含羟基聚酰亚胺薄膜的制备

以2,2-双[4-(3,4-二羧基苯氧基)苯基]丙二酐(BPADA)、羟基二胺、含氰基二胺(CNDA)为原料,在160℃且不添加化学脱水剂的情况下,制备了含羟基聚酰亚胺(CN-OH-PI)薄膜,并通过傅里叶变换红外光谱、核磁共振氢谱、差示扫描量热法和热重分析等手段研究了其结构和性能。结果表明:成功合成了CN-OH-PI,将其与以BPADA和CNDA为原料制备的含氰基聚酰亚胺(CN-PI)对比,在300℃条件下热处理12.0 h后,CN-OH-PI的玻璃化转变温度比CN-PI提高约20℃。     

封端型低膨胀聚酰亚胺薄膜的制备及性能研究

以均苯四甲酸二酐（PMDA）、3,3’,4,4’-联苯四甲酸二酐（s-BPDA）为二酐单体,对苯二胺（p-PDA）、4,4’-二氨基二苯醚（ODA）为二胺单体,偏苯三酸酐（TMA）为封端剂,共聚制备了封端型聚酰亚胺（PI）浆料,并经热亚胺化得到封端型耐高温聚酰亚胺薄膜。利用傅里叶红外光谱对材料的化学结构进行了表征,研究了聚酰亚胺薄膜的热学性能和力学性能。结果表明,薄膜完全亚胺化,且末端羧基在升温过程中脱羧产生联苯键交联结构。此外,随着封端含量的增多,聚酰亚胺薄膜的耐热性能和力学性能得到改善。与未封端的聚酰亚胺薄膜相比,封端型耐高温聚酰亚胺薄膜的玻璃化转变温度上升8～15℃,1%热失重温度提高了10～24℃,而且热膨胀得到抑制,PI-8薄膜的线性热膨胀系数仅为4.16×10-6/℃。     

共聚与机械共混对PMDA/ODA型聚酰亚胺性能的影响

针对均苯四甲酸二酐/二氨基二苯醚(PMDA/ODA)型聚酰亚胺(PI)难以溶解或熔融、柔韧性较差,以1,3-双(4氨-基苯氧基)苯(BAPB134)、ODA和PMDA为原料,通过共缩聚和机械共混分别制备了一系列共聚聚酰亚胺(CoPI)和共混聚酰亚胺。采用IR、TGA、DSC、XRD和拉伸等手段,对其结构和性能进行了研究。结果表明,CoPI薄膜为非晶态结构,玻璃化转变温度和起始分解温度分别在322℃和544℃以上,断裂伸长率由12%平均提高到54%,拉伸强度均超过100 MPa,但弹性模量平均降低了29%;共混PI的聚集态结构和性能与PMDA/ODA型PI相近。     

含氰基聚酰亚胺的合成

通过对3,3′,4,4′-联苯四甲酸二酐(BPDA)进行酯化、溴代、氰基取代、水解以及脱水闭环系列反应,合成了侧链含氰基的新型对称二酐——2,2′-二氰基联苯四甲酸二酐,将其与4,4′-二氨基二苯醚(ODA)通过两步法制备了侧链含氰基的聚酰亚胺(PIDC).PIDC的结构与性能由傅里叶变换红外光谱仪、差示扫描量热仪和热重分析仪表征.结果表明:直接由BPDA和ODA通过两步法制备的聚酰亚胺在大多数有机溶剂中不溶,而室温下PIDC在极性非质子溶剂N-甲基吡咯烷酮、二甲基亚砜、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺中溶解性能良好;氰基的引入使聚酰业胺的玻璃化转变温度由266℃增至303℃,氮气氛围下失重5％的温度提高至523℃.     

三元共聚无氟芳香族透明聚酰亚胺合成及性能

以N,N-二甲基乙酰胺为溶剂,用芳香族二胺4,4′-二氨基二苯醚(ODA)与不同比例的2个芳香族二酐4,4′-联苯四甲酸二酐(BPDA)、双酚A型二醚二酐(BPADA)制备三元共聚无氟芳香族透明聚酰亚胺(PI)薄膜。用傅里叶变换红外光谱仪(FTIR)表征PI结构,用差示扫描量热仪(DSC)、热重分析仪(TG)、阻抗分析仪、紫外-可见分光光度仪(UV-VIS)研究PI薄膜的热性能、介电性能和透光率。结果表明：三元共聚PI薄膜玻璃化转变温度高于210.0℃;热失重5%的温度高于480.0℃;在可见光范围内透明性良好,PI薄膜在465 nm处透光率均超过80.0%,最高可达85.5%;相对介电常数为1.728 1～2.987 2,介电损耗为0.002 9～0.014 3。     

含苯并噁唑结构共聚酰亚胺的合成及其性能

联苯四羧酸二酐(BPDA)与4,4′-二氨基二苯醚(ODA)及自制的2,6-二(对氨基苯)苯并[1,2-d;5,4-d']二噁唑(DAPBBO)在二甲基乙酰胺中共聚,然后进行铺膜和热酰亚胺化,得到了含有双苯并噁唑的共聚酰亚胺薄膜,对其结构、热性能、力学性能及光学性能进行了表征。结果表明:杂环单体的引入提高了聚酰亚胺的力学性能,增加了聚酰亚胺的玻璃化转变温度,并且使聚酰亚胺薄膜具有良好的紫外吸收能力。     

2L-FCCL用聚酰亚胺复合膜的制备与性能

采用2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)、4,4′-二氨基二苯醚(ODA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)合成BAPP/ODA/BTDA型聚酰亚胺(PI)的前驱体聚酰胺酸(PAA)溶液,将该溶液涂覆于3,3′,4,4′-联苯四甲酸二酐(BPDA)/ODA型PI基膜上,通过去溶剂和热亚胺化制备PI复合膜,将复合膜的热塑面与铜箔复合,热压制得二层挠性覆铜板(2L-FCCL)。研究了BAPP/ODA/BTDA型PI、BPDA/ODA型PI、PI复合膜及2L-FCCL的性能。结果表明:BAPP/ODA/BTDA型PI薄膜的玻璃化转变温度为238℃,耐热性能优异,PI复合膜在280℃,15MPa下与铜箔层压50~60min制得的2F-FCCL剥离强度大于0.8N/mm,且经360℃焊锡浴测试未分层、未起泡,耐热性能和剥离强度均满足工业要求。     

共聚共混改性聚酰亚胺的摩擦磨损性能研究

为了改善传统均苯四甲酸酐(PMDA)–4,4′-二胺基二苯醚(ODA)型聚酰亚胺(PI)的摩擦性能,分别以共聚和共混两种方式,引入柔性二胺单体芳香杂环二胺(DAMI),从分子结构制备不同ODA/DAMI物质的量之比的共聚和共混改性PI。并用摩擦磨损试验机、扫描电子显微镜、万能试验机以及X射线衍射仪等分析共聚和共混改性PI的结构和性能。结果表明,当ODA/DAMI物质的量之比分别为3∶1和5∶1时,共聚和共混改性PI具有最优的综合摩擦磨损性能,摩擦系数分别为0.273和0.280,磨损率分别为9.28×10–14,11.2×10–14 m3/(N·m)。共聚改性PI的摩擦系数随摩擦时间的增加变化比较稳定,其在兼顾磨损率和摩擦系数方面比共混改性PI更具优势。共聚和共混法改性PI磨损机理相似,主要为粘着磨损、磨粒磨损和疲劳磨损。随DAMI含量增加,两种改性PI的拉伸强度、拉伸弹性模量和玻璃化转变温度均呈下降趋势,当DAMI含量较高时,两种改性PI结晶取向增加,磨损率急剧升高。     

含硅聚酰亚胺的合成及性能研究

合成了一类含硅二胺双氨丙基四甲基二硅氧烷,并将其与芳族二胺和芳族四酸二酐共聚,得到了一系列不同配比的含硅聚酰亚胺。通过差热分析(DSC)和热重分析(TGA),表明引入有机硅链段能有效地改善聚酰亚胺的性能。共聚物的玻璃化转变温度(Tg)符合Kwei方程。     

可溶性聚酰亚胺树脂的合成及其薄膜制备

以含支链3,3′-二乙基-4,4′-二氨基二苯甲烷(M-OEA)为二胺单体,采用高温一步法与四种二酐进行聚合,合成了四种聚酰亚胺(PI)树脂,并制备了一系列聚酰亚胺薄膜。对聚酰亚胺树脂进行了溶解性测试,并通过傅里叶红外光谱、紫外-可见分光光度计、差示扫描量热仪、热重分析仪、静态热机械分析仪及电子万能材料试验机对PI薄膜的结构、光学性能、热性能和力学性能进行了表征。结果表明,该系列树脂溶解性优异,薄膜热稳定性良好,5%热失重温度(T_d⁵)均在390℃以上,玻璃化转变温度(T_g)均高于230℃,两种半脂环族PI薄膜的光学性能优异,紫外截止波长280 nm。     

基于异构联苯二酐的热塑性聚酰亚胺性能研究

制备了一系列基于异构联苯二酐[2,2’,3,3’-联苯四甲酸二酐(3,3’-BPDA)、2,3’,3,4’-联苯四甲酸二酐(3,4’-BPDA)和3,3’,4,4’-联苯四甲酸二酐(4,4’-BPDA)]的聚酰亚胺(PI)均聚物和共聚物,比较研究了这些聚合物的热学和力学性能。结果表明,当二胺结构相同时,基于3,3’-BPDA和3,4’-BPDA的PI均聚物或共聚物较基于4,4’-BPDA的均聚物有更高的玻璃化转变温度(Tg)和更好的热加工性;当二酐结构相同时,基于对苯二胺(PDA)的PI的Tg高于基于4,4’-二氨基二苯醚(ODA)的PI。基于3,4’-BPDA/PDA的PI具有最高的Tg,其值为382℃,由其制备的薄膜的拉伸强度为100 MPa,拉伸弹性模量为1.8 GPa,断裂伸长率为12%。基于4,4’-BPDA/PDA的PI薄膜具有最高的拉伸性能,其拉伸强度为307 MPa,拉伸弹性模量为4.1 GPa,断裂伸长率为23%。基于3,4’-BPDA/ODA和3,3’-BPDA/4,4’-BPDA(1/1)/ODA的PI模塑料均具有高于300℃的Tg和较好的力学性能,其冲击强度分别达到82.3 kJ/m2和94 kJ/m2。     

Functionalized KIT‐6/Terpolyimide composites with ultra‐low dielectric constant

Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As creation of voids in polyimide matrix could decrease dielectric constant, in this study mesoporous KIT‐6, synthesized hydrothermally, was functionalized with 3‐aminopropyltriethoxysilane (APTS) and mixed with 4,4′‐oxydianiline (ODA) in the synthesis of terpoly(amic acid) using 3,3′,4,4′‐biphenyldianhydride (BPDA), 3,3′,4,4′‐oxydiphthalic dianhydride (ODPA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and subsequently stage‐cured to obtain APTS‐KIT‐6/Terpolyimide composites (APTS‐KIT‐6/TPI). The asymmetric and symmetric vibrations of imide O?C? N? C?O groups of APTS‐KIT‐6/TPI composites showed their peaks at 1772 and 1713 cm^?1. The dielectric constant decreased with the increase in KIT‐6 loading from 2 to 4%, but increased at higher loadings, and at 4% loading it was 1.42. Its tensile strength (103 MPa), tensile modulus (2.5 GPa), and percentage elongation (8.2) and high thermal stability (>540°C) were also adequate for application in microelectronics such as flexible printed circuits. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40508.     

Effect of chemical structure of aromatic dianhydrides on the thermal, mechanical and electrical properties of their terpolyimides with 4,4′-oxydianiline

Aromatic terpolyimides were synthesized by the reaction of 3,3′,4,4′-oxydiphthalicdianhydride(ODPA), 3,3′,4,4′-biphenyldianhydride(BPDA) and 3,3′,4,4′-benzophenonetetracaboxylicdianhydride(BTDA) with 4,4′-oxydianiline(ODA) via thermal imidization with the view to enhance their tensile properties without compromising thermal properties compared to their homo and copolyimides. Their films were characterized by FTIR, TGA, DSC and XRD. Their FTIR spectra established formation of polyimide by the characteristic vibrations at 1375cm⁻¹(C-N stretch) and 1113 cm⁻¹(imide ring deformation). TGA results showed imidization of residual polyamide acid close to 250 °C and decomposition of polyimides at about 540 °C. XRD results showed amorphous nature for all terpolyimides. Their tensile strength and tensile modulus were higher than either homo or copolyimides. Incorporation of BPDA, without bridging groups between the aromatic rings into the backbone of ODPA/BTDA-ODA is suggested as the cause for such an enhancement. Such terpolyimide can find application as adhesives in making flexible single/multilayer polyimide metal-clad laminates in flexible printed circuits and tape automated bonding applications. In addition, the terpolyimide, BPDA/BTDA/ODPA-ODA (mole ratio 0.5:0.25:0.25:1), showed low dielectric constant (3.52) as BPDA could offer slight rigidity by which the orientation of polar groupings could be reduced.     

Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper‐clad laminates

BACKROUND: Polyimide films coated on copper are a potential new substrate for fabricating printed circuit boards; however, adhesion between the copper and polyimide films is often poor. The relations between residual stress and adhesion strength according to the development of molecular orientation of polyimide films with different chemical backbone structure coated on copper were studied. RESULTS: The effect of chemical structures on properties including the residual stress and the adhesion strength were widely investigated for four different polyimides. Diamine 4,4′‐oxydianiline (ODA) and dianhydrides 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA), 4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA) and 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) were used to synthesize polyimide. In an attempt to quantify the interaction of thermal mismatch with the polyimide films depending on various structures, residual stress experiments between polyimide film and Cu? Si wafer were carried out over a range of 25–400 °C using in situ thin film stress analysis. A universal test machine was used to conduct 180° peel test (ASTM D903‐98) of polyimide film from cooper foil. The residual stress on Cu? Si (100) wafer decreased in the order 6FDA‐ODA > BTDA‐ODA > ODPA‐ODA > PMDA‐ODA, and the interfacial adhesion strength decreased in the order BTDA‐ODA (5 N mm^?2) > ODPA‐ODA > PMDA‐ODA > 6FDA‐ODA. The results may suggest that the morphological structure, degree of crystallinity of chain orientation and packing significantly relate to the residual stress and adhesion strength in polyimide films. Wide‐angle X‐ray diffraction was used for characterizing the molecular order and orientation and X‐ray photoelectron spectroscopy was used for the analysis of components on copper after polyimide films were detached to confirm the existence of copper oxide chemical bonding and to measure the binding energy of elements on the copper surface. CONCLUSION: In this research, it is demonstrated that BTDA‐ODA polyimide has a low residual stress to copper, good adhesion property, good thermal property and low dielectric constant. Therefore, BTDA‐ODA would be expected to be a promising candidate for a two‐layer copper‐clad laminate. Copyright © 2007 Society of Chemical Industry     

含苯环侧基三元共聚PI的合成及其表征

以4,4’-二胺基二苯醚(ODA)、2,2’-双[3-苯基-4(4-氨基苯氧基)苯基]丙烷(BPAPOPP)和均苯四甲酸酐(PMDA)为单体,采用溶液共缩聚方法合成了一系列共聚聚酰亚胺(PI)薄膜;采用傅里叶红外光谱仪(FTIR)、差示扫描量热仪(DSC)等分析了PI薄膜的结构和性能。结果表明:随着高聚物中柔性体系含量的增加,PI薄膜的热学性能和力学性能都有一定程度降低;但其加工性能得到了改善。     

改性环氧丙烯酸酯胶粘剂的合成与性能

本文研究了环氧丙烯酸酯的改性，采用双马来酰亚胺、环氧树脂、丙烯酸酯、改性剂为主要原料合成了改性环氧丙烯酸酯胶粘剂．运用IR、DSC等分析测试手段研究了该胶粘剂的固化行为。运用TGA、DTA等分析手段研究了该胶粘剂固化后的热稳定性．同时，用改性环氧丙烯酸酯胶粘剂制得了聚酰亚胺薄膜挠性印刷电路基板并测试了有关性能．     

一种新型共聚酰亚胺的合成与表征

以3,3’-二氨基二苯砜（DDS）和4,4’-二氨基二苯醚（ODA）作为共缩聚二胺单体,与3,3’,4,4’-二苯酮四羧酸二酐（BTDA）进行缩合聚合,合成了一系列具有一定溶解性的共聚酰亚胺。采用升温红外光谱监控了聚酰胺酸热环化为聚酰亚胺的过程,对所得产物的热稳定性和力学性能进行研究,发现二胺单体的组成对共聚酰亚胺的性能产生较为明显的影响。     

新型含吡啶环芳香二胺及其可溶性聚酰亚胺的合成与表征

以苯甲醛和3-(4-硝基苯氧基)苯乙酮(NPAP)为原料,通过改进的Chichibabin反应制备了硝基化合物4-苯基-2,6-双[3-(4-硝基苯氧基)苯基]吡啶(PNPP),再用Pd/C和水合肼将PNPP进行还原,成功制备了一种新型含吡啶环的芳香二胺4-苯基-2,6-双[3-(4-胺基苯氧基)苯基]吡啶(PAPP)。以PAPP作为二胺,3,3′,4,4′-二苯醚四羧酸二酐(ODPA)作为二酐,N,N-二甲基甲酰胺(DMF)为溶剂,通过常规的两步法,经热或者化学亚胺化形成聚酰亚胺,制得了一种新型的含吡啶环聚酰亚胺。所得聚酰胺酸和聚酰亚胺的粘度分别为0.59 dL/g和0.56 dL/g。化学亚胺化所得的聚酰亚胺速溶于常见有机溶剂如DMF、N,N-二甲基乙酰胺(DMAc)、N-甲基-2-吡咯烷酮(NMP)、四氢呋喃(THF)等。制得了柔韧的聚酰亚胺膜,膜有很好的热稳定性,玻璃化转变温度(T_g)为230.8℃,氮气氛中10%失重温度为552.0℃,同时,膜还有较好的力学性能,拉伸强度为88.6 MPa,拉伸模量为1.04 GPa,断裂伸长率为8.7%,膜的吸水率为0.89%。