A CMOS 10-gb/s SONET transceiver

This paper presents a single-chip SONET OC-192 transceiver (transmitter and receiver) fabricated in a 90-nm mixed-signal CMOS process. The transmitter consists of a 10-GHz clock multiplier unit (CMU), 16:1 multiplexer, and 10-Gb/s output buffer. The receiver consists of a 10-Gb/s limiting input amplifier, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. Both transmit and receive phase-locked loops employ a 10-GHz on-chip LC voltage-controlled oscillator (VCO). This transceiver exceeds all SONET OC-192 specifications with ample margin. Jitter generation at 10.66-Gb/s data rate is 18 mUI/sub pp/ (unit interval, peak-to-peak) and jitter tolerance is 0.6 UI/sub pp/ at 4-MHz jitter frequency. This transceiver requires 1.2V for the core logic and 1.8 V for input/output LVDS buffers. Multiple power supply domains are implemented here to mitigate crosstalk between receiver and transmitter. The overall power dissipation of this chip is 1.65 W.     

基于65nm工艺的3Gb/s多通道收发器*

采用 65nm工艺,实现了一款16位并行收发器的IP核,它在5pf的负载及HBM 2000V的ESD保护下,其速率为3Gb/s。为了减小延时,均衡器、时钟数据恢复电路、CRC检测电路以及8b/10b编码电路在设计中均没有使用,所以整个电路在没有电缆的情况的延时为7ns。根据收发器在工艺、电压和温度下的鲁棒特性,在设计中采用了自动频率校正的锁相环电路,低偏移的差分时钟树及具有共模反馈的稳定电流模驱动器电路。该收发器在3Gbps速度下误码率小于10^-15,可以在不同的工艺角和极端温度下正常工作,并且能够容忍20%电压的偏差变化,在100nm下的具有低延时和高稳定性的高性能处理器中能够得到很好的应用。     

A 2.5-10-Gb/s CMOS transceiver with alternating edge-sampling phase detection for loop characteristic stabilization

This paper describes a technique for stabilizing the binary phase detector (PD) gain under various jitter conditions. A dead zone in the phase detector estimates the magnitude of high-frequency data jitter, and the resulting jitter information is used to control the charge-pump current. An alternating edge-sampling (AES) PD reduces hardware overhead by removing possible redundancies in previous dead-zone implementations. A series sense amplifier driven by a single-phase clock helps high-speed data sampling with increased data evaluation time. A dual path voltage-controlled oscillator incorporating dual-loop architecture enables wide-range operation of clock/data recovery circuits with low jitter. Fabricated in a 0.18-/spl mu/m CMOS process, a test transceiver operates from 2.5 to 11.5 Gb/s with a bit-error rate of less than 10/sup -12/ while consuming 540 mW from a 1.8-V supply.     

A four-channel 3.125-Gb/s/ch CMOS serial-link transceiver with a mixed-mode adaptive equalizer

This work presents a quad-channel serial-link transceiver providing a maximum full duplex raw data rate of 12.5Gb/s for a single 10-Gbit eXtended Attachment Unit Interface (XAUI) in a standard 0.18-/spl mu/m CMOS technology. To achieve low bit-error rate (BER) and high-speed operation, a mixed-mode least-mean-square (LMS) adaptive equalizer and a low-jitter delay-immune clock data recovery (CDR) circuit are used. The transceiver achieves BER lower than <4.5/spl times/10/sup -15/ while its transmitted data and recovered clock have a low jitter of 46 and 64 ps in peak-to-peak, respectively. The chip consumes 178 mW per each channel at 3.125-Gb/s/ch full duplex (TX/RX simultaneous) data rate from 1.8-V power supply.     

A 0.3-μm CMOS 8-Gb/s 4-PAM serial link transceiver

An 8-Gb/s 0.3-μm CMOS transceiver uses multilevel signaling (4-PAM) and transmit preshaping in combination with receive equalization to reduce intersymbol interference due to channel low-pass effects. High on-chip frequencies are avoided by multiplexing and demultiplexing the data directly at the pads. Timing recovery takes advantage of a novel frequency acquisition scheme and a linear phase-locked loop that achieves a loop bandwidth of 35 MHz, phase margin of 50°, and capture range of 20 MHz without a frequency acquisition aid. The transmitted 8 Gb/s data are successfully detected by the receiver after a 10-m coaxial cable. The 2×2 mm² chip consumes 1.1 W at 8 Gb/s with a 3-V supply     

Low-power fully integrated 10-Gb/s SONET/SDH transceiver in 0.13-/spl mu/m CMOS

Here, we present a low-power fully integrated 10-Gb/s transceiver in 0.13-/spl mu/m CMOS. This transceiver comprises full transmit and receive functions, including 1:16 multiplex and demultiplex functions, high-sensitivity limiting amplifier, on-chip 10-GHz clock synthesizer, clock-data recovery, 10-GHz data and clock drivers, and an SFI-4 compliant 16-bit LVDS interface. The transceiver exceeds all SONET/SDH (OC-192/STM-64) jitter requirements with significant margin: receiver high-frequency jitter tolerance exceeds 0.3 UI/sub pp/ and transmitter jitter generation is 30 mUI/sub pp/. All functionality and specifications (core and I/O) are achieved with power dissipation of less than 1 W.     

A 20-Gb/s CMOS multichannel transmitter and receiver chip set forultra-high-resolution digital displays

A multichannel transmitter (TX) and receiver (RX) chip set operating at 20 Gb/s (5 Gb/s×4 ch) has been developed by using 0.25-μm CMOS technology. To achieve multichannel data transmission and high-speed operation, the chip set features: (1) circuits for compensating the phase difference between multiple RX chips, which is due to data skew resulting from different lengths of transmission cables, and for compensating the frequency difference between the system clocks of the TX and RX chips; (2) a self-alignment phase detector with parallel output for a high-speed data-recovery circuit; and (3) a fully pipelined 8B10B encoder. At a 2.5-V power supply, the power consumption of the TX chip during 5-Gb/s operation is 500 mW and that of the RX chip is 750 mW. Four of these TX/RX chip sets can provide an aggregate bandwidth of 20 Gb/s     

A 0.4-4-Gb/s CMOS quad transceiver cell using on-chip regulated dual-loop PLLs

This paper describes the design and implementation of a quad high-speed transceiver cell fabricated in 0.13-/spl mu/m CMOS technology. The clocking circuit of the cell employs a dual-loop architecture with a high-bandwidth core phase-locked loop (PLL) and low-bandwidth digitally controlled interpolators. To achieve low jitter while maintaining low power consumption, the dual-loop PLL uses two on-chip linear regulators of different bandwidths, one for the core and the other for the interpolator loop. The prototype chip operates from 400 Mb/s to 4 Gb/s with a bit error rate of <10/sup -14/. The quad cell consumes 390 mW at 2.5 Gb/s (95 mW/link) under typical operating conditions with a 400-mV output swing driving double terminated links.     

A 0.13-/spl mu/m CMOS 5-Gb/s 10-m 28AWG cable transceiver with no-feedback-loop continuous-time post-equalizer

The frequency-dependent attenuation of the transmission lines between chips and printed circuit boards, for example, is an obstacle to improving the performance of a system enhanced with LSI technology scaling. This is because large frequency-dependent attenuation results in poor eye-opening performance and a high bit-error rate in data transmission. This paper presents a 5-Gb/s 10-m 28AWG cable transceiver fabricated by using 0.13-/spl mu/m CMOS technology. In this transceiver, a continuous-time post-equalizer, with recently developed no-feedback-loop high-speed analog amplifiers, can handle up to 9dB of frequency-dependent attenuation in cables and also achieve an 18-dB improvement in the attenuation (27dB total improvement) by using pre- and post-equalization techniques in combination.     

A redundant multivalued logic for a 10-Gb/s CMOS demultiplexer IC

A redundant multivalued logic is proposed for high-speed communication ICs. In this logic, serial binary data are received and converted into parallel redundant multivalued data. Then they are restored into parallel binary data. Because of the multivalued data conversion, this logic makes it possible to achieve higher operating speeds than that of a conventional binary logic. Using this logic, a 1:4 demultiplexer (DEMUX, serial-parallel converter) IC was fabricated using a 0.18-/spl mu/m CMOS process. The IC achieved an operating speed of 10 Gb/s with a supply voltage of only 1.3 V and with power consumption of 38 mW. This logic may achieve CMOS communication ICs with an operating speed several times greater than 10 Gb/s.     

A 2-Gb/s 0.5-/spl mu/m CMOS parallel optical transceiver with fast power-on capability

This paper describes an optical transceiver designed for power-efficient connections within high-speed digital systems, specifically for board- and backplane-level interconnections. A 2-Gb/s, four-channel, dc-coupled differential optical transceiver was fabricated in a 0.5-/spl mu/m complementary metal-oxide-semiconductor (CMOS) silicon-on-sapphire (SoS) process and incorporates fast individual-channel power-down and power-on functions. A dynamic sleep transistor technique is used to turn off transceiver circuits and optical devices during power-down. Differential signaling (using two optical channels per signal) enables self-thresholding and allows the transceiver to quickly return from power-down to normal operation. A free-space optical link system was built to evaluate transceiver performance. Experimental results show power-down and power-on transition times to be within a few nanoseconds. Crosstalk measurements show that these transitions do not significantly impact signal integrity of adjacent active channels.     

A 1.8-V 10-Gb/s fully integrated CMOS optical receiver analog front-end

A fully integrated 10-Gb/s optical receiver analog front-end (AFE) design that includes a transimpedance amplifier (TIA) and a limiting amplifier (LA) is demonstrated to require less chip area and is suitable for both low-cost and low-voltage applications. The AFE is fabricated using a 0.18-/spl mu/m CMOS technology. The tiny photo current received by the receiver AFE is amplified to a differential voltage swing of 400 mV/sub (pp)/. In order to avoid off-chip noise interference, the TIA and LA are dc-coupled on the chip instead of ac-coupled though a large external capacitor. The receiver front-end provides a conversion gain of up to 87 dB/spl Omega/ and -3dB bandwidth of 7.6 GHz. The measured sensitivity of the optical receiver is -12dBm at a bit-error rate of 10/sup -12/ with a 2/sup 31/-1 pseudorandom test pattern. Three-dimensional symmetric transformers are utilized in the AFE design for bandwidth enhancement. Operating under a 1.8-V supply, the power dissipation is 210 mW, and the chip size is 1028 /spl mu/m/spl times/1796 /spl mu/m.     

A 10-Gb/s Inductorless CMOS Limiting Amplifier With Third-Order Interleaving Active Feedback

This paper presents an inductorless circuit technique for CMOS limiting amplifiers. By employing the third-order interleaving active feedback, the bandwidth of the proposed circuit can be effectively enhanced while maintaining a suppressed gain peaking within the frequency band. Using a standard 0.18-mum CMOS process, the limiting amplifier is implemented for 10-Gb/s broadband applications. Consuming a DC power of 189 mW from a 1.8-V supply voltage, the fabricated circuit exhibits a voltage gain of 42 dB and a -3-dB bandwidth of 9 GHz. With a 2³¹-1 pseudo-random bit sequence at 10 Gb/s, the measured output swing and input sensitivity for a bit-error rate of 10^-12 are 300 and 10 mV_pp, respectively. Due to the absence of the spiral inductors, the chip size of the limiting amplifier including the pads is 0.68times0.8 mm² where the active circuit area only occupies 0.32times0.6 mm²     

An 8-Gb/s/pin simultaneously bidirectional transceiver in 0.35-/spl mu/m CMOS

This paper presents architecture, circuits, and test results for a single-ended, simultaneously bidirectional interface capable of a total throughput of 8 Gb/s per pin. The interface addresses noise reduction challenges by utilizing a pseudodifferential reference with noise immunity approaching that of a fully differential reference. The transmitter supports on-chip termination, predistortion, and low-skew near-end outgoing signal echo cancellation. The receiver's sense amplifier evaluates the average of two differential input signals without use of analog components and utilizes imbalanced charge injection to compensate for offset voltages. A test chip integrated in a 0.35-/spl mu/m digital CMOS technology uses the proposed techniques to implement an 8-bit wide single-ended voltage-mode simultaneous bidirectional interface and achieves a performance of 8 Gb/s per pin.     

A 10-GB/s SONET-compliant CMOS transceiver with low crosstalk and intrinsic jitter

A 4:1 SERDES IC suitable for SONET OC-192 and 10-Gb/s Ethernet is presented. The receiver, which consists of a limiting amplifier, a clock and data recovery unit, and a demultiplexer, locks automatically to all data rates in the range 9.95-10.7 Gb/s. At a bit error rate of less than 10/sup -12/, it has a sensitivity of 20 mV. The transmitter comprises a clock multiplying unit and a multiplexer. The jitter of the transmitted data signal is 0.2 ps RMS. This is facilitated by a novel notched inductor layout and a special power supply concept, which reduces cross-coupling between the transmitter and receiver. Integrated in a 0.13-/spl mu/m CMOS technology, the total power consumption from both 1.2- and 2.5-V supplies is less than 1 W.     

An adaptive PAM-4 5-Gb/s backplane transceiver in 0.25-/spl mu/m CMOS

This paper describes a backplane transceiver, which uses pulse amplitude modulated four-level (PAM-4) signaling and continuously adaptive transmit-based equalization to move 2.5-GBd/s symbols totalling 5 Gb/s across typical FR-4 backplanes for total distances of up to 50 inches through two sets of backplane connectors. The 17-mm/sup 2/ device is implemented in a 0.25-/spl mu/m CMOS process, operates off of 2.5- and 3.3-V supply voltages, and consumes 1 W.     

A 2-Gb/s optical transceiver with accelerated bit-error-ratio test capability

Accelerated bit-error-ratio (BER) measurement techniques using specialized test equipment are widely used for rapidly verifying the low BER (<10/sup -12/) of high-performance optical links. However, once these links are deployed in the field, it takes days to weeks to complete such BER measurements using a conventional testing method. This paper describes an optical transceiver architecture with on-chip accelerated BER measurement mechanics that reduces "in the field" BER testing time to minutes. The approach described in this paper uses an integrated interference generator to degrade receiver performance and raise the BER to a range that allows a substantially reduced measurement time. Values of BER versus the amount of interference are then extrapolated to the point of zero artificial degradation for actual BER. A 0.5-/spl mu/m complementary metal-oxide-semiconductor, 2-Gb/s, four-channel optical transceiver chip was designed, fabricated, and tested to serve as a vehicle for verifying the concept. The experimental results show excellent agreement between the extrapolated and actual BER values. The architecture described here points to a practical built-in self-test capability for optical links within high-performance digital systems, specifically in board- and backplane-level interconnections.     

A 10-Gb/s Inductorless CMOS Analog Equalizer With an Interleaved Active Feedback Topology

A 10-Gb/s low-power analog equalizer for a 10-m coaxial cable has been realized in 0.13- $muhbox{m}$ CMOS technology. To compensate the cable loss of 20 dB at 5 GHz, this equalizer with an interleaved active feedback topology is proposed without using inductors. Moreover, additional capacitive and resistive source degenerations are incorporated to meet low-frequency losses. This circuit consumes only 14 mW (excluding the output buffer) from a 1.2-V supply with the output swing up to 400 $hbox{mV}_{rm pp}$, and it occupies $0.38 times 0.34 hbox{mm}^{2}$. For 8-, 9-, and 10-Gb/s pseudorandom binary sequences (PRBSs) of $2^{31} - 1$, the measured maximum peak-to-peak jitters are 26, 34, and 40 ps, respectively, and the measured bit error rate (BER) is less than $10^{-12}$.      

A Single-Chip 2.5-Gb/s CMOS Burst-Mode Optical Receiver

This paper describes the design of a 2.5-Gb/s burst-mode optical receiver in a 0.18-mum CMOS process. A dual-gain-mode transimpedance amplifier (TIA) with constant damping factor control is proposed to tolerate a wide dynamic range input signal. By incorporating an automatic threshold tracking circuit (ATC), the TIA and limiting amplifier (LA) are dc coupled with feedforward offset cancellation. Dual-band filters are adopted in the ATC for a rapid response time while keeping the tracking error small. By integrating both a TIA and a post-LA in a single chip, the burst-mode receiver provides a conversion gain of 106 dBmiddotOmega in the high gain mode, 97 dBmiddotOmega in the low gain mode, and a -3-dB bandwidth of 1.85 GHz. The measured input sensitivity, overload level, and dynamic range of the optical receiver are -19 dBm, -2 dBm, and 17 dB, respectively. The response time is less than 50 ns. Operating under a single 1.8-V supply, this chip dissipates only 122 mW.     

A 0.4-μm CMOS 10-Gb/s 4-PAM pre-emphasis serial link transmitter

A serial link transmitter fabricated in a large-scale integrated 0.4-μm CMOS process uses multilevel signaling (4-PBM) and a three-tap pre-emphasis filter to reduce intersymbol interference (ISI) caused by channel low-pass effects. Due to the process-limited on-chip frequency, the transmitter output driver is designed as a 5:1 multiplexer to reduce the required clock frequency to one-fifth the symbol rate, or 1 GHz. At 5 Gsym/s (10 Gbis), a data eye opening with a height >350 mV and a width >100 ps is achieved at the source. After 10 m of a copper coaxial cable (PE142LL), the eye opening is reduced to 200 mV and 90 ps with pre-emphasis, and to zero without filtering, The chip dissipates 1 W with a 3.3-V supply and occupies 1.5×2.0 mm² of die area