composite

The hot forming behavior, failure mechanism, and microstructure evolution of in-situ TiB₂ particle-reinforced 7075 aluminum matrix composite were investigated by isothermal compression test under different deformation conditions of deformation temperatures of 300–450 °C and strain rates of 0.001-1 s^?1. The results demonstrate that the failure behavior of the composite exhibits both particle fracture and interface debonding at low temperature and high strain rate, and dimple rupture of the matrix at high temperature and low strain rate. Full dynamic recrystallization, which improves the composite formability, occurs under conditions of high temperature (450 °C) and low strain rate (0.001 s^?1); the grain size of the matrix after hot compression was significantly smaller than that of traditional 7075Al and ex-situ particle reinforced 7075Al matrix composite. Based on the flow stress curves, a constitutive model describing the relationship of the flow stress, true strain, strain rate and temperature was proposed. Furthermore, the processing maps based on both the dynamic material modeling (DMM) and modified DMM (MDMM) were established to analyze flow instability domain of the composite and optimize hot forming processing parameters. The optimum processing domain was determined at temperatures of 425-450 °C and strain rates of 0.001-0.01 s^?1, in which the fine grain microstructure can be gained and particle crack and interface debonding can be avoided.     

Effects of Strain Rate and Temperature on Mechanical Property of Nickel-based Superalloy GH3230

对航空发动机用新型镍基高温合金GH3230在不同温度和应变速率下进行了高温拉伸-断裂试验,分析了应变速率和温度对该合金高温力学性能的影响。结果表明,随着应变速率的增加和温度的下降,合金的塑性流动应力有所提高,加工硬化指数下降。从流变应力、应变速率和温度的相关性,得到应变速率敏感系数是一个独立于温度的常量,并计算出GH3230合金的变形激活能=441 kJ/mol。GH3230合金的热变形温度在1273 K左右时,合金在变形过程中能够充分再结晶,并得到晶粒细小、均匀的组织。SEM断口分析表明GH3230合金在高温下（1144~1273 K）应变率范围为10-3~10-1 s-1时的拉伸断裂都是由损伤引起的韧性断裂,且温度对断口形貌影响不大,但应变速率增大会使韧窝尺寸和深浅变小。     

Effect of temperature and grain size on the dominant diffusion process for superplastic flow in an AZ61 magnesium alloy

The effect of temperature and grain size on superplastic flow was investigated using a relatively coarse-grained (∼20 μm) Mg–Al–Zn alloy for the inclusive understanding of the dominant diffusion process. Tensile tests revealed that the strain rate was inversely proportional to the square of the grain size and to the second power of stress. The activation energy was close to that for grain boundary diffusion at 523–573 K, and was close to that for lattice diffusion at 598–673 K. From the analysis of the stress exponent, the grain size exponent and activation energy, it was suggested that the dominant diffusion process was influenced by temperature and grain size. It was demonstrated that the notion of effective diffusivity explained the experimental results.     

AZ31镁合金热变形流动应力预测模型

采用近等温单轴压缩实验获得了AZ3l镁合金变形温度为523 723 K,应变速率为0.01—10 s^-1条件下的流动应力,分析了变形温度和应变速率对流动应力的影响规律.结果表明,AZ31镁合金变形过程中发生了动态再结晶,523 K时形成细小组织;而723 K时动态再结晶和长大的晶粒沿径向拉长.考虑实验过程塑性变形功和摩擦功引起的温度升高,在高应变速率条件下采用温度补偿修正了流动应力.在此基础上,建立了基于双曲正弦模型的峰值流动应力和统一本构关系,该模型利用材料参数耦合应变来描述流动应力的应变敏感性,进一步获得了合金热变形过程中流动应力与变形温度、应变速率和应变的定量关系.采用该本构关系模型预测流动应力具有较高的精度,预测值与实测值相关系数为0.976,平均相对误差为5.07%,实验条件范围内预测的流动应力与实验值几乎能保持一致.     

BEHAVIOR OF FLOW STRESS OF ALUMINUM SHEETS USED FOR PRESSURE CAN DURING COMPRESSION AT ELEVATED TEMPERATURE

The behavior of flow stress of Al sheets used for pressure can prepared by different melt-treatment during plastic deformation at elevated temperature was studied by isothermal compression test using Gleeble1500 dynamic hot-simulation testing machine. The results show that the AI sheets possess the remarkable characteristic of steady state flow stress when they are deformed in the temperature range of 350-500℃ at strain rates within the range of 0.01-10.0s^-1. A hyperbolic sine relationship is found to correlate well the flow stress with the strain rate, and an Arrhenius relationship with the temperature, which implies that the process of plastic deformation at elevated temperature for this material is thermally activated. Compared with the AI pieces prepared by no or conventional melt-treatment, hot deformation activation energy of AI sheets prepared by high-efficient melt-treatment is the smallest （ Q= 168.0kJ/mol）, which reveals that the hot working formability of this material is very better, and has directly to do with the effective improvement of its metallurgical quality.     

Diffusional bonds in laminated composites produced by ECAP

The microstructure, diffusional and mechanical bonding behavior and microhardness distribution of laminated composites fabricated by ECAP process were investigated. Al-Cu and Cu-Ni laminated composites were produced by ECAP process up to 4 passes at room temperature and high temperature (300 °C). The results of microstructure characterization by SEM and shear strength test revealed that the joints between the layers of 4-pass ECAPed samples were considerably stronger than those of 1-pass ECAPed samples due to tolerating higher values of plastic deformations during ECAP. Furthermore, shear strength data showed that increasing ECAP temperature caused a notable increase in shear strength of the specimens. The reason lies in the formation of diffusional joint between the interface of both Al/Cu and Cu/Ni layers at high temperature. The shear bonding strength of ECAPed Cu/Ni/Cu composite at high temperature was remarkably higher than that of ECAPed Cu/Al/Cu composite.