碳纳米管的化学镀铜

A simple chemical method was employed to coat carbon nanotubes with a layer of copper. Due to the hydrophobic nature, large surface curvature, small diameter and large aspect ratio, it is difficult to gain continuous electroless plating layer on the surface of carbon nanotubes. In this paper, a series methods (oxidization, sensitization and activation) are used to add active sites before electroless plating, and the adjustment of the traditional composition of copper electroless plating bath and operating condition can decelerate electroless plating rate. The samples before and after coating were analyzed using transmission electron microscopy and energy-dispersive X-ray spectroscopy. The results showed that the surface of carbon nanotubes was successfully coated with continuous layer of copper, which lays a good foundation for applying carbon nanotubes in composites.     

碳纤维布化学镀铜工艺的研究

采用以甲醛为还原剂的化学镀铜液,用硝酸银作活化剂,在碳纤维布表面沉积出连续、均匀、有光泽的化学镀铜层。研究了不同前处理工艺对碳纤维布化学镀铜的影响。采用扫描电子显微镜表征了化学镀铜层的表面形貌,并用数字电压表测试了碳纤维布化学镀铜前后的导电性。     

TiB2表面镀铜工艺

利用化学镀覆技术成功在TiB2颗粒表面均匀化学镀覆铜。透射电子显微镜观察表明：通过严格的镀前预处理工艺的优化设计以增加活化点,对传统镀液配方的调整以降低镀速,能够成功地在TiB2颗粒表面镀覆一层铜,从而培强了其和铜基体之间的界面结合力,为TiB2在复合材料领域之中的应用打下了坚实基础。     

碳纤维表面化学镀铜工艺的优化

以甲醛为还原剂对碳纤维表面进行化学镀铜,利用正交实验对碳纤维化学镀铜工艺进行了优化,研究了施镀时间与镀层厚度及导电性之间的关系,确定了较理想的化学镀铜工艺。结果表明,采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀,光泽性好,镀层结合力强,导电性能显著提高。     

化学镀银的应用与发展

综述了化学镀银的沉积机理及其发展概况,主要包括:铜粉化学镀银,空心玻璃微球化学镀银,碳纤维布化学镀银,碳纳米管化学镀银,Yb2O3粉体化学镀银,高分子材料表面化学镀银等;并对化学镀银的应用进行了阐述.     

镀铜碳纳米管导电胶的研究

通过化学镀方法制备了镀铜碳纳米管,用透射电镜(TEM)对其表面形貌进行表征;并以镀铜碳纳米管为填料制备了环氧树脂导电胶。结果表明:镀铜碳纳米管上的镀层的质量、填料在树脂中的分散性以及填料的质量分数对于导电胶电性能和黏结性能起着决定因素。     

酚醛塑料环保型电镀精饰新工艺

针对目前酚醛塑料无法直接电镀、无法规模化电镀及现有电镀工艺废水污染严重的现状,研究一种在酚醛塑料表面直接电镀的环保经济型新工艺。通过对导电涂层表面导电能力、沉积速率、镀液稳定性及结晶颗粒细致度的具体分析、实验对比,提出在酚醛塑料表面喷涂以次纳米级铜粉为导电金属的导电金属漆层,采用以次亚磷酸钠作为还原剂的化学镀铜工艺,在涂层表面镀覆一层薄铜。该工艺对酚醛塑料表面可直接进行电镀,在实现重金属等污染物零排放的同时大幅降低了生产成本。     

Electrochemical materials and processes in Si integrated circuit technology

Various technical issues related to feature scaling and recent electrochemical technologies advances for on-chip copper interconnects at Intel are reviewed. Effects of additives on electroplating, as well as performance of novel Cu direct plating on ruthenium liner are discussed. An electroless cobalt capping layer of Cu lines, which led to increased electromigration resistance, has been characterized. The potential application of carbon nanotubes as future interconnects materials, their properties and controlled placement by using dielectrophoresis are also reviewed.     

ABS塑料化学镀铜工艺

介绍了ABS塑料表面化学镀铜的工艺流程,讨论了粗化温度和时间、敏化和活化时间、硫酸铜质量浓度、甲醛体积浓度、酒石酸钾钠质量浓度、镀液温度和镀液pH对镀层质量以及化学镀铜沉积速率的影响。确定了最佳工艺条件为15~20g/L硫酸铜、15mL/L甲醛、14g/L酒石酸钾钠,镀液温度为323K,镀液的pH为11~12。扫描电镜表明,所得镀层均匀、光亮,结合力好。     

碳纳米管化学镀镍及镀层析氢催化性能研究

研究了在碳纳米管上化学镀Ni-P的工艺及镀层析氢催化性能.用扫描电镜(SEM)观察了镀层的表面形貌,用能谱成分分析仪(EDS)对镀层进行了成分分析,用X射线衍射仪(XRD)对镀层进行了物相分析,最后通过电化学实验测试了镀层的析氢催化性能.结果表明:镍包裹碳纳米管/Ni-P镀层的交换电流密度较大,具有良好的析氢催化活性.     

模拟化工大气环境中不同类型铜管的腐蚀研究

在自制的实验箱中模拟化工大气环境,考察了裸铜管、化学镀標铜管和化学镀操-染黑铜管的腐蚀情况,并利用扫描电镜和三维形貌仪观察了不同类型铜管腐蚀前后的微观组织及腐蚀后的局部三维形貌。结果表明:在模拟化工大气环境中腐蚀后裸铜管表面存在连成片且很深的蚀坑,化学镀襟铜管表面的胞状物消失,化学镀鎳-染黑铜管表面存在沿着缝隙分布的大面积细小蚀坑;化学镀铢铜管的耐蚀性最好,其次是化学镀操-染黑铜管,裸铜管的耐蚀性最差。     

Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches

The bottom-up filling of electroless copper usually depends on inhibiting the Cu deposition at the surface or accelerating the Cu deposition in the bottom of trenches to achieve a relative high deposition rate of electroless copper in the bottom of trenches. In this paper, a complete bottom-up filling of electroless copper, in which the deposition rates of the electroless copper were not only inhibited at the surface of the substrate, but also were accelerated in the bottom of the trenched, was designed and achieved in the plating bath with an addition of bis (3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG). The cross-sectional SEM observation of trenches indicated that all trenches with different widths ranging from 100 to 290 nm were filled completely by electroless copper, and no void was found. This was attributed to three factors, the electroless Cu deposition was accelerated markedly by an addition SPS only; but it was suppressed sharply by a combination addition SPS and PEG-4000; the large molecular weight and lower diffusion coefficient of PEG-4000 resulted in concentration gradient of PEG-4000 in the trenches. The effects of PEG-4000 and SPS on the polarization behaviors of the electroless copper plating bath were investigated by the linear sweep voltammetry method and mixed potential theory.     

以次磷酸钠为还原剂的化学镀铜

研究了以次磷酸钠为还原剂的化学镀铜过程。确立了以硫酸铜为主盐,次磷酸钠为还原剂,乙二胺四乙酸二钠和柠檬酸钠为混合配位剂的碱性还原镀铜体系。在铸铁基体上实现了铜的连续自催化沉积,获得了较光亮、红黄色的铜镀层。     

木材单板表面化学镀镍

以杨木单板为原料,利用化学镀法在其表面镀覆N i-P合金镀层,以此来制备具有电磁屏蔽功能的木材-金属复合材料。用扫描电镜(SEM)、能谱分析仪(EDS)和X射线衍射仪(XRD)分析了镀层形貌、成分和镀层结构,研究了经表面化学镀N i-P合金后杨木单板的电磁屏蔽性能和表面导电性能。SEM分析表明,杨木单板经表面化学镀N i-P合金后,表面完全被镀层覆盖,金属感增强。EDS分析表明,镀层为N i-P合金镀层,其中磷含量较低,主要成分为镍。XRD分析结果表明,镀层为晶态结构。镀后杨木单板的表面电阻率很低,而电磁屏蔽效能较高,在9 kHz~1.5 GHz,可达到60 dB左右。     

水合肼和次磷酸钠为还原剂的化学镀Ni-P合金研究

铜上化学镀Ni-P合金通常需要用钯催化剂或其它无钯催化剂催化后才能施镀,研究了利用水合肼为引发剂,以水合肼和次磷酸钠为还原剂的化学镀Ni-P合金液,在铜箔上直接施镀,铜箔无须镀前催化。利用扫描电镜和X-射线衍射仪研究了镀层的表面形貌,利用能谱仪测定了镀层中P含量,同时研究了水合肼和次磷酸钠的浓度对镀速和P含量的影响,探讨了无催化铜箔化学镀Ni-P合金的反应机理。     

Supercritical fluid‐assisted electroless metal plating onto aramid films: The influence of thermal treatment

Although the production of electro‐conductive aramid fibers is efficient, the method needs to be modified before it can be applied to aramid films. Whereas impregnation of an aramid film with a metal complex using supercritical CO₂ is achievable, the relatively low adhesion strength of the metal layer applied using electroless copper plating is problematic. To solve this problem, thermal treatment was conducted before, after, or both before and after electroless plating. The rationale for using thermal treatment to improve the adhesiveness of the plated layer was based on the findings that (1) an aramid film contains a significant amount of water (about 3.5 % w.o.f.), which might have a negative impact on adhesion; and (2) because an impregnated metal complex liberates metal catalyst by thermal decomposition during impregnation, a supplementary thermal action might liberate more catalyst and thereby improve adhesion. We found that thermal treatment improved adhesion of the metal layer to the aramid film. Moreover, we discovered that with respect to electroless copper plating, a short time‐lag was crucial to obtaining a thin and homogeneous metal layer with strong adhesion. In addition, we demonstrate the affinity of an aramid film for Pd(acac)₂. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

碳纤维镀铜及其对铜基复合材料界面影响

碳纤维与铜之间的润湿性很差，导致碳纤维-铜复合材料的界面问题十分突出，给碳纤维增强铜基复合材料具有的优异性能带来很大的影响.用化学反应法在碳纤维表面镀铜,然后再与铜复合，可以有效地解决上述问题.但由于碳纤维具有纤细疏水、表面惰性的特点，对它镀铜很难.本文以CuSO₄为主盐，锌粉为还原剂，研究了4种不同类型添加剂: A（烷基苯磺酸盐）、B（烷基磺酸盐）、C（十二烷基脂肪酸盐）和D（十二烷基脂肪酸盐+乙酸钠）对碳纤维镀铜的影响.结果表明：D型添加剂最有利于碳纤维镀铜, 它能有效地解决碳纤维镀铜时经常发生的碳纤维束“黑心”问题.在实验中观察到整束碳纤维被均匀、连续地镀上了铜.通过扫描电镜观察：在镀铜碳纤维的断面上可以看到镀层和碳纤维结合得很牢固;在镀铜碳纤维与铜复合所得的复合材料中碳纤维与铜之间的界面结合得十分紧密.     

Tribological application of carbon nanotubes in a metal-based composite coating and composites

Ni-P-carbon nanotube (CNT) composite coating and carbon nanotube/copper matrix composites were prepared by electroless plating and powder metallurgy techniques, respectively. The effects of CNTs on the tribological properties of these composites were evaluated. The results demonstrated that the Ni-P-CNT electroless composite coating exhibited higher wear resistance and lower friction coefficient than Ni-P-SiC and Ni-P-graphite composite coatings. After annealing at 673 K for 2 h, the wear resistance of the Ni-P-CNT composite coating was improved. Carbon nanotube/copper matrix composites revealed a lower wear rate and friction coefficient compared with pure copper, and their wear rates and friction coefficients showed a decreasing trend with increasing volume fraction of CNTs within the range from 0 to 12 vol.% due to the effects of the reinforcement and reduced friction of CNTs. The favorable effects of CNTs on the tribological properties are attributed to improved mechanical properties and unique topological structure of the hollow nanotubes.     

PE塑料化学镀铜的研究

采用锉刀实验法和划线划格实验两种镀层结合力测试方法,对化学镀铜层与塑料基体之间结合力的优劣进行了定性评价;通过沉积速率的计算,研究了镀铜时间对塑料化学镀铜沉积速率的影响。结果表明,镀层与基体之间的结合力良好塑料表面可通过化学镀形成铜镀层,且随着镀铜时间的增加,沉积速率增加(30 min内)。镀铜10~15 min时,沉积速率相对较低,而镀铜15 min后,沉积速率急剧增大。     

镀铜碳纤维布的制备及性能研究

为制备新型毫米波无源干扰材料,采用化学镀方法在碳纤维布表面沉积了金属铜层。测量了优化工艺条件下制得的镀铜碳纤维布的表面电阻,并采用冷热循环法检测了镀层的结合强度,应用雷达散射截面(RCS)测试系统测试了同样尺寸的镀铜碳纤维布及未改性碳纤维布的3mm波段RCS值。结果表明:镀铜碳纤维布镀覆均匀,金属光泽强,有良好的镀层结合强度及较强的导电性能。镀铜碳纤维布在3mm波段的RCS值较未改性碳纤维布有很大提高,且与理论计算值接近。