具有SAF结构的IrMn基自旋阀材料的磁场退火研究

用磁控溅射法制备了被钉扎层为反铁磁(SAF)结构(CoFe/Ru/CoFe)的IrMn基顶钉扎自旋阀材料, 分别采用HRTEM、AFM、XPS对材料的结构和成分进行表征。首先, 制备的自旋阀材料分别在200℃、245℃、255℃、265℃的真空条件(＜10^-5 Pa)下退火4 h, 发现经265℃退火, 自旋阀材料会发生明显的层间扩散, 从而引起磁电阻率的降低。在选择合适退火温度(245℃)的基础上, 研究了退火磁场对自旋阀材料磁电阻率的影响。在245℃的真空环境下, 沿着材料的钉扎方向分别施加大小为80、160、240、400、560 kA/m的磁场退火4 h。实验发现经过80和160 kA/m的磁场退火后, 材料的磁电阻率由退火前的8.80%分别下降到5.87%和6.31%; 经240 kA/m的磁场退火后材料的磁电阻率变为7.91%; 经400 kA/m的磁场退火后磁电阻率增大到9.89%; 经560 kA/m的磁场退火后磁电阻率进一步增大到10.79%, 比退火前增加了22.6%。     

退火对IrMn基自旋阀结构和磁性能的影响

采用高真空直流磁控溅射的方法制备了结构为//Ta(5nm)/Co75Fe25(5nm)/Cu(2.5nm)/Co75Fe25(5nm)/ Ir20Mn80(12nm)/Ta(8nm)的顶钉扎自旋阀多层膜,通过X射线衍射(XRD)、原子力显微镜(AFM) 和振动样品磁强计(VSM)研究了退火对自旋阀的结构及磁性能的影响.结果表明:退火使得IrMn(111)织构减弱,表面/界面粗糙度在低温退火后增大,而较高温度退火后减小;退火后交换偏置场和被钉扎层矫顽力减小,而自由层矫顽力增加;退火后自旋阀多层膜交换偏置场随样品在反向饱和场下停留时间的增加而不发生变化.     

Mn成分对CoFe/Pt_(50)(Cr_(100-x)Mn_x)_(50)体系交换偏置的影响

采用直流磁控溅射的方法制备了CoFe/Pt-CrMn交换偏置体系,反铁磁的Pt-CrMn是利用[Pt/CrMn]n多层膜并经过300℃、2h的退火获得。通过调整Mn的成分,系统地研究了体系交换偏置场的变化。获得了钉扎性能良好的L10相反铁磁钉扎材料Pt-CrMn,即CoFe/Pt50(Cr88Mn12)50钉扎体系,其界面交换耦合能为0.22×10-7J/cm2,截止温度(blocking temperature)为480℃。     

界面掺杂FeMn对CoFe/CrPt交换偏置体系的影响

采用磁控溅射的方法制备了CoFe/CrPt钉扎的交换偏置体系,用外加磁场真空退火以获得钉扎场.通过把反铁磁的FeMn掺入到该钉扎体系中发现,约0.7nm厚度的FeMn掺入在CoFe/CrPt的界面时,可以使体系的钉扎场从原来的5.6×103A/m增加到1.55×104A/m,而体系的Blocking温度仍然可以达到600℃.     

磁控溅射法制备IrMn底钉扎自旋阀研究

采用高真空直流磁控溅射的方法,在玻璃衬底上制备了结构为Ta／buffer layer／IrMn／CoFe／Cu／CoFe／NiFe／Ta的IrMn底钉扎自旋阀。研究了NiFe和Cu作为缓冲层对自旋阀磁性能的影响,并对缓冲层厚度进行了参数优化,当缓冲层厚度为2nm时自旋阀各项性能达到最佳。研究了退火制度对底钉扎自旋阀性能的影响,得到了30000e强磁场下200℃保温1h为最佳处理条件。通过结构的改善和工艺的优化,得到的底钉扎自旋阀的磁电阻率8．51％,矫顽场为0．50e,交换偏置场超过8000e。最后对自旋阀的底钉扎和顶钉扎结构进行了比较。     

交换耦合双层膜PtMn/Co的微观结构和磁性

采用磁控溅射法在Si（100）基片上沉积了PtMn／Co双层膜，研究退火温度与样品微结构以及磁性的关系，发现退火温度越高，反铁磁性PtMn层由fcc非磁性相向fct反铁磁性相转变越充分，交换偏置场值Hex越高。同时，随着退火温度的升高，反铁磁层的晶粒尺寸逐渐增大，交换偏置场Hex值随着反铁磁层晶粒尺寸的增大几乎呈线性增加。研究了交换偏置场与铁磁层、反铁磁层厚度的关系，结果表明，在250℃退火时Hex与PtMn厚度关系为有峰值的曲线，此退火温度下反铁磁层临界厚度为20nm，最佳反铁磁层厚度为60nm。还发现了交换偏置场Hex随着铁磁性Co层厚度的增大几乎呈线性降低，充分说明铁磁、反铁磁交换耦合作用是一种界面耦合效应。     

NiO/CoFe双层膜的交换机制研究

通过改变制备NiO薄膜的氩气压和衬底材料,研究了NiO的结构、表面粗糙度对NiO/CoFe双层膜交换耦合场Hex的影响.实验表明完全自旋未补偿面与交换耦合场的产生没有直接联系,但交换耦合场Hex与界面状况密切相关.增大NiO的表面粗糙度会使交换耦合场Hex减小.应用随机场理论在考虑了实际界面存在的粗造度、杂质和缺陷等实际情况下,正确地预测了交换耦合场的数量级,而且对交换耦合场与铁磁层厚度tFM、反铁磁层厚度tAFM以及交换耦合场的温度特性等实验结果做出了合理解释.并应用随机场模型对反铁磁/铁磁双层膜中铁磁层矫顽力Hc与铁磁层厚度tFM的关系进行了定量计算,发现矫顽力Hc与铁磁层厚度1/tFM成正比,这一结果表明理论计算与我们的实验数据符合得很好.     

磁控溅射法制备IrMn顶钉扎自旋阀研究

通过高真空直流磁控溅射的方法,在玻璃和硅上淀积了结构为Ta/NiFe/CoFe/Cu/CoFe/IrMn/Ta的IrMn顶钉扎自旋阀薄膜。通过结构的改善和工艺条件的优化,自旋阀的磁电阻率达到9.12％,矫顽力为1.04×(10~3/4π)A/m。研究了Ta缓冲层厚度(小于6nm)对晶格结构和自旋阀性能的影响。结果表明,Ta为3nm时自旋阀磁电阻率最大,而矫顽力随着Ta厚度增大而减小。利用CoFe/Cu/CoFe SAF结构替换掉与IrMn相邻的CoFe被钉扎层,使交换偏置场从原来没有SAF的180×(10~3/4π)A/m上升到600×(10~3/4π)A/m左右,且交换偏置场随着SAF结构中两层CoFe的厚度差减小而增大。研究了RIE对自旋阀性能的影响,发现2min的RIE能使矫顽力减小33％,而磁电阻率几乎不受影响。     

自旋阀多层膜磁化翻转场的调控和磁电阻特性

用磁控溅射方法制备Ta/CoFe/Fe/Au/Fe/IrMn/Ta和Ta/CoFe¹/Au/CoFe²/IrMn/Ta两种多层膜结构的自旋阀,并优化各功能层的溅射参数有效调控了磁化翻转场和磁电阻特性。根据TEM确定了样品多层膜的微观结构和膜厚,使用VSM和加磁场四探针法分别测量了样品的磁滞回线和磁电阻(MR)特性曲线。结果表明,样品中隔离层Au的厚度与MR值之间存在振荡衰减的关系;而钉扎层、自由层和被钉扎层的厚度直接影响各膜层的矫顽力和饱和磁化强度等磁学性能,进而改变MR值。各层厚度为6/6/3.8/6/9/6 nm的Ta/CoFe¹/Au/CoFe²/IrMn/Ta结构自旋阀,具有最佳的MR值。     

CoFe/Cu/CoFe/IrMn自旋阀结构多层膜磁化反转过程的研究

通过高真空直流磁控溅射的方法制备了结构为//Ta(5nm)/Co75 Fe25(5nm)/Cu(2.5nm)/Co75Fe25(5nm)/Ir20 Mn80(12nm)/Ta(8nm)的顶钉扎自旋阀结构多层膜,研究了磁场循环次数、反向饱和场等待时间和磁场变化率对自旋阀结构多层膜磁化反转过程的影响.结果表明,磁场循环次数和反向饱和场等待时间对自由层的磁化反转过程没有影响,而在被钉扎层中出现了练习效应和时间效应;磁场变化率对被钉扎层和自由层的前、后支反转场的影响变化趋势相似,但反铁磁层对被钉扎层的反转有一定的影响.     

氢气氛退火对硅上低温外延制备的硅锗薄膜性能的影响

采用反应型热化学气相沉积系统在硅(100)衬底上外延生长富锗硅锗薄膜。四氟化锗作为锗源, 乙硅烷作为还原性气体。通过设计表面反应, 在低温条件下(350℃)制备了高质量的富锗硅锗薄膜。研究了氢退火对低温硅锗外延薄膜微结构和电学性能的影响。结果发现退火温度高于700℃时, 外延薄膜的表面形貌随着退火温度的升高迅速恶化。当退火温度为650℃时, 获得了最佳的退火效果。在该退火条件下, 外延薄膜的螺旋位错密度从3.7×10⁶ cm^-2下降到4.3×10⁵ cm^-2, 表面粗糙度从1.27 nm下降到1.18 nm, 而外延薄膜的结晶质量也有效提高。霍尔效应测试表明, 经退火处理的样品载流子迁移率明显提高。这些结果表明, 经过氢退火处理后, 反应型热化学气相沉积制备的低温硅锗外延薄膜可以获得与高温下硅锗外延薄膜相比拟的性能。     

α籽晶促进低温反应溅射沉积α-Al2O3薄膜

分别使用反应溅射Al+α-Al₂O₃(15% α-Al₂O₃,质量分数)复合靶和在金箔基体表面预植α-Al₂O₃籽晶,促进α-Al₂O₃薄膜的低温沉积。使用扫描电子显微镜(SEM)、掠入射X射线衍射(GIXRD)和能谱仪(EDS)等方法表征薄膜样品的表面形貌、相结构和元素组成。结果表明,在射频反应溅射Al+α-Al₂O₃复合靶、沉积温度为560℃条件下能在Si(100)基体上沉积出化学计量比的单相α-Al₂O₃薄膜;使用射频反应溅射Al靶、沉积温度为500℃条件下能在预植α-Al₂O₃籽晶(籽晶密度为10⁶/cm²)的金箔表面沉积出化学计量比的单相α-Al₂O₃薄膜。两种研究方案的结果均表明,α-Al₂O₃籽晶能促进低温沉积单相α-Al₂O₃薄膜。     

Investigation of stress behaviors and mechanism of void formation in sputtered TiSix films

We have investigated the stress behaviors and a mechanism of void formation in TiSi_x films during annealing. TiSi_x thin films were prepared by DC magnetron sputtering using a TiSi_2.1 target in the substrate temperature range of 200–500 °C. The as-deposited TiSi_x films at low substrate temperature (<300 °C) have an amorphous structure with low stress of 1×10⁸ dynes/cm². When the substrate temperature increases to 500 °C, the as-deposited TiSi_x film has a mixture of C49 and C54 TiSi₂ phase with stress of 8×10⁹ dynes/cm². No void was observed in the as-deposited TiSi_x film. Amorphous TiSi_x film transforms to C54 TiSi₂ phase with a random orientation of (311) and (040) after annealing at 750 °C. The C49 and C54 TiSi₂ mixture phase transforms to (040) preferred C54 TiSi₂ phase after annealing over 650 °C. By increasing substrate temperature, the transformation temperature for C54 TiSi₂ can be reduced, resulting in relieved stress of TiSi₂ film. The easy nucleation of the C54 phase was attributed to an avoidance of amorphous TiSi_x phase. We found that amorphous TiSi_x→C54 TiSi₂ transformation caused higher tensile stress of 2×10¹⁰ dynes/cm², resulting in more voids in the films, than C49→C54 transformation. It was observed that void formation was increased with thermal treatment. The high tensile stress caused by volume decreases in the silicide must be relieved to retard voids and cracks during C54 TiSi₂ formation.     

PdSe2半导体薄膜的真空硒化法制备研究

PdSe2薄膜主要通过机械剥离法和气相沉积法制得,本研究采用一种简单有效的可在SiO2/Si衬底上制备PdSe2薄膜的方法.通过高真空磁控溅射技术在SiO2/Si衬底上沉积一层Pd金属薄膜,将Pd金属薄膜与Se粉封在高真空的石英管中并在一定的温度下进行硒化,获得PdSe2薄膜.根据截面高分辨透射电镜(HRTEM)照片可...     

Electrical and optical properties of single-phase CuInS2 films prepared using spray pyrolysis

The spray pyrolysis conditions required to prepare single-phase CuInS₂ films of good optical quality were optimized. The as-deposited films had a sphalerite structure which transformed to the chalcopyrite structure on annealing at 670 K. Single-phase and two-phase (mixture of CuInS₂ and Cu_xS) regimes were established and were correlated with the cation-to-anion and copper-to-indium ratios in the spray solution. The resistivity of both as-deposited and annealed single-phase films changed from about 10³ Ωm to about 10⁻¹ Ωm with increasing copper-to-indium ratio in the spray solution. An optical gap of about 1.38 eV was measured for both the sphalerite and the chalcopyrite structures. Photoconductivity was observed in the as-deposited films and was enhanced on annealing. The photosensitivity decreased as the copper excess in the spray solution was increased (up to 7%).     

Synthesis and surface acoustic wave properties of AlN films deposited on LiNbO3 substrates

The c-axis-oriented aluminum nitride (AlN) films were deposited on z-cut lithium niobate (LiNbO₃) substrates by reactive RF magnetron sputtering. The crystalline orientation of the AlN film determined by x-ray diffraction (XRD) was found to be dependent on the deposition conditions such as substrate temperature, N₂ concentration, and sputtering pressure. Highly c-axis-oriented AlN films to fabricate the AlN/LiNbO₃-based surface acoustic wave (SAW) devices were obtained under a sputtering pressure of 3.5 mTorr, N₂ concentration of 60%, RF power of 165 W, and substrate temperature of 400°C. A dense pebble-like surface texture of c-axis-oriented AlN film was obtained by scanning electron microscopy (SEM). The phase velocity and the electromechanical coupling coefficient (K²) of SAW were measured to be about 4200 m/s and 1.5%, respectively. The temperature coefficient of frequency (TCF) of SAW was calculated to be about -66 ppm/°C     

Sc2W3O12薄膜制备及其负热膨胀性能

采用脉冲激光沉积法制备了斜方相Sc₂W₃O₁₂薄膜。利用X射线衍射仪(XRD)和场发射扫描电镜(FESEM)对Sc₂W₃O₁₂靶材和Sc₂W₃O₁₂薄膜组分、表面形貌和靶材断面形貌进行表征, 研究衬底温度与氧分压对薄膜制备的影响。采用变温XRD和热机械分析仪(TMA)分析了Sc₂W₃O₁₂陶瓷靶材和薄膜的负热膨胀特性。实验结果表明: 经1000℃烧结6 h得到结构致密的斜方相Sc₂W₃O₁₂陶瓷靶材, 其在室温到600℃的温度范围内平均热膨胀系数为-5.28×10^-6 K^-1。在室温到500℃衬底温度范围内脉冲激光沉积制备的Sc₂W₃O₁₂薄膜均为非晶态, 随着衬底温度的升高, 薄膜表面光滑程度提高; 随着沉积氧压强增大, 表面平整性变差。非晶膜经1000℃退火处理7 min后得到斜方相Sc₂W₃O₁₂多晶薄膜, 在室温到600℃温度区间内, Sc₂W₃O₁₂薄膜的平均热膨胀系数为-7.17×10^-6 K^-1。     

Preparation of strontium titanate thin films by mirror-confinement-type electron cyclotron resonance plasma sputtering

Using mirror-confinement-type electron cyclotron resonance (ECR) plasma sputtering method, strontium titanate (SrTiO₃) thin films have been prepared on Si and Pt/Ti/SiO₂/Si substrates at a low substrate temperature (below 450 K) in a low pressure (2.7×10⁻² Pa) environment of pure Ar and Ar/O₂ mixture. Prepared film surfaces were very smooth regardless of high deposition rate (8.5 nm/min). The composition ratio Sr/Ti of Sr to Ti in the films varied with the distance between the target and the substrate. All as-deposited films on Si substrates were found to be amorphous and were crystallized by post-deposition annealing using an electric furnace at 650 K, i.e. approximately 250 K lower than annealing for films obtained by conventional RF magnetron sputtering. Post-deposition annealing of these films using millimeter-wave radiation decreased the crystallization temperature to a value of 550 K. Furthermore, all as-deposited films on Pt/Ti/SiO₂/Si substrates by a plasma of Ar and O₂ gas mixture were found to be crystallized regardless of no substrate heating.     

Ion beam deposition and structural characterization of GMR spinvalves

NiO exchange-biased “bottom” spin valves of the type NiO/NiFe/Co/Cu/Co/NiFe and FeMn exchange-biased “top” spin valves of the type NiFe/Co/Cu/Co/NiFe/FeMn were deposited by ion-beam deposition (except the NiO layer). Their magnetic properties, magneto-transport, and microstructures are characterized and compared with corresponding GMR spin valves deposited by dc magnetron sputtering. High-resolution cross-sectional transmission electron microscopy and X-ray diffraction reveal microstructural differences between ion-beam-deposited and dc magnetron sputtered spin valves. In particular, film texture, surface morphology, GMR ratio, exchange bias, interlayer coupling strength, and coercivity vary widely, but property-structure-processing correlation can be identified. A GMR ratio of ~9.7% was obtained on random textured NiO exchange-biased bottom spin valves by ion-beam deposition