采用噪声抵消技术的无电感宽带低噪声放大器

设计了一款多用途、宽带、无电感的低噪声放大器。放大器的第1级为单端输入差分输出结构,采用了噪声抵消技术来降低噪声;第2级引入有源感性负载,并通过电阻负反馈来扩展带宽。采用TSMC 130 nm工艺对电路进行仿真,后仿结果表明,在0.4~6.2 GHz带宽范围内,S21为19 dB,噪声系数为1.9~2.5 dB,功耗为9.6 mW,电路核心面积为0.08 mm²。     

基于噪声抵消技术的CMOS宽带LNA设计

设计了一种用于1～4GHz射频前端的全集成CMOS宽带低噪声放大器。利用电流复用技术,对典型并联共栅-共源噪声抵消结构进行改进,以缓和噪声、增益及功耗之间的矛盾。采用在输入端引入电容电感并与MOS管寄生电容构成П形网络的方式来改善输入匹配特性。基于TSMC 0.18μm CMOS工艺进行设计和仿真。仿真结果表明,LNA噪声系数小于3.24dB,输入反射系数S11小于-8.86dB,增益大于15.6dB,IIP3优于+1.55dBm,在1.8V单电源供电条件下功耗仅为16.2mW。     

一种利用栅极电感峰化和噪声抵消技术的CMOS宽带低噪声放大器的设计

本文给出了一种应用于多模多标准接收机的宽带低噪声放大器的设计。采用噪声抵消技术实现了低噪声特性,同时采用栅极电感峰化技术实现了宽带平稳增益,进而提高了高频处得噪声性能。芯片在0.18 μm CMOS 工艺下制造,测试结果表明,该低噪放的-3dB带宽为2.5 GHz,增益为16 dB。在300 MHz 到2.2 GHz 带宽内的增益变化在0.8 dB之内。噪声系数为3.4 dB,不同频点处测得的平均IIP3 为-2 dBm。该低噪放的核心芯片面积为0.39mm2, 在1.8V供电电压下,抽取直流电流11.7 mA。     

短沟道下共栅结构宽带CMOS LNA的设计

基于短沟道MOS器件的过量因子随沟道长度降低缓慢增加的特征,研究了短沟道下共栅结构宽带低噪声放大器的噪声性能,并在0.18μm CMOS工艺下设计实现了共栅结构的宽带低噪声放大器.流片测试结果表明,在1.8 V电源电压、4.1 mA工作电流下,该系统获得6.1 dB的最小噪声系数;综合性能与长沟道下相近,符合理论分析和设计要求.     

一种基于噪声抵消技术的宽带低噪声放大器

设计了一种应用于全球数字广播 (Digital Radio Mondiale,DRM)和数字音频广播 (Digital Audio Broadcasting,DAB) 的宽带低噪声放大器.采用噪声抵消结构,抵消输入匹配器件在输出端所产生的热噪声和闪烁噪声,使输入阻抗匹配和噪声优化去耦.电路采用华润上华CSMC 0.6 μm CMOS工艺实现.测试结果表明,3 dB带宽为100 kHz～213 MHz,最大增益为16.2 dB, S11和S22小于-7.5 dB, 最小噪声系数为3.3 dB, 输入参考的1 dB增益压缩点为-3.8 dBm,在5 V电源电压下,功耗为51 mW,芯片面积为0.18 mm2.     

一种用于电视协调器的CMOS无电感互补噪声抵消低噪声放大器设计

本文介绍了一个用于电视协调器的CMOS无电感互补噪声抵消低噪声放大器。放大器包括一个共栅极和一个共源级,实现单端转差分的功能。采用的互补结构能够节省功耗和改善噪声系数。线性度也通过采用多个晶体管并联技术来增强。芯片采用SMIC 0.18μm CMOS 工艺。测试结果表明,在50MHz到860MHz频段内,电压增益达到13.5到16dB,噪声系数小于4.5dB,最小达到2.9dB,在860MHz频率处,输入1dB压缩点为-7.5dBm。核心电路在1.8V电源电压下,消耗6mA电流,芯片面积是0.2×0.2mm2     

基于噪声抵消技术的宽带低噪声放大器设计

采用0.18μm CMOS工艺,针对DMB-T/H标准数字电视调谐器应用,设计了一个基于噪声抵消技术的宽带低噪声放大器.详细分析了噪声抵消技术的原理,给出了宽带低噪声放大器的设计过程.仿真结果表明,在48～862 MHz频率范围内输入输出反射系数均小于-20 dB,噪声系数低于3 dB,增益大于17 dB,1 dB压缩点为-6dBm.在1.8V电压下,电路功耗为10.8mW.     

一种基于噪声抵消的0.5μmCMOS宽带低噪声放大器设计

设计了一种应用于DRM(Digital Radio Mondiale,全球数字广播)和DAB(Digital Audio Broadcasting,数字音频广播)的宽带低噪声放大器.该放大器采用噪声抵消结构,抵消输入匹配器件在输出端所产生的热噪声和闪烁噪声,使得输入阻抗匹配和噪声优化去耦.采用华润上华CSMC 0.5μm CMOS工艺实现.测试结果表明,3dB带宽为300kHz~555MHz,最大增益为16.2dB,S11和S22小于-3.6dB,最小噪声系数为3.8dB,输入参考的1dB增益压缩点为0.5dBm,在5V电源电压情况下功耗为97.5mW,芯片面积为0.49mm2.     

一种高增益且可调谐的1~3 GHz宽带LNA

提出了一种增益高且增益可调谐的1~3 GHz宽带低噪声放大器(HTG-LNA)。在输入级,采用带有RC串联负反馈的共基-共射电流镜结构,实现了良好的输入匹配,并提高了电路的稳定性;在中间级,采用以有源电感作为负载的共基-共射达林顿电路结构,在保证宽带的同时实现了较高的增益与增益的可调谐;在输出级,采用带有电流镜的射极跟随器结构,获得了较大的输出功率和良好的输出匹配。基于稳懋0.2 μm GaAs HBT工艺进行验证,结果表明,该HTG-LNA的电压增益大于37 dB,最高可达50.7 dB;功率增益大于37.4 dB,最高可达51 dB;最大增益可调谐幅度为2.2 dB;输入回波损耗小于-7.11 dB;输出回波损耗小于-11.97 dB;噪声系数小于3.23 dB;稳定因子大于5.61;在5 V工作电压下,静态功耗小于65 mW。     

A 90-nm Wideband Merged CMOS LNA and Mixer Exploiting Noise Cancellation

This paper describes the design and implementation of a wideband merged LNA and mixer chip covering the frequency range from 0.1 to 3.85 GHz using 90-nm CMOS technology. Its high level of integration as well as its low power consumption makes it suitable for the rapidly growing software defined radio RF receivers. The chip performance achieves S11 below -10 dB along the entire band and a minimum single side band noise figure of 8.4 dB at IF frequency of 70 MHz. Power conversion gain is measured to be 12.1 dB while the input referred 1 dB compression point is measured to be -12.8 dBm. The chip core consumes only 9.8 mW from a 1.2 V supply with a die area, including the pads, of 0.88 mm²     

A Packaged and ESD-Protected Inductorless 0.1–8 GHz Wideband CMOS LNA

In this letter, an inductorless 0.1-8 GHz wideband CMOS differential low noise amplifier (LNA) based on a modified resistive feedback topology is proposed. Without using any passive inductors, the modified resistive feedback technique implemented with a parallel R-C feedback, an active inductor load, and neutralization capacitors achieves high gain, low noise, and good return loss over a wide bandwidth. To ensure the robustness in the system integration, electro-static discharge diodes are added to the radio frequency pads. The LNA was fabricated using a digital 90 nm CMOS technology. It achieves a 3 dB bandwidth of 8 GHz with a 16 dB voltage gain, noise figures from 3.4 dB to 5.8 dB across the whole band, and an input third-order intermodulation product (IIP3) of -9 dBm. The active area of the chip is 0.034 mm². The chip was packaged and tested on an FR4 PCB using the chip-on-board approach.     

An Inductorless 300 MHz Wideband CMOS Power Amplifier

The power amplifier tends to be one of the most demanding parts to fully integrate when building an entire radio on a CMOS chip. In this paper the design of a fully integrated RF power amplifier without inductors is described. As inductors in CMOS technology are associated with various problems, it is interesting to examine what performance can be achieved without them. An amplifier with an operating band from 60 MHz to 300 MHz (–3 dB) is built in 0.8 m CMOS. A 3 V supply is used. The measured midband power gain is 30 dB with 50 resistive source and load impedance. As linearity is important for many modern modulation schemes, the amplifier is designed to be as linear as possible. The measured third order intercept point is 23 dBm and the 1 dB compression point is 10 dBm, both referred to the output. The output is single ended to avoid an off-chip differential to single ended transformer.     

采用噪声抵消技术的宽带SiGe HBT 低噪声放大器设计

宽带低噪声放大器的输入匹配需要兼顾阻抗匹配和噪声匹配.通常,这两个指标是耦合在一起的.现有的宽带匹配技术需要反复协调电路参数,在阻抗匹配和噪声匹配之间折衷,给设计增大了难度.提出一种噪声抵消技术,通过两条并联的等增益支路,在输出端消除了输入匹配网络引入的噪声,实现阻抗匹配和噪声匹配的去耦.基于Jazz 0.35 μm SiGe工艺,设计了一款采用该噪声抵消技术的宽带低噪声放大器.放大器的工作带宽为0.8-2.4 GHz,增益在 16 dB以上,噪声系数小于3.25 dB, S11在-17 dB以下.     

A Highly Linear Broadband CMOS LNA Employing Noise and Distortion Cancellation

A broadband inductorless low-noise amplifier (LNA) design that utilizes simultaneous noise and distortion cancellation is presented. Concurrent cancellation of the intrinsic third-order distortion from individual stages is exhibited with the common-gate and common-source cascade. The LNA is then limited by the second-order interaction between the common source and common gate stages, which is common in all cascade amplifiers. Further removal of this third-order distortion is achieved by incorporating a second-order-distortion-free circuit technique in the common gate stage. Implemented in 0.13 m CMOS technology, this LNA achieved 16 dBm in both the 900 MHz and 2 GHz bands. Measurements demonstrate that the LNA has a minimum internal gain of 14.5 dB, noise figure of 2.6 dB from 800 MHz to 2.1GHz while drawing 11.6 mA from 1.5 V supply voltage.     

超宽频带VHF频段CMOS LC VCO

实现了一个宽频带VHF频段CMOS VCO.其最大的改进在于将振荡器中交叉耦合MOS管分为并联可开关的若干段.这样使其特性可以在较大范围内补偿VCO调频过程中状态的变化.该VCO使用标准0.18μmCMOS工艺制作,核心版图面积约为550μm×700μm.测试结果表明:该VCO频率覆盖范围为31～111MHz;功耗为0.3～6.9mW;在100kHz频偏处相位噪声约-110dBc/Hz.     

An Ultra Wideband VHF CMOS LC VCO

实现了一个宽频带VHF频段CMOS VCO.其最大的改进在于将振荡器中交叉耦合MOS管分为并联可开关的若干段.这样使其特性可以在较大范围内补偿VCO调频过程中状态的变化.该VCO使用标准0.18μmCMOS工艺制作,核心版图面积约为550μm×700μm.测试结果表明:该VCO频率覆盖范围为31～111MHz;功耗为0.3～6.9mW;在100kHz频偏处相位噪声约-110dBc/Hz.     

60GHz高增益宽带单片集成低噪声放大器

基于0.15μm GaAs pHEMT工艺,设计和制作了一款宽带单片集成低噪声放大器.放大器设计采用四级级联的拓扑结构以获得高增益.芯片尺寸2mm×lmm.实测性能指标为:工作频段45～65GHz,增益18±1.5dB,输入驻波比小于3,输出驻波比小于2.3,直流功耗96mW.在增益、带宽和功耗上达到国际现有产品指标.该芯片可被应用于60GHz宽带无线通信系统.