A 6-ns ECL 100 K I/O and 8-ns 3.3-V TTL I/O 4-Mb BiCMOS SRAM

The authors report a 4 M word×1 b/1 M word×4 b BiCMOS SRAM that can be metal mask programmed as either a 6-ns access time for an ECL 100 K I/O interface to an 8-ns access time for a 3.3-V TTL I/O interface. Die size is 18.87 mm×8.77 mm. Memory cell size is 5.8 μm×3.2 μm. In order to achieve such high-speed address access times the following technologies were developed: (1) a BiCMOS level converter that directly connects the ECL signal level to the CMOS level; (2) a high-speed BiCMOS circuit with low threshold voltage nMOSFETs; (3) a design method for determining the optimum number of decoder gate stages and the optimum size of gate transistors; (4) high-speed bipolar sensing circuits used at 3.3-V supply voltage; and (5) 0.55-μm BiCMOS process technology with a triple-well structure     

A 0.65-ns, 72-kb ECL-CMOS RAM macro for a 1-Mb SRAM

An ultrahigh-speed 72-kb ECL-CMOS RAM macro for a 1-Mb SRAM with 0.65-ns address-access time, 0.80-ns write-pulse width, and 30.24-μm ² memory cells has been developed using 0.3-μm BiCMOS technology. Two key techniques for achieving ultrahigh speed are an ECL decoder/driver circuit with a BiCMOS inverter and a write-pulse generator with a replica memory cell. These circuit techniques can reduce access time and write-pulse width of the 72-kb RAM macro to 71% and 58% of those of RAM macros with conventional circuits. In order to reduce crosstalk noise for CMOS memory-cell arrays driven at extremely high speeds, a twisted bit-line structure with a normally on MOS equalizer is proposed. These techniques are especially useful for realizing ultrahigh-speed, high-density SRAM's, which have been used as cache and control storages in mainframe computers     

Full-swing Schottky BiCMOS/BiNMOS and the effects of operatingfrequency and supply voltage scaling

Novel full-swing BiCMOS/BiNMOS logic circuits which use Schottky diode in the pull-up section for low supply-voltage regime are developed. The full-swing pull-up operation is performed by saturating the bipolar transistor with a base current pulse. After which, the base is isolated and bootstrapped to a voltage higher than V_DD. The BiCMOS/BiNMOS circuits do not require a PNP bipolar transistor. They outperform other BiCMOS circuits at low supply voltage, particularly at 2 V using 0.5 μm BiCMOS technology. Delay, area, and power dissipation comparisons have been performed. The new circuits offer delay reduction at 2 V supply voltage of 37% to 56% over CMOS. The minimum fanout at which the new circuits outperform CMOS gate is 2 to 3. Furthermore, the effect of the operating frequency on the delay of a wide range of BiCMOS and BiNMOS circuits is reported for the first time, showing the superiority of the Schottky circuits     

New full-voltage-swing BiCMOS buffers

Circuit techniques are presented for increasing the voltage swing of BiCMOS buffers through active charging and discharging using complementary bipolar drivers. These BiCMOS circuits offer near rail-to-rail output voltage swing, higher noise margins, and higher speed of operation at scaled-down power supply voltages. The circuits are simulated and compared to BiCMOS and CMOS buffers. The comparison shows that the conventional BiCMOS and the complementary BiCMOS buffers are efficient for power supply voltages greater than 3V and that if the power supply voltage is scaled down (<3 V) and the load capacitance is large (>1 pF), the complementary BiCMOS buffers would be the most suitable choice. They provide high speed and low delay to load sensitivity and high noise margins. The first implementation is favorable near a 2.5-V power supply for its smaller area     

3.3-V BiCMOS current-mode logic circuits for high-speed adders

New high-speed BiCMOS current mode logic (BCML) circuits for fast carry propagation and generation are described. These circuits are suitable for reduced supply voltage of 3.3-V. A 32-b BiCMOS carry select adder (CSA) is designed using 0.5-μm BiCMOS technology. The BCML circuits are used for the correct carry path for high-speed operation while the rest of the adder is implemented in CMOS to achieve high density and low power dissipation. Simulation results show that the BiCMOS CSA outperforms emitter coupled logic (ECL) and CMOS adders     

A single-power-supply 10-b video BiCMOS sample-and-hold IC

A +5-V single-power-supply 10-b video BiCMOS sample-and-hold IC is described. Video speed, low power, and 10-b accuracy sample-and-hold operation have been achieved using a complementary connected buffer format sample switch. A high-speed p-n-p transistor used in the sample switch is formed by a combination of n-p-n and PMOS transistors. The sample-and-hold operation is accomplished by feeding back the hold capacitor voltage to the sample switch inputs, so that the inputs transfer symmetrically for the hold capacitor voltage at any input level. The sample-and-hold IC has been implemented in 1.2-μm BiCMOS technology and evaluated. The following results have been obtained: 185-MHz 3-dB bandwidth at 22-pF hold capacitor, 63-dB signal-to-noise ratio at 8-MHz full-scale input, 20-ns acquisition time at 1-V step input, 15-ns switch setting time, and 0.1% linearity error. Power dissipation is 150 mW     

3.3-V BiCMOS circuit techniques for a 120-MHz RISC microprocessor

This paper describes 3.3-V BiCMOS circuit techniques for a 120-MHz RISC microprocessor. The processor is implemented in a 0.5-μm BiCMOS technology with 4-metal-layer structure. The chip includes a 240 MFLOPS fully pipelined 64-b floating point datapath, a 240-MIPS integer datapath, and 24 KB cache, and contains 2.8 million transistors. The processor executes up to four operations at 120 MHz and dissipates 17 W. Novel BiCMOS circuits, such as a 0.6-ns single-ended common base sense amplifier, a 0.46-ns 22-b comparator, and a 0.7-ns path logic adder are applied to the processor. The processor with the proposed BiCMOS circuits has a 11%-47% shorter delay time advantage over a CMOS microprocessor     

A 6-ns, 1.5-V, 4-Mb BiCMOS SRAM

A 0.3-μm 4-Mb BiCMOS SRAM with a 6-ns access time at a minimum supply voltage of 1.5 V has been developed. Circuit technologies contributing to the low-voltage, high-speed operations include: (1) boost-BiNMOS gates for address decoding circuits; (2) an optimized word-boost technique for a highly-resistive-load memory cell; (3) a stepped-down CML cascoded bipolar sense amplifier; (4) optimum boost-voltage detection circuits with dummies for boost-voltage generators     

Merged BiCMOS logic to extend the CMOS/BiCMOS performance crossoverbelow 2.5-V supply

The authors discuss the merged BiCMOS (MBiCMOS) gate, a unique circuit configuration to improve BiCMOS gate performance at low supply voltages. MBiCMOS maintains a measured delay and power-delay advantage over CMOS into the 2-V supply range, in a simple four-device gate that does not require any change in the standard BiCMOS processing sequence. In a 2-μm technology, MBiCMOS outperforms CMOS down to a 2.6-V supply. Gates designed for fabrication in a 0.5-μm technology and simulated using measured device parameters indicate that MBiCMOS can be used to extend the performance crossover voltage to below 2 V in the submicrometer regime. A full-swing version of the MBiCMOS gate (FS-MBiCMOS) is introduced. Simulations of 2-μm gates show FS-MBiCMOS/CMOS performance crossover voltages of 2.2 V     

Design of a 1.5 V full-swing bootstrapped BiCMOS logic circuit

A low voltage full-swing BiCMOS bootstrapping technique that allows the design of BiCMOS logic circuits at supply voltages down to 1.5 V is presented. This is the first 1.5-V design technique that does not require complementary bipolar devices. The technique is shown to have significant advantages over existing low voltage BiCMOS logic designs in sub-3 V operation. Inverter gates fabricated using a 0.8-μm technology were operated at 150 MHz with a supply voltage of 1.5 V. Implementation of this technique on dynamic logic is also demonstrated and experimental results match closely with simulation     

A sub-2.0 V BiCMOS logic circuit with a BiCMOS charge pump

A BiCMOS logic circuit with very small input capacitance has been developed, which operates at low supply voltages. A High-beta BiCMOS (Hβ-BiCMOS) gate circuit which fully utilizes the bipolar transistor features achieves 10 times the speed of a CMOS gate circuit with the same input capacitance and operating at 3.3 V supply voltage. In order to lower the minimum supply voltage of Hβ-BiCMOS, a BiCMOS circuit configuration using a charge pump to pull up the output high level of the BiCMOS gate circuit is proposed. By introducing a BiCMOS charge pump, Hβ-BiCMOS achieves very high speed operation at sub-2.0 V supply voltage. It has also been demonstrated that only a very small number of charge pump circuits are required to drive a large number of Hβ-BiCMOS gate circuits     

A circuit technology for sub-10-ns ECL 4-Mb BiCMOS DRAM's

The feasibility of realizing an emitter-coupled-logic (ECL) interface 4-Mb dynamic RAM (DRAM) with an access time under 10 ns using 0.3-μm technology is explored, and a deep submicrometer BiCMOS VLSI using this technology is proposed. Five aspects of such a DRAM are covered. They are the internal power supply voltage scheme using on-chip voltage limiters, an ECL DRAM address buffer with a reset function and level converter, a current source for address buffers compensated for device parameter fluctuation, an overdrive rewrite amplifier for realizing a fast cycle time, and double-stage current sensing for the main amplifier and output buffer. Using these circuit techniques, an access time of 7.8 ns is expected with a supply current of 198 mA at a 16-ns cycle time     

Bootstrapped full-swing BiCMOS/BiNMOS logic circuits for 1.2-3.3 Vsupply voltage regime

Novel full-swing BiCMOS/BiNMOS logic circuits using bootstrapping in the pull-up section for low supply voltage down to 1 V are reported. These circuit configurations use noncomplementary BiCMOS technology. Simulations have shown that they outperform other BiCMOS circuits at low supply voltage using 0.35 μm BiCMOS process. The delay and power dissipation of several NAND configurations have been compared. The new circuits offer delay reduction between 40 and 66% over CMOS in the range 1.2-3.3 V supply voltage. The minimum fanout at which the new circuits outperform CMOS gate is 5, which is lower than that of other gates particularly for sub-2.5 V operation     

DRAM macros for ASIC chips

DRAM macros in 4-Mb (0.8-μm) and 16-Mb (0.5-μm) DRAM process technology generations have been developed for CMOS ASIC applications. The macros use the same area efficient one transistor trench cells as 4-Mb (SPT cell) and 16-R Mb (MINT cell) DRAM products. It is shown that the trench cells with capacitor plates by the grounded substrate are ideal structures as embedded DRAM's. The trench cells built entirely under the silicon surface allow cost effective DRAM and CMOS logic merged process technologies. In the 0.8-μm rule, the DRAM macro has a 32-K×9-b configuration in a silicon area of 1.7×5.0 mm² . It achieves a 27-ns access and a 50-ns cycle times. The other DRAM macro in the 0.5-μm technology is organized in 64 K×18 b. It has a macro area of 2.1×4.9 mm and demonstrated a 23-ns access and a 40-ns cycle times. Small densities and multiple bit data configurations provide a flexibility to ASIC designs and a wide variety of application capabilities. Multiple uses of the DRAM macros bring significant performance leverages to ASIC chips because of the wide data bus and the fast access and cycle times. A data rate more than 1.3 Gb/s is possible by a single chip. Some examples of actual DRAM macro embedded ASIC chips are shown     

0.13μm BiCMOS低压差线性稳压器

设计了一种0.13μm BiCMOS低压差线性稳压器(LDO),包括BiCMOS误差放大器、带软启动的BiCMOS带隙基准源、"套筒式"共源-共栅补偿电路等。为了改善线性瞬态响应性能,在BiCMOS误差放大器的前级设置了动态电流偏置电路。由于所设计的BiCMOS带隙基准源对温度的敏感性较小,故能为LDO提供高精度的基准电压。对所设计的LDO进行了工艺流片。流片测试结果表明,该LDO可提供60 mA的输出电流且最小压差只有100 mV。测试同时验证了所设计LDO的负载和瞬态响应都得到改善:负载调整率为0.054 mV/mA,线性调整率为0.014%,而芯片面积约为0.094 mm2,因此特别适用于高精度、便携式片上电源系统。     

一种高精度BiCMOS电流模带隙基准源

采用Xfab0.35μmBiCMOS工艺设计了一种高电源抑制比（PSRR）、低温漂、输出0.5V的带隙基准源电路。该设计中,电路采用新型电流模带隙基准,解决了传统电流模带隙基准的第三简并态的问题,且实现了较低的基准电压;增加了修调电路,实现了基准电压的微调。利用Cadence软件对其进行仿真验证,其结果显示,当温度在-40～＋120℃范围内变化时,输出基准电压的温度系数为15ppm/℃;电源电压在2～4V范围内变化时,基准电压摆动小于0.06mV;低频下具有-102.6dB的PSRR,40kHz前电源抑制比仍小于-100dB。     

0.5-μm 2 M-transistor BiPNMOS channelless gate array

A channelless gate array has been realized using 0.5-μm BiCMOS technology integrating more than two million transistors on a 14-mm×14.4-mm chip. A small-size PMOS transistor and a small-size inverter are added to the conventional BiNMOS gate to form the BiPNMOS gate. The gate is suitable for 3.3-V supply and achieves 230-ps gate delay for a two-input NAND with full-swing output. Added small-size MOS transistors in the BiPNMOS basic cell can also be used for memory macros effectively. A test chip with four memory macros-a high-speed RAM, a high-density RAM, a ROM, and a CAM macro-was fabricated. The high-speed memory macros utilize bipolar transistors in bipolar middle buffers and in sense amplifiers. The high-speed RAM macro achieves an access time of 2.7 ns at 16-kb capacity. The high-density RAM macro is rather slow but the memory cell occupies only a half of the BiPNMOS basic cell using a single-port memory cell     

Study of BiCMOS logic gate configurations for improved low-voltageperformance

A simple BiCMOS configuration employing the source-well tie PMOS/n-p-n pull-down combination is proposed for low-voltage, high-performance operations. The improved BiCMOS gate delay time over that of the NMOS/n-p-n (conventional) BiCMOS gate is confirmed by means of inverter simulations and measured ring oscillator data. The source-well tie PMOS/n-p-n BiCMOS gate outperforms its conventional BiCMOS counterpart in the low-voltage supply range, at both high and low temperatures. A critical speed path from the 68030 internal circuit is used as a benchmark for the proposed BiCMOS design technique. The measured propagation delay of the BiCMOS speed path is faster than its CMOS counterpart down to 2.3 V supply voltage at -10°C and sub-2 V at 110°C     

1-V power supply high-speed digital circuit technology withmultithreshold-voltage CMOS

1-V power supply high-speed low-power digital circuit technology with 0.5-μm multithreshold-voltage CMOS (MTCMOS) is proposed. This technology features both low-threshold voltage and high-threshold voltage MOSFET's in a single LSI. The low-threshold voltage MOSFET's enhance speed performance at a low supply voltage of 1 V or less, while the high-threshold voltage MOSFET's suppress the stand-by leakage current during the sleep period. This technology has brought about logic gate characteristics of a 1.7-ns propagation delay time and 0.3-μW/MHz/gate power dissipation with a standard load. In addition, an MTCMOS standard cell library has been developed so that conventional CAD tools can be used to lay out low-voltage LSI's. To demonstrate MTCMOS's effectiveness, a PLL LSI based on standard cells was designed as a carrying vehicle. 18-MHz operation at 1 V was achieved using a 0.5-μm CMOS process     

An experimental 1-Mbit BiCMOS DRAM

Three developments are proposed for high-performance DRAMs: a bipolar complementary MOS (BiCMOS) DRAM device structure featuring high soft-error immunity due to a p/SUP +/ buried layer; a high-speed circuit configuration of eight NMOS subarrays combined with BiCMOS peripheral drivers and BiCMOS data output circuitry; and BiCMOS voltage and current limiters lowering power dissipation as well as peak current. A 1.3 /spl mu/m 1-Mb DRAM is designed and fabricated to verify the usefulness of these BiCMOS DRAM technologies. Features of this chip include a typical access time of 32 ns, a typical power dissipation of 450 mW at a 60-ns cycle time, and chip size of 5.0/spl times/14.9 mm/SUP 2/.