Analysis of tensile strength and microstructure of Ni–SiC composites prepared by electroforming

Ni–SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath. Tensile strength and microstructure of the composites before and after heat treatment were investigated. The maximum of tensile strength was obtained after heat treatment at 300 °C × 24 h. The values were 641 N/mm² and 701 N/mm² respectively. The complete reaction between nickel and SiC particles can produce shrinkage pores in the interface. The volume of shrinkage pores was equal to 8% of the volume of SiC particles in the composites. The interfacial reaction products were composed of Ni₃Si and a little amount of Ni₃₁Si₁₂ after heat treatment at 600 °C × 24 h. The fracture evolution went though microcracks initiation, growth and coalescence. Cracking of the matrix, debonding of Ni–SiC interfaces and cracking of particles were three types of cracking modes for Ni–SiC composites.     

An investigation of the effect of SiC particle size on Cu–SiC composites

In this study mechanical properties of copper were enhanced by adding 1 wt.%, 2 wt.%, 3 wt.% and 5 wt.% SiC particles into the matrix. SiC particles of having 1 μm, 5 μm and 30 μm sizes were used as reinforcement. Composite samples were produced by powder metallurgy method and sintering was performed in an open atmospheric furnace at 700 °C for 2 h. Optical and SEM studies showed that the distribution of the reinforced particle was uniform. XRD analysis indicated that the dominant components in the sintered composites were Cu and SiC. Relative density and electrical conductivity of the composites decreased with increasing the amount of SiC and increased with increasing SiC particle size. Hardness of the composites increased with both amount and the particle size of SiC particles. A maximum relative density of 98% and electrical conductivity of 96% IACS were obtained for Cu–1 wt.% SiC with 30 μm particle size.     

Sinter-HIP of polymer-derived Al2O3–SiC composites with high SiC contents

Submicrometer Al₂O₃ composites with more than 20 vol.% of SiC particles were produced using a multiple infiltration of porous bodies with a liquid polymer SiC precursor. The fully dense composites were successfully densified using a sinter-HIP process. Parameters of sintering and HIP steps are discussed with respect to both densification and microstructure evolution of the composites. The initial pressure during the sintering step plays an important role for the preparation of fully dense composites with a submicrometer alumina matrix at 1750 °C. Optimized densification schedule of sinter-HIP represents a novel approach of densification at relatively mild conditions compared to previously reported or common densification methods of Al₂O₃–SiC composites with high SiC content, such as pressureless sintering, hot pressing and post-HIPing. The method expands the possibilities for preparation of alumina based composites with SiC volume fraction > 20 vol.%, filling the gap in available literature data.     

Thermal shock behavior of nano-sized SiC particulate reinforced AlON composites

Aluminum oxynitride (AlON) has been considered as a potential ceramic material for high-performance structural and advanced refractory applications. Thermal shock resistance is a major concern and an important performance index of high-temperature ceramics. While silicon carbide (SiC) particles have been proven to improve mechanical properties of AlON ceramic, the high-temperature thermal shock behavior was unknown. The aim of this investigation was to identify the thermal shock resistance and underlying mechanisms of AlON ceramic and 8 wt% SiC–AlON composites over a temperature range between 175 °C and 275 °C. The residual strength and Young's modulus after thermal shock decreased with increasing quenching temperature and thermal shock times due to large temperature gradients and thermal stresses caused by abrupt water-quenching. A linear relationship between the residual strength and thermal shock times was observed in both pure AlON and SiC–AlON composites. The addition of nano-sized SiC particles increased both residual strength and critical temperature from 200 °C in the monolithic AlON to 225 °C in the SiC–AlON composites due to the toughening effect, the lower coefficient of thermal expansion and higher thermal conductivity of SiC. The enhancement of the thermal shock resistance in the SiC–AlON composites was directly related to the change of fracture mode from intergranular cracking along with cleavage-type fracture in the AlON to a rougher fracture surface with ridge-like characteristics, crack deflection, and crack branching in the SiC–AlON composites.     

Enhanced properties of alumina–aluminium titanate composites obtained by spark plasma reaction-sintering of slip cast green bodies

Full dense alumina + 40 vol.% aluminium titanate composites were obtained by colloidal filtration and fast reaction-sintering of alumina/titania green bodies by spark plasma sintering at low temperatures (1250–1400 °C). The composites obtained had near-to-theoretical density (>99%) with a bimodal grain size distribution. Phase development analysis demonstrated that aluminium titanate has already formed at 1300 °C. The mechanical properties such as Vickers hardness, flexural strength and fracture toughness of bulk composites are significantly higher than those reported elsewhere, e.g. the composite sintered at 1350 °C show values of about 24 GPa, 424 MPa and 5.4 MPa m^1/2, respectively. The improved mechanical properties of these composites are attributed to the enhanced densification and the finer and more uniform nanostructure achieved by non-conventional fast sintering of slip-cast dense green compacts.     

Effects of copper addition on the in-situ synthesis of SiC particles in Al–Si–C–Cu system

In this research work, SiC particles have been successfully in-situ synthesized in Al–Si–Cu matrix alloy utilizing a novel liquid–solid reaction method. The effect of copper addition on the synthesis of SiC in Al–Si–C–Cu system was investigated. The composites mainly contain spherical SiC particles and θ-Al₂Cu eutectic phases, which are embedded in the α-Al matrix. Results indicated that the temperature for forming in-situ SiC particles significantly reduced from 750 °C to 700 °C with the copper addition. The size of in-situ synthesized SiC particles can be as low as 0.2 μm. Further study found that the addition of 10 wt.% copper into Al–Si–C alloy causes its solidus temperature to decrease by about 65 °C. Additionally, the Rockwell hardness value of SiCp/Al–18Si–5Cu composites has an average of 92, which is 50% higher than that of the sample without copper addition.     

The dynamic mechanical response of SiC particulate reinforced 2024 aluminum matrix composites

The compression properties of the aluminum alloy 2024 metal matrix composites reinforced with 50 vol.% SiC particles were investigated using Instron testing machine and split Hopkinson pressure bar (SHPB) in this paper. The compression stress–strain curves were obtained at the strain rates ranging from 1 × 10^− 3 to 2.5 × 10³/s. The fracture surfaces were characterized by scanning electron microscopy. The results showed that SiCp/2024 Al composites exhibited high strain-rate sensitivity. The strength of composites tended to increase–decrease with increasing of strain rates. The effect of the strain rate on elongation was also discussed.     

In situ joining of titanium to SiC/Al composites by low pressure infiltration

A method of in situ joining of titanium to SiC/Al composites by low pressure infiltration was proposed. The effect of infiltration temperature on microstructure and bending strength of in situ joining composites was investigated and the best infiltration temperature was confirmed to be 710 °C. The interfacial region of SiC/Al/Ti composites was consisted of Ti substrate, Al–Ti interfacial layer, Al layer and SiC/Al composite. The bending strength of SiC/Al composites kept nearly constant as the infiltration temperature changed while that of SiC/Al/Ti composites was influenced significantly by the infiltration temperature. The fracture occurred at the Al–Ti and Al–SiC/Al interfaces alternately as infiltrated at 670 °C. But as the infiltration temperature was increased to 710 °C, the fracture occurred only at the Al–SiC/Al interface which shows a great interfacial bonding at the Al–Ti interface. The formation of Al–Ti brittle intermetallics and the effect of crystallization and grain coarsening are two possible reasons which lead to the decrease of bending strength when the infiltration temperatures were increased from 710 °C to 730 °C.     

Effect of electroceramic particles on damping behaviour of aluminium hybrid composites produced by ultrasonic cavitation and mechanical stirring

In this study, electroceramics PBN and PLZT along with SiC were included in Al–3.96 wt.% Mg (A514.0) master alloy. Ultrasonic cavitation (UST) and mechanical stirring (MS) were employed to improve wettability and dispersion during casting. Two composite systems were produced: PBN system (5 wt.% PBN + 1 wt.% SiC and 15 wt.% PBN + 1 wt.% SiC) and the PLZT system (follows the same designation). The influence of fabrication method on the microstructures, particle distribution and wettability as well as electroceramic impact on dynamo-mechanical properties of prepared composites were investigated. Optical microscope (OM) and scanning electron microscope (SEM) results indicate that the processing technique was effective as it promoted wettability and homogeneous dispersion of particles throughout the Al matrix. Dynamic mechanical analysis (DMA) study of the composites demonstrated that the addition of the functional particles to the Al alloy matrix improved damping capacity (Tan δ) at 200 °C. The composites exhibited an increase in Tan δ of 24.3 ± 0.3% and 91.4 ± 0.2% for 5 and 15 wt.% PBN + 1 wt.% SiC and an increase of 19.7 ± 0.5% and 42.5 ± 0.3% for 5 and 15 wt.% PLZT + 1 wt.% SiC, respectively, when compared to the aluminium alloy matrix.     

Influence of the microstructure evolution of ZrO2 fiber on the fracture toughness of ZrB2–SiC nanocomposite ceramics

ZrB₂–SiC nanocomposite ceramics toughened by ZrO₂ fiber were fabricated by spark plasma sintering (SPS) at 1700 °C. The content of ZrO₂ fiber incorporated into the ZrB₂–SiC nanocomposites ranged from 5 mass% to 20 mass%. The content, microstructure, and phase transformation of ZrO₂ fiber exhibited remarkable effects on the fracture toughness of the ZrO_2(f)/ZrB₂–SiC composites. Fracture toughness of the composites greatly improved to a maximum value of 6.56 MPa m^1/2 ± 0.3 MPa m^1/2 by the addition of 15 mass% of ZrO₂ fiber. The microstructure of the ZrO₂ fiber exhibited certain alterations after the SPS process, which enhanced crack deflection and crack bridging and affected fracture toughness. Some microcracks were induced by the phase transformation from t-ZrO₂ to m-ZrO₂, which was also an important reason behind the improvement in toughness.     

Effects of high-temperature annealing on the microstructure and properties of C/SiC–ZrB2 composites

C/SiC–ZrB₂ composites prepared via precursor infiltration and pyrolysis (PIP) were treated at high temperatures ranging from 1200 °C to 1800 °C. The mass loss rate of the composites increased with increasing annealing temperature and the flexural properties of the composites increased initially and then decreased reversely. Out of the four samples, the flexural strength and the modulus of the specimen treated at 1400 °C are maximal at 216.9 MPa and 35.5 GPa, suggesting the optimal annealing temperature for mechanical properties is 1400 °C. The fiber microstructure evolution during high-temperature annealing would not cause the decrease of fiber strength, and moderate annealing temperature enhanced the thermal stress whereas weakened the interface bonding, thus boosting the mechanical properties. However, once the annealing temperature exceeded 1600 °C, element diffusion and carbothermal reduction between ZrO₂ impurity and carbon fibers led to fiber erosion and a strong interface, jeopardizing the mechanical properties of the composites. The mass loss rate and linear recession rate of composites treated at 1800 °C are merely 0.0141 g/s and 0.0161 mm/s, respectively.     

The preparation and mechanical properties of carbon–carbon/lithium–aluminum–silicate composite joints

Silica carbide modified carbon cloth laminated C–C composites have been successfully joined to lithium–aluminum–silicate (LAS) glass–ceramics using magnesium–aluminum–silicate (MAS) glass–ceramics as interlayer by vacuum hot-press technique. The microstructure, mechanical properties and fracture mechanism of C–C/LAS composite joints were investigated. SiC coating modified the wettability between C–C composites and LAS glass–ceramics. Three continuous and homogenous interfaces (i.e. C–C/SiC, SiC/MAS and MAS/LAS) were formed by element interdiffusions and chemical reactions, which lead to a smooth transition from C–C composites to LAS glass–ceramics. The C–C/LAS joints have superior flexural property with a quasi-ductile behavior. The average flexural strength of C–C/LAS joints can be up to 140.26 MPa and 160.02 MPa at 25 °C and 800 °C, respectively. The average shear strength of C–C/LAS joints achieves 21.01 MPa and the joints are apt to fracture along the SiC/MAS interface. The high retention of mechanical properties at 800 °C makes the joints to be potentially used in a broad temperature range as structural components.     

High-temperature dielectric and electromagnetic interference shielding properties of SiCf/SiC composites using Ti3SiC2 as inert filler

Ti₃SiC₂ filler has been introduced into SiC_f/SiC composites by precursor infiltration and pyrolysis (PIP) process to optimize the dielectric properties for electromagnetic interference (EMI) shielding applications in the temperatures of 25–600 °C at 8.2–12.4 GHz. Results indicate that the flexural strength of SiC_f/SiC composites is improved from 217 MPa to 295 MPa after incorporating the filler. Both the complex permittivity and tan δ of the composites show obvious temperature-dependent behavior and increase with the increasing temperatures. The absorption, reflection and total shielding effectiveness of the composites with Ti₃SiC₂ filler are enhanced from 13 dB, 7 dB and 20 dB to 24 dB, 21 dB and 45 dB respectively with the temperatures increase from 25 °C to 600 °C. The mechanisms for the corresponding enhancements are also proposed. The superior absorption shielding effectiveness is the dominant EMI shielding mechanism. The optimized EMI shielding properties suggest their potentials for the future shielding applications at temperatures from 25 °C to 600 °C.     

Effects of polymer derived SiC interphase on the properties of C/ZrC composites

Polymer derived silicon carbide (SiC) interphase was introduced by precursor infiltration and pyrolysis (PIP) to prevent carbon fiber erosion and to improve the fiber–matrix interface bonding of C/ZrC composites prepared by PIP. Introducing SiC interphase increased the density of the composites. The SiC interphase not only protected carbon fibers effectively from erosion by carbo-thermal reduction, but also enhanced the mechanical properties of C/ZrC composites by strengthening the interface bond. The flexural strength and fracture toughness of C/ZrC composites with SiC interphase prepared by two PIP cycles were 319 MPa and 18.8 MPa m^1/2 respectively. The ablation properties of C/ZrC composites were with rising content of SiC interphase but then decreased when excessive. The mass loss rate and the linear recession rate of the C/ZrC composites with SiC interphase prepared by one PIP cycle were 0.0079 g/s and 0.0084 mm/s, respectively.     

Preparation and thermal performance analysis of novel multilayer cladding structure composites

With regard to the adiabatic principle of insulation, a novel multilayer cladding structure composites (MCSC) with vacuum inside was put forward, which could be used in high temperature insulation field. In the composites, SiO₂ was used to fill the microcracks and protect the carbon matrix from oxidizing. This novel material was composed of two parts, one was the core material consisted of SiC foam ceramic, the other was the flawless outer shell consisted of carbon fiber reinforced composites with vacuum inside that produced by Chemical Vapor Infiltration (CVI) Pyrolytic Carbon (PyC) and silicasol-infiltration–sintering methods. Material density was 0.81 g/cm³. The effective thermal conductivity of MCSC ranged from 0.193 W/m · K to 0.721 W/m · K within the temperature from 303 K to 703 K, which was 13.5–23.3% lower than the value of SiC ceramic foam core materials. However, at 1473 K, the measured data of MCSC and SiC foam were 1.815 W/m · K and 1.911 W/m · K, respectively. It was only 5.02% lower than that of SiC foam.     

Effect of metalloid silicon addition on densification,microstructure and thermal–physical properties of Al/diamond composites consolidated by spark plasma sintering

Aluminum matrix composites reinforced with diamond particles were consolidated by spark plasma sintering. Metalloid silicon was added (Al–Si/diamond composites) to investigate the effect. Silicon addition promotes the formation of molten metal during the sintering to facilitate the densification and enhance the interfacial bonding. Meanwhile, the alloying metal matrix precipitates the eutectic-Si on the diamond surfaces acting as the transitional part to protect the improved interface during the cooling stage. The improved interface and precipitating eutectic-Si phase are mutually responsible for the optimized properties of the composites. In this study, for the Al–Si/diamond composite with 55 vol.% diamonds of 75 μm diameter, the thermal conductivity increased from 200 to 412 Wm⁻¹ K⁻¹, and the coefficient of thermal expansion (CTE) decreased from 8.9 to 7.3 × 10⁻⁶ K⁻¹, compared to the Al/diamond composites. Accordingly, the residual plastic strain was 0.10 × 10⁻³ during the first cycle and rapidly became negligible during the second. Additionally, the measured CTE of the Al–Si/diamond composites was more conform to the Schapery’s model.     

The synthesis of nanocrystalline YIG in an ammonium nitrate melt

Yttrium iron garnet particles were synthesized in two different ways: first, in an ammonium nitrate melt (ANM) and second, via a solid-state reaction (SSR) route. The structural and magnetic properties of the samples were compared using XRD, SEM and dc magnetization measurements. It was observed for the ANM technique that the phase formation of YIG starts at 1000 °C and then develops with increasing temperature and sintering times. The saturation magnetization, M_s, increases sharply with increasing annealing temperature and then saturates at around 23 emu g^?1 above 1100 °C, while the coercivity decreases due to the increasing particle size. An almost single-phase sample was obtained through ANM route by annealing for 2 h at 1300 °C, after which the YIG fraction in the SSR sample was only 0.34, with M_s = 7.08 emu g^?1. The average particle sizes of the ANM samples were calculated using experimentally determined M_s values. It appeared that they vary from the sub-micron to the micron range, depending on the sintering temperature, and this coincides with the values determined from the SEM micrographs. These samples have homogeneous structures, small grains, good magnetic properties, and do not contain massive agglomerates. Therefore, the synthesis of YIG via the ANM technique represents another alternative to the SSR route.     

Preparation,phase structure and microwave dielectric properties of CoLi2/3Ti4/3O4 ceramic

A new low loss microwave dielectric ceramic with composition of CoLi_2/3Ti_4/3O₄ was prepared by a conventional solid-state reaction method. The compound has a cubic spinel structure [Fd-3m (227)] similar to MgFe₂O₄ with lattice parameters of a = 8.3939 Å, V = 591.42 Å³, Z = 8 and ρ = 4.30 g/cm³. This ceramic has a low sintering temperature (～1050 °C) and good microwave dielectric properties with relative permittivity of 21.4, Q × f value of 35,000 GHz and τ_f value of ?22 ppm/°C. Furthermore, the addition of BaCu(B₂O₅) (BCB) can effectively lower the sintering temperature from 1050 °C to 900 °C and does not induce much degradation of the microwave dielectric properties. Compatibility with Ag electrode indicates that the BCB added CoLi_2/3Ti_4/3O₄ ceramics are good candidates for LTCC applications.     

Sol–gel derived Cr(III) and Cu(II)/γ-Al2O3 doped solids: Effect of the dopant precursor nature on the structural,textural and morphological properties

Powders of xerogel γ-Al₂O₃ doped with various concentrations of Cr³⁺ and Cu²⁺ (M/M + Al molar fraction = 0.75–10%) were prepared via a sol–gel method. Cr³⁺ and Cu²⁺ precursors (acetylacetonate, nitrate or chloride) were added to 0.12 M 2-propanol solution of aluminum tri-sec-butoxide (ASB) and hydrolysis was performed using a H₂O/ASB molar ratio of 4.7. The effect of the dopant precursor on structural, textural and morphological properties was studied. Employing acac precursors resulted in unique properties after calcination at 500 °C including high surface areas, as high as 455 m²/g, homogeneous mesopores, 3–12 nm, and amorphous powders (5–10 nm particles in diameter). On the other hand, the acac precursor enhanced the resistance to sintering mainly at higher metal loads (10%) and elevated temperature (800 °C). Nevertheless, the solids issued from nitrate and chloride precursors exhibited lower surface areas at high metal loads, and lower resistance to sintering.     

An innovative process to fabricate copper/diamond composite films for thermal management applications

Diamond dispersed copper matrix (Cu/D) composite films with strong interfacial bonding were produced by tape casting and hot pressing without carbide forming additives. The tape casting process offers an original solution to obtain laminated materials with accurate thickness control, smooth surface finish, material net-shaping, scalability, and low cost. This study presents an innovative process of copper submicronic particles deposition onto diamond reinforcements prior to densification by hot pressing. Copper particles act as chemical bonding agents between the copper matrix and the diamond reinforcements during hot pressing, thus offering an alternative solution to traditionnal carbide-forming materials in order to get efficient interfacial bonding and heat-transfer in Cu/D composites. It allows high thermal performances with low content of diamond, thus enhancing the cost-effectiveness of the materials. Microstructural study of composites by scanning electron microscopy (SEM) was correlated with thermal conductivity and thermal expansion coefficient measurements. The as-fabricated films exhibit a thermal conductivity of 455 W m^?1 K^?1 associated to a coefficient of thermal expansion of 12 × 10^?6 °C^?1 and a density of 6.6 g cm^?3 with a diamond volume fraction of 40%, which represents a strong enhancement relative to pure copper properties (λ_Cu = 400 W m^?1 K^?1, α_Cu = 17 × 10^?6 °C^?1, ρ_Cu = 8.95 g cm^?3). The as-fabricated composite films might be useful as heat-spreading layers for thermal management of power electronic modules.