夹具形状对硅抛光片表面质量的影响

在硅抛光片的清洗技术中,湿法清洗技术仍然是主流清洗技术。随着抛光片尺寸增大,传统的手工清洗方式和半自动清洗方式已经不适于大尺寸硅抛光片的清洗,因此全自动湿法清洗设备逐步在大尺寸硅抛光片清洗设备中占据主导地位。在湿法清洗工艺中,夹具形状对清洗槽中液体的流动有着较大的影响,若夹具形状设计不合理,将影响抛光片表面沾污的去除,在抛光片表面形成"色斑"缺陷。     

压电式喷射点胶控制系统的电路设计

基于新型压电式点胶头采用的双压电陶瓷的推挽驱动作为胶体喷射的作用机制,设计并搭建了压电式喷射点胶控制系统,完成了硬件与软件模块的组装调试,实现对下压电陶瓷信号的频率、占空比、幅值、上压电陶瓷信号幅值的连续可调,具备人机交互、清洗、喷射点数可调等功能。经测试,系统各参数达到预定指标,频率显示误差:±1.2 Hz;占空比显示误差:±1%;幅值显示误差:±8 mV。在驱动方波电压200 V、频率65 Hz、占空比20%、喷嘴直径250μm、供料压力4 bar、喷射高度3.5 mm的条件下,得到平均直径为1.07 mm左右的喷射胶滴,一致性误差为±2%。     

半导体制造设备排气通风设计及仿真

从设计标准、性能标准、测试方法等方面介绍了SEMI S6标准,并以CMP后清洗设备为例介绍了排气通风设计中的一些注意事项.以CMP后清洗设备中的清洗槽为例,介绍了利用流体仿真软件对排气通风设计的有效性进行验证的方法,对设备排气通风的设计具有指导意义.     

一种高精度数字可调片上振荡器设计

在传统的电路基础上对电流、电压基准电路进行补偿,设计一种高精度数字可调CMOS片上振荡器电路.利用电阻和PNP管相反的温度系数产生的自偏置基准电流电路PTAT,NTAT两路电流,叠加得到一路与温度无关的基准电流上,实现了温度补偿;利用电阻网络补偿工艺产生高PSRR带隙基准电路电压的频率误差;数字修调寄存器粗调电流用以选择频率,微调电阻用以调节精度.经流片测试表明,该振荡器频率2 MHz,4 MHz可选,2 MHz可调精度达±0.1%;4 MHz可调精度达±0.125%.     

LED湿法清洗设备CDS设计

介绍了LED湿法清洗设备CDS的组成及工作原理,对化学液配、补液的实现方法进行了探讨,给出了利用流量传感器提高配、补液精度的解决方案。     

干冰微粒喷射清洗技术

简要介绍了随着工艺节点的缩小,传统RCA清洗方法在硅片清洗工艺中的局限性和弊端,进而提出了以CO2为介质的新型干冰微粒喷射清洗方法。从CO2的物理特性出发,论述了CO2流经喷枪后形成干冰微粒的机理,并简要分析了干冰微粒喷射技术对颗粒污染物和有机污染物的清洗机理。在此基础上,介绍了自主研发的一台基于干冰微粒喷射技术的半导体清洗设备,对该设备的结构和各部分的作用作了简要介绍,论述了使用该设备对硅片进行清洗的工艺流程。通过对比实验发现,采用压强为8 MPa、纯度为5N的CO2作为气源,喷嘴前压强设置为11 MPa,使用该设备可以达到很好的清洗效果。     

多晶硅清洗设备研究

介绍了多晶硅清洗设备,即：硅块、硅棒／硅芯清洗设备。并对其结构设计进行阐述。对设备关键部件-工艺槽、机械臂的设计进行了详细的说明。该设备满足了大规模生产的需要,能够保证产品的品质及生产效率。     

带膜微通道板的工艺和特性研究

微通道板(MCP)电子透射膜是决定Ⅲ代微光像管稳定性和可靠性的主要因素.采用有机衬底掩膜技术和冷基底溅射相结合的方法在MCP输入面制备非晶态Al2O3电子透射膜,测量了带膜MCP紫外光辐照清洗前后的电学特性. 讨论在多孔MCP输入面形成连续电子透射膜与气体辉光放电的关系,工艺失败对MCP的危害性.     

MCP噪声因子特性研究

微通道板(简称MCP)是决定像增强器信噪比的关重件,MCP的噪声因子是对MCP噪声特性进行评价研究的主要参数.通过对不同材料、不同腐蚀工艺、不同烧氢工艺制备的MCP以及不同工作条件下MCP的噪声因子进行测试分析,研究不同制备工艺、不同工作条件下MCP的噪声特性,最终得出了最优噪声性能的MCP制备工艺和工作条件,结果表明采用B材料,采用混合类腐蚀液腐蚀工艺,尽可能长的烧氢时间,可获得较低噪声因子的MCP,同时适当增加入射电子能量和微通道板工作电压以改善通道板噪声特性,提高像管成像质量,这些研究成果为进一步降低MCP噪声因子提供了理论和工艺指导.     

6061铝水导激光加工工艺参数优化研究

为研究水导激光加工关键工艺参数对6061铝切槽形状与组织性能的影响,利用自研的水导激光加工设备,对6061铝开展了包括激光功率、激光重复频率、进给速度及加工次数在内的多个关键工艺参数的多因素影响切槽实验.利用金相显微镜对加工沟槽的深宽比、侧壁锥度及组织变化情况进行了测量与分析.实验结果表明:激光重复频率对沟槽宽度有较明...     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks