Diffusion and strain relaxation in Si/Si1−xGex/Si structures studied with Rutherford backscattering spectrometry

The thermal stability of strained Si/Si_1−xGe_x/Si structures grown by molecular beam epitaxy was investigated by resistive heating and in situ Rutherford backscattering spectrometry. Ge profiles obtained from a 50 nm Si_1−xGe_x layer on a Si(100) substrate capped with 50 nm Si were evaluated for different Ge concentrations after sequential heating periods at a particular temperature between 850 and 1010° C. The diffusion coefficients, calculated from the increase in signal in the tail of the Ge profile, proved to be comparable to the value for Ge in bulk Si. A more pronounced decrease of the signal at the center of the Ge profile indicated a faster diffusion within the SiGe layer which was confirmed by analysis of the FWHM of the Ge profile. Ion channeling measurements were used to characterize tetragonal strain in the buried SiGe layers. Angular scans through the 111 direction were interpreted with Monte Carlo channeling calculations and used to study strain relaxation in dislocation-free and partially relaxed layers.     

Monitoring interstitial fluxes by self-assembled nanovoids in ion-implanted Si/SiGe/Si strained structures

We report on the effect of the rapid thermal annealing (RTA) ambiance on evolution of self-assembled voids of nanometer size. The spherically shaped voids are produced in molecular beam epitaxially grown Si/SiGe/Si strained structures with in-situ implantation of 1 keV Ge ions followed by RTA at 800 or 900 °C. The voids are of nanometer size and are exclusively assembled in the narrow SiGe layer. During the RTA, the voids grow in size in a nitrogen ambiance and shrink in an oxygen ambiance. The evolution of the voids correlates well with oxidation-induced injection of excess interstitials. Prospects for point defect monitoring are discussed.     

Investigation on the strain of SiGe/Si heteroepitaxial system during high temperature annealing by BiBS/Channeling

1 INTRODUCTIONSilicon-germanium (Sil--.Ge.) is playing an increasingly imPortant role in modernvery-large scale integration (VLSI) technology, paxticulaxly in high-speed devices for fu-tu-re telecommwhcation applications.[1] when si1--.Ge. alloy filins are grown epittalanYon Sillcon substrates, there exists a lattice nilsmatch at the interface. This Ansmatchcauses a strain in the Si1--.Ge. aJloy filIn, which is comPressive in the plane of the in-terface and tensile perpendicular to i…     

Investigation on the strain of SiGe ／Si heteroepitaxial system during high temperature annealing by RBS／Channeling

The influence of the high temperature processing on the strain stored in SiGe hetero epilayer was studied by means of RBS/Channeling. Channeling angularscan along the ＜ 110 ＞ axial direction in the (100) plane was used to characterize the tetragonal distortion in the SiGe strained layer. The strained crystal structure parameters were acquired by combining the determination of strain with the elasticity theory. It is shown that the strain stored in the SiGe epilayer has significantly change (relaxation factor from 0.023 to 0.84) after high temperature annealing. The potential strain relaxation mechanisms were discussed.     

SiGe/Si(100)外延薄膜材料的应变表征研究

如何表征SiGe／Si异质外延薄膜中的应变对提升SiGe器件的性能至关重要。本文详细介绍了卢瑟福背散射／沟道效应(RBS／C)、高分辨率X射线衍射(HRXRD)和拉曼(Raman)谱等技术表征SiGe薄膜中应变的原理。通过这些实验技术,研究了SiGe／Si外延薄膜在氧气和惰性气体氛围下高温退火前后应变弛豫及离子注入Si衬底上外延生长的SiGe薄膜应变状态。     

Thermal solid phase epitaxial growth and ion-beam induced crystallisation of Ge ion implanted layers in silicon

Solid phase epitaxial growth (SPEG) of amorphous SiGe layers in Si has been investigated. The amorphous layers were formed by 40 keV ⁷⁴Ge⁺ ion implantation in Si(100) single crystals with doses giving 22 at.% Ge at the maximum of the ion implanted distribution of Ge. SPEG of the amorphous layers was achieved by either thermal SPEG or a combination of thermal SPEG and ion-beam induced crystallisation (IBIC). The crystal quality of the layers was investigated by Rutherford backscattering spectrometry and transmission electron microscopy. Fully crystallised SiGe alloy layers were obtained by annealing in a furnace at 550°C for 60 min or at 850°C for 20 min. However, the SiGe alloy layers contain extended defects formed at the relaxation of the built-in strain in the alloy layer. When the combination of thermal SPEG and IBIC was used for the SPEG very few of these defects were formed.     

Strain relaxation of epitaxial SiGe layers on Si(1 0 0) improved by hydrogen implantation

We propose a new method to fabricate strain relaxed high quality Si_1−xGe_x layers on Si by hydrogen implantation and thermal annealing. Hydrogen implantation is used to form a narrow defect band slightly below the SiGe/Si interface. During subsequent annealing hydrogen platelets and cavities form, giving rise to strongly enhanced strain relaxation in the SiGe epilayer. As compared to thermally induced strain relaxed Si–Ge epilayers, the hydrogen implanted and annealed samples show a greatly reduced threading dislocation density and a much higher degree of strain relaxation (90%). We assume that the hydrogen induced defect band promotes strain relaxation via preferred nucleation of dislocation loops in the defect band which extend to the interface to form misfit segments. The samples have been investigated by X-ray diffraction, Rutherford backscattering spectrometry and transmission electron microscopy.     

Characterization of Si/GexSi1 − x heterojunction bipolar transistors formed by Ge ion implantation in Si

Epitaxial Si/Ge_xSi_{1 − x} heterojunctions were formed by high dose Ge ion implantation in Si followed by rapid thermal annealing at 1000°C for 10 s. This technique was adopted to fabricate Si/Ge_xSi_{1 − x} heterojunction n-p-n bipolar transistors (HBT) using a self-aligned, double polycrystalline silicon process commonly used for fast Si bipolar transistors. The devices are characterized by a 60 nm wide neutral base with a Ge concentration peak of ≈ 7 at.% at the base-collector junction. Good static and dynamic electrical characteristics are demonstrated and discussed.     

Characterization of extended defects in SiGe alloys formed by high dose Ge implantation into Si

The synthesis of SiGe/Si heterostructures by Ge⁺ ion implantation is reported. 400 keV Ge⁺ ions were implanted at doses ranging from 3 × 10¹⁶ to 10 × 10¹⁶ ions/cm² into (001) Si wafers, followed by Si⁺ amorphisation and low temperature Solid Phase Epitaxial Regrowth (SPER). TEM investigations show that strained alloys can be fabricated if the elastic strain energy (E_el) of the SiGe layer does not exceed a critical value (E′_el) of about 300 mJ/m², which is independent of the implantation energy. Our analysis also suggests that “hairpin” dislocations are formed as strain relieving defects in relaxed structures. A “strain relaxation” model is proposed to explain their formation.     

Thin relaxed SiGe layer grown on Ar^＋ ion implanted Si substrate by ultra-high vacuum chemical vapor deposition

1 Introduction Relaxed SiGe layers have gained considerable attention due to their applications in strained Si/SiGe high electron mobility transistor, metal-oxide-semi- conductor field-effect transistor (MOSFET) and other devices. High-quality relaxed SiGe templates, espe- cially those with low threading dislocation density and smooth surface, are crucial for the electrical perform- ance of devices.[1,2] In order to realize high-quality relaxed SiGe layer with such good characteristics, …     

Damage creation in ion irradiated Si1−xGex/Si structures

Strained SiGe/Si structures have been proposed as substrates for fabrication of high speed metal oxide semiconductor transistors. However, influence of strain and/or presence of Ge atoms on damage creation during ion irradiation have not been explored to a significant extent. In this study, Rutherford backscattering spectrometry (RBS) was used to characterize Si_1−xGe_x/Si structures irradiated by 140 keV He⁺ ions at room temperature. When compared with pure Si, strained samples show enhanced damage accumulation as a function of He fluence. Channeling angular scans did not reveal any specific configuration of displacements. Possible mechanisms for enhanced damage in strained Si are discussed.     

Nanometer-thick SGOI structures produced by Ge+ ion implantation of SiO2 films and subsequent hydrogen transfer of Si layers

Nanometer-thick silicon-germanium-on-insulator (SGOI) structures have been produced by the implantation of Ge⁺ ions into thermally grown SiO₂ layer and subsequent hydrogen transfer of silicon film on the Ge⁺ ion implanted substrate. The intermediate nanometer-thick Ge layer has been formed as a result of the germanium atom segregation at the Si/SiO₂ bonding interface during annealing at temperatures 800–1100 ^оС. From a thermodynamic analysis of Si/Ge/SiO₂ system, it has been suggested that the growth of the epitaxial Ge layer is provided by the formation of a molten layer at the Si/SiO₂ interface due to the Ge accumulation. The effect of germanium on the hole mobility in modulation-doped heterostructures grown over the 3–20 nm thick SGOI layers was studied. An increase in the Hall hole mobility in SGOI-based structures by a factor of 3–5 was obtained in comparison with that in respective Ge-free SOI structures.     

Strain-driven defect evolution in Sn+ implanted Si/SiGe multilayer structure

We report on secondary defect evolution in a multilayered Si/SiGe structure after 1 MeV Sn⁺-ion implantation to a fluence of 2 × 10¹⁴ cm^?2 followed by thermal annealing in a dry nitrogen atmosphere. Formation of a buried amorphous layer is registered after ion implantation. Thermal treatment leads to formation of dislocation loops in an EOR-defect band, and a mixture of tangle dislocations and “clamshell” defects at the depth of 200–500 nm. In addition, self-assembling of voids in a near-surface SiGe layer structure is observed. The voids are of nanometer size and are preferably located in thin SiGe layers. The results are discussed in terms of the separation of the vacancy and interstitial depth profiles attributed to the preferential forward momentum of recoiling Si atoms. The compressively strained SiGe layers play the role of vacancy accumulator, prevent in-surface diffusion of vacancies and, in this way, result in self-assembling of voids inside compressively strained SiGe layers.     

Formation of Si/SiC multilayers by low-energy ion implantation and thermal annealing

Si/SiC multilayer systems for XUV reflection optics with a periodicity of 10-20 nm were produced by sequential deposition of Si and implantation of 1 keV ions. Only about 3% of the implanted carbon was transferred into the SiC, with a thin, 0.5-1 nm, buried SiC layer being formed. We investigated the effect of thermal annealing on further completion of the carbide layer. For the annealing we used a vacuum furnace, a rapid thermal annealing system in argon atmosphere, and a scanning e-beam, for different temperatures, heating rates, and annealing durations. Annealing to a temperature as low as 600 °C resulted in the formation of a 4.5 nm smooth, amorphous carbide layer in the carbon-implanted region. However, annealing at a higher temperature, 1000 °C, lead to the formation of a rough poly-crystalline carbide layer. The multilayers were characterized by grazing incidence X-ray reflectometry and cross section TEM.     

COMPETING REACTIONS OF EXISTING Ni SILICIDE AND Ni OR Si INDUCED BY THERMAL ANNEALING AND MeV Si ION BEAM MIXING

The competing reactions between existing Ni silicides surrounded by Si and Ni were investigated by thermal annealing and MeV Si ion beam mixing. With high energy irradiation, the energy deposition at both interfaces, Ni/Ni silicide and Ni silicide/Si, is equal. Two MeV He~- RBS and TEM were used to obtain the reacted layer composition and epitaxial orientation, respectively. Also glancing angle Co K_a. X-ray diffraction was utilized to identify phase formation. The main results indicate that the existing silicides preferentially react with Ni layer, and that there are pronounced differences of Ni silicide phase transition between thermal annealing and MeV Si ion beam mixing, even though the mixing was performed in radiation enhanced diffusion regime. The results can be explained in term of the heat of silicide formation and surface energy change.     

Ion beam induced amorphization and recrystallization of Si/SiC/Si layer systems

Epitaxial, buried silicon carbide (SiC) layers have been fabricated in (100) and (111) silicon by ion beam synthesis (IBS). In order to study the ion beam induced epitaxial crystallization (IBIEC) of buried SiC layers, the resulting Si/SiC/Si layer systems were amorphized using 2 MeV Si²⁺ ion irradiation at 300 K. An unexpected high critical dose for the amorphization of the buried layers is observed. Buried, amorphous SiC layers were irradiated with 800 keV Si⁺ ions at 320 and 600°C, respectively, in order to achieve ion beam induced epitaxial crystallisation. It is demonstrated that IBIEC works well on buried layers and results in epitaxial recrystallization at considerably lower target temperatures than necessary for thermal annealing. The IBIEC process starts from both SiC/Si interfaces and may be accompanied by heterogenous nucleation of poly-SiC as well as interfacial layer-by-layer amorphization, depending on irradiation conditions. The structure of the recrystallized regions in dependence of dose, dose rate, temperature and crystal orientation is presented by means of TEM investigations.     

Strain enhancement in Si induced by direct bonding of a LaAlO3 film to a Si substrate

The depth profiles of lattice strain near the interface regions of LaAlO₃/Si and the SiO₂ interfacial layer/Si were investigated by the ion channeling technique using high-resolution Rutherford backscattering spectroscopy (HRBS). In the case of the LaAlO₃/Si stack, horizontal tensile strain in the Si near the interface was clearly observed. However, this strain was relaxed by formation of the interfacial layer through annealing in an oxygen ambient. These results suggest that the strain in Si induced by a dielectric strongly depends on the material in contact with Si.     

2 MeV Si ion implantation damage in relaxed Si1−xGex

The damage produced by implanting, at room temperature, 3 μm thick relaxed Si_1−xGe_x layers with 2 MeV Si⁺ ions has been measured as a function of Ge content (x = 0.04, 0.13, 0.24 or 0.36) and Si dose in the dose range 10¹⁰–10¹⁵ cm⁻². The accumulation of damage with increasing dose has been studied as a function of Ge content by Rutherford Backscattering Spectrometry, Optical Reflectivity Depth Profiling and Transmission Electron Microscopy and an increased damage efficiency in Si_1−xGe_x with increasing x is observed. The characteristics of implantation-induced defects have been investigated by Electron Paramagnetic Resonance. The results are discussed in the context of a model of the damage process in SiGe.     

Structural characterization of amorphous Fe–Si and its recrystallized layers

We have synthesized amorphous Fe–Si thin layers and investigated their microstructure using transmission electron microscopy (TEM). Si single crystals with (1 1 1) orientation were irradiated with 120 keV Fe⁺ ions to a fluence of 4.0 × 10¹⁷ cm⁻² at cryogenic temperature (120 K), followed by thermal annealing at 1073 K for 2 h. A continuous amorphous layer with a bilayered structure was formed on the topmost layer of the Si substrate in the as-implanted specimen: the upper layer was an amorphous Fe–Si, while the lower one was an amorphous Si. After annealing, the amorphous bilayer crystallized into a continuous β-FeSi₂ thin layer.     

带有AlN插入层的GaN薄膜的结构及应变研究

利用金属有机化学汽相沉积（MOCVD）法在硅衬底上生长具有AlN插入层的GaN外延膜，采用高分辨X射线衍射（HRXRD）和卢瑟福背散射/沟道（RBS/Channeling）技术研究分析其结构和应变性质。从RBS<0001>沟道谱可知，该外延膜具有良好的结晶品质，χ_min=2.5%。利用不同方位角上XRD摇摆曲线测量，可得出GaN（0001）面与Si（111）面之间的夹角β=1.379°。通过对GaN（0002）和GaN（1015）衍射面的θ-2θ扫描，可以得出GaN外延膜在垂直方向和水平方向的平均弹性应变分别为-0.10%±0.02%和0.69%±0.09%。通过对{1010}面内非对称<1213>轴RBS角扫描可得出由弹性应变引起的四方畸变e_T在近表面处为0.35%±0.02%。外延膜弹性性质表明GaN膜在水平方向具有张应力(e∥>0)、在垂直方向具有压应力(e^⊥<0)，印证了XRD的结果。四方畸变是深度敏感的，通过对不同深度的四方畸变计算可知，AlN插入层下面的GaN外延膜弹性应变释放速度比AlN层上面的GaN层弹性应变释放快，说明AlN层的插入缓解了应变释放速度。