High thermal conductivity of flexible polymer composites due to synergistic effect of multilayer graphene flakes and graphene foam

Research on flexible thermal interface materials (TIMs) has shown that the interconnected network of graphene foam (GF) offers effective paths of heat transportation. In this work, a variant amount of multilayer graphene flakes (MGFs) was added into 0.2 vol% GF/polydimethylsiloxane (PDMS) composite. A remarkable synergistic effect between MGF and GF in improving thermal conductivity of polymer composites is achieved. With 2.7 vol% MGFs, the thermal conductivity of MGF/GF/PDMS composite reaches 1.08 W m⁻¹ K⁻¹, which is 80%, 184% and 440% higher than that of 2.7 vol% MGF/PDMS, GF/PDMS composites and pure PDMS, respectively. The MGF/GF/PDMS composite also shows superior thermal stability. The addition of MGFs and GF decreases slightly the elongation at break, but observably increases the Young’s modulus and tensile strength of composites compared with pure PDMS. The good performance of MGF/GF/PDMS composite makes it a good TIM for possible application in thermal management of electronics.     

Enhanced conductivity behavior of polydimethylsiloxane (PDMS) hybrid composites containing exfoliated graphite nanoplatelets and carbon nanotubes

Polydimethylsiloxane (PDMS) hybrid composites consisting of exfoliated graphite nanoplatelets (xGnPs) and multiwalled carbon nanotubes functionalized with hydroxyl groups (MWCNTs-OH) were fabricated, and the effects of the xGnP/MWCNT-OH ratio on the thermal, electrical, and mechanical properties of polydimethylsiloxane (PDMS) hybrid composites were investigated. With the total filler content fixed at 4 wt%, a hybrid composite consisting of 75% × GnP/25% MWCNT-OH showed the highest thermal conductivity (0.392 W/m K) and electrical conductivity (1.24 × 10⁻³ S/m), which significantly exceeded the values shown by either of the respective single filler composites. The increased thermal and electrical conductivity found when both fillers are used in combination is attributed to the synergistic effect between the fillers that forms an interconnected hybrid network. In contrast, the various different combinations of the fillers only showed a modest effect on the mechanical behavior, thermal stability, and thermal expansion of the PDMS composite.     

Thermal conductivity of Cu–Zr/diamond composites produced by high temperature–high pressure method

Copper matrix composites reinforced with about 90 vol.% of diamond particles, with the addition of zirconium to copper matrix, were prepared by a high temperature–high pressure method. The Zr content was varied from 0 to 2.0 wt.% to investigate the effect on interfacial microstructure and thermal conductivity of the Cu–Zr/diamond composites. The highest thermal conductivity of 677 W m⁻¹ K⁻¹ was achieved for the composite with 1.0 wt.% Zr addition, which is 64% higher than that of the composite without Zr addition. This improvement is attributed to the formation of ZrC at the interface between copper and diamond. The variation of thermal conductivity of the composites was correlated to the evolution of interfacial microstructure with increasing Zr content.     

Effects of poly(oxyethylene)-block structure in polyetheramines on the modified carbon nanotube/poly(lactic acid) composites

The hybrids of multi-walled carbon nanotube and poly(lactic acid) (MWCNT/PLA) were prepared by a melt-blending method. In order to enhance the compatibility between the PLA and MWCNTs, the surface of the MWCNTs was covalently modified by Jeffamine® polyetheramines by functionalizing MWCNTs with carboxylic groups. Different molecular weights and hydrophilicity of the polyethermaines were grafted onto MWCNTs with the assistance of a dehydrating agent. The results showed that low-molecular-weight Jeffamine® polyetheramine modified MWCNTs can effectively improve the thermal properties of PLA composites. On the other hand, high-molecular-weight and poly(oxyethylene)-segmented polyetheramine could render the modified MWCNTs of well dispersion in PLA, and consequently affecting the improvements of mechanical properties and conductivity of composite materials. With the addition of 3.0 wt% MWCNTs, the increment of E′ of the composite at 40 °C was 79%. For conductivity, the surface resistivity decreased from 1.27 × 10¹² Ω/sq for neat PLA to 8.30 × 10⁻³ Ω/sq for the composites.     

Study on thermal properties of graphene foam/graphene sheets filled polymer composites

The polymer composites composed of graphene foam (GF), graphene sheets (GSs) and pliable polydimethylsiloxane (PDMS) were fabricated and their thermal properties were investigated. Due to the unique interconnected structure of GF, the thermal conductivity of GF/PDMS composite reaches 0.56 W m⁻¹ K⁻¹, which is about 300% that of pure PDMS, and 20% higher than that of GS/PDMS composite with the same graphene loading of 0.7 wt%. Its coefficient of thermal expansion is (80–137) × 10⁻⁶/K within 25–150 °C, much lower than those of GS/PDMS composite and pure PDMS. In addition, it also shows superior thermal and dimensional stability. All above results demonstrate that the GF/PDMS composite is a good candidate for thermal interface materials, which could be applied in the thermal management of electronic devices, etc.     

Enhanced thermal conductivity and dielectric properties of Al/β-SiCw/PVDF composites

Polymeric composites with high thermal conductivity, high dielectric permittivity but low dissipation factor have wide important applications in electronic and electrical industry. In this study, three phases composites consisting of poly(vinylidene fluoride) (PVDF), Al nanoparticles and β-silicon carbide whiskers (β-SiC_w) were prepared. The thermal conductivity, morphological and dielectric properties of the composites were investigated. The results indicate that the addition of 12 vol% β-SiC_w not only improves the thermal conductivity of Al/PVDF from 1.57 to 2.1 W/m K, but also remarkably increases the dielectric constant from 46 to 330 at 100 Hz, whereas the dielectric loss of the composites still remain at relatively low levels similar to that of Al/PVDF at a wider frequency range from 10⁻¹ Hz to 10⁷ Hz. With further increasing the β-SiC_w loading to 20 vol%, the thermal conductivity and dielectric constant of the composites continue to increase, whereas both the dielectric loss and conductivity also rise rapidly.     

Growing polystyrene chains from the surface of graphene layers via RAFT polymerization and the influence on their thermal properties

The polystyrene (PS) macromolecular chains were grafted on the surface of graphene layers by reversible addition-fragmentation chain transfer (RAFT) polymerization. In this procedure, a RAFT agent, 4-Cyano-4-[(dodecylsulfanylthiocarbonyl) sulfanyl] pentanoic acid, was used to functionalize the thermal reduced graphene oxide (TRGO) to obtain the precursor (TRGO-RAFT). It can be calculated that the grafting density of PS/graphene (PRG) composites was about 0.18 chains per 100 carbons. Successful in-plain attachment of RAFT agent to TRGO and PS chain to TRGO-RAFT was shown an influence on the thermal property of the PRG composites. The thermal conductivity (λ) improved from 0.150 W m⁻¹ K⁻¹ of neat PS to 0.250 W m⁻¹ K⁻¹ of PRG composites with 10 wt% graphene sheets loading. The thermal property of PRG composites increased due to the homogeneous dispersion and ordered arrangement of graphene sheets in PS matrix and the formation of PRG composites.     

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Cu/diamond composites were fabricated by spark plasma sintering (SPS) after the surface pretreatment of the diamond powders, in which the diamond particles were mixed with copper powder and tungsten powder (carbide forming element W). The effects of the pretreatment temperature and the diamond particle size on the thermal conductivity of diamond/copper composites were investigated. It was found that when 300 μm diamond particles and Cu–5 wt.% W were mixed and preheated at 1313 K, the composites has a relatively higher density and its thermal conductivity approaches 672 W (m K)⁻¹.     

Transparent and flexible cellulose nanofibers/silver nanowires/acrylic resin composite electrode

In this study, we report a novel, eco-friendly and simple method to fabricate cellulose nanofibers (CNFs)/silver nanowires (AgNWs)/acrylic resin (AR) composite electrode. CNFs with average diameter of 15 nm were disintegrated only by one time-pass grinding. Aqueous dispersion of AgNWs was embedded onto the surface of CNFs film by simple vacuum filtration. The final composite electrode was obtained by impregnating CNFs/AgNWs film to AR with the assist of adhesive tape. This electrode with AgNWs density of 134 mg/m² showed low sheet resistance (4 Ω/sq), and high light transmittance (85%) which was 6% lower than that of neat AR. The coefficient of thermal expansion of the composite electrode was as low as 25.32 ppm K⁻¹. The tensile strength and Young’s modulus of CNFs/AgNWs/AR composite film were 35.71 MPa and 1.63 GPa, which were about 8 and 5.8 times larger than neat AR film, respectively.     

Fabrication of a polymer composite with high thermal conductivity based on sintered silicon nitride foam

A novel route was developed to fabricate Si₃N₄/epoxy composite. In this route, the Si₃N₄ particles were constructed into the foamed shape by using protein foaming method, firstly. Then the Si₃N₄ foams were sintered to bond these Si₃N₄ particles together. Finally, the Si₃N₄/epoxy composite was fabricated by infiltrating the epoxy resin solution into the sintered Si₃N₄ foams. This route was proved to be an efficient way in enhancing the thermal conductivity of epoxy matrix at a low loading fraction. For example, the thermal conductivity of the as-prepared Si₃N₄/epoxy composite with a loading fraction of 22.2 vol% was up to 3.89 W m⁻¹ K⁻¹, which was about 17 times higher than that of neat epoxy.     

Thermal conductivity of carbon nanotube reinforced aluminum composites: A multi-scale study using object oriented finite element method

In this study, object oriented finite element method (OOF) has been utilized to compute the thermal conductivity of plasma sprayed Al-12 wt.% Si containing 10 wt.% multiwall carbon nanotubes (CNTs). The computations have been made at micro- and macro-length scales which highlight the effect of CNT dispersion on thermal conductivity. Experimentally measured values at 50 °C indicate that CNT addition reduced the thermal conductivity of Al–Si matrix from 73 W m⁻¹ K⁻¹ to 25.4 W m⁻¹ K⁻¹ which is attributed to the presence of CNT clusters. OOF calculations at micro-length scale predicted an 81% increase in the conductivity of Al–Si matrix due to presence of well dispersed CNTs inside the matrix. At larger lengths scale, the decrease in the overall conductivity is related to the extremely low conductivity of CNT clusters. Thermal conductivity of CNT clusters could be up to three orders of magnitude lower than individual CNTs. OOF computed values match well with experimental results. OOF compute thermal conductivity of Al–CNT composite is also compared with theoretical two-phase models for CNT-composites at different length scales.     

Highly conductive graphene oxide/polyaniline hybrid polymer nanocomposites with simultaneously improved mechanical properties

Graphene oxide (GO) was added to a polymer composites system consisting of surfactant-wrapped/doped polyaniline (PANI) and divinylbenzene (DVB). The nanocomposites were fabricated by a simple blending, ultrasonic dispersion and curing process. The new composites show higher conductivity (0.02–9.8 S/cm) than the other reported polymer system filled with PANI (10⁻⁹–10⁻¹ S/cm). With only 0.45 wt% loading of GO, at least 29% enhancement in electric conductivity and 29.8% increase in bending modulus of the composites were gained. Besides, thermal stability of the composites was also improved. UV–Vis spectroscopy, X-ray diffraction analysis (XRD) and scanning electron microscopy (SEM) revealed that addition of GO improves the dispersion of PANI in the polymer composite, which is the key to realize high conductivity.     

Polysaccharidic binders for the conception of an insulating agro-composite

The objective of this study is the formulation of a natural polysaccharidic binder for the conception of an insulating bio-based composite made with sunflower stalk particles. The formulation was performed using chitosan cross-linked with Genipin and mixed with alginate, guar gum and starch. A fractional factorial experimental design within 32 essays was established to find the formulation leading to composites with the best combination between good mechanical properties and limited amount of chitosan in the binder. Composites with a thermal conductivity (κ) of 0.07 W m⁻¹ K⁻¹ and a maximum tensile stress (σ_max) of 0.2 MPa were obtained with a total binder ratio of 5.5% (w/w). The results of this study show that the insulating bio-based composites evaluated have competitive mechanical and thermal performances compared with other eco-friendly insulating materials available on the market.     

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D–2D SiC_NWs-GSs) hybrid fillers were successfully prepared. The PI/SiC_NWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiC_NWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt% fillers loading, increased by 138% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young’s modulus of PI composites are remarkably improved in comparison with that of the neat PI.     

Enhanced thermal conductivity of Cu matrix composites reinforced with Ag-coated β-Si3N4 whiskers

Cu matrix composites reinforced with 10 vol.% Ag-coated β-Si₃N₄ whiskers (ASCMMCs) were prepared by powder metallurgy method. With the aim of improving the thermal conductivity of the composites, a quite thin Ag layer was deposited on the surface of β-Si₃N₄ whiskers. The results indicated that thermal conductivity of ASCMMCs with 0.30 vol.% Ag (0.30ASCMMCs) reached up to 273 W m⁻¹ K⁻¹ at 25 °C, which was 98 W m⁻¹ K⁻¹ higher than that of Cu matrix composites reinforced with uncoated β-Si₃N₄ whiskers (USCMMCs). The Ag coating could promote the densification of composites, reduce the aggregation of β-Si₃N₄ whiskers and enhance the Cu/Si₃N₄ interfacial bonding, therefore it could efficiently enhance the thermal conductivity of Cu matrix composites reinforced with β-Si₃N₄ whiskers (SCMMCs).     

Aramid fibers reinforced silica aerogel composites with low thermal conductivity and improved mechanical performance

Aramid fibers reinforced silica aerogel composites (AF/aerogels) for thermal insulation were prepared successfully under ambient pressure drying. The microstructure showed that the aramid fibers were inlaid in the aerogel matrix, acting as the supporting skeletons, to strengthen the aerogel matrix. FTIR revealed AF/aerogels was physical combination between aramid fibers and aerogel matrix without chemical bonds. The as prepared AF/aerogels possessed extremely low thermal conductivity of 0.0227 ± 0.0007 W m⁻¹ K⁻¹ with the fiber content ranging from 1.5% to 6.6%. Due to the softness, low density and remarkable mechanical strength of aramid fibers and the layered structure of the fiber distribution, the AF/aerogels presented nice elasticity and flexibility. TG–DSC indicated the thermal stability reaching approximately 290 °C, can meet the general usage conditions, which was mainly depended on the pure silica aerogels. From mentioned above, AF/aerogels present huge application prospects in heat preservation field, especially in piping insulation.     

Graphene woven fabric-reinforced polyimide films with enhanced and anisotropic thermal conductivity

Due to the growing needs of thermal management in modern electronics, polyimide-based (PI) composites are increasingly demanded in thermal interface materials (TIMs). Graphene woven fabrics (GWFs) with a mesh structure have been prepared by chemical vapor deposition and used as thermally conductive filler. With the incorporation of 10-layer GWFs laminates (approximate 12 wt%), the in-plane thermal conductivity of GWFs/PI composite films achieves 3.73 W/mK, with a thermal conductivity enhancement of 1418% compared to neat PI. However, the out-of-plane thermal conductivity of the composites is only 0.41 W/mK. The in-plane thermal conductivity exceeds its out-of plane counterpart by over 9 times, indicating a highly anisotropic thermal conduction of GWFs/PI composites. The thermal anisotropy and the enhanced in-plane thermal conductivity can be attributed to the layer-by-layer stacked GWFs network in PI matrix. Thus, the GWFs-reinforced polyimide films are promising for use as an efficient heat spreader for electronic cooling applications.     

Enhancement of fracture toughness,mechanical and thermal properties of rubber/epoxy composites by incorporation of graphene nanoplatelets

Carboxyl terminated butadiene acrylonitrile (CTBN) was added to epoxy resins to improve the fracture toughness, and then two different lateral dimensions of graphene nanoplatelets (GnPs), nominally <1 μm (GnP-C750) and 5 μm (GnP-5) in diameter, were individually incorporated into the CTBN/epoxy to fabricate multi-phase composites. The study showed that GnP-5 is more favorable for enhancing the properties of CTBN/epoxy. GnPs/CTBN/epoxy ternary composites with significant toughness and thermal conductivity enhancements combined with comparable stiffness to that of the neat resin were successfully achieved by incorporating 3 wt.% GnP-5 into 10 wt.% CTBN modified epoxy resins. According to the SEM investigations, GnP-5 debonding from the matrix is suppressed due to the presence of CTBN. Nevertheless, apart from rubber cavitation and matrix shear banding, additional active toughening mechanisms induced by GnP-5, such as crack deflection, layer breakage and separation/delamination of GnP-5 layers contributed to the enhanced fracture toughness of the hybrid composites.     

Synergistic effect of hybrid graphene nanoplatelet and multi-walled carbon nanotube fillers on the thermal conductivity of polymer composites and theoretical modeling of the synergistic effect

We found that the thermal conductivity of polymer composites was synergistically improved by the simultaneous incorporation of graphene nanoplatelet (GNP) and multi-walled carbon nanotube (MWCNT) fillers into the polycarbonate matrix. The bulk thermal conductivity of composites with 20 wt% GNP filler was found to reach a maximum value of 1.13 W/m K and this thermal conductivity was synergistically enhanced to reach a maximum value of 1.39 W/m K as the relative proportion of MWCNT content was increased but the relative proportion of GNP content was decreased. The synergistic effect was theoretically estimated based on a modified micromechanics model where the different shapes of the nanofillers in the composite system could be taken into account. The waviness of the incorporated GNP and MWCNT fillers was found to be one of the most important physical factors determining the thermal conductivity of the composites and must be taken into consideration in theoretical calculations.     

Electrostatic self-assembled carbon nanotube/nano carbon black composite fillers reinforced cement-based materials with multifunctionality

Electrostatic self-assembled carbon nanotube (CNT)/nano carbon black (NCB) composite fillers are added into cement mortar to fabricate smart cement-based materials. The grape bunch structure of CNT/NCB composite fillers is beneficial for dispersing CNT/NCB in cement mortar matrix and achieving cooperative improvement effect. The mechanical, electrically conductive, and piezoresistive behaviors of the cement mortar are investigated. The CNT/NCB composite fillers can effectively enhance the flexural strength and electrical conductivity of cement mortars, and endow stable and sensitive piezoresistivity to cement mortar at a low filler content. However, they weaken the compressive strength of cement mortar to some extent. The percolation threshold zone of cement mortar with CNT/NCB composite fillers ranges in the amount of 0.39–1.52 vol.%. The optimal content of CNT/NCB composite fillers is 2.40 vol.% for piezoresistivity and the stress and strain sensitivities can reach 2.69% MPa⁻¹ and 704, respectively.