Synthesis and evaluation of positive-acting photosensitive polyimides with phenol moiety

Novel positive-acting photosensitive polyimide resists ( 1 ) developable with an alkaline aqueous solution were prepared. The resists consisted of a naphthoquinone diazide (NQ) and a polyamic acid bearing hydroxyphenyl groups (PA). The hydroxyphenyl moieties are newly incorporated by adding 2-N,N-dimethylaminoethyl-3-hydroxybenzoate (m-PEA) or 2-N,N-dimethylaminoethyl-4-hydroxybenzoate (p-PEA) to the polyamic acid, through ionic interaction between the carboxylic acid and the amine. The NQ acts as a solution inhibitor for the PA by the interaction with the hydroxyphenyl moiety. This system is similar to that of phenol-novolac resin/NQ resists currently conducted in the fabrication of the Large Scale Integrated circuit (LSI). The resist ( 1 ) is exposed to a G-line and is developed with tetramethylammonium hydroxide aqueous solution to provide fine patterns, proving that the ( 1 ) is compatible with LSI-production lines currently applied. A novel polyamic acid-curing mechanism found in the course of this study is also reported. © 1995 John Wiley & Sons, Inc.     

Novel positive‐working aqueous‐base developable photosensitive polyimide precursors based on diazonaphthoquinone‐capped polyamic esters

Novel positive‐working aqueous‐base developable photosensitive polyimide (PSPI) precursors based on partially diazonaphthoquinone (DNQ)‐capped polyamic esters bearing phenolic hydroxyl groups and a DNQ photosensitive compound (PIC‐3) were developed. The partially DNQ capped polyamic esters were prepared from an esterification reaction of 1,2‐naphthoquinone diazide‐5‐sulfonyl chloride with the polyamic esters. The partially DNQ capped polyamic esters decreased the dark film loss effectively in the aqueous‐base developer and were able to make thicker film resists compared to the uncapped polyamic esters. The 25 mol % DNQ‐capped BisAPAF–PMDA polyamic ester and BisAPAF–ODPA polyamic ester containing 25 wt % PIC‐3 photosensitive compound showed a sensitivity of 176 and 185 mJ/cm², and a contrast of 1.68 and 1.02, respectively, in a 3‐μm film with 1.25 wt % tetramethylammonium hydroxide developer. A pattern with a resolution of 5 μm was obtained from both PSPI precursor compositions. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2293–2300, 2003     

Morphology and size control of inorganic particles in polyimide hybrids by using SiO2-TiO2 mixed oxide

Polyimide/inorganic hybrids were prepared by sol-gel reaction starting from tetraethoxysilane (TEOS), and tetrabutyl titanate (TBT) in the solution of polyamic acid in N,N-dimethylformamide. The hybrid films were obtained by the hydrolysis-polycondensation of TEOS and TBT in polyamic acid solution, followed by the elimination of solvents and imidization process. Binary polyimide/SiO₂ and polyimide/TiO₂ hybrids, as well as ternary polyimide/SiO₂-TiO₂ hybrids (with varied ratio of SiO₂ to TiO₂) were prepared to study the effects of the recipes and inorganic components on the morphologies of the polyimide hybrids. Transparent films with much higher inorganic content can be obtained in ternary polyimide hybrids, while lower inorganic content in binary hybrids. The results also indicate that the inorganic particles are much smaller in the ternary systems than in the binary systems, the shape of the inorganic particles and the compatibility for polyimide and inorganic moieties are varied with the ratio of the inorganic moieties in the hybrids. The completely imidization temperature of the polyamic acid was delayed, and furthermore, the thermal stability of polyimide was enhanced through the incorporation of the inorganic moieties in the hybrid materials.     

Improvement in the adhesion of polyimide/epoxy joints using various curing agents

An improvement in the adhesion strength of polyimide/epoxy joints was obtained by (1) introducing a functional group on the polyimide surface, (2) improving the mechanical properties of the epoxy adhesive, (3) increasing the curing temperature, and (4) using polyamic acid as an adhesion‐promoting layer. The functional group on polyimide was introduced via treatment with aqueous KOH. An adhesion‐promoting layer was formed by spin coating polyamic acid onto a modified polyimide surface. The maximum adhesion strength of the polyimide/epoxy joint was obtained using polyamic acid as both the adhesion‐promoting layer and as the curing agent. The surface energy of the modified polyimide was examined using contact angle measurements and Fourier transform infrared spectroscopy, and the peel strength was determined by the T‐peel method. The peeled surfaces were analyzed using scanning electron microscopy and X‐ray photoelectron spectroscopy.© 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 812–820, 2002     

聚酰胺酸合成工艺与聚酰亚胺膜制备及表征

聚酰亚胺是一类新型高性能的聚合物材料,是由聚酰胺酸脱水环化而成,因此高分子量的聚酰胺酸是获得高性能PI的前提。探讨了聚酰胺酸合成过程中的影响因素,得出了合成高分子量的聚酰胺酸的最佳工艺条件为:均苯四羧酸二酐与4,4' 二氨基二苯醚摩尔比为1.015～1.020∶1,反应温度20℃,反应时间为3h,聚酰胺酸在N 甲基 2 吡咯烷酮中的特性粘度为0.62dL/g左右。采用热转化法将聚酰胺酸脱水环化制备成均苯型聚酰亚胺膜,通过差示扫描量热法、红外光谱等进行了表征,其玻璃化转变温度为365～385℃,拉伸强度达192.4MPa,表明得到的聚酰亚胺膜具有优良的机械性能。     

Synthesis and characterization of polyimides by use of metal salts and phosphorous compounds in the presence of solvent

Polyimide precursors and polyamic acid were synthesized by direct polycondensation reaction of the 1,2,3,4-butanetetracarboxylic acid (BTCA) and diamines in the presence of metal salts and phosphorous compounds. The BTCA was reacted with an initiating species, which is the phosphonium salt of metal salts and phosphorous compounds, to form acyloxy phosphonium salt building up at moderated temperatures. The salt reacts with diamine to form polyamic acid. The reaction was markedly affected by several factors: reaction temperature and time, solvent, metal salts phosphorous compounds, and tertiary amine. The polyamic acid was converted into polyimide by chemico-thermal or thermal methods. The polyimide with a high molecular weight can be prepared from BTCA and diamines and was soluble in polar aprotic solvent. © 1996 John Wiley & Sons, Inc.     

Surface-Enhanced Raman Scattering As an In-Situ Probe of Polyimide/Silver Interphases

The molecular structure of interphases formed by chemically curing the polyamic acid of pyromellitic dianhydride (PMDA) and oxydianiline (ODA) against meta-aminothiophenol (m-ATP)-primed silver substrates was determined using surface-enhanced Raman scattering (SERS) and reflection-absorption infrared spectroscopy (RAIR). It was found that m-ATP was adsorbed dissociatively onto silver substrates through the sulfur atoms. When polyamic acid was deposited onto silver substrates pretreated with m-ATP, acid groups of the polyamic acid combined with amino groups of m-ATP to form ammonium carboxylate salts near the interphase. SERS and RAIR results indicated that the structure of the interphase was significantly different from that of the bulk polymer. Chemical curing of the polyamic acids located in the interphase was suppressed because of the formation of ammonium carboxylate salts. However, the bulk of the polyamic acid films was highly cured to form polyimide. It was also found that more isoimide groups were formed when thin polyamic acid films were chemically cured in acetic anhydride/pyridine solutions than in acetic anhydride/triethylamine solutions.     

Determination of poisson's ratio for polyimide films

The Poisson's ratios of polyamic acid and polyimide films were determined using a high pressure gas dilatometer. In this technique, a sample is held at constant length and a hydrostatic pressure is applied to the sample. The resulting change in stress on the sample with applied pressure provides a measure of Poisson's ratio. For fully cured polyimide films based on pyromellitic dianhydride and oxydianiline, Poisson's ratio was measured to be 0.34 at approximately 1% strain. This value increases to 0.48 as the strain is increased to 5%.     

Photoinduced electron transfer in nanostructures of ultrathin polyimide films containing porphyrin moieties

Photoinduced electron transfer between porphyrin moieties and pyromellitimide fragments has been investigated in multi-layered structures of ultrathin polyimide films prepared by the Langmuir-Blodgett (LB) technique. The LB films were composed of three kinds of polyimides, which contained zinc tetraphenylporphyrin (ZnTPP) unit as an electron donor (D-layer), no chromophoric groups (S-layer), and pyromellitimide fragments as an electron acceptor (A-layer). The layered structure and orientational distribution of porphyrin moieties in the LB films were evaluated by surface plasmon measurement and absorption dichroism measurement, respectively. The thickness of monolayer was estimated to be 0.9 nm for the polyamic acid films and 0.4 nm for the polyimide films. The molecular plane of porphyrin moieties was oriented in the direction parallel to the substrate plane. In the multi-layered structures of polyimide LB films, the efficiencies of photoinduced electron transfer from porphyrin moieties to pyromellitimide fragments varied sharply with the number of spacing layers, indicating that the short-range interactions such as electron transfer could be controlled by the fabric of ultrathin films. The rate of electron transfer observed by the fluorescence quenching measurements was numerically simulated for the nanostructure using the Monte Carlo method.     

Polyimide blend alignment layers for control of liquid crystal pretilt angle through baking

Polyimide films were used for liquid crystal (LC) alignment layers to control LC pretilt angles over the full range (8°-90°). The pretilt angles could be controlled using polyimide films prepared from polyamic acid for vertical LC alignment and using polyimide blend films prepared from two types of polyamic acids, one for vertical LC alignment and the other for planar LC alignment, by changing the baking times ranging from 40 to 180 min at 230 °C. The polyimide blend film could control the pretilt angle better than the polyimide prepared from just one polymer component. The LC alignment behavior was well correlated with the wettability of the polyimide films due to the fragmentation of the long alkyl side group on the polyimide surfaces by the baking process.     

Adhesion and interface studies between copper and polyimide

The adhesion and interface structure between copper and polyimide have been studied. Polyimide films were prepared by spinning a polyamic acid solution (Du Pont PMDA-ODA) in an NMP solvent onto a Cu foil, followed by thermal curing up to 400°C. The adhesion strength was measured by a 90° peel test. The peel strength of 25 μm thick Cu foil to 25 μm thick polyimide substrate was about 73 g/mm with the peel strength decreasing with increasing polyimide thickness. Cross-sectional TEM observation revealed very fine Cu-rich particles distributed in the polyimide. Particles were not found closer than 80-200 nm from Cu boundary. These Cu-rich particles were formed as a result of reaction of polyamic acid with Cu during thermal curing. We attribute the high peel strength to interfacial chemical bonding between Cu and polyimide. This behavior is in contrast to vacuum-deposited Cu onto fully cured polyimide.     

Formation of graphite fiber–polyimide prepregs by electrodeposition

Nonaqueous electrodeposition of polyamic acid of pyromellitic dianhydride and 4,4′-diaminodiphenyl ether was carried out from an emulsion containing a solvent, precipitant, emulsifier, and the polyamic acid. The amount of polyamic acid deposited onto the graphite fibers was dependent on electrodeposition parameters such as the applied current, the amount of polyamic acid (solid content), precipitant/solvent (P/S) ratio, and the acid/base (COOH/TEA) mole ratio. The weight gain of fibers increased with increased current density, P/S ratio, solid content, and deposition time. A maximum weight gain of fibers of about 95% was obtained from an emulsion composed of 3 wt % solid content, P/S ratio of 3 : 1, and TEA/COOH ratio of 1 : 1. The electrodeposition of polyamic acid onto graphite fibers proceeded in accordance with the Faraday's law of electrolysis and a Coulombic efficiency of about 62.2 mg/C was attained. Thermal analysis shows that the cured polyimide coatings were thermally stable up to 500°C. © 1996 John Wiley & Sons, Inc.     

聚砜酰胺酸和聚砜酰亚胺的微波辐射合成

采用4，4'-二氨基二苯砜(DDS)与均苯四酸二酐(PMDA)为单体进行微波辐射溶液聚合反应，所得的聚酰胺酸进行固相微波辐射亚酰化。考察了微波辐射时间、反应温度、单体浓度、单体配比等因素对聚合物的特性粘数、转化率的影响，并与热聚合进行比较，用红外及核磁共振的测试方法对聚合物的结构进行了表征，通过红外光谱表征了聚酰亚胺的亚酰化度。实验结果表明：微波辐射不仅能缩短缩聚反应时间，还能提高缩聚物的特性粘数和转化率。固相微波辐射使聚酰胺酸的亚酰化时间缩短，亚酰化度增大。合成的聚酰胺酸和聚酰亚胺都具有一定的荧光性能，聚酰亚胺具有一定的磁性。     

Physicochemical characterization of alloy of polyimide with varying degree of crosslinking through diisocyanates

Polyimide alloys are prepared by blending the crosslinked and uncrosslinked polyamic acid components and followed by thermal imidization. The blend components can be synthesized by the reaction of polyamic acid with the varying concentration of crosslinker [here methylene bis (4-phenyl isocyanate or MDI)] from 1.54 × 10^?2 mol/L (i.e. hypothetically calculated critical crosslinker concentration or CCC) to 1.54 × 10^?6 mol/L. This communication discusses the synthesis and characterization of polyimide (PI) blends and alloys prepared by varying degrees of crosslinking introduced via isocyanate-amic acid reaction. The polyimides were prepared by thermally imidizing the polyamic acid blends at different curing temperatures from 50°C to 350°C. The degree of imidization and residual solvent content for blends having varying mole fractions of crosslinked (or branched) and uncrosslinked components and two extreme conditions and at specified temperature-time profiles have been studied. The resultant PI-MDI blends have exhibited synergism on mechanical properties. The improvement in mechanical properties, however, was significantly higher at the lower imidization temperature (i.e. 50°C to 150°C). The feasibility of preparing polyimide alloys with synergistic combinations of crosslinked and uncrosslinked polyimide components was inferred.     

Fibers from a soluble,fluorinated polyimide

Polyimide fibers have been produced from both polyamic acid and polyimide resins, derived from 2, 2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride and 2, 2-bis (4-4-aminophenoxy) phenyl) hexafluoropropane, by extrusion into various aqueous organic media. Polyimide fibers obtained from polyamic acid fibers after thermal imidization exhibited round or oval cross-sections, while fibers obtained directly from a polyimide resin had dogbone, C-shaped, or oval cross-sections. The effect of polymer inherent viscosity and filament production parameters on the formation of macropores within the filament will be discussed. Tensile properties of fibers, produced under various conditions, are listed and compared. © 1993 John Wiley & Sons, Inc.     

A comparison of physical and mechanical properties of polyimide films containing different metal ions

Metal ions have been incorporated into linear polyimide films in order to improve the potential of these materials for applications in space. Various metals such as Al, Pd, Ag, Au, and Sn in a variety of chemical states were added to a polyamic acid prepared from 3,3′, 4,4′-benzophenone tetracarboxylic acid dianhydride and 4,4′-oxydianiline. Films of the metal ion-filled polyamic acids were prepared and cured to the corresponding polymides by heating at 300°C in air. The cured films were characterized for such properties as glass transition temperature, electrical conductivity, and thermal stability. Modulii and tensile strengths of the metal-containing polymide films were obtained at both ambient and elevated temperatures. Comparison of the physical and mechanical properties of these polyimide films as a function of metal additive is made.     

Study on organosilicon positive resist. I. Syntheses and characterization of silsesquioxane,siloxane, and silmethylene polymers with phenolic hydroxy groups

Silsesquioxane, siloxane, and silmethylene polymers with phenolic hydroxy groups were prepared in order to obtain alkali-soluble organosilicon polymers. These polymers have structures in which the phenol moieties are separated by one carbon from the silicon. The hydroxy groups were protected as methoxy groups in polymerization processes, then were changed into hydroxy groups by a reaction with trimethylsilyl iodide followed by alcoholysis. In the course of discussion on the characteristics of these polymers, silsesquioxane with phenolic hydroxy groups is found to possess excellent properties for matrix resins of alkalidevelopable organosilicon resists, such as O₂RIE resistance and heat resistance.     

Comparison of one-pot and two-step polymerization of polyimide from BPDA/ODA

The one-pot method polymerization of polyimide was carried out from 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA) and 4,4′-oxydianiline (ODA) by the use of p-chloro-phenol as the solvent. The behavior of the polymerization was compared with that of the two-step method. The imidization reaction in the one-pot method proceeds completely in this system at even a low temperature such as 100°C. In the course of the film preparation from the solution, the embrittlement occurs when the film is prepared from polyamic acid solution, while it does not occur in the case of that from the solution of the one-pot method. A molecular weight of polyimide film is almost the same as that of precursor polyimide in the solution. In the same way, that of polyimide film is almost the same as that of precursor polyamic acid. The mechanical properties of the polyimide film prepared by the one-pot method are similar to those by the two-step method. © 1996 John Wiley & Sons, Inc.     

多壁碳纳米管/聚酰亚胺复合材料制备及其性能研究

聚酰亚胺的前聚体,聚酰胺酸,是通过4,4-二氨基二苯醚(ODA)与3,3,4,4二苯甲酮四羧酸二酐(BTDA)反应制备的。未改性的、酸改性和胺改性的多壁碳纳米管(MWCNT)被分别地单独加入到聚酰胺酸溶液中,并加热至300℃,从而制成聚酰亚胺/碳纳米管复合材料。扫描型电子显微镜(SEM)和透射电子显微镜(TEM)的显微照片表明,酸改性的多壁碳纳米管和胺改性多壁碳纳米管在聚酰亚胺基体中被均匀一致地分散开。通过对酸和胺改性的多壁碳纳米管MWCNTS对多壁碳纳米管/聚酰亚胺复合材料的表面和体积电阻率的影响进行了研究。了解到该纳米复合材料的表面电阻率ITES从1.28×10^(15)Ω/cm^(2)(纯聚酰亚胺),降到7.59×10^(6)Ω/cm^(2)(26.98%的未改性的多壁碳纳米管含量)。除此之外,添加多壁碳纳米管影响了纳米复合材料的玻璃化转变温度。改性多壁碳纳米管意义就是提高了纳米复合材料的机械性能。多壁碳纳米管/聚酰亚胺复合材料的拉伸强度从10^(2)MPa(纯的聚酰亚胺)增加到134 MPa(6.98%酸改性多壁碳纳米管/聚酰亚胺复合材料)。     

Simulation of dry‐spinning process of polyimide fibers

As one type of high‐performance fibers, the polyimide fibers can be prepared from the precursor polyamic acid via dry‐spinning technology. Unlike the dry‐spinning process of cellulose acetate fiber or polyurethane fiber, thermal cyclization reaction of the precursor in spinline with high temperature results in the relative complex in the dry‐spinning process. However, the spinning process is considered as a steady state due to a slight degree of the imidization reaction from polyamic acid to polyimide, and therefore a one‐dimensional model based on White‐Metzer viscoelastic constitutive equation is adopted to simulate the formation of the fibers. The changes of solvent mass fraction, temperature, axial velocity, tensile stress, imidization degree, and glass transition temperature of the filament along the spinline were predicted. The effects of spinning parameters on glass transition temperature and imidization degree were thus discussed. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009