衬底温度和生长速率对MBE自组织生长InxGa1-xAs/GaAs QD的影响

研究GaAs基InxGa1-xAs/GaAs量子点(QD)的MBE生长条件,发现在一定的Ⅴ/Ⅲ比下,衬底温度和生长速率是影响InxGa1-xAs/GaAsQD形成及形状的一对重要因素,其中衬底温度直接影响着In的偏析程度,决定了InxGa1-xAs/GaAs的生长模式;生长速率影响着InxGa1-xAs外延层的质量,决定了InxGa1-xAs/GaAsQD的形状及尺寸.通过调节衬底温度和生长速率生长出了形状规则、尺寸较均匀的InxGa1-xAs/GaAsQD(x＝0.3).     

生长温度对于Ge衬底上分子束外延生长的InGaAs/GaAs量子阱结构质量的影响

本文研究了斜切割（100）Ge衬底上InxGa1-xAs/GaAs量子阱结构的分子束外延生长（In组分为0.17或者0.3）。所生长的样品用原子力显微镜、光致发光光谱和高分辨率透射电子显微镜进行了测量和表征。结果发现,为了生长没有反相畴的GaAs缓冲层,必须对Ge衬底进行高温退火。在GaAs外延层和InxGa1-xAs/GaAs量子阱结构的生长过程中,生长温度是一个至关重要的参数。文中讨论了温度对于外延材料质量的影响机理。通过优化生长温度,Ge衬底上的InxGa1-xAs/GaAs量子阱结构的光致发光谱具有很高的强度、很窄的线宽,样品的表面光滑平整。这些研究表面Ge 衬底上的III-V族化合物半导体材料有很大的器件应用前景。     

InGaAs／GaAs自组织量子点光致发光特性研究

用PL谱测试研究了GaAs和不同In组份InxGa1-xAs(x=0.1,0.2,0.3)覆盖层对分子外延生长的InAs/GaAs自组织量子点发光特性的影响,用InxGa1-xAs外延层覆盖InAs/GaAs量子点,比用GaAs做 其发光峰能量向低有端移动,发光峰半高度变窄,量子点发光峰能量随温度的红移幅度较小,理论计算证实这是由于覆盖层InxGa1-xAs减小了InAs表面应力导致发光峰红移,而In元素有效抑制了InAs/GaAs界面组份的混杂,量子点的均匀性得到改善,PL谱半高宽变窄,用InGaAs覆盖的In0.5Ga0.5As/GaAs自组织量子点实现了1．3μm发光,室温下PL谱半高宽为19．2meV,是目前最好的实验结果。     

优化生长的In_xGa_(1-x)As缓冲层上双势垒In_yGa_(1-y)As/Al_zGa_(1-z)As/GaAs/Al_zGa_(1-z)As多量子阱应变状态测量

一种多步生长方法应用于GaAs衬底上的InxGa1-xAs缓冲层的MOCVD生长．在这种InxGa1-xAs缓冲层上生长的InyGa1-yAs／AlzGa1-zAs／GaAs／AlzGa1-xAs双垫垒量子阱材料表现出了很好的晶格特性和光学性质．超晶格的室温光伏谱中出现很强的22H高阶机制吸收峰，表明超晶格界面质量很好．主要应用X射线双晶衍射方法，给出了样品中各层的应变状态．据此，合理地解释了样品的光学测试结果．     

基于低温In_xGa_(1-x)P组分渐变缓冲层的InP/GaAs异质外延

采用低温GaAs与低温组分渐变InxGa1-xP作为缓冲层,利用低压金属有机化学气相外延(LP-MOCVD)技术,在GaAs(001)衬底上进行了InP/GaAs异质外延实验。实验中,InxGa1-xP缓冲层选用组分线性渐变生长模式(xIn0.49→1)。通过对InP/GaAs异质外延样品进行双晶X射线衍射(DCXRD)测试,并比较1.2μm厚InP外延层(004)晶面ω扫描及ω-2θ扫描的半高全宽(FWHM),确定了InxGa1-xP组分渐变缓冲层的最佳生长温度为450℃、渐变时间为500s。由透射电子显微镜(TEM)测试可知,InxGa1-xP组分渐变缓冲层的生长厚度约为250nm。在最佳生长条件下的InP/GaAs外延层中插入生长厚度为48nm的In0.53Ga0.47As,并对所得样品进行了室温光致发光(PL)谱测试,测试结果表明,中心波长为1643nm,FWHM为60meV。     

闪锌矿BxAl1-xAs合金的LP-MOCVD生长研究

利用低压金属有机化学气相沉积(LP-MOCVD)生长工艺,采用三乙基硼(TEB)源,在GaAs(001)衬底上生长了B并入比为0.4%～4.4%的一系列BxAl1-xAs合金。实验结果表明,BxAl1-xAs的最优生长温度为580℃;当生长温度为550℃和610℃时,BxAl1-xAs中B并入比都会下降,550℃时B并入比下降更为显著。在580℃最优生长温度下,B并入比随着TEB摩尔流量增加而提高,且B并入比从临界值2.1%增加至最大值4.4%时,DCXRDω-2θ扫描BxAl1-xAs衍射峰的半高宽值从51.8 arcsec升高到204.7 arcsec,原子力显微镜(AFM)测试表面粗糙度从2.469 nm增大到29.086 nm,说明B并入比超过临界值后BxAl1-xAs晶体质量已经逐渐严重恶化。     

Zn、Zn-Cd在In_xGa_(1-x)As中扩散的研究

本文利用ZnAs2、ZnAs2+Cd作扩散源,研究了Zn、Zn-Cd在InxGa1-xAs中的扩散。给出了扩散温度和扩散时间,扩散源的种类和材料的组份对xj-t1/2关系的影响,Zn在InxGa1-xAs中的扩散速度(xj2/t)较Zn-Cd在InxGa1-xAs中的快。在500600℃,Zn在InxGa1-xAs的表面浓度为1101921020cm-3。Zn在InxGa1-xAs中的表面浓度较在InP中的高。利用InxGa1-xAs作1.3m发光管的接触层可使接触电阻降低。     

泊松比取值对InGaAs/GaAs异质结组分分析的影响

通过对InxGa1-xAs泊松比的两级优化,讨论了泊松比取值对InxGa1-xAs/GaAs异质结应变层中组分分析的影响.以PB模型计算的临界厚度为指导,设计了一组实验,采用分子束外延(MBE)技术生长不同In组分、不同应变层厚度的InxGa1-xAs/GaAs异质结样品且进行X射线双晶衍射测试,并依据该结果分析应变层组分.对于影响组分分析的泊松比,通过线性内插法将应变层泊松比优化为组分的函数,并分别采用传统的单一值和优化的泊松比分析应变层的组分:泊松比取单一值1/3时,组分偏差高达0.009 1,取优化的泊松比时,偏差仅0.001 5.研究表明,相对于取单一值和线性内插法优化的泊松比,采用线性内插弹性系数优化的泊松比可以更准确地分析异质结应变层的组分.     

两步生长和直接生长GaAs/Si单晶薄膜的比较

报道了采用热壁外延(HWE)技术,在(100),(111)和(211)三种典型Si表面通过两步生长和直接生长法制备GaAs单晶薄膜,经过拉曼光谱、霍尔测试和荧光光谱分析比较,得出结论:(1)相同取向Si衬底,两步生长法制备的GaAs薄膜结晶质量比直接生长法制备的GaAs薄膜的要好;(2)采用HWE技术在Si上异质外延GaAs薄膜,其表面缓冲层的生长是降低位错、提高外延质量的基础;(3)不同取向Si衬底对GaAs外延层结晶质量有影响, (211)面外延的GaAs薄膜质量最好,(100)面次之,(111)面最差.     

采用InGaAs或InAlAs缓冲层的高In组分InGaAs探测器结构材料特性

利用气态源分子束外延在InP衬底上生长了具有InxGa1-xAs或InxAl1-xAs连续递变缓冲层的高In组分In0.78Ga0.22As探测器结构.通过原子力显微镜、X射线衍射、透射电子显微镜和光致发光对它们的特性进行了表征和比较.结果表明,具有InxGa1-xAs或InxAl1-xAs缓冲层的结构都能获得较平整的...     

自然增长与计划增长

可靠性增长有两种方式：一种是自然增长,另一种是计划增长。前者是不与可靠性目标值相联系的增长方式;后者是受可靠性目标值制约的增长方式。讨论了自然增长和计划增长的概念、内涵和特点,并举例阐述了二者之间的本质区别。     

塑封半导体器件的可靠性增长分析

应用ＥＤＲＩＣ可靠性模型对彩电配套用塑封整流二极管进行了增长分析,讨论了该器件的失效模式、失效机理及增长对策,使该器件的可靠性得到了较大的增长。     

碲锌镉籽晶定向熔接技术研究

应用CdZnTe晶体作为衬底材料时,其晶向非常关键。CdZnTe晶体籽晶引晶定向生长技术能够有效提高晶体利用率。但是,受碲锌镉晶体生长方法限制,CdZnTe籽晶引晶技术成功率并不高。本文即通过一系列实验研究了籽晶熔接过程升温方式以及籽晶晶向对碲锌镉籽晶熔接成功率的影响,并确定了升温方式是籽晶熔接的关键工艺所在。后续籽晶引晶生长晶向能否持续与籽晶选择晶向有关。通过显著提升初始熔体过热度可以促进<111>籽晶引晶晶向的保持。     

Seeded growth of AlN crystals on nonpolar seeds via physical vapor transport

Seeded growth of AlN single crystals was demonstrated in an induction-heated, high-temperature reactor via a physical vapor transport (PVT) process. AlN seeds were prepared from a self-seeded boule containing large single-crystalline grains. Seeded growth was interrupted several times in order to refill the AlN powder source, and a dedicated process scheme was used to ensure epitaxial growth on the seed surface, after prior exposure to air. The growth temperatures were in the range of 2200–2300°C, and the reactor pressure was in the range of 500–900 torr of UHP-grade nitrogen during each growth run. Under these growth conditions, a seed (10 mm diameter) expanded at an angle of 45°, and a larger single crystal up to 18 mm in diameter was obtained. The as-grown surface had three facets, of which facet (1120) was smooth and featureless while the other two, (4150) and (2570), showed serrated morphologies. The double-crystal x-ray rocking curve and glow discharge mass spectroscopy analysis confirmed that the grown crystal was of high crystalline quality with low impurity incorporation.     

Ultraviolet light-driven epitaxial growth of gallium arsenide at reduced substrate temperatures

We report on the photodeposition of gallium arsenide on gallium arsenide and silicon at low substrate temperatures utilizing ultraviolet radiation. A 1000 W Hg-Xe arc lamp serves as the light source with triethylgallium and arsine serving as the reactants. In this study, single crystal gallium arsenide thin films are obtained at substrate temperatures of approximately 357°. The electrical, chemical and structural properties of the photodeposited films are presented and the mechanisms involved in the deposition process are discussed. It is found that both photolytic and pyrolytic mechanisms are involved in the deposition process for the experimental conditions considered and that the desorption of excess arsenic is important in the low temperature growth of GaAs using photochemical means.     

Te溶剂垂直区熔法生长Φ20MCT晶体组分控制研究

采用Ｔｅ作溶剂在特制的垂直区熔炉上开展了Φ２０ＭＣＴ晶体的生长研究；详细阐述了该方法ＭＣＴ晶体的生长过程和生长机理；总结了分析了晶体生长过程中影响组分的因素；提出了生长过程中组分控制存在的问题和改善组分控制的措施。     

利用三氯氢硅(TCS)作为硅源在4H-SiC上外延生长的研究

Epitaxial growth on n-type 4H-SiC 8° off-oriented substrates with a size of 10 × 10 mm^2 at different temperatures with various gas flow rates has been performed in a horizontal hot wall CVD reactor, using trichlorosilane （TCS） as a silicon precursor source together with ethylene as a carbon precursor source. The growth rate reached 23 μm/h and the optimal epilayer was obtained at 1600℃ with a TCS flow rate of 12 sccm in C/Si of 0.42, which has a good surface morphology with a low RMS of 0.64 nm in an area of 10 x 10 pm2. The homoepitaxial layer was obtained at 1500℃ with low growth rate （〈 5 μm/h） and the 3C-SiC epilayers were obtained at 1650 ℃ with a growth rate of 60-70 μm/h. It is estimated that the structural properties of the epilayers have a relationship with the growth temperature and growth rate. Silicon droplets with different sizes are observed on the surface of the homoepitaxial layer in a low C/Si ratio of 0.32.     

Epitaxial growth on 4H-SiC by TCS as a silicon precursor

onship with the growth temperature and growth rate. Silicon droplets with different sizes are observed on the surface of the homoepitaxial layer in a low C/Si ratio of 0.32.     

基于改进L-系统的树木生长动画实现

将改进函数L-系统与时控L-系统结合,通过对系统中枝条生长函数的分析和选择,使用多项式函数和指数函数作为生长函数,可以直观、连续地实现枝条生长的控制。结合计算机动画实现方法,实现了植物的连续生长动画。该算法思路清晰,容易实现,可控性较好。