Mo-Cu合金与1Cr18Ni9Ti不锈钢真空钎焊接头的组织性能

采用Ag-Cu-Ti钎料,控制钎焊温度为910℃,保温时间为20 min,可以实现Mo-Cu合金与1Cr1 8Ni9Ti不锈钢的真空钎焊,接头抗剪强度为75 MPa.采用扫描电镜、能谱分析仪和显微硬度计对Mo-Cu/1 Cr18 Ni9Ti接头组织特征及性能进行分析.结果表明,钎焊接头靠近1Cr18Ni9Ti钢一侧,主要形成Ag-Cu共晶组织和少量的TiC相;靠近Mo-Cu合金一侧,Ag,Cu元素在合金与钎缝间相向扩散,共晶组织消失,以富铜相为主.钎缝的显微硬度明显低于Mo-Cu合金和1Cr18Ni9Ti不锈钢母材,无脆性化合物生成,剪切断口呈现剪切韧窝的形貌特征.     

铝合金与不锈钢的过渡层钎焊

铝合金与不锈钢的物化性能相差很大，两者的直接连接易于在界面上生成Al和Fe的脆性化合物。作者用试验的方法研究了LF3铝合金与0Cr18Ni9不锈钢的Ni／Cu过渡层钎焊的工艺方法以及接头的组织与力学性能，并对各连接界面进行了机理分析。对钎缝的界面做剪切试验、X射线衍射、扫描电镜(SEM)和透射电镜(TEM)等分析发现，镀层与钎料等各界面连接紧密，特别是钎缝与母材之间没有生成脆性Al-Fe金属间化合物。由此得出结论，面心立方结构的Ni／Cu电刷镀层能有效地阻挡Al、Fe等原子扩散，钎缝与镀Cu界面上虽然生成了少量的AlCu3，但由于组织不连续，没有大幅度降低钎缝的剪切强度。通过过渡层钎焊，实现了LF3铝合金与0Cr18Ni9不锈钢的复合连接．满足了工程需要。     

新型含钯镍基钎料钎焊不锈钢接头的性能分析

对新型Ni-Pd-Ag-Cr-Si钎料钎焊1Cr18Ni9Ti不锈钢的接头性能进行了分析。结果表明,新型Ni-Pd-Ag-Cr-Si钎料对1Cr18Ni9Ti不锈钢有良好的润湿性;钎焊接头中,紧靠钎缝与母材界面的是与该界面平行的长条形齿状镍钯基固溶体致密组织。这种固溶体具有较高的强度和塑性,钎缝宽度为170μm时,钎缝仍具有较高的剪切强度,利于保证钎焊不锈钢产品质量不发生重大变化。     

铝合金/不锈钢高频感应钎焊接头结构与性能研究

采用自炼的Al-Si-Cu-RE钎料进行高频感应钎焊,实现了LF21铝合金与1Cr18Ni9Ti不锈钢的连接,利用电子万能试验机进行了钎焊接头剪切试验,利用SEM,EDS等手段对钎焊接头的微观组织进行研究和分析.微观结构分析表明,钎焊接头的显微组织由α(Al)-θ (CuAl2)共晶组成,高频感应快速加热避免了钎缝中Fe-Al金属间化合物的生成,且由于钎料中添加了RE元素,CuAl2相为均匀分布的枝状晶,Si相经变质处理细小分散;Al-Si-Cu-RE钎料与LF21铝合金反应良好,界面过渡均匀,钎缝与1Cr18Ni9Ti不锈钢之间有明显的分界,剪切试验表明接头抗剪强度达95 MPa.     

铝合金与不锈钢接触反应钎焊接头微观组织分析

采用Ag-Ni复合镀层,在钎焊温度580℃,保温时间1～20min的条件下,对6063铝合金与1Cr18Ni9Ti不锈钢进行了接触反应钎焊试验,初步分析了接头的微观组织及镀Ni层的作用效果.结果表明,在钎焊时间较短时,钎缝主要由Al(Ag)固溶体与Ag-Al化合物构成;钎焊时间超过20min,Ag-Al化合物含量显著增加,镀Ni层对防止生成Al-Fe脆性金属间化合物的作用效果减弱.     

钎焊间隙对BNi74CrSiB钎料真空钎焊1Cr18Ni9Ti不锈钢接头界面组织的影响

采用BNi74CrSiB颗粒状钎料对不同钎焊间隙的1Cr18Ni9Ti奥氏体不锈钢板进行了真空钎焊试验。结果表明:钎焊间隙为0.05～0.10 mm时,钎焊接头致密完整,表面无宏观缺陷;钎缝与母材组织间无明显的界限;0.1～0.3mm时,钎缝出现了局部未钎透缺陷,且钎缝与母材界面附近出现大量麻点状的Fe2B物相;0.30～0.45 mm时,钎缝出现严重未钎透和大气孔缺陷。钎缝基体组织均由γ-Ni基固溶体和Ni-Si共晶组织构成,在基体组织上均分布有一定量的Cr B脆性相。     

钎焊温度对GH4169/1Cr18Ni9Ti接头组织和性能影响研究

采用BNi82CrSiB镍基钎料真空钎焊GH4169/1Cr18Ni9Ti母材,通过光学显微镜、能谱仪、显微硬度计、拉伸试验机等研究了钎焊温度对钎缝的显微组织、显微硬度、力学性能的影响。结果表明:在1 060~1 100℃范围内,接头的钎缝主要由镍基固溶体组成,钎缝中未出现金属间化合物相,钎焊温度的变化对接头的钎缝组织无明显影响。断口分析结果表明:接头断裂均为韧性断裂,断裂区域均处于靠近1Cr18Ni9Ti母材的扩散区中。     

HLCuNi30钎焊1Cr18Ni9Ti工艺的研究

使用真空中频钎焊炉对1Cr18Ni9Ti进行焊接,钎料为HLCuNi30。采用钎料铺展面积测量法,得出该钎料钎焊该母材时的大体钎焊温度;采用钎焊接头楔形间隙图,对HLCuNi30钎料钎焊1Cr18Ni9Ti的最大钎焊间隙进行分析,得出HLCuNi30钎料钎焊1Cr18Ni9Ti时的不同钎焊工艺(钎焊温度和钎焊保温时间)及钎后扩散热处理对最大钎焊间隙的影响。     

BNi-2钎焊1Crl8Ni9Ti工艺的研究

通过实验,采用钎焊接头楔形间隙图,对BNi-2钎料钎焊1Cr18Ni9Ti的最大钎焊间隙进行分析.得出BNi-2钎料钎焊1Cr18Ni9Ti时的不同钎焊工艺(钎焊温度和钎焊保温时间)及钎焊后扩散热处理对最大钎焊间隙的影响.最终得出BNi-2钎焊1Cr18Ni9Ti的最佳钎焊工艺:1000℃保温60～90min.     

TC4／Ag-Cu—Ti／1Cr18Ni9Ti钎焊接头界面组织与结构

以Ag—Cu—Ti箔状钎料对钛合金TCA和不锈钢1Cr18Ni9Ti进行了真空钎焊。采用扫描电镜、能谱分析、金相显微镜和x一射线衍射等分析测试手段对钎焊过程中所形成的反应产物和接头界面结构进行了分析。结果表明：接头界面形成了Ti（s．s）、AS（s．s）、Ti—Cu金属问化合物等反应产物。连接温度较低（920℃）时,界面结构依次为1Cr18Ni9Ti／TiCu／Ag（s．s）＋少量Ti2cu／％2cu／Ti2cu＋Ti（s．s）／TC4;连接温度升高（960oC）时,界面结构为1Crl8Ni9Ti／Ti：Cu／Ti：Cu＋矩（s．s）／Ti2Cu／Ti2Cu＋Ti（s．s）／TCA;连接温度较高（1000oC）时,界面结构为1Crl8Ni9Ti／TiCu2／TiCu／Ti2Cu／Ti：Cu＋Ti（s．s）／TC4。提高钎焊温度与延长保温时间对钎焊接头界面组织结构有相似的影响,各反应相、反应层逐渐长大,金属问化合物反应相所占比例增大,而Ag（s．s）组织所占的比例变得更小,这种趋势随着焊接工艺参数的提高更加明显。     

Corrosion resistance of Zn–Ni/Ni and Ni/Zn–Ni compositionally modulated multilayer coating

Zn–Ni/Ni and Ni/Zn–Ni compositionally modulated multilayer (CMM) coatings were prepared by dual‐bath technique. The effects of layers number and sublayers order were studied. Specially, the effect of different sublayers thickness ratios with the same multilayer period (λ) on the corrosion resistance of the CMM coatings was investigated in detail. Results showed that the corrosion resistance of Ni/Zn–Ni (Zn–Ni alloy sublayer as the top layer) CMM coating was better than that of Zn–Ni/Ni (Ni sublayer as the top layer) CMM coating. The 6‐layer CMM coating with the layer thickness ratio of Ni/Zn–Ni = 0.8:1.2 (λ = 2 µm) has the best corrosion resistance.     

单分散Ni球制备及Ni／NiO的磁性研究

使用微波辅助Poly方法制备了直径范围在100nm～180nm单分散的Ni球，用磁力显微镜（MFM）测其磁结构。进一步对Ni球表面氧化获得了高度球化的NicoreNiOshell结构，采用XRD，TEM，XPS和EDAX对其进行了测量分析，并用VSM和SQUID进一步讨论了铁磁／反铁磁的界面耦合效应。同时，估算了磁性交换偏置耦合场与颗粒尺寸的关系。     

Synthesis,characterisation and properties of Ni/PSZ and Ni/YSZ nanocomposites

Nanocrystalline partially stabilised zirconia (PSZ) and yttria-fully stabilised zirconia (YSZ) powders were prepared by solution combustion process. Nanocrystalline nature of the powders was confirmed by XRD and TEM. Nanocomposite Ni/PSZ and Ni/YSZ films were electrodeposited from a suspension of nanoparticles in nickel sulfamate solution. The strengthening of the nanocomposite due to nanoparticle incorporation was characterised by nanohardness measurements.     

层叠Ni/Ti热扩散形成金属间化合物的规律

选择Ni和Ti粉末及其机械合金化粉末制备Ni/Ti扩散偶,利用扫描电镜和X射线衍射等手段研究了Ni/Ti扩散偶在固相热处理作用下金属间化合物的形成及生长规律.随着热处理温度的提高,Ni3Ti,Ti2Ni和NiTi金属间化合物的数量增加明显;随热处理保温时间的增加,NiTi金属间化合物呈抛物线规律生长,而对Ni3Ti和Ti2Ni的生长影响不大.结果表明,金属间化合物在形成过程中,Ni3Ti和Ti2Ni优先形成,达到一定厚度后,NiTi金属间化合物开始形成并快速增长.     

Microstructure and interface fracture of LPPS Ni／Fe and Cu／Ni sprayed materials

The interfaces of two materials, Ni/Fe and Cu/Ni, deposited by low pressure plasma spraying method,were studied by means of scanning electron microscopy (SEM) and transmission electron microscopy (TEM) combined with energy dispersive X-ray spectroscopy (EDS). The adhesion between coatings and substrates was measured with the aid of Knoop interfacial indentation testing method. The results show that the interfacial micrcstructures have strong influence on the mechanical properties. Cu/Ni interface is weak link with NiO amorphousphase. Ni/Fehave strong in-interracial layer consists primarily of Fe and Ni oxide crystalline phases, containing dispersive (Fe, Ni) spotlike intermetaUic compound phase in nanometer dimension, and the interracial interdiffusion was detected. The micro-mechanism of interracial fracture was discussed.     

轧制中间热处理温度对Ni7W/Ni12W/Ni7W复合基带组织及织构的影响

采用压延辅助双轴织构技术制备了涂层导体用Ni7W/Ni12W/Ni7W复合基带。复合基带轧制形变过程加入3次不同温度的轧制中间热处理优化其形变组织。采用X射线衍射及背散射电子衍射技术分析了复合基带轧制过程中表面及截面的形变及回复组织,以此探索轧制中间热处理温度对Ni7W/Ni12W/Ni7W复合基带形变及立方织构形成过程的影响机制。结果显示,经600S°C/60Smin轧制中间热处理后的复合基带在较低的再结晶温度下获得了95% (<10°)的高立方织构含量。晶体取向分布图表明该中间热处理温度下复合基带回复及初始再结晶组织中立方取向的晶粒含量都更高;不同取向间点对点的晶体取向差分析证实了立方取向晶粒较大的晶界角,这使立方取向在回复及初始再结晶过程具有高的界面迁移率,从而促进了后续再结晶过程强立方织构的形成。     

SAC0307-xNi/Ni焊点的IMC及镍镀层的消耗

利用扫描电镜(SEM)对焊点SAC0307/Ni(Sn-O.3Ag-0.7Cu/Ni)和SAC0307-0.05Ni/Nj(Sn-O.3Ag-0.7Cu-0.05 Ni/Ni)经过180℃老化后的界面金属问化合物(IMC)的微观结构及镍镀层的消耗进行了研究.结果表明,回流焊后,SAC0307/Ni和SAC0307-O.05Ni/Ni焊点的IMC层均为(Cu_(1-x)Ni_x)_6Sn_5,且随着老化时间的延长,IMC层的厚度均逐渐增加,化合物类型没有变化,但IMC的化学组成有所改变.SAC0307-0.05Ni/Ni焊点中IMC层形貌为蠕虫状,厚度比不加镍时有所降低.回流焊后两种钎料焊盘的镍层消耗几乎相同,但老化384h后SAC0307/Ni的焊盘镍层的剩余厚度明显比SAC0307-0.05Ni/Ni的小.因此,钎料中添加适量的镍可以有效地降低焊盘镍层在时效过程中的消耗速率,即显著提高镍焊盘的抗老化能力.

Abstract：

The micrestmcture of interfacial IMC and the consumption of Ni layer for SAC0307/Ni ( Sn-0.3Ag-0.7Cu/Ni ) soldered joint and SAOY307-0.05Ni/Ni (Sn-O. 3Ag-0.7Cu-0.05Ni/Ni) soldered joint after aging at 180℃ were studied by scanning electron microscope( SEM ). The results indicated that the IMC layer of SAC0307/Ni and SAC0307-0.05Ni/Ni are both (Cu_(1-x),Ni_x)_6Sn_5 after reflow soldering. With the increasing of aging time, the thickness of IMC layer increases gradually, the type of IMC is not changed, but the chemical composition changes. The morphology of IMC is stormshaped and the thickness of IMC is much thinner when SAC0307 solder added 0. 05 % Ni is used. The consumption of Ni layer is nearly the same using both solders "after the first time reflow soldering, but the residual thickness of the Ni layer in SACO307/Ni solder is thinner than that in SAC0307-0.05Ni/Ni after aging for 384 h. So solders with a little Ni element can decrease the consumption rate of Ni layer effectively during aging, that is, the aging-resistant abihty of Ni pad is improved obviously.     

Microstructure and magnetic properties of Ti/Ni/Ti in dependence on Ni layer thickness

The films of Ti(15 nm)/Ni(t nm)/Ti(15 nm)(t=20, 30, 40, 50) were prepared by dc magnetron sputtering at room temperature and subsequent annealing at 400 ℃ for 30 min. Scanning probe microscope (SPM), vibrating sample magnetometer (VSM) and X-ray diffraction (XRD) were applied to study the magnetic properties and microstructure. AFM images show that small and uniform grains and some clusters appear with the increase of Ni thickness, also MFM images show that the size of domain first decreases and then increases. The coercivity reaches the maximum 48 kA·m-1 at t=30 nm. The XRD profiles show stronger fcc (111) orientation peak of Ni and weak hcp structure peaks of Ni3Ti. This results reveal that the crystal lines have the prefer orientation and achieve the ordered.     

多孔Ni/CNT/Ni3S2复合薄膜体系的设计及其光热海水淡化性能

目的 针对目前水资源短缺的问题,设计Ni/CNT/Ni₃S₂复合薄膜,并测试其光热海水淡化性能。方法 在多孔Ni网上,采用化学气相沉积(CVD)和水热合成相结合的方法制备Ni/CNT/Ni₃S₂复合薄膜,并构建太阳能蒸发器。利用SEM、TEM对样品的微观形貌进行表征,通过XRD、XPS分析样品的物相组成和表面元素,利用紫外可见近红外光谱分析蒸发器的光吸收能力,通过电感耦合等离子体光发射光谱仪检测海水淡化前后的离子浓度变化。结果 在制备的蒸发器中,Ni/CNT/Ni₃S₂-12蒸发器表现出优异的性能,在整个太阳光谱能吸收90.1%的太阳光。在1个太阳的光照强度下,蒸发速率高达2.57 kg/(m²·h),在不同质量分数的盐溶液中也有很好的蒸发效果。此外,淡化后的海水、污水中的离子浓度达到世界卫生组织对安全饮用水规定的标准。结论 多孔Ni基底具有大孔结构,既能漂浮于水面上实现界面加热,又能提供水的运输通道与蒸汽逸出通道,有很好的耐腐蚀性和...