固体纳米电子器件和分子器件

综述了两类纳米电子器件———固体纳米电子器件和分子电子器件的定义、分类方法及特点,并提出发展纳米电子器件的几点建议。     

纳米电子器件

概述了用于超高密度集成电子计算机的纳米尺寸电子开关器件的研究进展。讨论了场效应晶体管的两类替代物： （１） 量子效应和单电子固态器件, （２） 分子电子器件。提出了每一类器件的分类方法, 描述了其工作原理并对各种器件进行了比较     

纳米电子器件

概述了用于超高密度集成电子计算机的纳米尺寸电子开关器件的研究进展。讨论了场效应晶体管的两类替代物：（１）量子效应的单电子固态器件；（２）分子电子器件。提出了每一类器件的分类方法，描述了其在工作原理并对各种器件进行了比较。     

分子电子学的研究目标和途径

本文阐明了继真空器件和半导体器件之后,分子电子器件作为第三代器件将呈现于信息科学之中。这不仅是器件发展趋势所致,也是基于进化求解原理的新一代计算系统发展的需要。文中提出了用分子电子器件构成的关联存贮器和网络模型;并讨论了近期的研究目标与途径。     

基于纳米尺寸的分子电子信息存储研究

以有机分子为基础的"纳米存储"是一种新型的数据存储系统,具有替代目前广泛应用的半导体存储器件的趋势。目前,有两种"分子"被潜在地应用于"纳米存储",一种是分子电子器件,包括分子导线、分子整流器、分子开关以及分子晶体管;另外一种应用了纳米结构的材料,如纳米管、纳米导线以及纳米粒子等。本文以分子电子器件的制备和构筑单元的设计为视角,根据分子结构、装置类型、终端电极的数目以及分子介质的状态对分子电子器件进行了分类,同时也对分子结的制备、特征、电荷转移机制以及三终端分子器件、树状化合物分子尺寸纳米电荷存储的发展进行了探讨,并对纳米信息存储存在的问题及发展方向进行了展望。     

国内首个256位分子存储器电路研制成功

借助中科大国家同步辐射实验室二次X射线光刻工艺,中国科学院微电子所纳米加工与新器件集成技术实验室近日成功研制出国内首个256位分子存储器电路。据介绍,分子电路是指在分子层次上构筑的电子器件及集成电路,是后摩尔时代接替硅基电路最受关注的方向之一。它能够使电子器件的关键尺寸缩小到分子尺度,推动集成电路向更小尺寸、更高集成度方向发展。     

纳米分子电子器件的研究

纳米分子电子器件是未来电子器件发展的重要方向。对几种典型的纳米分子电子器件,如纳米分子开关、纳米分子整流器、纳米分子晶体管、纳米分子电磁器件和纳米分子电光器件的工作原理、应用前景等方面进行了介绍,同时分析了各自的优势与问题所在。这一领域所遇到的主要挑战问题在于器件的可靠性与生产的高成本。目前纳米分子电子器件的发展趋势和研究重点是通过对器件原理的深入研究以及制备方法的不断探索,找到提高器件可靠性的方法以及解决降低成本和适应市场化的问题。     

纳米加工和纳米电子器件

介绍了电子束曝光技术、EUV光刻技术和X射线光刻技术的进展;对各种纳米电子器件如单电子器件、共振隧穿器件和分子电子器件的研究现状及面临的主要挑战进行了讨论。     

量子器件与量子信息技术

从信息社会的发展分析提出了量子器件及量子信息技术产生和发展的必然性,介绍了谐振隧穿器件、单电子器件、电子波导晶体管等纳米电子器件及其特点,对量子激光器和量子信息技术及其性能作了简要介绍,并给出了应用前景.     

半导体器件的发展与固态纳米电子器件研究现状

简要回顾了半导体电子器件由真空电子管到固体晶体管,直至纳米电子器件的发展历程。分别比较了不同的半导体电子器件的材料、理论和所采用的制备技术。在此基础上综述了当前较热门的纳米电子学和固态纳米电子器件,并由纳米器件的分类简单介绍了当前固态纳米电子器件的三个部分,即量子点、谐振隧穿器件和单电子晶体管。最后对半导体器件的发展提出了展望。     

Progress in silicon carbide semiconductor electronics technology

Silicon carbide’s demonstrated ability to function under extreme high-temperature, high-power, and/or high-radiation conditions is expected to enable significant enhancements to a far-ranging variety of applications and systems. However, improvements in crystal growth and device fabrication processes are needed before SiC-based devices and circuits can be scaled-up and incorporated into electronic systems. This paper surveys the present status of SiC-based semiconductor electronics and identifies areas where technological maturation is needed. The prospects for resolving these obstacles are discussed. Recent achievements include the monolithic realization of SiC integrated circuit operational amplifiers and digital logic circuits, as well as significant improvements to epitaxial and bulk crystal growth processes that impact the viability of this rapidly emerging technology.     

印刷电子学的发展

综述了印刷电子学的发展及趋势,着重介绍了喷墨打印技术的新进展及其在印制电路板(PCB)和嵌入式无源元件中的应用,指出了目前印刷电子产品生产过程中尚待解决的问题,预测印刷电子电路(PEC)将是印刷电子学的未来发展方向。     

Integrated electronics and change in the electronics industry

Those who use electronics to solve problems for customers must exercise science, engineering, art, and business sense, and work with four generations of electronics based on vacuum tubes, discrete semiconductor devices, integrated circuits, and integrated electronic components, respectively. This paper includes forecasts of the growing applications and economic impact of integrated electronics. The concept of Active Element Groups (AEGs) is used to analyze the growth of the market from 1963 to 1973 and to emphasize the increasing integration of electronics. Despite dramatic trends now emerging in product mix and technology, the electronics industry will not be radically changed in structure. Bigger organizations are likely to get still bigger and stronger; smaller organizations are likely to consolidate; integrated electronics will make electronics pervasive. Integrated electronics makes the inward-looking science, engineering, and art of electronics more usable and allows the outward-looking practitioners who use electronics to solve problems for customers to move up their skills and concentrate on more effective and more sophisticated solutions-to those problems. It does not decrease their ability to serve their customers. It does require that they upgrade and change the emphasis of that ability to serve their customers more effectively.     

Ultrasonics in integrated electronics

The capabilities of present integrated circuits are limited since only electrical interactions in solids are being utilized. The point of view is presented that additional degrees of freedom will be obtained in the future through the use of "Functional" electronic devices which also utilize mechanical, thermal, radiation, and/or magnetic phenomena. Development of these functional devices will come in response to pressure to overcome specific limitations imposed by present technology. In particular, no satisfactory substitute for an inductor is presently available in integrated electronics technology. The most serious limitation which results is the inability to achieve a narrow band-pass frequency response, a limitation which hinders the full exploitation of present capabilities in a wide variety of systems. Electromechanical resonators offer an extremely promising solution to this "tuning problem" because of their inherent compatibility of size and stability of Q and resonant frequency. Progress to date on integratable mechanically resonant devices covering the frequency range from less than 1 kc/s to more than 100 Mc/s is reviewed. These devices stimulate the imagination to conceive a variety of other new electromechanical devices. Therefore, it is predicted that the marriage of the ultrasonics and integrated electronics technologies will give birth to an exciting and fruitful new field of investigation.     

Recent advances in power electronics

Recent advances in several key areas of power electronics technology, such as power semiconductor devices, power converter circuits, and control of power electronics, are discussed. The structure and characteristics of IGBT, SIT, SITH, and MCT devices are reviewed. The principal converter types and their recent trends are described. A brief review of power integrated circuits is included. The features of microcomputer and VLSI control are described, and recent advances in microcomputers are highlighted. The principles of expert systems, fuzzy control, and neural networks are presented     

Materials and applications of bioresorbable electronics

Bioresorbable electronics is a new type of electronics technology that can potentially lead to biodegradable and dissolvable electronic devices to replace current built-to-last circuits predominantly used in implantable devices and consumer electronics.Such devices dissolve in an aqueous environment in time periods from seconds to months,and generate biological safe products.This paper reviews materials,fabrication techniques,and applications of bioresorbable electronics,and aims to inspire more revolutionary bioresorbable systems that can generate broader social and economic impact.Existing challenges and potential solutions in developing bioresorbable electronics have also been presented to arouse more joint research efforts in this field to build systematic technology framework.     

A versatile switch model for power electronics SPICE2 simulations

Using a versatile switch model, a SPICE2 input file containing voltage-controlled hysteresis, nonhysteresis switches, and ideal silicon-controlled rectifiers can be written to perform both steady-state and transient analysis. Two typical power electronics circuits are simulated to demonstrate various aspects of the model     

QHE key to spin electronics and quantum computing

Researchers Shuichi Murakami, University of Tokyo and Shoucheng Zhang, Stanford University may have discovered a spin current associated with holes rather than electrons in semiconductors. The predicted current would be able to inject spin momentum into quantum dots and would interact with conventional electron currents, bridging electronics and spin-based quantum circuits.Visit www.three-fives.com for the latest advanced semiconductor industry news     

An overview of radiation effects on electronics in the space telecommunications environment

Trapped protons and electrons in the Earth’s radiation belts and cosmic rays present significant challenges for electronics that must operate reliably in the natural space environment. Single event effects (SEE) can lead to sudden device or system failure, and total dose effects can reduce the lifetime of a space-based telecommunications system. One of the greatest sources of uncertainty in developing radiation requirements for a space system is accounting for the small but finite probability that the system will be exposed to a massive solar particle event. Once specifications are decided, standard laboratory tests are available to predict the total dose response of MOS and bipolar components in space, but SEE testing of components can be more challenging. Prospects are discussed for device modeling, and for the use of commercial electronics in space. In addition, technology trends are discussed for the radiation response of microelectronics in space.