基于显微干涉的纳米探针测量系统

为实现微纳米结构的定量测量和定位观察需要,设计了一种基于显微干涉的纳米探针测量系统。该系统基于干涉显微镜基体,同时融合采用白光干涉法和激光干涉法来对纳米探针的纵向位移进行测量。所构成的探针系统能与光波直接溯源,能直接观察被测区域,测量精度高。实验结果表明所设计的测量系统满足定量测量和定位观察需要。     

复合型超精密表面形貌测量仪

研制了基于同一显微镜基体实现原子力探针扫描测量与非接触光学测量两种功能的复合型超精密表面形貌测量仪.分析了基于白光显微干涉原子力探针的测量方法、探针微悬臂变形量与白光干涉条纹移动量的关系以及探针微悬臂测量非线性误差的修正方法,和通过融合垂直扫描系统的位移量和悬臂梁变形量得到了原子力探针的工作方式.研制了三维精密位移系统...     

白光干涉表面结构测量仪的优化设计与应用

为测量微机电系统的表面结构,研制了一种基于白光干涉法的表面结构测量仪。设计了显微干涉仪,通过实验分析了显微干涉仪关键设计参数中的光源带宽、物镜数值孔径、孔径光阑大小对垂直扫描白光显微干涉测量中干涉条纹光强分布的影响;设计了Z向一维位移工作台,提出了一种以显微干涉图像灰度值归一化标准方差为依据的白光干涉测量条纹自动搜索定位方法。相关实验结果为白光干涉表面结构测量仪的优化设计提供了参考依据。     

双测头复合型微纳米测量仪的研制

针对当前微纳米测量中存在的大范围高精度测量及复杂微结构几何参数表征难题,基于多测头传感和精密定位平台复用技术,开发了一台具有多种测量尺度和测量模式的复合型微纳米测量仪。为使其具备大范围快速扫描测量和小范围精细测量功能,仪器集成了白光干涉和原子力显微镜两种测头,通过设计适用于两种测头集成的桥架结构及宏/微两级驱动定位平台,实现整机的开发。为保证仪器测量结果的准确性和溯源性,利用标准样板对开发完成的仪器进行了校准。仪器搭载的白光干涉测头可以达到横向500 nm,纵向1 nm的分辨力;原子力显微镜测头横向和纵向分辨力均可达到1 nm。最后,利用目标仪器对微球样品进行了测量,通过大范围成像和小范围精细扫描,获得了微球的表面特征,验证了仪器对复杂微结构的测量能力。     

一种新型垂直扫描白光显微干涉测量仪

研究开发了一种新型垂直扫描白光显微干涉测量仪。基于Linnik显微干涉结构,设计了干涉测量仪的显微干涉系统,介绍了干涉系统的工作原理;设计了Z向一维位移工作台,介绍了其结构和驱动原理;分析了测量仪的工作原理,并采用标准样板对测量仪的测量精度进行了验证。     

金刚石砂轮表面形貌测量系统

为了实现对金刚石砂轮表面形貌的非接触精密测量,开发了基于干涉原理的金刚石砂轮表面形貌专用测量系统,研究了该系统的测量原理和关键技术。根据垂直扫描白光干涉显微测量原理以及被测对象的特征,提出了适用于砂轮测量的方法,研究了系统的自动扫描范围、垂直方向的扫描方法、单次测量三维表面的恢复算法和磨粒的识别算法。结合自行设计的夹具搭建了砂轮测量系统,并对多次测量拼接算法进行了实验分析。实验结果表明:基于区域重合大小(重合度为30%~50%)的拼接算法获得的拼接前后重合区域的相关系数均大于0.8,拼接后重合区域的高度差均小于0.4μm。得到的结果显示所搭建的系统可以恢复砂轮的形貌,其测量范围和精度满足砂轮磨粒评定和分析的要求。     

计量型原子力显微镜的位移测量系统(英文)

针对纳米结构表征和纳米制造的质量控制需要,中国计量科学研究院设计并搭建了一台计量型原子力显微镜用于纳米几何结构的测量.为了将位移精确溯源到国际单位米,研制了单频8倍程干涉仪测量位移,样品表面形貌则由接触式原子力显微镜测量.一个立方体反射镜与原子力显微镜的测头固定,作为干涉仪的参考镜.两个互相垂直的干涉仪用于测量样品与探针在x-y方向的相对位置.样品台置于具有三面反射镜的零膨胀玻璃块上,由压电陶瓷位移台驱动.另外两台干涉仪测量样品与探针在z方向的位移,探针针尖位于干涉仪光束的交点以减小Abbe误差.由于光学器件的缺陷产生的相位混合会引起非线性误差,采用谐波分离法拟合干涉信号来修正误差,修正后干涉仪测量误差减小为0.7 nm.     

一种便携式光学表面轮廓仪

研究了一种基于短相干光相移干涉法的便携式光学表面轮廓仪,分析了短相干光干涉显微镜相移干涉技术,实现了基于该项技术的光干涉显微系统。采用光路集成化的设计方法,实现了一体化轮廓仪光路集成,优化了机械三维调整测量台,实现了可用于大、小口径元件表面测量的正置、倒置两种测量模式。测试结果表明,仪器的粗糙度测量精度为0.1nm,重复性误差优于0.01nm,横向分辨率优于1μm。     

散射式太赫兹扫描近场光学显微技术研究

基于散射式近场探测原理,设计并搭建了散射式太赫兹扫描近场光学显微系统(THz s-SNOM),实现了纳米量级空间分辨率的太赫兹近场显微成像测量。该系统以输出频率范围为0.1~0.3THz的太赫兹倍频模块为发射源,通过纳米探针的针尖产生纳米光源与样品相互作用,并将样品表面的倏逝波转化为可在远场测量的辐射波。通过探针逐点扫描样品表面,同时获得了样品表面的形貌图和太赫兹近场显微图。该系统的显微分辨率取决于探针针尖的曲率半径,而与太赫兹波的波长无关。使用该系统测量了金薄膜/硅衬底样品和石墨烯样品的近场显微图,结果表明,近场显微的空间分辨率优于60nm,波长与空间分辨率之比高达λ/26000。     

基于轮廓法的金刚石线锯整周三维表面形貌测量和评价

针对毫米级尺度线径和微米级尺度磨粒的金刚石线锯整周三维表面形貌测量难以实现与定量评价问题,提出一种基于轮廓法的圆周扫描表面磨粒形貌测量与分析方法。通过显微测量系统沿周向扫描采集金刚石线锯对应的边缘轮廓图像序列,经图像处理后获得金刚石线锯整个圆周表面形貌的坐标点云,采用三次样条插值法对数据进行平滑处理,经圆柱坐标变换处理,可重构金刚石线锯三维表面形貌。在金刚石线锯常用评价参数基础上,提出基于扫描过程二维投影轮廓和三维重构形貌的综合评价参数。采用自行研制的测量系统,对两个规格的线锯（线径外径分别为0.250 mm、0.320 mm;磨粒粒径范围30~40 μm）进行测量和评价。试验结果表明：该方法无需多次拼接,就可完成金刚石线锯整周三维微观形貌测量,并能实现对线锯特征参数的全面评价,可为线锯本身制造及使用过程中的工艺优化提供更加客观的基础数据。     

Evaluation on 3D micro-ground profile accuracy of micro-pyramid-structured Si surface using an adaptive-orientation WLI measurement

According to the aperture of the objectives, surfaces with steep topographies greater than approximate 25° are difficult or unable to measure with white light interferometry. Hence, an adaptive-orientation measurement is proposed by adjusting the incidence angle from 51° to 21°. In this study, a micro-grinding with #3000 diamond wheel V-tip was employed to fabricate the micro-pyramid-structured Si surface with 142 μm in depth and 38 nm in surface roughness. The objective is to evaluate the micro-profile accuracy of micro-ground Si surface. First, the four micro-ground surfaces of micro-pyramid-structured surface were measured along the adaptive orientation with an incidence angle, respectively; then iterative closest point (ICP) matching was used to reconstruct the whole micro-ground surface with four adaptive-orientation measured point clouds; finally, 3D reconstruction error and characterized profile error were investigated. It is shown that the ICP matching with denoising and finishing is valid to register four adaptive-orientation measured point clouds for reconstructing an integrated micro-ground surface. Moreover, a decrease in incidence angle to measured surfaces leads to a decrease in 3D reconstruction error, an increase in valid top-topographic point number and a decrease in characterized profile error. It is confirmed that the adaptive-orientation measurement with 21° incidence angle may enhance 3D reconstruction accuracy by about 35%, valid top-topographic point number by about 3 times and characterized profile accuracy by about 38% against the traditional measurement, respectively. The micro-ground form error of 5.5 μm and the characterized profile error of 6.0 μm may be achieved, respectively, thus the micro-grinding is valid for the precision micro-fabrication of micro-structured surface.     

A portable three-dimensional stylus profile measuring instrument

This paper describes the development of an inexpensive, portable three-dimensional (3-D) stylus-based surface profiler with a scan range of 4.5 mm × 5.5 mm and a maximum vertical range of 150 μm (limited by signal conditioning electronic range) with a resolution of better than 0.9 μm and a range of 30 μm with a resolution of better than 30 nm at the highest vertical sensitivity. The instrument occupies a volume with dimensions of approximately 75 × 75 × 40 mm (L × B × H) with scan speeds up to 0.5 mm s⁻¹. Construction of instrument components from similar material results in a thermally balanced design with a reasonably low thermal coefficient of 0.27 μm K⁻¹ and a first-order time constant of approximately 40 min. The stylus probe sensor has a free resonant frequency of 49 Hz and a low damping ratio of 0.006. When in stationary contact with a steel surface, this increases to above the transducer bandwidth of 900 Hz. Calibration of the probe sensor is achieved through direct comparison against a standard stylus gauge. Lateral calibration of the specimen carriage position has been assessed by the measurement of standard gratings and laser interferometry. Planar errors caused by the motion of the carriage have been assessed by measuring an optical flat and inferring deviation from a perfect plane as an indication of the worst-case error, which in this case, was 0.2 μm (P-V). The design and construction of the internal datum and the portability of the instrument to facilitate in situ measurement of components are emphasized. Images illustrating the surface mapping capabilities of the profiler are presented.     

飞秒激光抛光CVD金刚石涂层表面

为了实现降低金刚石涂层粗糙度的目的,本文研究了飞秒激光功率,重复频率以及扫描速度对金刚石涂层表面粗糙度的影响,试验之后利用白光干涉仪检测抛光区域形貌以及粗糙度。试验结果表明：粗糙度随着功率的降低而减小,当功率降至100 mw以下时抛光后的粗糙度会随着功率的降低而略微的提高;重复频率对抛光后的粗糙度无显著影响;粗糙度随扫描速度的增大而减小,当扫描速度增加到1.6 mm/s之后,粗糙度会出现略微的升高。在功率100 mw,重复频率1 KHz,扫描速度1.6 mm/s的条件下,得到的粗糙度最低,约为0.14 μm,局部区域粗糙度可降至100 nm以下,并且抛光的区域相对于未抛光区域更具有致密性,基本上满足金刚石涂层低摩擦表面的要求。     

电镀金刚石砂轮高效精密修整及熔融石英磨削试验研究

大尺寸光学玻璃元件主要采用细磨粒金刚石砂轮进行精密/超精密磨削加工,但存在砂轮修整频繁、工件表面面形精度难以保证、加工效率低等缺点。采用大磨粒金刚石砂轮进行加工则具有磨削比大、工件面形精度高等优点,然而高效精密的修整是其实现精密磨削的关键技术。采用Cr12钢对电镀金刚石砂轮(磨粒粒径151 μm)进行粗修整,借助修整区域聚集的热量加快金刚石的磨损,可使砂轮的回转误差快速降至10 μm以内。结合在线电解修锐技术,采用杯形金刚石修整滚轮对粗修整后的电镀砂轮进行精修整,砂轮的回转误差可达6 μm以内,轴向梯度误差由6 μm降至2.5 μm。通过对修整前后的金刚石砂轮表面磨损形貌成像及其拉曼光谱曲线分析了修整的机理。对应于不同的砂轮修整阶段进行熔融石英光学玻璃磨削试验,结果表明,砂轮回转误差较大时,工件材料表面以脆性断裂去除为主;随着砂轮回转误差和轴向梯度误差的减小,工件表面材料以塑性去除为主,磨削表面粗糙度为Ra19.6 nm,亚表层损伤深度低至2 μm。可见,经过精密修整的大磨粒电镀金刚石砂轮可以实现对光学玻璃的精密磨削。     

C/SiC复合材料组织对磨削力与加工表面质量的影响

采用树脂结合剂金刚石砂轮对C/SiC复合材料与SiC陶瓷进行了平面磨削加工试验,通过对比两种材料的磨削力及磨削加工表面质量,分析了C/SiC复合材料组织与其磨削加工特性的 关系。研究结果表明,C/SiC复合材料中碳纤维及SiC基体皆以脆性断裂方式实现材料去除;与SiC陶瓷的加工表面(其表面粗糙度值Ra为0.2~0.3μm)相比,C/SiC复合材料磨削时由于碳纤维层状断裂、拔出及其与SiC非同步去除现象导致其加工表面粗糙度值较高, Ra为0.8~1.0μm;C/SiC复合材料磨削力较小,是相同工艺参数下SiC陶瓷材料磨削力的35%~76%。     

Determination of film thickness and surface profile using reflectometry and spectrally resolved phase shifting interferometry

Surface profiling and film thickness measurement play an important role for inspection in semi conductor industry. White light source had been used as scanning white light interferometry and spectrally resolved white light interferometry for determining surface and film thickness profile. These techniques however failed for thinner film. Recently, reflectometry and spectrally resolved white light interferometry was combined for the same. This technique used Fourier Transform for the calculation of phase in spectral domain with the use of Linnik interferometer. In this method a large amount of carrier offset (carrier fringes) is required to be effective. This carrier fringes in spectrally resolved white light interferometry was achieved by increasing the optical path difference between the test and the reference surface. But, Linnik interferometer cause defocusing problem to create these carrier fringes. We propose in this paper to combine reflectometry and spectrally resolved phase shifting interferometry for measurement of surface and film thickness profile with the use of Michelson objective. Michelson objective will be convenient to implement as compared to the Linnik type and the use of phase shifting interferometry does not necessarily need large number of fringes in the spectral domain.     

Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel

Coarse-grained wheels can realize high efficient grinding of optical glass. However, the serious surface and subsurface damage will be inevitably introduced by the coarse-grained wheels. In this paper, the grinding damage of a copper-resin bond coarse-grained diamond wheel with grain size of 150μm was investigated on optical glass BK7. The wheel was first properly trued with a metal bond diamond wheel, then pre-dressing for the wheel and grinding experiments are carried out on a precision grinder assisted with electrolytic in process dressing (ELID) method. The surface roughness (Ra) of ground surface was measured using an atomic force microscope (AFM) and the surface topography were imaged by a white light interferometer (WLI) and the AFM. The subsurface damage level of ground surface was evaluated by means of both MRF spot method and taper polishing-etching method, in term of the biggest depth of subsurface damage, distribution of micro defects beneath the ground surface, the cluster depth of subsurface damage, relationship between subsurface damage (SSD) and PV surface roughness (SR), propagating distance and pattern of cracks beneath the ground surface. Experimental results indicate that a well conditioned copper-resin bond coarse-grained diamond wheel on a precision grinder can generate good surface quality of Ra less than 50nm and good subsurface integrity with SSD depth less than 3.5ε for optical glass BK7.     

游泳池水中氰尿酸快速检测仪性能评价

对游泳池水中氰尿酸快速检测仪的反应时间、线性、试剂批次、不同操作人员对检测结果的影响,以及仪器波长示值误差和重复性、仪器示值误差和重复性以及样品加标回收率等性能指标进行了系统的考察。实验结果表明:氰尿酸在20.0～100.0 mg/L检测范围内时,检测仪标准曲线的线性相关系数r大于0.9998;不同批次试剂检测相对误差小于±5%;不同操作人员检测同一样品的相对误差小于±10%;3台检测仪波长示值误差范围为-0.05 nm～0.53 nm,波长重复性范围为0.02 nm～0.05 nm; 3台仪器设备对20.00 mg/L和50.00 mg/L两浓度标准溶液测定的示值误差均小于±5%,重复性均小于5%;水样的低、中、高浓度加标回收率范围为86.3.0%～111.6%。     

铜合金表面元素的飞行时间二次离子质谱微区原位分析

铜合金中含有Pb、Sn、Zn、Ni等元素,其分布和相对含量对铜合金的性能具有重要影响。本工作采用飞行时间二次离子质谱（TOF-SIMS）法对铜合金标准样品GBW02137和GBW02140的表面进行了微区原位分析;采用束斑直径约5 μm的一次离子束轰击500 μm×500 μm区域内的混合固体合金样品,实现了Cu、Pb、Ni、Sn和Zn元素的表面成像,并测量了各元素在铜合金样品表面的分布情况;利用标样校准法对GBW02137、GBW02140中的⁶⁴Zn/¹²⁰Sn、²⁰⁸Pb/¹²⁰Sn值进行相对含量分析。实验结果表明：TOF-SIMS法可用于铜合金中Cu、Pb、Ni、Sn和Zn等元素的表面成像和相对含量测定;采用标样校准法进行相对含量分析时,测得的⁶⁴Zn/¹²⁰Sn相对误差小于5.1%,RSD优于2.5%,²⁰⁸Pb/¹²⁰Sn的测量相对误差较大,接近27%,但其RSD仍低于5%。     

随动导丝及喷水机构大锥度高速电火花线切割研究

高速往复走丝电火花线切割机床大锥度（≥±5°）切割时,受到诸多因素的影响,尤其是电极丝采用导轮定位产生的结构误差的影响,加上切割时工作液不能很好地包裹住电极丝并随着电极丝沿倾斜方向进入加工区域,使其加工精度和表面粗糙度比直体切割时差很多,对于锥度零件的多次切割特别是大锥度零件的多次切割则显得更加困难,其根本原因是没有能够保持电极丝空间位置及稳定性的随动导丝器和喷水机构。为此,设计了一种随着电极丝倾斜能随动导丝并跟踪喷液的六连杆大锥度随动导丝及喷水机构。通过试验,在相同加工参数条件下,新型随动机构与现有机构相比,圆锥加工误差从80μm减小到40μm,表面粗糙度Ra从4.059μm减小至3.495μm,多次切割后加工精度可以达到25μm（锥度±20°,工件厚40mm）,表面粗糙度Ra达到1.670μm。