超薄钛酸锶电瓷基片研磨加工工艺优化

无压烧结钛酸锶(SrTiO3)电瓷基片表面不平整、均匀性差且翘曲度大,无法有效使用;采用研磨加工容易破碎、加工效果差。利用柔性加载双面研磨的加工工艺,优化分析了磨料种类、磨料粒度、磨料浓度、研磨压力和转速对钛酸锶电瓷基片研磨加工的影响,使钛酸锶电瓷基片表面达到了粗糙度为Ra0.268μm、去除率为4.6μm/min、厚度为0.19mm,以及厚度误差小于0.01mm的加工效果。     

研磨压力对固结聚集体磨料垫自修正影响

固结磨料研磨过程中磨料的微破碎是实现固结磨料垫自修正特性的主要途径,研磨压力是影响磨粒微破碎的关键参数。选用单晶金刚石和聚集体金刚石作为磨粒制备固结磨料垫,在15 kPa压力下以石英玻璃为加工对象进行研磨实验,比较两者的材料去除率及加工稳定性;制备了4种陶瓷结合剂含量的聚集体金刚石,并制备成固结聚集体金刚石磨料垫,探索了不同压力下的固结聚集体金刚石磨料垫的自修正性能;分析了研磨后的工件表面粗糙度和表面微观形貌。结果表明:采用固结聚集体金刚石磨料垫,研磨后工件表面粗糙度低,去除效率稳定;在15~21 kPa的压力下,结合剂含量次高的聚集体金刚石研磨效率高,材料去除率达到8.94~12.43μm/min,加工性能较稳定,研磨后的工件表面粗糙度R a在60 nm左右;在3.5~7 kPa压力下,结合剂含量次低的聚集体金刚石研磨性能较稳定,材料去除率在2.67~3.12μm/min,研磨后的表面粗糙度R a在40 nm左右。高结合剂含量的聚集体金刚石磨粒更适合高研磨压力条件,而低结合剂的聚集体金刚石磨粒更适合于低研磨压力。     

抛物面研磨的材料去除率及表面粗糙度研究

固着磨料抛物面研磨是一种新型的抛物面加工方法,文中从单个磨粒的角度出发,讨论了研磨工艺参数对材料去除率和表面粗糙度的影响,建立了理论预测模型,然后利用计算机辅助软件对不同硬度工件材料的材料去除率和表面粗糙度进行了数值模拟仿真,最后用实验验证了模型的正确性,并得出结论:理论预测模型仅能预测材料去除率和表面粗糙度的变化趋势,并不能代替实验得出具体的实验数值,即固着磨料抛物面研磨的材料去除率与主轴转速、研磨压力的5/4次方成正比,与磨粒浓度的1/4次方成反比;表面粗糙度随磨粒尺寸和研磨压力的增加而增加,随磨粒浓度的增加而减小。     

集群磁流变效应抛光垫的磨粒“容没”效应机理研究

针对集群磁流变抛光加工方法,研究了集群磁流变效应抛光垫对磨粒的"容没"机理。通过建立磨粒"容没"模型,并在磁流变抛光工作液中掺杂大尺寸磨粒对K9光学玻璃与硅片进行抛光加工实验,发现在粒径为0.6μm的磨粒中掺杂粒径为1.8μm的金刚石粉进行抛光后的表面质量优于粒径为1.1μm的磨粒加工的表面质量,且发现随着掺杂磨粒尺寸的增大,加工表面的Ra、Rv值虽有增大,但增长幅度远小于同等状况下游离磨粒加工的增长幅度。研究结果表明:集群磁流变效应抛光垫的磨粒"容没"效应能够使粒径不同的磨粒均匀作用于工件表面,显著减小甚至消除大尺寸磨粒对加工表面造成的损伤。     

固结磨料研磨K9玻璃表面粗糙度模型

表面粗糙度模型是研磨过程设计和工艺参数选择的重要依据,K9玻璃是应用最广泛的光学材料之一。建立研磨K9玻璃表面粗糙度模型有利于提高加工效率、节约生产成本。简化固结磨料研磨过程,基于研磨垫表面微结构,计算研磨过程中参与研磨的有效磨粒数和单颗磨粒切入工件深度,利用研磨过程中受力平衡,建立固结磨料研磨K9玻璃表面粗糙度模型。采用不同磨粒粒径和不同磨料浓度的固结磨料研磨垫以及不同压力研磨K9玻璃验证表面粗糙度模型。结果表明：固结磨料研磨K9玻璃的表面粗糙度与磨粒粒径、研磨压力1/3次方成正比,与研磨垫浓度2/9次方成反比。表面粗糙度理论值与试验值随研磨压力、磨粒粒径和研磨垫浓度的变化趋势吻合。利用该模型能够成功预测固结磨料研磨K9玻璃表面粗糙度,指导研磨过程设计及加工过程中研磨垫和工艺参数的选择,可靠性高。     

蓝宝石基片的单面研磨工艺研究

为了实现蓝宝石基片的快速平坦化,对蓝宝石基片进行系统的单因素单面研磨试验,研究了磨料种类、磨料粒径、研磨盘转速、研磨压力以及磨料质量分数等研磨工艺参数对蓝宝石基片材料去除率和表面粗糙度的影响规律。试验结果表明:金刚石磨料适合蓝宝石基片的单面研磨;随着磨料粒径的增大,材料去除率逐渐增大,表面越来越粗糙;随着研磨盘转速的增大,材料去除率先增大后减小,表面粗糙度值在20～60 r/min区间变化不大,稳定在Ra 0. 12～Ra 0. 13μm之间,而在60～100 r/min区间波动较大,当研磨盘转速为60 r/min时,材料去除率最大;随着研磨压力的增大,材料去除率逐渐增大,而表面粗糙度值越来越低;随着磨料质量分数的增大,材料去除率先增大后减小,表面粗糙度先增大然后趋于平缓,当磨料质量分数为3 wt%时,材料去除率最大,且表面粗糙度值相对较小;最后通过正交试验优化了工艺参数,在优化的工艺条件下依次选用粒径为W40、W14、W3的金刚石磨料对蓝宝石基片进行粗研、半精研及精研,取得了表面粗糙度为Ra 7. 9 nm的平坦表面。     

喷油嘴微孔磨粒流抛光数值模拟与试验

以喷油嘴喷孔为研究对象,采用kε固液两相Mixture湍流模型对磨粒流抛光过程中流场分布规律进行数值模拟,并通过正交试验探索了抛光压力、磨料浓度、磨粒粒径及加工时间等工艺参数对被抛光微孔表面粗糙度的影响规律。结果表明：喷油嘴微孔磨粒流单向循环抛光加工有利于改善喷孔结构;流道表面粗糙度与各加工参数均成负相关关系,且受抛光压力及磨料浓度影响显著。通过试验获得了最优参数组合,在此条件下喷油嘴微孔表面粗糙度值(Ra)由初始的1.16μm降至0.20μm。     

永磁场磁力研磨316L不锈钢实验研究

基于磁力研磨,采用永磁极吸附雾化法制备的新型球形磨料,对316L不锈钢进行光整加工.研究了当加工时间和磁感应强度为定值时,主轴转速、加工间隙、磨料粒径、磨粒相粒径对表面粗糙度和材料去除量的影响及其变化规律.并利用正交设计得出优化的加工参数:转速S=1 000 r/min,加工间隙δ=1.5 mm,磨料粒径为150～124μm时(磨粒相粒径为6μm),工件经研磨后平均原始表面粗糙度可由研磨前的0.275μm下降到0.038μm(工件最初表面粗糙度值为2.76μm).     

光纤端面研磨加工机理研究

给出了研磨光纤时的材料去除机理,选用粒度为微米及亚微米级的金刚石磨料砂纸,在研磨压力为0.48Mpa时,在KE-OFP-12型光纤连接器研磨机上对光纤端面进行了研磨实验.结果表明:光纤研磨加工的材料去除存在脆性断裂、半脆性半延性、延性等3种模式.材料去除模式主要取决于磨料的平均粒度,磨料粒度为3μm时,为脆性断裂到延性研磨的临界转换点.并从理论上对结果进行了分析,光纤以延性模式研磨加工时,光纤表面粗糙度Ra可达到纳米级,其表面看不到任何划痕,而光纤以脆性断裂模式研磨加工时,其表面粗糙度只能达到亚微米级,证明材料以延性模式去除是提高光纤表面质量的有效方法.     

外圆超声振动研磨Al2O3陶瓷的去除率研究

研究了Al2 O3 陶瓷试件的超声振动研磨特征 ,分析超声研磨中加工参数与试件材料去除率的关系。经研究得出 :在相同的加工条件下 ,超声振动研磨加工比普通研磨加工 ,材料去除效率高 ,去除率随工件转速的增加而增加 ,随着转速的增加 ,去除率的斜率有所下降 ;保证材料去除率达到最大的研磨压力存在一个最佳值 ;粗粒度油石研磨加工去除效率较细粒度的高 ;细磨粒油石超声研磨工件表面粗糙度值小于粗磨粒研磨工件。同时与普通研磨相比较 ,超声研磨加工不仅效率高、且加工工件表面粗糙度值较小。     

硬脆性材料用柔性磨具研磨的加工表面粗糙度建模

通过分析磨粒与工件表面的作用过程,建立了硬脆性材料柔性磨具加工表面粗糙度的理论预测模型.以橡胶结合剂金刚石研磨盘为柔性磨具、蓝宝石衬底为工件,在不同弹性模量、磨粒浓度、磨粒粒度和研磨压力下开展研磨试验,将不同研磨条件下的表面粗糙度试验值与理论预测值进行比较,发现试验结果与理论模型预测结果的趋势一致,且预测误差为7.71...     

氧化锆陶瓷平面零件超精密研磨实验的研究

针对氧化锆陶瓷平面零件的超光滑表面加工问题,将两种超精密研磨工艺应用到氧化锆零件加工中。研究了研磨液和磨料粒径对零件表面粗糙度的影响,分析了不同加工阶段的材料去除机理,同时发现工件表面孔隙的致密性会降低氧化锆零件的可加工性能,并采用了致密性更好的氧化锆材料在使用相同工艺情况下进行了实验对比。研究结果表明,采用金刚石油膏研磨加工得到了表面粗糙度为12．9nm的超光滑表面,在“采用Al2O3研磨液,并使用SiO：作为抛光工序”的条件下,得到了表面粗糙度为6．55nm的超光滑表面,并且在选用致密性更好材料进行加工后,得到了表面粗糙度为4．72nm的超光滑表面。     

基于不同磨料的氮化硅陶瓷球精研工艺研究

为探究磨料对氮化硅陶瓷球精研加工的影响,从而提高氮化硅陶瓷球的表面质量和材料去除率,以基液种类、磨料种类和研磨盘转速为主要影响因素设计正交试验,并分析各因素对表面粗糙度Ra的影响程度。以表面粗糙度Ra和材料去除率为评价指标,通过单因素试验优化研磨参数。根据正交试验结果,得到精研加工过程中各影响因素对于表面粗糙度Ra的影响程度,从大到小排列依次为:磨料种类>基液种类>研磨盘转速。综合考虑陶瓷球精研加工的要求,确定最佳的研磨参数组合为:煤油基液、碳化硅磨料以及150 r/min的研磨盘转速。在金刚石、碳化硅、氮化硼、氧化铬和氧化铁这5种磨料中,氧化铁磨料修复粗研过后的氮化硅陶瓷球表面缺陷的效果最好。     

Surface roughness and material removal rate of lapping process on ceramics

Lapping is a widely used surface finishing process for ceramics. An experimental investigation is conducted into the lapping of alumina, Ni−Zn ferrite and sodium silicate glass using SiC abrasive to study the effect of process parameters, such as abrasive particle size, lapping pressure, and abrasive concentration, on the surface roughness and material removal rate during lapping. A simple model is developed based on the indentation fracture and abrasive particle distribution in the slurry to explain various aspects of the lapping process. The model provides predictions for the surface roughness,R _a andR _t , on the machined surface and rough estimation for the material removal rate during lapping. Comparison of the predictions with the experimental measurements reveals same order of magnitude accuracy.     

新型环保抛光液的制备及其对软脆碲锌镉晶片的化学机械抛光

针对软脆碲锌镉晶片的传统加工工艺“游离磨料-抛光-化学机械抛光”存在的缺点,提出“固结磨料研磨-新型绿色环保抛光液化学机械抛光”新方法。固结磨料研磨工艺为：采用3000号刚玉防水砂纸,压力为17kPa,抛光盘与抛光垫转速均为80r/min,研磨时间为5min。新型绿色环保抛光液含有双氧水和硅溶胶,采用天然桔子汁作为pH值调节剂。化学机械抛光工艺为:采用自行研制的化学机械抛光液,绒毛抛光垫,抛光压力为28kPa,抛光盘与抛光垫转速均为60r/min,抛光时间为30min。试验结果表明,经过上述加工可获得超光滑的表面,表面粗糙度算术平均值、均方根值、峰谷值分别可以达到0.568nm、0.724nm、6.061nm。     

A comparative study between smaller-the-better and normal-the-best quality characteristics when lapping ceramic blocks

In traditional study, minimum surface roughness is an objective function, so the smaller-the-better (STB) quality characteristic is selected. This paper proposes three models of the normal-the-best (NTB) quality characteristic for surface roughness. A comparative study employing three indices for normal-the-best and one index for smaller-the-better for surface roughness is presented when lapping ceramic blocks. The results show that the dominating lapping parameter for surface roughness is the abrasive size, and the smaller-the-better can be replaced by the normal-the-best quality characteristic. Model 3 is better than Models 1 and 2 at the normal-the-best quality characteristics.     

Spectral analysis of surface roughness features of a lapped ultraprecision single-point diamond machined surface

Single-point diamond turning of soft metals could provide a much shiny surface with an optimal feed rate; however, the machining mark would be left on the machined surface, which caused the roughness cannot be neglected. If the feed rate is too small, the roughness of the surface could be improved but the reflectiveness would be decreased because of damaging the profile. Therefore, it is necessary to develop a lapping method to reduce the roughness by removing the machining mark, while the reflectiveness can be kept at the original level simultaneously. In this study, the novel lapping method, using strands of wool fibers to deliver the abrasive slurry to rub against the lens, was proposed for removing the machining marks on the mold of a lenticular lens by lapping without damaging the profile of the mold. Even though the normal pressure applied by the wool strands onto the mold surface is very low, the coefficient of friction would be increased significantly with the application of the abrasive slurry. The combined effect was to provide a relatively large shear force to lap the surface with a minimal normal force. Therefore, the proposed method could theoretically avoid damaging the lens while effectively removing the irregularities that appeared on the surfaces. In order to evaluate the proposed lapping method, we firstly lapped the machining marks with different lapping parameters (speed, grit size, time, and pressure) to find out the relationship between these parameters and roughness with the same profile of the mold. Secondly, the optimal lapping parameters were designed based on the above lapping results to deduce the best lapping solution for processing the machining marks. Thirdly, the lapped surface profile of the mold was test by optical profiling system, and the features of the surface can be categorized into various spectral distribution groups. Finally, by comparing the variation of the spectral distribution groups, it is verified that based on our proposed methodology, selective removal of surface spectral groups of features becomes possible.     

A study on the mirror surface machining by using a micro-energy EDM and the electrophoretic deposition polishing

In order to achieve a mirror-like workpiece surface by EDM, a micro-energy EDM or a manual lapping is normally used. However, both methods are time consuming and economically unattractive. To have better performance, a sinking EDM machine was first used in this research on SKD 61 for a micro-energy discharge process followed by the electrophoretic deposition (EPD) process to coat Al₂O₃ particles uniformly on a rotation electrode. The precision polishing process was then applied on the discharged workpiece with suitable parameters including the voltage, electrode rotating speed, pH value of electrolyte, and abrasive concentration. After the EDM process, the surface roughness and the recast layer thickness of a workpiece could also be reduced. The experimental data showed that when 0.3 μm of Al₂O₃ particles was used for the EPD polishing process, the initial roughness of a discharge surface could be improved from 0.52 μm Ra (6.50 μm Rt) to a mirror-like surface of 0.068 μm Ra (0.742 μm Rt). Also, the total working time could be reduced significantly to within the range of 5 to 10 min.