Adaboost集成BP神经网络在传感器阵列检测系统中的应用

针对目前常见的多元有害气体检测问题,设计并搭建了一种基于传感器阵列和集成 BP神经网络相结合的传感器阵列检测系统。在该系统中采用集成BP神经网络对传感器阵列的三种混合有害气体的响应信号进行回归分析。为了提高集成BP神经网络的预测准确性,又利用Adaboost算法对集成BP神经网络进行了优化。结果显示：该系统能够准确地检测气体组分,通过Adaboost算法对集成BP神经网络优化后,预测的平均相对误差小于2%,能够有效解决气体传感器的交叉敏感问题,提高传感器的选择性。     

有害气体检测的光纤传感技术发展

光纤气体传感器具有易于小型化、可遥测、灵敏度高、响应快等诸多优点.根据传感原理,概述了有害气体检测的光纤传感器,包括折射率变化型光纤气体传感器、倏逝波光纤气体传感器、表面等离子共振光纤气体传感器、光声光纤气体传感器、多孔光纤气体传感器,以及吸收型光纤气体传感器、荧光型光纤气体传感器、染料指示剂型光纤气体传感器.简要介绍了光纤气体传感器的发展.     

基于集成气体传感器阵列的电子鼻系统

介绍一种基于集成气体传感器阵列的电子鼻系统硬件实现方法。描述了系统的一般组成,重点介绍了所采用的集成气体传感器及其信号拾取方法。该系统可实现对检测气体的自动数据采集、微机传送,具有高的灵敏性和可靠性。另外,对采用的集成气体传感器系列,该电子鼻系统具有一定的通用性。利用该系统对五种葡萄酒进行了检测,结果表明:该电子鼻系统可有效地用于葡萄酒的定性识别,识别准确率达到100%。     

全固态控制电位电解型①SO2 气体传感器的研制

采用三电极结构，Naifion-117膜为中间固态电解质，研制一种新颖的全固态控制电位电解型SO2气体传感器。研究表明：其响应时间、底电流、结构性能等均优于Au-Naifion膜作为中间电解质的半固态控制电位电解型SO2气体传感器与全液态SO2气体传感器。在SO2气体间断监测上具有较好的应用前景。     

半导体场效应型气体传感器的研究现状与未来

集成技术在未来传感器制作中起重要作用。综述了与集成工艺兼容的半导体场效应气体传感器的研究现状与未来发展。     

MEMS结构氧传感器的研究

采用微加工技术研制了一种以硅为基底材料,具有MEMS结构的氧传感器.阐述了该传感器的工作原理、结构设计、工艺流程以及特性分析.给出了溅射制备TiO2薄膜的方法及锐钛矿型晶体结构能谱,讨论了二氧化钛的氧敏机理.研究表明与传统的气体传感器相比,此种传感器具有体积小、低功耗、可集成的特点.     

暂态电化学多组份气体传感器研究(Ⅰ) 多孔薄层电极库仑型气体传感器

常见的电化学气体传感器就其工作状态而言 ,大多属稳态类型 ,功能单一 ,传感器性能的提高受到“稳态”的制约 .本文根据薄层电化学原理 ,提出并建立了一类全新的暂态电化学多组份气体传感器——多孔薄层电极库仑型气体传感器 .这类以多孔薄层气体电极为核心元件构成的库仑型气体传感器 ,既有检测多种气体组份的功能 ,又有响应快、灵敏度高、低温度效应等优异性能     

半固态控制电位电解型SO2 气体传感器的研究

本文采用 Nafion膜研制半固态控制电位电解型 SO2 气体传感器 ,并与全液态控制电位型 SO2 气体传感器对比。研究表明 :半固态控制电位电解型 SO2 气体传感器具有响应时间快、检测灵敏度高、底电流和噪声小、温度系数小、稳定性好、使用寿命较长等优点。在 SO2 气体间断监测上具有较好的应用前景。     

暂态电化学多组份气体传感器研究(I)多孔薄层电极库仑型气体传感器

常见的电化学气体传感器就其工作状态而言,大多属稳态类型,功能单一,传感器性能的提高受到“稳态”的制约,本文根据薄层电化学原理,提出并建立了一类全新的暂态电化学多组份气体传感器－多孔薄层电极库仑型气体传感器。这类以多孔薄层气体电极为核心元件构成的库仑型气体传感器,既有检测多种气体组份的功能,又有响应快、灵敏度高、低温度效应等优异性能。     

组合结构半导体气体传感器的研究进展

综合介绍了基于气体传感器互补反馈和互补增强原理的新型组合结构半导体气体传感器的研究进展,着重对传感器的原理、结构、材料及性能作了介绍,并分析了组合结构半导体气体传感器的发展趋势。     

Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

In this paper, we present the use of thermosetting nano-imprint resists in adhesive wafer bonding. The presented wafer bonding process is suitable for heterogeneous three-dimensional (3D) integration of microelectromechanical systems (MEMS) and integrated circuits (ICs). Detailed adhesive bonding process parameters are presented to achieve void-free, well-defined and uniform wafer bonding interfaces. Experiments have been performed to optimize the thickness control and uniformity of the nano-imprint resist layer in between the bonded wafers. In contrast to established polymer adhesives such as, e.g., BCB, nano-imprint resists as adhesives for wafer-to-wafer bonding are specifically suitable if the adhesive is intended as sacrificial material. This is often the case, e.g., in fabrication of silicon-on-integrated-circuit (SOIC) wafers for 3D integration of MEMS membrane structures on top of IC wafers. Such IC integrated MEMS includes, e.g., micro-mirror arrays, infrared bolometer arrays, resonators, capacitive inertial sensors, pressure sensors and microphones.     

Integrating testability into microsystems

 The integration of sensors and actuators with microelectronics into either compact packages or onto a single silicon die is likely to be of major technological importance over the next decade. These systems are referred to as Microsystems or Micro-Electro-Mechanical-Systems (MEMS). One obstacle to mass-market introduction are difficulties with quality and reliability verification. This paper outlines the difficulties of testing microsystems, shows approaches of test generation and verification transferable from the mixed-signal Integrated-Circuit (IC) domain, and demonstrates an on-line test designed for bridge-type, micromachined accelerometer and pressure sensors [1]. Received: 31 October 1996 / Accepted: 14 November 1996     

A power and data front-end IC for biomedical monitoring systems

To enable the evolution towards electronically assisted healthcare, future medical implants require sensors and processing circuitry to inform patient and doctor on the rehabilitation status. An important branch of systems are those where implant strain is monitored through strain gauges. Since batteries inside the human body are avoided as much as possible, a transcutaneous power link is used to wirelessly power the implant. The same RF link provides an elegant way of establishing bi-directional data communication between the external base station and the medical device. This paper describes a front-end IC that manages both power reception and bi-directional data communication. It has a clock generation circuit on board to drive additional digital processing circuits. A new architecture that uses a current driven data demodulation principle is introduced. It is able to detect an AM signal with modulation depth of a mere 4%, which is better than recent similar systems in the field. The IC is fabricated in a solid 0.35 μm HVCMOS technology and consumes only 0.56 mA.     

高磁阻材料在磁场传感中的应用

从１９８８年法国科研人员首次发现高磁阻效应以来,由于这些材料的高灵敏度,良好的温度稳定性和在较大测量内优异的线性,已在磁场测量及其它领域中获得了广泛应用。本文主要介绍高磁阻材料几种结构及其在磁场传感器中的应用。同时还将这种材料与传统磁场测量技术做了比较。将传感器和信号调理及输出电路集成在一起的集成高磁阻传感器,使高磁阻技术得到了进一步应用,本文也做相应介绍。     

An incremental algorithm for clustering spatial data streams: exploring temporal locality

Clustering sensor data discovers useful information hidden in sensor networks. In sensor networks, a sensor has two types of attributes: a geographic attribute (i.e, its spatial location) and non-geographic attributes (e.g., sensed readings). Sensor data are periodically collected and viewed as spatial data streams, where a spatial data stream consists of a sequence of data points exhibiting attributes in both the geographic and non-geographic domains. Previous studies have developed a dual clustering problem for spatial data by considering similarity-connected relationships in both geographic and non-geographic domains. However, the clustering processes in stream environments are time-sensitive because of frequently updated sensor data. For sensor data, the readings from one sensor are similar for a period, and the readings refer to temporal locality features. Using the temporal locality features of the sensor data, this study proposes an incremental clustering (IC) algorithm to discover clusters efficiently. The IC algorithm comprises two phases: cluster prediction and cluster refinement. The first phase estimates the probability of two sensors belonging to a cluster from the previous clustering results. According to the estimation, a coarse clustering result is derived. The cluster refinement phase then refines the coarse result. This study evaluates the performance of the IC algorithm using synthetic and real datasets. Experimental results show that the IC algorithm outperforms exiting approaches confirming the scalability of the IC algorithm. In addition, the effect of temporal locality features on the IC algorithm is analyzed and thoroughly examined in the experiments.     

毫米波探测技术与寻的引信

分析了毫米波传感器(包括毫米波雷达和毫米波辐射计)的特点及工作原理，讨论了基于毫米波传感器的多模复合探测技术，并具体介绍了它们在灵巧弹药寻的引信中的广泛应用，结合现代电子技术和信号处理技术展望了其发展前景。     

传感器的TAS焊接

本文介绍了采用Ar+H_2混合气体保护自动点焊(TAS焊)新工艺,实现了压力传感器、电感传感器等器件的封装。文中对传感器结构及焊接特点,TAS焊接设备及工艺作了详细的阐述。     

FBG传感技术在工程结构监测中的应用

FBG传感技术代表了一种先进的技术,具有传统技术无可比拟的优势。分析了FBG传感器用于土木工程检测的二个关键技术问题,研制了二种FBG传感器,并进行了工程试验。试验结果表明:FBG传感器比电检测系统传感器具有更高准确度,能实现绝对数值测量,抗干扰能力强,结构简单,长期稳定性高,实现对工程结构的实时、在线监测。     

Technology management and strategy composition: innovation of IC foundry

The goals of this research are two-tiered: The first goal is to analyze the evaluation criteria used by integrated circuit (IC) designers when selecting foundry service providers. The second goal is to use an in-depth case study on the global IC foundry leader, TSMC, to explore the strategic compositions of IC foundry’s process development, since the process technology has been found, through our survey at the prior stage, to be the most significant evaluation criterion in view of competitiveness in the customer market. As a result, for the foundry industry, technology no longer counts for everything, although it is a priority; coordinated strategies, in contrast, should assure more business merits for all concerned. This study has drawn the strategy matrix with eight categories of IC foundry process strategies.