共轭和临界双滑移取向Cu单晶体疲劳位错结构的热稳定性研究

在不同塑性应变幅下对[2ˉ23]共轭双滑移和[017]临界双滑移取向Cu单晶体进行疲劳实验直至循环饱和,然后在不同温度下进行退火处理,考察了其位错结构的热稳定性.结果表明,300℃退火处理后,位错结构发生了明显的回复;500和800℃退火处理后,均发生了明显的再结晶现象,并伴随退火孪晶的形成.不同取向Cu单晶体循环变形后形成不同的位错结构,其热稳定性由高到低依次为:脉络结构、驻留滑移带(PSB)结构、迷宫或胞结构.不同取向疲劳变形Cu单晶体中形成的退火孪晶均沿着疲劳后开动的滑移面方向发展,疲劳后的滑移变形程度越高,退火后形成的孪晶数量则越多.但过高的退火温度(如800℃)会加快再结晶晶界的迁移速率,进而抑制孪晶的形成,致使孪晶数量有所减少.     

铜晶体的疲劳损伤微观机制

对Cu单晶体、双晶体和多晶体疲劳损伤微观机制的总结结果表明：在中、低应变范围Cu单晶体的疲劳裂纹主要沿驻留滑移带萌生,而在高应变范围则沿粗大形变带萌生;Cu双晶体中疲劳裂纹总是优先沿大角度晶界萌生和扩展,而小角度晶界则不萌生疲劳裂纹;对于Cu多晶体,疲劳裂纹主要沿大角度晶界萌生,有时也沿驻留滑移带萌生,而孪晶界面两侧由于滑移系具有相容的变形特征而未观察到疲劳裂纹萌生．     

疲劳Cu单晶驻留滑移带的演化及其内应力场

利用扫描电镜电子通道衬度(SEM-ECC)技术,对单滑移取向疲劳Cu单晶从基体脉络位错结构到驻留滑移带(PSBs)位错结构的演化进行了观察．且对这个演化过程中典型的位错结构进行了模拟计算,给出了PSBs演化过程中典型位错结构内应力场的分布．结果表明：在从基体脉络位错结构到PSBs位错结构的演化过程中,内应力的分布是不均匀的,位错密集区域(基体脉络和PSBs墙中)比位错贫乏区域(通道中)平均内应力分布相对集中,PSBs夹层与基体相比平均内应力的分布相对较弱,PSBs与基体边界处存在很大的应力差由观察和计算结果对PSBs演化给出了一个新的可能的演化机制．     

Cu及Cu－Zn合金预变形和循环软化的滑移线形貌

观察了两种不同滑移方式的材料──纯Ｃｕ及Ｃｕ－Ｚｎ合金经预变形及循环软化后的表面滑移线形貌．发现二者预变形的双交滑移特征不同，且Ｃｕ－Ｚｎ合金的交滑移与应力—应变曲线上的动态应变时效现象相对应．Ｃｕ－Ｚｎ合金循环软化后有两种衬度的滑移带，而纯Ｃｕ则主要表现为驻留滑移带，说明两种材料疲劳应变的容纳方式不同．根据滑移带形貌解释了它们不同的软化行为．     

循环变形铜单晶体的滞后回线形状变化与驻留滑移带的萌生

本文系统测量并总结了不同类型双滑移取向铜单体循环变形中滞后回线性形状参数ＶＨ随循环周次Ｎ的变化关系,结果表明,与单滑移晶体不同晶体取向双滑移晶体的滞后回线形状变化趋势有显著的影响,ＶＨ与驻留滑移带（ＰＳＢ）的形成有无明业对应关系与该取向单晶体的循环应力－应变（ＣＳＳ）曲线有无平台区或准平台区出现密切相关,ＶＨ随Ｎ的变化关系反映了晶体在循环变形中的微观组织结构的不同变化,通过ＶＨ确定了不同类型双滑移     

Cu双晶的循环形变行为与疲劳裂纹萌生：Ⅰ.循环形变行为和滑移形貌

在切应变幅γpl≈1066×10-4至9．1×10-3s范围内，研究了四种Cu双晶的循环形变行为,实验结果表明，对于含两单滑移取向组元晶体的三种子行晶界双晶，其循环形变行为表现出和单滑移取向Cu单晶类似的特征，循环应力一应变（CSS）曲线上存在一平台区，但平台应力都高于单滑移取向Cu单晶的典型值（28MPa），且各有所差别对于含一单滑移和一双滑移组元晶体的垂直晶界双晶，CSS曲线上没有明显的平台，并且发现曲线与Cu多晶的CSS曲线非常类似表面形貌观察表明，上述循环形变行为与由于晶界约束而导致的双滑移或多沿移现象以及开动沿移系的位错反应强度密切相关     

铜单晶循环变形饱和阶段疲劳裂纹萌生及表面区域内应力分布的模拟

利用扫描电镜电子通道衬度(SEM—ECC)技术观察了循环变形饱和阶段Cu单晶样品中近表面区域的位错微结构．在样品边缘一些条带状或斑点状呈黑色的位错组织区,利用离散位错动力学方法模拟了该区的位错微观结构,并计算了与此位错微结构相对应的内应力分布,模拟和计算结果表明,黑色区是内应力出现最大值区,即应力集中区,它与驻留滑移带(PSB)中的不均匀变形有关,是疲劳裂纹萌生最可能的位置．模拟和计算结果很好地解释了这一现象．     

高钴钼低碳不锈轴承钢的拉压疲劳裂纹萌生与扩展

采用QBG-50型高周疲劳试验机对高钴钼不锈轴承钢进行轴向拉压疲劳试验,研究了其在室温和500℃下的疲劳裂纹萌生扩展行为。结果表明：室温条件下试验钢的拉压疲劳极限强度为785 MPa, 500℃条件下试验钢的拉压疲劳极限强度为550 MPa,较室温降低了30.0%。通过扫描电镜对疲劳断口观察发现,室温下试验钢的疲劳裂纹起裂类型为单源起裂,起裂源为驻留滑移带、表面加工缺陷和夹杂物,高温下试验钢的起裂类型为单源起裂和多源起裂,起裂源为驻留滑移带、夹杂物和表面加工缺陷。室温下疲劳裂纹萌生于内部驻留滑移带,而500℃下疲劳裂纹多形成在表面或接近表面的滑移带。拉压裂纹萌生寿命占总寿命的97.88%以上。     

Cu及Cu－Zn合金预变形和循环软化的滑移线形貌SCIEI

观察了两种不同滑移方式的材料──纯Ｃｕ及Ｃｕ－Ｚｎ合金经预变形及循环软化后的表面滑移线形貌．发现二者预变形的双交滑移特征不同，且Ｃｕ－Ｚｎ合金的交滑移与应力—应变曲线上的动态应变时效现象相对应．Ｃｕ－Ｚｎ合金循环软化后有两种衬度的滑移带，而纯Ｃｕ则主要表现为驻留滑移带，说明两种材料疲劳应变的容纳方式不同．根据滑移带形貌解释了它们不同的软化行为．     

疲劳态铜单晶高速形变下绝热剪切带的形成

采用分离式Hopkinson压杆(SHPB)实验装置和SEM研究了原始态和疲劳态铜单晶在高应变率下形变的组织演变．实验结果表明：原始态铜单晶在高应变率下很难产生绝热剪切带(ASB),而疲劳态铜单晶容易产生绝热剪切带．驻留滑移带(PSBs)和冲击波引起的应力集中是疲劳态铜单晶高应变率形变下绝热剪切带形成的重要原因,绝热剪切带的间距和宽度随应变率的增大而减小．     

高密度脉冲电流对Cu单晶体驻留滑移带的影响

对含驻留滑移带（ＰＳＢ）的「１２３」取向的疲劳Ｃｕ单晶体,进行了高密度脉冲电流处理,结果表明,高密度脉冲电流处理产生的热压应力改善了ＰＳＢ－基体界面的应力集中状态,使驻留滑移带局部消失,理论计算同时表明,高密度脉冲电流处理能提高Ｃｕ单晶疲劳寿命。     

Cyclic saturation behavior of tungsten monofilament-reinforced monocrystalline copper matrix composites

Studies on saturation behavior produced by cyclic deformation have been conducted on tungsten monofilament-reinforced monocrystalline copper composites. The effect of the fiber on strain localization has been investigated using interferometry. For a given applied strain amplitude, local strain and volume fraction of the persistent slip bands (PSBs) in the composite appeared no different from those observed in monolithic copper single crystals. However, the distribution of the PSBs was observed to be more uniform, and the total number of PSBs is substantially higher than that in monolithic crystals. The PSBs appeared mostly in the form of micro-PSBs or macro-PSBs with very limited width. Instead of expanding existing PSBs, new PSBs were more likely to nucleate at new locations during cyclic deformation. The volume fraction and width of the PSBs were observed to increase during saturation, which indicates that some of the PSBs become aged and new PSBs form in order to continue to carry the plastic strain. A rule of mixtures model was established to link the cyclic stress–strain response of the monocrystalline composites to the behavior of monolithic single crystals and fibers. The results calculated from the model show very good agreement with the experimental data.     

Fatigue mechanism in Ni3Fe single crystals with L12 superlattice structure

Ni₃Fe single crystals with the L1₂ structure were cyclically deformed with various loading axes at different plastic strain amplitudes. The crystals demonstrated initial strong cyclic hardening followed by rapid cyclic softening at any orientation tested. There existed a typical plateau region in the cyclic stress–strain curves of the crystals oriented for single slip, while the saturation shear stress (τ_s) monotonically increased with increasing plastic shear strain amplitude (γ_pl) for double-slip oriented crystals. Persistent slip bands (PSBs) with cell-like dislocation structure developed in fatigued Ni₃Fe single crystals. The relationship between the volume fraction of PSBs and γ_pl suggests that Winter’s two-phase model can be applied to explain the cyclic stress–strain response in Ni₃Fe single crystals. Activation of the secondary slip is closely related to the cyclic hardening/softening behaviour and the formation of PSB in Ni₃Fe single crystals.     

不同取向疲劳态铜单晶高速冲击下的绝热剪切带

采用分离式Hopkinson压杆装置（SHPB）和扫描电镜电子通道衬度（SEM—ECC）技术研究了不同取向疲劳态铜单晶高应变率压缩下形成的绝热剪切带（ASB）．实验表明,ASB形成的临界应变与晶体取向有关,接近压缩临界双滑移取向晶体需要的临界应变最小,单滑移和压缩共轭双滑移取向的次之,共面双滑移取向的最大．本实验条件下形成的ASB内部典型的位错组态为位错胞结构,未观察到再结晶现象．根据空间位向,ASB可以分为3类：第1类非常接近铜晶体疲劳时形成的第2类形变带（DBII）平面,其临界应变最小;第2类ASB位向或者比较接近DBII平面或者比较接近第1类形变带（DBI）平面,其临界应变居中;第3类ASB位向与DBI和DBII平面均不接近,其临界应变最大．     

镁合金早期疲劳损伤的非线性超声在线检测与原位微观观察(英文)

开发了一套在材料疲劳实验机上直接在线测量超声非线性系数的实验系统。利用该系统进行3组不同加载应力下的镁合金试件疲劳在线非线性超声检测,同时,利用光学显微镜对镁合金材料随着疲劳周数增大的微观结构变化进行原位观察。结果表明,在疲劳寿命的55%之前,随着疲劳周数的增加,位错滑移产生的驻留滑移带增多,微裂纹萌生扩展,超声非线性系数随之增大;在疲劳寿命的55%之后,宏观裂纹的出现使超声衰减系数增大,超声非线性系数有减小趋势。微观观察结果可以很好地验证超声实验结果。另外,高周和低周疲劳以及拉-拉和拉-压等疲劳模式的变化对实验结果没有明显的影响。     

Fatigue of metallic microdevices and the role of fatigue-induced surface oxides

A new method for fatigue testing of metallic micro-electro-mechanical systems has been developed and applied to characterize the high-cycle fatigue behavior of nickel microspecimens formed by the LIGA process. Cantilever microbeams with a cross-section of 26 × 250 μm were tested under fully reversed loading conditions at 20 Hz. The observed stress-life curve and fatigue limit was similar to what has typically been reported for conventional bulk nickel. SEM inspection of the fatigue surface revealed that failure initiated in zones of localized extrusions and intrusions associated with persistent slip bands (PSBs). Focused ion beam machining was used to extract a cross-sectional TEM foil from the deformation zone, revealing an unexpected thick (up to 400 nm) oxide on the surface of the PSBs. This PSB oxide thickening mechanism appears to be the source of crack initiation.