微膨胀型热开关热特性的参数敏感性

采用参数敏感性分析法研究了微膨胀型热开关导热路径上各项不确定因素对其断开热阻、闭合热阻及开关比等关键热特性的影响。通过与性能试验的比对,验证了热开关有限元仿真热模型的正确性。基于该模型,分析了结构组件导热系数和配合面接触热导率与断开热阻、闭合热阻等热特性的关联性,并依据性能指标的绝对/相对变化量对不确定因素进行了敏感性分类。研究表明:定位杆导热系数是关于断开热阻和开关比的敏感参数,敏感性指标分别为6.716m~(0.5)·K/W和5.129 m~(0.5)·K~(0.5)/W~(0.5);冷端-伸缩段间接触热导率是闭合热阻的敏感参数,绝对变化量和敏感性指标分别为1.865K/W和0.267m·K/W,其余配合面的接触热导率均是闭合热阻的不敏感参数;定位杆径向小面接触热导率是断开热阻和开关比的敏感参数,绝对变化量(敏感性指标)分别为56.495K/W(0.307m·K/W)和32.936(0.235m·K~(0.5)/W~(0.5))。所得的结论可为优化微膨胀型热开关的结构性能提供参考与借鉴。     

大功率固态功率管热设计优化及验证

为研究大功率固态功率管的传热问题,文中以某风冷固态功率管为例,介绍了其结构形式,分析了从功率管管壳到空气热沉之间的主要热阻,通过热设计软件进行了仿真计算。计算结果表明,造成功率管温升较大的热阻有对流换热热阻、导热热阻和接触热阻。为了降低功率管的结温,对每个热阻分别进行了优化设计和计算,通过试验对优化后的模型进行了验证,测试结果与仿真结果一致。最后还对大功率固态功率管的热设计优化方法进行了介绍。     

大功率激光二极管列阵的硅基微通道热沉研制

为了提高大功率激光二极管列阵的散热效率以便提高其寿命和波长稳定性,研制了一种封装集成度较高的屋脊式硅基微通道热沉.将田口稳健设计方法用于微通道热沉的优化设计,利用正交试验和信噪比分析实现了参数的稳健优化.以(110)单晶硅作为基片,采用KOH各向异性刻蚀和硅-玻璃-硅三层阳极键合方法制作出了通道宽度约为50 μm的微通道热沉,通道壁面粗糙度优于0.1 μm.采用激光二极管芯片对样品进行了封装和测试,利用砷化镓激光波长的温度漂移系数估算出了中间激光二极管的有源区温升,从而计算出了热沉的热阻.测试结果表明,该微通道热沉的单位面积热阻约为0.070 cm2·K/W,与有限元分析结果基本一致.     

含有结合面结构的热模型研究

文章主要研究了结合面接触热阻特性及其在建立机械结构热模型中的处理手法,提出了虚拟扩张单元的概念,并用实例检验了热模型的正确性,表明考虑结合面接触热阻影响的热模型具有较好的计算精度。     

地埋管热响应测试及数据分析方法

对上海某商务楼垂直地埋管换热器进行热响应测试,该商务楼占地面积大,在相隔300m两个地块分别钻三口测试井.本测试的特点是:地埋管换热器有效换热深度大,测试内容包括单U型及双U型地埋管,根据测试要求设定不同的循环流速.采用一维线热源模型对测试数据进行科学严谨的分析,本文将给出计算土壤导热系数、垂直地埋管换热器传热热阻及确定单位井深换热量方法.试验数据具有很强的对比性并能验证测试准确度.测试结果表明,该测试点的土壤导热系数为1.84～1.94 W/(m·K);相同埋管形式与管径地埋管换热器,传热热阻相同.本测试中双U型φ32埋管热阻大于双U型φ25热阻,单U型φ32型埋管热阻最大.应用线热源模整理出计算给定进水温度下的单位井深换热量公式,并计算出不同埋管形式及循环水流量下的单位井深换热量.     

接触热阻效应下的数控机床主轴系统热态特性

为了更为精确地获取数控机床主轴系统的热态特性,基于W-M分形函数与赫兹接触理论获取主轴系统的接触热阻,并在综合考虑机床热源、传热系数计算等因素影响的情况下,建立了主轴系统热态特性分析模型。通过有、无加载接触热阻的主轴系统模型仿真分析与实验研究可知:有接触热阻的主轴系统热态特性模型相较于无热阻的有更高的精度。有接触热阻的主轴系统热态特性模型仿真结果与实验测点获得的温度结果最大绝对误差和相对误差分别1.25℃、4.74%,而热变形结果的绝对误差和相对误差分别为0.73μm、4.27%。该研究为数控机床的热设计与分析提供了参考。     

基于接触热阻的磨齿机电主轴热特性分析

大规格数控成形磨齿机高速电主轴系统在加工过程中产生大量热量,导致砂轮主轴产生相应热变形,影响加工精度。针对这一现象,提出了一种考虑接触热阻的瞬态热-结构耦合分析方法。该方法基于分形理论,利用W-M分形函数表征结合面接触状态,使用均方根测度法对分形参数进行识别。结合基体热阻和收缩热阻的影响计算结合面间总接触热阻,并计算热源发热量及各部件的对流换热系数,建立了综合考虑内部热源、边界条件和接触热阻的综合有限元模型,获得热误差仿真结果。分析电主轴温度及热变形在是否考虑接触热阻情况下变化差异。最后建立电主轴系统热误差测量试验平台,通过试验验证了该方法的准确性和可靠性。通过仿真得到温度及热位移量与实验值基本一致。     

雷达信号处理专用芯片及其热设计技术

本文主要讨论雷达信号处理专用芯片（ＡＳＩＣ）的结构特点及其热要求,针对多芯片模块的特点,提出减少ＭＩＣＭ内部热阻和外部热阻的热设计技术,并利用数值传热学的基本理论,计算其热特性。     

固态组件材料和结构参数对热阻的影响

研究了热流密度为100 W/cm2的固态组件的基板和壳体的等效导热系数、厚度和横截面面积对整个组件的冷却装置的热阻的影响。基板和壳体的导热系数从160 W/(m·K)提高到800 W/(m·K)时,冷却装置总热阻分别下降约1.2℃/W和0.55℃/W,下降比例分别为33.3%和15.5%;基板厚度从0.4 mm增加到1.6 mm时,冷却装置总热阻下降约0.78℃/W,下降比例为22.0%;基板横截面面积从0.42 cm2增加到2.1 cm2时,冷却装置总热阻下降约0.52℃/W,下降比例为15.1%;壳体厚度从0.8 mm增加到2.4 mm时,冷却装置总热阻下降约0.43℃/W,下降比例为11.6%;以上各种情况中冷却装置总热阻下降趋势为先急后缓。对于目前的组件而言,参考上述结果进行优化,将使组件的冷却得到明显改善。     

基于热网络法的电主轴热结构耦合计算

为了更准确地对电主轴系统进行温度场的预测,建立了综合考虑接触热阻、轴承热变形和气隙变化等因素影响的热网络模型和热结构耦合热网络瞬态温度平衡方程(简称热平衡方程).首先计算了接触热阻、轴承热变形、电机的定子与转子由于热变形导致的气隙变化以及电机与轴承的生热;然后选择电主轴主要部件作为温度节点,建立了电主轴系统的热网络模型...     

Precooling of a superconducting magnet using a cryocooler and thermal switches

A simple precooling system for a superconducting magnet is developed using a Cryomech GB02 cryocooler and gas filled thermal switches. A superconducting magnet (NbTi wire, 7 T of maximum field, 5.6 kg of weight) is precooled to 16 K in about 70 h without any manual control. Heat transfer rate of each thermal switch (H2 or N2 gas filled at 1.3 MPa at room temperature) is about 3x10(-1) W/K during the ON state, and 5x10(-3) W/K during the OFF state.     

Multichip on Aluminum Metal Plate Technology for High Power LED Packaging

Multichip on Aluminum Metal Plate(MOAMP) technology with simple structure and low thermal resistance is developed for effective heat removal of Light Emitting Diode(LED) p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the junction to aluminum metal plate, considering input power of LED module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED lighting modules.     

A facility for characterizing the steady-state and dynamic thermal performance of microelectromechanical system thermal switches

A facility to characterize microelectromechanical system (MEMS) thermal switches by measuring two pertinent figures of merit is described. The two figures of merit measured are the ratio of thermal resistance of the switch in the off and on states, Roff/Ron, and the time required to switch from the off to the on state, tauswitch. The facility consists of two pieces of equipment. A guard-heated calorimeter is used to measure heat transfer across the thermal switch under steady-state conditions. Measuring heat transfer across a thermal switch in both the off and on states then gives the thermal resistance ratio Roff/Ron. A thin-film radial heat-flux sensor is used to measure heat transfer across the thermal switch under dynamic conditions. Measuring heat transfer across a thermal switch as the switch changes from the off to the on state gives the thermal switching time tauswitch. The test facilities enable the control of the applied force on the thermal switch when the thermal switch is on, the thickness of the gas gap when the thermal switch is off, and the gas species and pressure in the thermal switch gas gap. The thermal performance of two MEMS thermal switches employing two different thermal contact materials, a polished silicon surface and an array of liquid-metal microdroplets, is characterized and compared.     

玻璃润滑剂对TA15钛合金与K403镍基高温合金界面接触热阻的影响

为了给钛合金的模锻工艺制定提供理论依据,利用稳态法在自制的接触热阻测量装置上研究了玻璃润滑剂对TA15钛合金与模具用K403镍基高温合金界面接触热阻的影响。结果表明:在TA15和K403合金接触面间加入玻璃润滑剂可显著增大两者间的接触热阻;当界面平均温度不超过636℃,玻璃润滑剂厚度在0.06~0.96 mm范围内时,TA15与K403合金界面接触热阻与玻璃润滑剂厚度大致呈线性关系;TA15与K403合金的界面接触热阻随着温度的升高及压力的增大而减小。     

锥形毛细芯平板热管传热特性研究

随着机械电子设备的不断发展,热管理问题面临越来越严重的挑战,为解决此问题,根据仿生学原理,以天鹅绒竹芋表面微观凸起结构为设计依据,以纳米尺度铜粉为材料烧结制备锥形毛细芯,构造新型平板热管,并以去离子水为工质对其热性能进行研究。研究加热功率、平板热管放置角度及毛细芯氧化与未氧化等因素对平板热管传热特性的影响。结果表明,由于锥形毛细芯多尺度孔隙结构的存在,不仅实现蒸汽从大尺度孔隙逸出,液体从小孔隙吸入,而且缩短了液体流动路径,减小了流动阻力,同时扩大了换热面积,因此大大提高了平板热管的传热性能。锥形毛细芯平板热管具有较好的传热性能及抗重力特性。毛细芯经氧化处理后可显著减小平板热管的换热热阻,提高平板热管的传热性能,在热流密度为107.1 W/cm2时,其总热阻最小值为0.079 K/W。     

一种新型低温热管传热性能的试验研究

对某内部一体式吸液芯结构的低温热管进行了一系列试验研究,主要分析了该型热管水平工况下不同加热功率及工作温度对其轴向温度分布、最大温差、当量导热系数、总热阻以及蒸发/凝结传热系数的影响。研究结果表明:该型热管元件在-30~0℃的工况下具有较好的均温特性和传热能力,适用于对恒温特性有一定要求的0~40W的小功率热量传输场合。     

An Optoelectronic Switch of Voltage Polarity at a Nanovolt Level

A theoretical model of the contact metal topography of a photoconductive cell and a thermal model of an optoelectronic switch of the voltage polarity are considered. Expressions for photo and thermal emf of photoconductive cells with arbitrary contact metal topographies and distributions of the illumination and temperature at the cell surface are obtained. The regularities of minimization of parasitic emf of photoconductive cells are revealed. An optoelectronic switch of the voltage polarity with low levels of temperature (<2 nV/°C) and temporal (3–4 nV/h) drifts of the intrinsic emf, resistances in the ON and OFF states of 100 and 10¹² , respectively, an insulation resistance of 10¹¹ a switching time of 0.5 ms, and a transfer capacitance of 0.1 pF is developed.     

Analysis of thermal conductivity in HI-LEDs lighting materials

The present study devised a measurement system to estimate the thermal conductivity of electronic product materials, especially in HILEDs lighting materials, exhibiting distinct thermal characteristics by conducting thermal performance experiments and theoretical analyses. First, steady-state conduction analysis with thermal resistance method was investigated on three composite material substrates of unknown heat conduction coefficients through a substrate material named Bakelite of low thermal conductivity revealing stable quality. Second, one-dimension semi-infinite transient conduction analysis was utilized to investigate metal materials with high thermal conductivities. Results showed that the Bakelite experimental module was verified for 62.5 % of the original wattages, which closest to the thermal conductivity 0.233 W/m-K of the Bakelite. And these composite materials M1, M2 and M3 composed of polymer and epoxy were 1.311, 0.844 and 2.403 W/m-K, respectively. The thermal performance experiments were investigated and the results have proved the correctness of the theoretical model. According to the experimental results, calculating the temperature value of the metal materials comprising cotton insulation and the transient analysis, this study determined the temperature error to be less 20 %. Consequently, a transient measurement system and method for metal materials with high heat conduction coefficients was established. Finally, the results of this work are the useful thermal conductivity method to facilitate rapid analysis in the future.

     

The thermal flash technique: the inconsequential effect of contact resistance and the characterization of carbon nanotube clusters

This article presents a comprehensive mathematical treatment of the theory behind the thermal flash technique used to measure the thermal diffusivity of nanostructures. Analytical expressions predicting the temperature and its rate of change for various combinations of sample length and diffusivity confirmed that the presence of contact resistance between the heat sink/source or within a cluster of materials does not influence the measurement. Measurements on multi-walled carbon nanotube clusters provide further experimental evidence supporting the claim that contact resistance is inconsequential to this technique and yield a thermal conductivity of 2665 W/m K, which corresponds to an isolated nanotube and not the overall cluster.