Growth behavior of electroless copper on silicon substrate

The growth behavior containing deposit morphology, growth rate, activation energy, and growth mechanism of copper on silicon substrate, especially at the initial stage, in the electroless plating process was studied. Copper was deposited on the surface of the silicon substrate in an electloless plating bath containing formalin （CH2O 37vol%） as a reducing agent at a pH value of 12.5 and a temperature of 50-75℃. The copper deposit was characterized using a field emission scanning electron microscope and transmission electron microscope. The results showed that after the activation process, nanoscale Pd particles were distributed evenly on the surface of the silicon; in the deposition process, copper first nucleated at locations not only near the Pd particles but also between the Pd particles; the growth rate of electroless Cu ranged from 0.517 nm/s at 50℃ to 1.929 nm/s at 75℃. The activation energy of electroless Cu on Si was 52.97 kJ/mol.     

Electroless plating of carbon nanotubes and their millimeter-wave absorbing properties

A method of electroless plating was utilized to deposit Cu, Ni, Co, Ag on the surface of carbon nanotubes (CNTs) respectively, in order to prepare millimeter-wave absorbing materials. Field emission scanning electron microscope (FE-SEM) and energy dispersive spectrometer (EDS) were used to observe morphologies and chemical compositions of the samples respectively. Millimeter-wave radiometer imaging detection was employed to measure the absorbing properties of the samples. FE-SEM and EDS results demonstrate the effectiveness of successful metal deposition. The results of millimeter-wave radiometer imaging detection reveal that the millimeter-wave absorbing properties of electroless-silver plating are better than other kinds of samples.     

高分子材料表面化学镀银工艺的研究

研究了高分子材料表面化学镀银工艺 ,筛选出沉积速度高 ,稳定性好的工艺配方。用此配方在用高分子材料制成的球囊表面镀银 ,可获得具有临床使用价值的介入疗法球囊电极     

Mechanism and Microstructure of Electroless Ni-Fe-P Plating on CNTs

Electroless Ni-Fe-P alloy plating on the surface of CNTs was carded out with a bath using citrate salt and lactic acid as complex agents. We proposed a chemical reaction mechanism. The morphology, structure and chemical composition of the Ni-Fe-P/CNTs were studied with the aid of a scanning electronic microscope （SEM）, X-ray diffraction （XRD） and an energy-dispersive X-ray spectral analysis （EDS）. The results show that through a correct pre-treatment and electroless plating, Ni-Fe-P/CNTs composite particles can be obtained. The optimum electroless plating parameters of 35-42℃ and pH of 8.5-9.7 were achieved. The as-plated Ni-Fe-P alloy is amorphous. After a heat treatment at 500℃ for 90 min in H2, the coating is transformed into crystalloid Ni3E Fe2NiP and （Fe,Ni）3R The Ni-Fe-P alloy coating on the surface of CNTs is smooth and unique. The amount of Ni on the surface （mass fraction） of the Ni-Fe-P/CNTs composite particles is 29.13%, that of Fe 3.19% and that of P 2.28%.     

化学镀法制备钴包覆碳化硅复合粉末的研究

采用化学镀法制备钴包覆碳化硅复合粉末,通过研究化学镀过程中钴盐浓度、还原剂浓度、络合剂浓度、缓冲剂浓度、温度以及pH值等因素对沉积速率的影响规律,得到化学镀钴的优化条件。利用XRD、SEM和EDAX等测试手段对该复合粉末的组分及形貌进行了表征。实验和表征结果表明,当硫酸钴浓度为30～50g/L,次磷酸钠浓度为40g/L,柠檬酸钠浓度为60～70g/L,控制温度为50～70℃以及调节pH值等于8时,镀层沉积速度较快,所得粉体表面被钴均匀包覆。     

The effect and mechanism of Nano-Cu lubricating additives on the electroless deposited Ni-W-P coating

The coating and deposition process with excellent anti wear and suitable for industrial application were developed, and the optimum bath composition and process were obtained by studying the influence of the bath composition, temperature and pH value on the deposition rate and the plating solution stability. Moreover, the tribological properties of nano-Cu lubricating additives and electroless deposited Ni-W-P coating as well as their synergistic effect are researched using ring-block abrasion testing machine and energy dispersive spectrometer. Research results show that Ni-W-P alloy coating and nano-Cu lubricating additive have excellent synergistic effect, e g, the wear resistance of Ni-W-P alloy coating (with heat treatment and the oil with nano-Cu additives) has increased hundreds times than 45 steel as the metal substrate with the basic oil, and zero wear is achieved, which breaks through the bottleneck of previous separate research of the above-mentioned two aspects.     

The linear regression method for improving magnetic parameter of the electroless CoFeB films

The kinetics equation of deposition rate was implemented to help explain some of the mechanisms responsible for structures observed during the deposition of CoFeB films on poly-ester plastic. The plating rate of electroless CoFeB films is a function of concentration of sodium tetrahydroborate, pH of the plating bath, plating temperature and the metallic ratio. The estimated regression coefficient, confidence interval, residual error and confidence interval were confirmed by computer program. The optimal composition of the plating bath was obtained and the dynamic electromagnetic parameters of films were measured in the 2-10 GHz range. At 2 GHz, the permeability, magnetic loss of the electroless CoFeB films were 304,76.6 respectively as the concentration of reducer is 1 g·L^-1.     

仿生自清洁金属纤维过滤材料

基于土壤生物体表的脱附特性和以荷叶为代表的生物体表的自清洁特性,通过化学涂镀的方法在金属纤维表面制备Ni-P合金镀层,对仿生金属纤维自清洁过滤材料进行了研究。应用X射线衍射仪(XRD)研究了镀层的晶体结构和晶粒尺寸,应用扫描电子显微镜(SEM)和透射电子显微镜(TEM)观察了镀层的表面结构和表面形貌特征,应用光学接触角测量仪(OCAM)测量了金属丝网表面的水接触角(WCA),并对纤维材料过滤效率和压降进行了讨论。实验结果表明,经过表面处理后的仿生金属丝网过滤材料表面润湿特性得到了明显的改善,压降没有大幅度的增加,过滤效率得到了一定程度的提高。     

Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine.     

化学镀Ni-B工艺的研究

介绍了一种稳定性高、沉积速度快的酸性化学镀 Ｎｉ－Ｂ工艺．研究了镀液组成成分及工艺条 件对镀层沉积速度的影响,提出了化学镀Ｎｉ－Ｂ合金的最佳镀液组成和工艺条件,结果表明：该镀 层附着性好,经一定热处理后具有很高硬度、耐磨性和耐蚀性     

碳酸钙粉体无钯活化化学镀银研究

采用无钯活化粉体化学镀技术制备了银包碳酸钙导电粉体.探讨了表面处理和PH值对沉积效果的影响,以及复合粒子的结合强度.通过扫描电镜(SEM),X射线能量色散谱仪(EDS)和X射线衍射(XRD)对复合粉体进行表面形貌分析和成分测试.结果表明:碳酸钙粉体经WD-50表面处理后,生成的银粒子粒径较小,对碳酸钙粒子的包覆均匀致密.随着镀液pH值的升高,银的析出量增大,粉体表观颜色变浅.调节镀液pH至13.0,得到了镀层结合强度高的银包碳酸钙复合粉体.     

Ni—Cu—P镀层在氢氟酸溶液中的耐蚀性研究

为了改善20R钢在氢氟酸介质中的耐蚀性,采用化学镀技术在该材料表面制备了Ni—Cu—P三元合金镀层。通过金相显微镜和X射线衍射观察和分析了镀层的表面形貌和组成,通过浸泡法、电化学系统测试了20R钢和镀层在氢氟酸溶液中的腐蚀性能。结果表明：Ni—Cu—P镀层能顺利地在20R钢表面发生沉积,镀层光滑、致密、无裂纹,阻隔了氢氟酸与20R钢的直接接触。镀层在氢氟酸溶液中更容易发生钝化,具有一定的耐蚀性能。     

Metallization of bacteria cells

Biomaching is a new processing method. The feasibility of bioremoving forming has been confirmed by machining metals using physiology of Thiobacillus ferrooxidan [1—4]. A new branch of biomachining, biolimited-forming technology, is presented in this paper. In this method, bacteria cells are used as templates to fabricate monomers with certain mechanical, electrical or magnetic characters by an electroless deposition technique, and then these monomers are to be manipulated or arranged to form…     

酸性镀液铝合金表面沉积Ni-Mo-P三元合金非晶镀层

采用酸性化学镀液在铝合金表面沉积Ni-Mo-P三元合金非晶镀层。利用透射电镜（TEM）、场发射扫描电镜（FESEM）、X射线衍射分析（XRD）、能谱（EDS）等现代分析手段,对镀层显微结构进行了表征,探讨了钼酸钠浓度和热处理对镀层纳米压痕硬度的影响。结果表明,镀态下,化学镀Ni-Mo-P三元合金镀层为致密非晶态镀层,镀层中Mo元素分布均匀,镀层与基体结合良好。热处理可促使非晶镀层晶化,产生Ni和Ni3P晶相,获得了纳米压痕硬度为15.12 GPa的最大值。     

镁合金镀镍磷合金及无铬前处理工艺

AZ91D镁合金首先在无铬的磷酸盐溶液中磷化,然后在硫酸盐镀液中镀镍磷合金。用SEM和XRD对磷化膜的化学组成及微观结构进行了表征,探讨了磷化膜及镍磷合金镀层的形成机理。结果表明:磷化膜主要由Zn3(PO4)2.4H2O和单质锌组成,金属锌粒子作为进一步镀镍磷合金的形核催化剂;磷化液中的间硝基苯磺酸钠使磷化膜的一部分微阳极区变为微阴极区,增加了磷化膜的成膜速度并细化了磷化膜结晶;在含4.0 g/L间硝基苯磺酸钠的磷化液中得到的磷化膜上沉积的镍磷合金镀层致密均匀,有较高的耐蚀性,镀层的附着强度符合ISO 2819的要求。     

玻璃表面化学镀纳米铜膜

利用化学镀铜工艺,以十二烷基苯磺酸钠(SDBS)作为镀液添加剂,在未经刻蚀的玻璃表面制备了纳米铜膜。采用FESEM、SEM和XRD等技术对铜膜表面、断面形貌及晶体结构进行了表征。结果表明,铜膜内团簇尺寸非常细小,晶粒尺寸约为15.5~28.3 nm,且存在较强的〈111〉织构。采用四探针法测量铜膜的电阻率,并讨论了电阻率随沉积时间增加而逐渐下降的原因。     

涤纶织物化学镀铜镍合金研究

选用次亚磷酸钠作还原剂,用化学镀的方法制备了铜镍合金化涤纶织物。用X射线衍射法、扫描电镜等分析了镀层结构,并探讨了施镀条件对镀层结构的影响。结果表明：铜镍合金化织物具有良好的耐磨性、优良的导电性和电磁波屏蔽性能。     

氟塑料表面化学镀镍及镀层性能的研究

采用化学镀工艺在氟塑料表面成功获得了Ni-P镀层。通过扫描电镜(SEM)、X射线衍射仪(XRD)、能谱分析仪(EDS)和电化学工作站对镍镀层的形貌、生长方式、组成、结构、耐腐蚀性和电化学阻抗进行分析表征。实验结果表明,镀层均匀、致密、性能良好。镀层明显改善了氟塑料膜的导电性。在200～250℃下进行热处理有利于提高镀层晶化程度,改善镀层导电性。通过静态腐蚀试验和电化学测试表明镀层耐腐蚀性良好。     

电镀镍磷合金老化镀液资源化利用的研究

电镀老化液中含有重金属,属于危险废液。文章提出了一种处理电镀镍磷合金老化镀液的新方法,该方法可将电镀老化液转化为可用的化学镀液。研究了转化镀液的镍离子浓度对沉积速度及稳定性的影响,确定了转化镀液的优化配比,测试了镀层的结合力及镀层断面不同测点的显微硬度,观察了镀层表面及断面的微观形貌。结果表明,镀层具有合格的结合强度和中等的硬度,致密平滑,磷含量稳定。     

阴极脉冲电流作用下的Ni－P合金化学镀过程

研究了Ｍｉ－Ｐ合金脉冲化学镀过程，找出了镀层Ｐ含量，镀速和脉冲电流参数，温度的关系。由于脉冲电流的作用，可以减缓镀液中亚磷酸盐的积累，并且Ｐ的化学沉积过程也得到加速。