无线和卫星手机的电源管理专用芯片

一、概述 手机和其他消费类电器一样,均要供电才能正常工作。从爱立信GF768/788型GSM数字手机和飞利浦828手机线路中看出,手机中的电源供电线路是由多块稳压器组成。而本文介绍的电源芯片MA×886/MA×888是一种具有多路输出编程电压和各种驱动     

先进的锂电池线性充电管理芯片BQ2057应用

利用BQ2057系列芯片及简单外围电路可设计低成本的单/双节锂电池充电器,非常适用于便携式电子仪器的紧凑设计。     

照度传感器改善移动设备的电源管理

在手机和其他移动电子设备中,随着彩色液晶显示(LCD)以及其它功耗很大的附加功能(如摄像头、全球定位系统等)应用不断普及,功耗问题变得越来越关键。设计者现在采用的改进功耗管理的办法之一,是利用输出响应与人眼功能类似的照度传感器来检测环境光亮度。在使用照度传感器的情况下,移动设备可以根据环境光照条件关闭或调整键盘/LCD的背光。这样就可以有效的降低功耗、延长电池寿命。照度传感器的各种关键应用照度传感器的应用包括:亮度调节:照度传感器的测量结果可以用来调节显示器的亮度,或者优化背光照明,使之与环境光条件协调一致,从…     

一种多源能量收集电源管理芯片

采用高压0.6μm CMOS工艺,设计了一种可以同时对压电、光电进行高效收集的多源能量收集电源管理芯片。该收集芯片由光电接口电路、压电接口电路和DC-DC电路等单元构成。光电接口电路中采用全局最大功率追踪电路,减少了阴影对太阳能板收集光能的影响,提高了最大功率追踪效率。DC-DC电路中,采用导通时间可调、频率可调的控制模式,在更宽的输入功率范围内实现更高效率的同时保持输出端较小的电压纹波。仿真结果表明,该收集芯片的整体平均动态电流为7.6μA,能量转换效率最高为91.2%。版图尺寸为9 623μm×3 655μm。     

USB OTG组合电源IC

USBOTG(On-The-Go)技术可实现在没有主机的情况下从设备间的数据传送。分析了OTG组合电源IC的内部拓扑结构及其应用设计。     

为DDR-SDRAM度身定造高效功率管理芯片

引言 DDR—SDRAM,即双数据速率同步DRAM,简称DDR。DDR因其更为卓越的性能(起初的数据速率为266MBps,后来提升至400MBps,而一般SDRAM只有133MBps)、更低的功耗以及更具竞争力的价格,已经在桌面和便携式应用中颇为流行。最近推出的第二代DDR或称DDR2(JESD79—2A),数据速率从400MBps提升到了667MBps。因此与之前的SDRAM技术相比,DDR存储器需要更加复杂和新颖的功率管理结构。     

高集成度TYPE A读写器芯片MF RC500及其应用

介绍了高集成度TYPEA读写器芯片MFRC500的内部电路结构 ,并对其内部寄存器的有关命令及加密算法等功能做了较详细的阐述 ,最后在此基础上给出了MFRC500的典型应用电路     

用于先进CMOS电路的150mm硅外延片外延生长

随着大规模和超大规模集成电路特征尺寸向亚微米、深亚微米发展,下一代集成电路对硅片的表面晶体完整性和电学性能提出了更高的要求.与含有高密度晶体原生缺陷的硅抛光片相比,硅外延片一般能满足这些要求.该文报道了应用于先进集成电路的150mm P/P+CMOS硅外延片研究进展.在PE2061硅外延炉上进行了P/P+硅外延生长.外延片特征参数,如外延层厚度、电阻率均匀性,过渡区宽度及少子产生寿命进行了详细表征.研究表明:150mm P/P+CMOS硅外延片能够满足先进集成电路对材料更高要求,     

用于先进 CMOS电路的 150 mm硅外延片外延生长

随着大规模和超大规模集成电路特征尺寸向亚微米、深亚微米发展,下一代集成电路对硅片的表面晶体完整性和电学性能提出了更高的要求.与含有高密度晶体原生缺陷的硅抛光片相比,硅外延片一般能满足这些要求.该文报道了应用于先进集成电路的150mmP/P+CMOS硅外延片研究进展.在PE2061硅外延炉上进行了P/P+硅外延生长.外延片特征参数,如外延层厚度、电阻率均匀性,过渡区宽度及少子产生寿命进行了详细表征.研究表明:150mmP/P+CMOS硅外延片能够满足先进集成电路对材料更高要求,     

A Fully Integrated UHF CMOS Power Amplifier for Spacecraft Applications

A power amplifier (PA) is designed for a surface-to-orbit proximity link microtransceiver on Mars exploration rovers, aerobots, and small networked landers and works in conjunction with a 0.2-dB loss transmit/receive switch to allow nearly the full 1 W to reach the antenna. The fully integrated UHF CMOS PA with more than 30-dBm output is reported for the first time. A differential pMOS structure with floating-bias cascode transistors and 1:3-turn ratio output transformer are chosen to overcome low breakdown voltage (V _bk) of CMOS and chip area consumption issues at UHF frequencies. The high-Q on-chip transformer on a sapphire substrate enables the differential PA to drive a single-ended antenna effectively at 400 MHz. The PA in a standard package delivers 30-dBm output with 27% power-added efficiency. No performance degradation was observed in continuous-wave operation and the design has been tested to 136% of its nominal 3.3-V supply without failure.     

A Low Power Fully CMOS Integrated RF Transceiver IC for Wireless Sensor Networks

A fully CMOS integrated RF transceiver for ubiquitous sensor networks in sub-gigahertz industrial, scientific, and medical (ISM)-band applications is implemented and measured. The integrated circuit is fabricated in 0.18-mum CMOS technology and packaged in leadless plastic chip carrier (LPCC) package. The fully monolithic transceiver consists of a receiver, a transmitter, and an RF synthesizer with on-chip voltage-controlled oscillator. The chip fully complies with the IEEE 802.15.4 wireless personal area network in sub-gigahertz mode. The cascaded noise figure of the overall receiver is 9.5 dB and the overall transmitter achieves less than 6.3% error vector magnitude for 40 kb/s mode. The chip uses 1.8-V power supply and the power consumption is 25 mW for reception mode and 29 mW for transmission mode     

用于汽车传动系统的高度集成磁场传感器

异向性磁阻(AMR)效应是汽车领域众多传感器应用的基础,AMR传感器具有性能稳定、工作温差大、耐用等多种优势.包括节气门、电子线控和线控转向等系统在内的机械系统角度测量是一个非常重要的应用领域,AMR传感器可以提高机械系统效率,对开发环保型汽车具有直接意义.本文将以高度集成的角位传感器KMA210为例,详细探讨如何使用AMR角度传感器.     

手机用TFT-LCD驱动控制芯片电源模块设计

电源模块是TFT-LCD驱动控制芯片内置模拟电路的一个重要组成部分,其性能直接影响着芯片的功耗以及彩屏手机的显示画质。文章从TFT-LCD的驱动原理出发,提出了一种低功耗、易调节的电源模块设计思想,所产生的电压值可实现编程控制。用Hspice对采用0.25μmCMOS工艺设计的电路进行仿真表明,系统在启动200ms后能够生成稳定、正确的驱动电源电压,其静态功耗小于2mW。     

电源管理趋势探讨

随着半导体终端产品朝向轻薄短小、数字化和整合多功能三大趋势发展,模拟领域的电源管理IC的地位可说是越来越重要,成绩亦显得非常亮眼,在市场一片繁荣之下,电源管理的设计趋势也值得关注,对此,业内领先的电源管理芯片供应商从不同层面阐述了各自的一些技术观点以及相应的解决方案.     

A Power, Performance Scalable Eight-Cores Media Processor for Mobile Multimedia Applications

We have developed an eight-core media processor for mobile multimedia applications, which achieves low power consumption and high performance. The processor uses a specific parallel process execution scheme that achieves high performance and allows parallel processing with performance and power consumption scalability over available resources. In addition, the parallel process execution scheme enables software reusability and binary compatibility, which notably reduces development costs.      

一种用于电源管理IC的电流采样电路

利用高压集成功率集成器件,设计了一种用于电源管理IC的电流采样电路.此采样电路具有结构简单、精度高、耐高压(＞800 V)、低损耗等特点;同时实现了功率芯片的自供电功能,无需外加芯片供电电源.     

A Fully‐Integrated Penta‐Band Tx Reconfigurable Power Amplifier with SOI CMOS Switches for Mobile Handset Applications

A fully‐integrated penta‐band reconfigurable power amplifier (PA) is developed for handset Tx applications. The output structure of the proposed PA is composed of the fixed output matching network, power and frequency reconfigurable networks, and post‐PA distribution switches. In this work, a new reconfiguration technique is proposed for a specific band requiring power and frequency reconfiguration simultaneously. The design parameters for the proposed reconfiguration are newly derived and applied to the PA. To reduce the module size, the switches of reconfigurable output networks and post‐PA switches are integrated into a single IC using a 0.18 μm silicon‐on‐insulator CMOS process, and a compact size of 5 mm × 5 mm is thus achieved. The fabricated W‐CDMA PA module shows adjacent channel leakage ratios better than ?39 dBc up to the rated linear power and power‐added efficiencies of higher than around 38% at the maximum linear output power over all the bands. Efficiency degradation is limited to 2.5% to 3% compared to the single‐band reference PA.     

Advanced Optical Sensors for Power and Energy Systems Applications

We have highlighted how optical sensors can be exploited to solve many measurement problems within selected power and energy systems applications. Clearly, their development is defined at present by the industry demand, often unsatisfied with the functionality and performance of electrical instrumentation. In these cases, the overall gain from being able to monitor a plant will outweigh the higher cost associated with optical measurement systems. However, as the technology advances and costs decrease, it is hoped that photonic sensors will make their way into more areas of industry and become as widely accepted as a simple strain gauge or thermocouple. We hope that this article will provide a useful perspective and will inspire a renewed interest in photonic sensors among a broad range of researchers, engineers, and industrial end-users involved in the field of instrumentation and measurement     

中国电源管理芯片市场分析

2003年全球PC、手机及数字消费电子等产品供需两旺，成为拉动半导体市场增长的主要动力，全球半导体市场全面复苏，实现销售额1633亿美元，同比增长达15．8％，远远超过2002年的增长率为1．6％的水平，成为近三年来市场走势最好的一年。其中无线多媒体通信和计算市场的迅猛发展为全球半导体市场增长做出了主要贡献，同时也为全球电源以及电源管理芯片市场的发展注入了一股强劲的增长动力。     

用于逆变器的功率IC模块

<正> 一、前言最近在电力电子学的领域内,使功率器件的外围电路集成化的工作不断进展。特别是在使马达实现可变速控制的通用逆变器及空调器方面。对外围电路集成化的要求更为强烈。通过外围电路的集成化,才能实现系统的多功能,小型化和高可靠。外围电路包括输入输出的接口电路、功率器件的驱动电路和保护电路(即过电流、过负载、负载短路、负载开路、过热、过电压等的保护)。最近还介绍了将功率器件与外围电路集成到单片上的所谓“功率IC”和“智能型功率电路”。但是,上面说的这些电路,耐压大都在50～100V的范围,因此在采用市电的逆变器等马