Reduced Grain Size and Improved Thermoelectric Properties of Melt Spun (Hf,Zr)NiSn Half-Heusler Alloys

Half-Heusler thermoelectric materials Hf(/Zr)NiSn were prepared by levitation melting followed by melt-spinning to refine the boundary structures, and then they were consolidated by spark plasma sintering. X-ray diffraction analysis and scanning electron microscopy showed that single phased half-Heusler compounds without compositional segregation had been obtained. It was found that the thermoelectric properties, especially the thermal conductivity, depended strongly on the boundary structures. The melt-spinning samples with refined boundary structures had a lower thermal conductivity but a power factor comparable to that of the sample prepared by levitation melting, thus providing good thermoelectric properties.     

多步退火对(Pb,La)(Zr,Ti)O_3反铁电厚膜的影响

采用溶胶-凝胶技术,在Pt(111)/Ti/SiO2/Si(100)基底上制备Pb0.97La0.02(Zr0.95Ti0.05)O3反铁电厚膜材料,研究了单步和多步退火工艺对反铁电厚膜结构及电学性能的影响。结果表明:与传统的单步退火方式相比,多步退火工艺制备的反铁电厚膜材料晶粒尺寸较大,结构致密性好,室温下反铁电态更稳定,具有良好的择优取向度(100)、较高的介电常数(达529)和饱和极化强度(达42μC/cm2)。其反铁电-铁电和铁电-反铁电的相变电场强度分别为198和89 kV/cm,反铁电-铁电相变电流密度达2×10-5 A/cm2,多次退火工艺可提高反铁电厚膜的成膜质量。     

Na补偿的(Na,Bi)TiO3-Ba (Zr,Ti)O3无铅压电陶瓷

研究了(1-y)(Na0.5Bi0.5)TiO3-yBa(ZrxTi1-x)O3无铅压电陶瓷,获得压电应变常数d33高达185 pC/N的0.94(Na0.5Bi0.5)TiO3-0.06Ba(Zr0.055Ti0.945)O3压电陶瓷。添加0.04%摩尔过量Na2CO3的0.94(Na0.5Bi0.5)TiO3-0.06Ba(Zr0.055Ti0.945)O3高性能压电陶瓷d33高达195 pC/N。研究发现添加Na2CO3添加量至0.04%摩尔,Na起到软性添加物的作用,添加量超过0.04%,Na起到硬性添加物的作用.理论解释了过量Na的这一特性.为了降低介电损耗,对0.94(Na0.5Bi0.5)TiO3-0.06 Ba(Zr0.055Ti0.945)O3陶瓷进行了(Ce,Mn)掺杂改性研究。     

铁电存储器中Pb(Zr,Ti)O_3集成铁电电容的制备

在铁电不挥发存储器 (FERAM)技术中 ,集成铁电电容的制备是关键工艺之一。文中提出一种制备集成铁电电容的改进工艺 :采用 lift-off技术在衬底样品表面淀积铁电电容 Pt/Ti下电极 ,然后用 Sol-Gel方法制备 PZT薄膜。在 PZT薄膜未析晶前 ,先将它加工成电容图形 ,再高温退火成为 PZT铁电薄膜。最后完成铁电电容 Pt上电极。与传统工艺相比 ,改进后的工艺能保持 PZT铁电薄膜与金属上电极之间良好的接触界面。测试结果表明 ,工艺条件的变动不会影响 PZT铁电薄膜的成膜和结构 ,从而可得到性能优良的铁电电容。     

PZT铁电薄膜的印迹研究

印迹(Imprint)是造成铁电存储器失效的一个重要因素,通过分析不同厚度的PZT薄膜电容的界面层后认为,造成印迹的原因是上下电极与铁电薄膜之间界面层厚度的不同,导致了铁电薄膜表面极化钉扎状态的差异。矫顽电压偏移量对铁电薄膜的厚度依赖性,以及矫顽电压的偏移量随时间变化规律,很好地证实了笔者的设想。     

Properties of GaN(SiC)-(Ti,Zr)B x contacts subjected to rapid thermal annealing

Semiconductors - The effect of rapid thermal annealing on the structural and physical properties of Au-(Ti, Zr)B x -GaN(SiC) contacts and diode structures on their basis is investigated. The...     

PLZT薄膜的结构、介电与光学性能的研究

以硝酸镧、醋酸铅、钛酸丁酯和异丙醇锆为原料，乙二醇甲醚作溶剂。用简单的溶胶一凝胶法和快速退火工艺在Si(111)、石英和Pt／Ti／SiO2／Si(100)基片成功地制备出了高度多晶和(111)取向生长的(Pb，La)(Ti，Zr)O3(PLZT)薄膜。用原子力显微镜分析了薄膜的表面形貌；测试了薄膜的铁电和介电特性。PLZT薄膜的剩余极化强度和矫顽场分别为10．3μC／cm^2和36kV／cm；在100kHz，薄膜的介电常数和损耗因子分别为682和0．021。生长在石英基片上的薄膜具有好的透光性，当波长高于360nm，其透过率高达72％。     

(Ca,Sr)(Zr,Ti)O_3系抗还原高频介质瓷料的研究

采用固相合成法制备了(Ca,Sr)(Zr,Ti)O3(简称CSZT)系电容器陶瓷材料,研究了主晶相组分对所制材料介电性能的影响。结果表明:通过调整主晶相CSZT中各组分的配比,再加入适量的烧结助剂,能得到一种可在还原气氛中烧结的高频介质瓷料,该瓷料可与镍内电极共烧,其相对介电常数约为89,介质损耗(tanδ)小于5×10–4,绝缘电阻达到1012Ω,介电常数温度系数为–1 037×10–6/℃。     

Microstructure and domain configurations in ferroelectric PbTiO3 and Pb(Zr,Ti)O3 thin fims

Ferroelectric domain configurations in PbTiO₃ and Pb(Zr_xT_1−x)O₃ (PZT, x = 0.3 or 0.5) thin films have been studied by transmission electron microscopy. The PbTiOg and PZT thin films have been deposited by the ionized cluster beam technique and radio frequency sputtering, respectively. The grain size in these thin films is typically less than 0.5 μm. Lamellar 90°-domain features have been observed in both PbTiO₃ and PZT (30/70) samples. The domain walls correspond to the {011} twin boundaries. La-doping and Ca-modification are shown to affect the microstructure of the PZT films. No clear domain feature occurs in the PZT thin film that has composition near the morphotropic phase boundary. The effects of grain sizes are briefly discussed.     

sol-gel法制备锆钛酸钡薄膜的研究

采用sol-gel法在Pt/Ti/SiO2/Si衬底上制备了Ba(Zr0.3Ti0.7)O3(BZT)薄膜。对其先体溶液进行了差热与热失重曲线(DSC-TG)分析,并以此来确定了薄膜的热处理工艺。X射线衍射分析表明,550℃时开始有钙钛矿相生成,到600℃时,已经完全形成了钙钛矿结构。采用er、tgd的频率和偏压特性曲线研究了不同工艺条件下薄膜的介电性能。经过700℃热处理,薄膜在10 kHz频率,300 K温度测试条件下,相对介电常数为385,介质损耗为0.022;200103 V/cm电场条件下薄膜介电可调率为25.6%。     

Influences of embossing technology on Pb(Zr0.3,Ti0.7)O3 ferroelectric thin film

The ferroelectric random access memory (FRAM) which uses ferroelectric thin film as memory material is considered to be a candidate for the next generation memory application. In this work, we apply nano-embossing technology to fabricate Pb(Zr_0.3,Ti_0.7)O₃ (PZT) ferroelectric thin film nanostructures and investigate the influence of the patterning process on the material and ferroelectric properties by using SEM, XRD and Precision Ferroelectric Tester. Embossing process has been optimized for embossing depth and pattern profile. It was found that embossing will result in (1 0 0) preferred orientation of the PZT thin film. The electrical characteristics of patterned and un-patterned PZT films have been also studied for comparison.     

Sol-Gel processing of Nb-doped Pb(Zr,Ti)O3 thin films for ferroelectric memory applications

The ferroelectric properties of Nb-doped PZT thin films prepared by a sol-gel method were evaluated relative to memory device application requirements. Within the range of 0 to 4 mol %, Nb-doping of PZT compositions near the morphotropic phase boundary region (i.e. PZT 53/47) enhanced overall ferroelectric properties by reducing the te-tragonal distortion of the unit cell. A 4 mol % Nb-doped PZT 53/47 thin film (0.26 μm) had a coercivity of 8 V/ μm, a remanence ratio of 0.54, a switchable polarization of 45 μC/cm², and a specific resistivity of 3 x 10⁹ Ω-cm. Nb-doping levels in excess of 5 mol had a detrimental effect on the resulting thin film ferroelectric properties. X-ray diffraction (XRD) analysis of highly doped films showed development of a significant PbO phase accompanied by diffraction line broadening of the perovskite phase. As such, it was postulated that the creation of excessive lead vacancies in the PNZT lattice resulted in PbO accumulation at the grain boundaries which impeded grain growth, and hence, adversely affected ferroelectric switching performance. The fatigue performance of the sol-gel derived thin film capacitor system was a function of switching voltage. At switching fields sufficient to saturate the polarization, the endurance of the thin film capacitor was greater than 10⁹ cycles. Cycling with lower fields reduced endurance values, but in all cases, the switchable polarization decreased linearly with the logarithm of cycles. Nb-doping did not have a significant effect on the fatigue performance.     

Compositional design of Pb(Zr, Ti)O3 for highly reliableferroelectric memories

We have investigated Pb(Zr,Ti)O₃ (PZT) film composition suitable for highly reliable ferroelectric RAM (FeRAM) application. To obtain a wide operational margin for 2T/2C (two transistors and two capacitors) FeRAMs, the PZT film capacitor is needed to have a low coercive voltage (V_c) and a high dielectric constant on the polarization switching (ϵ_S) and a low dielectric constant on the nonswitching (ϵ_N), or essentially a large ϵ_S/ϵ_N ratio. Concerning the B-site composition in the perovskite structure, it is found that lowering the Zr/Ti ratio from 47/53 to Ti-richer ones increases the ratio of ϵ_S/ϵ_N as a positive effect on the wide operational margin, but increased V_c as a negative effect. Taking the balance of these factors into consideration, it is concluded that an optimum composition, such as Zr/Ti=30/70, provides the maximum operational margin. The A-site composition, on the other hand, affects the long-term reliability of a PZT capacitor. The endurance to the fatigue and imprint are enhanced by reduction of the Pb-excess and dope of La in the A-site. A La-doped PZT (Zr/Ti =30/70) capacitor is successfully integrated to the 8 kbit FeRAM macro with double-layer Al wiring to confirm the feasibility of this capacitor     

Fabrication of (Pb,La)(Zr,Ti)O/sub 3/ thin-film arrayed waveguide grating

The design and fabrication of an 8-ch, 500 GHz-spacing arrayed waveguide grating on (Pb,La)(Zr,Ti)O₃ has been successfully achieved for the first time. An insertion loss of 22.1 dB, including a 10 dB coupling loss, and an adjacent crosstalk of -23.1 dB have been obtained. The device is expected to be monolithically integrated into high-speed optical switches to form integrated chips such as a reconfigurable add-drop multiplexer     

Local electronic structure,optical bandgap and photoluminescence (PL) properties of Ba(Zr0.75Ti0.25)O3 powders

Ba(Zr_0.75Ti_0.25)O₃ (BZT-75/25) powders were synthesized by the polymeric precursor method. Samples were structurally characterized by X-ray diffraction (XRD), Rietveld refinement, X-ray absorption near-edge structure (XANES) and extended X-ray absorption fine structure (EXAFS) techniques. Their electronic structures were evaluated by first-principle quantum mechanical calculations based on density functional theory at the B3LYP level. Their optical properties were investigated by ultraviolet-visible (UV-Vis) spectroscopy and photoluminescence (PL) measurements at room temperature. XRD patterns and Rietveld refinement data indicate that the samples have a cubic structure. XANES spectra confirm the presence of pyramidal [TiO₅] clusters and octahedral [TiO₆] clusters in the disordered BZT-75/25 powders. EXAFS spectra indicate distortion of Ti–O and Ti–O–Ti bonds the first and second coordination shells, respectively. UV-Vis absorption spectra confirm the presence of different optical bandgap values and the band structure indicates an indirect bandgap for this material. The density of states demonstrates that intermediate energy levels occur between the valence band (VB) and the conduction band (CB). These electronic levels are due to the predominance of 4d orbitals of Zr atoms in relation to 3d orbitals of Ti atoms in the CB, while the VB is dominated by 2p orbitals related to O atoms. There was good correlation between the experimental and theoretical optical bandgap values. When excited at 482 nm at room temperature, BZT-75/25 powder treated at 500 °C for 2 h exhibited broad and intense PL emission with a maximum at 578 nm in the yellow region.     

Enhancing the Thermoelectric Properties via Modulation of Defects in P-Type MNiSn-Based (M = Hf,Zr, Ti) Half-Heusler Materials

The thermoelectric figure-of-merit (zT) of p-type MNiSn (M = Ti, Zr, or Hf) half-Heusler compounds is lower than their n-type counterparts due to the presence of a donor in-gap state caused by Ni occupying tetrahedral interstitials. While ZrNiSn and TiNiSn, have been extensively studied, HfNiSn remains unexplored. Herein, this study reports an improved thermoelectric property in p-type HfNi_1−xCo_xSn. By doping 5 at% Co at the Ni sites, the Seebeck coefficient becomes reaching a peak value exceeding 200 µV K⁻¹ that breaks the record of previous reports. A maximum power factor of ≈2.2 mW m⁻¹ K⁻² at 973 K is achieved by optimizing the carrier concentration. The enhanced p-type transport is ascribed to the reduced content of Ni defects, supported by first principle calculations and diffraction pattern refinement. Concomitantly, Co doping also softens the lattice and scatters phonons, resulting in a minimum lattice thermal conductivity of ≈1.8 W m⁻¹ K⁻¹. This leads to a peak zT of 0.55 at 973 K is realized, surpassing the best performing p-type MNiSn by 100%. This approach offers a new method to manipulate the intrinsic atomic disorder in half-Heusler materials, facilitating further optimization of their electronic and thermal properties.     

Ba(Ti0.91Zr0.09)O3陶瓷介电弛豫现象的研究

采用固相反应法制备了CuO-BaO掺杂的Ba(Ti0.91Zr0.09)O3陶瓷,研究了掺杂量对陶瓷介电性能的影响。结果表明:随着CuO-BaO混合物掺杂量从0.3%增加到1.0%时,Ba(Ti0.91Zr0.09)O3陶瓷的斜方-四方相变峰出现介电弛豫现象并且弛豫程度Δtm′从2.9增加到5.5,相变温度从+5℃移动到–21℃,室温εr从2841增加到3372,并且高于四方-立方相变点的εr。电滞回线变窄,矫顽场变小,呈现典型弛豫型铁电体的特征。     

Pb(Zr0.3Ti0.7)O3热释电薄膜材料研究

利用射频磁控溅射法对0.8Pb(Zr0.3Ti0.7)O3+0.2PbO的陶瓷靶进行溅射,在5英寸的TiOx/Pt/Ti/SiO2/Si基片上制备出了PZT薄膜.实验表明,PZT薄膜的取向由(111)到(100)的改变可以通过精确控制基片温度来实现.(111)取向的薄膜具有良好的介电、铁电和热释电性能,其剩余极化强度、介电常数、介电损耗、矫顽场和热释电系数分别为20μC/cm2,370,1.5%,130kV/cm和1.1×10-8C/cm2K,该薄膜可望在非制冷红外焦平面探测器阵列中得到应用.     

Effect of interconnect layer on Pb(Zr,Ti)O3 thin filmcapacitor degradation

Ferroelectric properties of a Pb(Zr,Ti)O₃ (PZT) thin film capacitor with a conventional Al/TiN/Ti interconnect layer are seriously degraded by annealing at around 400°C. The degradation is observed even if a contact hole on the top electrode is not formed. This indicates that the cause of the degradation is not the diffusion of the interconnect material into the PZT film, and this is confirmed by secondary ion mass spectrometry. We suggest that it is the thermal strain of the interconnect layer which imposes tensile stress on the PZT film during the annealing that degrades the ferroelectric properties of the PZT capacitor     

锆钛酸铅成分梯度薄膜的介电及铁电性能研究

采用溶胶-凝胶(Sol-Gel)法,通过快速热处理,在Pt/Ti/SiO2/Si衬底上制备出Pb(Zr,Ti)O3成分梯度薄膜。经俄歇微探针能谱仪(AES)对制备的上梯度薄膜进行了成分深度分析,结果证实其成分梯度的存在。经XRD分析表明,制备的梯度薄膜为四方结构和三方结构的复合结构,但其晶面存在一定的结构畸变。经介电温谱测试表明,随着温度的升高,梯度薄膜出现一个铁电-铁电相变点和两个居里点,同时出现一定的频率弥散现象。经-εV特性曲线测试表明,梯度薄膜的介电常数-电压(-εV)及介质损耗-电压(tan-δV)曲线呈现典型的双峰特性,并且左右不对称。经不同偏压下电滞回线的测试表明,梯度薄膜表现出良好的铁电性质。