Effect of residual stress on delamination from interface edge between nano-films

The focus in this study is on the effect of residual stress on the delamination crack initiation from the interface edge between thin films, Cu/TiN, where the stress is intensified by the free edge effect. The delamination tests, where the mechanical stress is applied on the interface, show that the specimen with the thinner Cu film has an apparently higher strength at the interface edge. The residual stress in the films is then evaluated by curvature measurement of film/substrate coupon and the influence on the delamination is analyzed. The residual stress increases with the increase of film thickness and remarkably intensifies the stress near the edge. By superimposing the contributions of the applied load and the residual stress, a good agreement is obtained in the normal stress intensity near the interface edge at the delamination independent of the Cu thickness. This signifies that the combination of intensified stresses due to the applied load and the residual stress governs the crack initiation at the interface edge, and the toughness at the interface edge is evaluated by the stress intensity factor on the basis of the fracture mechanics concept.     

Initiation of interface crack at free edge between thin films with weak stress singularity

Delamination tests using sandwich type specimens are conducted for eight combinations of materials: thin films formed on silicon substrates which are relatively popular in micro-electronic industry, to develop a method for quantitative evaluation and comparison of crack initiation strength at the free edge. The difficulty stems from the difference of stress singularity, K_ij/r^λ (K_ij: stress intensity, r: distance from free edge and λ: order of stress singularity), where λ is depending on the combination of materials. Thus, the critical K_ij has different dimensions, MPa m^λ, in each interface. Using the experimentally observed delamination load, the stress distribution along the interface is analyzed by boundary element method. Since the orders of stress singularity, λ, in the materials are less than 0.07 (weak singularity), the stress field near the interface edge is almost constant in atomic (nanometer) level. Then, the critical strength for the interface cracking is quantitatively represented by the concentrated stress near the edge. The effects of the several factors such as species of thin films, oxidized interlayers and deposition processes of thin films on the interface strength are evaluated on the basis of this critical stress as well.     

Role of plasticity on interface crack initiation from a free edge and propagation in a nano-component

In order to elucidate the role of plasticity on interface crack initiation from a free edge and crack propagation in a nano-component, delamination experiments were conducted by a proposed nano-cantilever bend method using a specimen consisting of ductile Cu and brittle Si and by a modified four-point bend method. The stress fields along the Cu/Si interface at the critical loads of crack initiation and crack propagation were analyzed by the finite element method. The results reveal that intensified elastic stresses in the vicinity of the interface edge and the crack tip are very different, although the Cu/Si interface is identical in both experiments. The plasticity of Cu was then estimated on the basis of the nano-cantilever deflection measured by in situ transmission electron microscopy. The plasticity affects the stress fields; the normal stress near the interface edge is intensified while that near the crack tip is much reduced. Both the elasto-plastic stresses are close to each other in the region of about 10 nm. This suggests that the local interface fracture, namely, the crack initiation at the interface edge and the crack propagation along the interface, is governed by elasto-plastic normal stress on the order of 10 nm.     

Increase of stress intensity near interface edge of elastic-creep Bi-material under a sustained load

The transition from small-scale creep to large-scale creep ahead of a crack tip or an interface edge with strong elastic stress singularity at the loading instant causes stress relaxation and the decrease of stress intensity in general. However, this study shows that the stress near the interface edge of bi-material with no or weak elastic stress singularity increases after the loading instant and brings about the stress concentration during the transition. In addition, the creep strain distribution of this bi-material after the loading instant is different from that occurred in the transition of an interface edge with strong elastic stress singularity or a crack tip (notch root). The criterion for the increase or decrease of stress intensity near the interface edge proved by the finite element method is proposed in this study. The stress intensity near the interface edge increases when the elastic stress singularity is lower than the creep stress singularity (λ^el < λ^cr) and vice versa.     

A method for eliminating the effect of 3-D bi-material interface corner geometries on stress singularity

The stress singularities at three-dimensional (3-D) interface corners and edges have been investigated numerically using common finite element methods. The effects of variation of edge angle and vertex angle between the two free side surfaces on the order of stress singularity at bi-material interface corners are determined. It is found that the order of stress singularity at interface corner depends not only on the combination of materials and edge angles but also on the vertex angle between the two free side surfaces. The effect of the vertex angle on the order of stress singularity at interface corner can be eliminated by smoothing the intersection of interface edges, which can be achieved simply by generating a circular-arc fillet at the intersection of the two free side surfaces. The numerical results show that, after smoothing the intersection of interface edges, the order of stress singularity along the interface edges become continuous, i.e. the order of the corner singularity can be reduced to the level of the edge singularity.     

Effect of interface layer consisting of nanosprings on stress field near interface edge

The purpose of this study is to investigate the effect of an interface layer consisting of discretely arrayed nano-sized elements on stress intensified fields. A material where an interface layer consisting of Ta₂O₅ helical nanoelements (nanosprings) is inserted between dissimilar components is prepared and two types of crack initiation experiments, which possess radically different stress conditions, are carried out. The finite element analyses indicate that the stress fields in the components with and without the interface layer are completely different, and it is experimentally clarified that the fracture mechanics concept cannot be applied to the crack initiation at the dissimilar interface edge with the interface layer. The stress distributions at the crack initiation reveal that the crack initiation is governed by the apparent stress of the nanospring, σ′, at the edge. This signifies that the interface layer eliminates the stress singular field at the interface edge. The criterion of the crack initiation is evaluated as .     

Crack initiation at free edge of interface between thin films in advanced LSI

Since electronic devices are made of multi-layered sub-micron films, delamination along the interface is one of the major failure mechanisms. This paper aims to develop a method for evaluating the mechanical criterion of interface cracking between thin films on a substrate. The focus is put on crack initiation from the free edge of the interface where the stress concentrates due to the mismatch of elastic deformation. In the evaluation, it is important to exclude plastic deformation and fracture of the thin metal film, because they bring about ambiguity on the measured magnitude of interface strength. In this study, an experimental method is proposed on the basis of fracture mechanics concepts, and the validity is examined by tests on Cu (conductor metal)/TaN (barrier metal) interface in a large-scale integrated circuit. The critical stress intensity at delamination crack initiation is successfully analyzed by the boundary element method.     

Stress field near interface edge of elastic-creep bi-material

Stress fields on elastic-creep bi-material interfaces with different geometry of the interface edge are analyzed by finite element method. The results reveal that the stress highly concentrates near the interface edge at the loading instant and it gradually decreases as the creep-dominated zone expands from the small-scale creep to the large-scale creep. The stress singularity due to creep which resembles the HRR stress singularity appears near the interface edge in all cases. The stress intensity near the interface edge time-dependently decreases and becomes constant when the transition reaches the steady state. The magnitude is scarcely influenced by the edge shape of elastic material, though it depends on the edge shape of creep material. The stress intensity during the transition can be approximately predicted by the J-integral at the loading instant.     

Disappearance of stress singularity at interface edge due to nanostructured thin film

The purpose of this study is to examine the stress distribution near the interface between a nanostructured thin film and a solid body. We focus on a nanostructured thin film that consists of Ta₂O₅ helical nanosprings fabricated on a Si substrate by dynamic oblique deposition. The mechanical properties of the thin film are obtained by vertical and lateral loading tests using a diamond tip built into an atomic force microscope. The apparent shear and Young’s moduli, G′ and E′, of the thin film are 2-3 orders of magnitude lower than those of a conventional solid Ta₂O₅ film. Moreover, the thin film shows strong anisotropy. A finite element analysis for two types of components with different interface edges between the thin film and an elastic solid body is conducted under uniform displacement. One has a free edge where the surface-interface angle is 90°-90°, and the other has a short interface crack. These analyses indicate the absence of not only stress singularity but also high stress concentration near the free edge and the interface crack tip. The characteristic stress distributions near the interface are due to the nanoscopically discrete structure of the thin film.     

Asymptotic fields near an interface corner in orthotropic bi-materials

Based on the existing asymptotic solutions of the displacement and singular stress fields in the vicinity of a singular point in 2D orthotropic elastic materials, the two simple eigenequations are explicitly given for the symmetric and anti-symmetric deformation modes to determine the orders of the stress singularity at the interface corner in orthotropic bi-materials, respectively. The related displacement and singular stress fields near the interface corner are also explicitly established. The relevant stress intensity factors are defined as in the case of crack problems. The theoretical results have been confirmed by numerical, finite-element-based results in a special bi-material case. The solution obtained in this paper may be applied to the interface corner in the orthotropic/orthotropic, orthotropic/isotropic, and isotropic/isotropic bi-materials, and it will be very useful to evaluate the strength of the bonded orthotropic bi-materials with interface corners.     

The use of interlayers in modeling interface crack propagation

Delaminations are a common mode of failure at interfaces between two material layers which have dissimilar elastic constants. There is a well-known oscillatory nature to the singularity in the stress fields at the crack tips in these bimaterial delaminations, which creates a lack of convergence in the modewise energy release rates. This makes constructing fracture criteria somewhat difficult. An approach used to overcome this is to artificially insert a thin, homogeneous, isotropic layer (the interlayer) at the interface. The crack is positioned in the middle of this homogeneous interlayer, thus modifying the original ‘bare’ interface crack problem into a companion ‘interlayer’ crack problem. Individual modes I and II energy release rates are convergent and calculable for the companion problem and can be used in the construction of a fracture criterion or locus. However, the choices of interlayer elastic and geometric properties are not obvious. Moreover, a sound, consistent, and comprehensive methodology does not exist for utilizing interlayers in the construction and application of mixed-mode fracture criteria in interface fracture mechanics. These issues are addressed here. The role of interlayer elastic modulus and thickness is examined in the context of a standard interface fracture test specimen. With the help of a previously published analytical relation that relates the bare interface crack stress intensity factor to the corresponding interlayer crack stress intensity factor, a suitable thickness and elastic modulus are identified for the interlayer in a bimaterial four-point bend test specimen geometry. Interlayer properties are chosen to make the interlayer fracture problem equivalent to the bare interface fracture problem. A suitable mixed-mode phase angle and a form for the fracture criterion for interlayer-based interface fracture are defined. A scheme is outlined for the use of interlayers for predicting interface fracture in bimaterial systems such as laminated composites. Finally, a simple procedure is presented for converting existing bare interface crack fracture loci/criteria into corresponding interlayer crack fracture loci.     

A three-dimensional eigenfunction expansion approach for singular stress field near an adhesively-bonded scarf joint interface in a rigidly-encased plate

A three-dimensional eigenfunction expansion approach for determination of the singular stress field in the vicinity of an adhesively-bonded scarf joint interface in a plate, with its top and bottom surfaces being encased, fully or partially, between infinitely rigid blocks is presented. The plate is subjected to extension/bending (mode I) and in-plane shear/twisting (mode II) far-field loading. Both the adhesive layer and plate materials are assumed to be isotropic and elastic. The boundary conditions that are prescribed on the end-faces (free, fixed and lubricated) of the plate as well as those, prescribed at the bottom or top surface of the scarf-bonded plate on either side of the interface between the plate and adhesive layer materials (fixed-fixed, free-fixed and fixed-free), are exactly satisfied. Numerical results include the dependence of the lowest eigenvalue (or most severe stress singularity) on the wedge aperture angle of the plate material. Variation of the same with respect to the shear moduli ratio of the constituent plate and adhesive layer materials is also an important part of the present investigation. Hitherto unobserved interesting and physically meaningful conclusions in regards to the fixed edge singularity and delamination type flaw sensitivity of an adhesively bonded plate surface are also presented. Finally, hitherto unavailable results, pertaining to the through-width variations of stress intensity factors corresponding to symmetric and skew-symmetric sinusoidal loads that also satisfy the boundary conditions on the end-faces of the adhesively bonded plate, in the vicinity of the scarf joint interface, under investigation, bridge a longstanding gap in the bonded joint stress singularity/fracture mechanics literature.     

Creep crack initiation at a free edge of an interface between submicron thick elements

To clarify the mechanics of time-dependent crack initiation at an interface edge in submicron thick elements due to creep, delamination experiments are conducted using a micro-cantilever bend specimen with a tin/silicon interface edge. After the specimen time-dependently deforms under a constant load, a delamination crack is initiated at the Sn/Si interface edge. In addition, the steady state creep property of Sn is estimated by performing an inverse analysis using a finite element method based on creep deformation experiments conducted for different specimens. Stress analysis using the obtained creep property reveals that stress and strain rate singularities exist at the Sn/Si interface edge under creep deformation. The intensity of the singular field time-dependently increases as the creep region expands, and eventually it becomes a steady state. The stress and strain rate intensities at the steady state correlate well with the crack initiation life, which indicates that the singular stress field near the interface edge governs the creep crack initiation.     

A through interface crack between a transversely isotropic pair of materials (+30°/−60°, −30°/+60°)

This study focuses on a delamination between two layers of a fiber-reinforced composite material oriented in the directions θ/(θ − 90°). Two specific interfaces are examined: the +30°/−60° interface and −30°/+60° interface. The delamination in these cases is treated effectively as a crack between two monoclinic materials. The behavior of the stress and displacement fields near the crack tip is studied. The first term of the asymptotic expansion for the stress and displacement fields are found by means of the Stroh and Lekhnitskii formalisms. A general solution is obtained for an interface crack in the x₂ = 0 plane. The crack is between two monoclinic materials with x₂ = 0 a symmetry plane.In order to calculate the stress intensity factors, a three-dimensional interaction energy or conservative M-integral is extended and implemented in conjunction with the finite element method. For the M-integral, the auxiliary fields used are particular cases of the stress and displacement fields obtained earlier. The displacement extrapolation method is also extended for this case. The crack surface displacements obtained from a finite element analysis are employed. The methods are independent of each other; hence, they may be used for validation of the results determined.Three test cases are analyzed to examine the accuracy of the results obtained by means of the M-integral method. In addition, two problems of a central crack in a symmetric composite under different loadings are solved. Those loadings are tension and in-plane shear. Stress intensity factors and the interface energy release rate are obtained along the crack front for all cases.     

Energy release rates of bi-material interface crack including residual thermal stresses: Application of crack tip element method

Crack tip element method is applied to the formulation of the energy release rate associated with interfacial crack growth of laminates with residual thermal stresses using the Timochenko beam model. Special attention is paid to the energy release rates of double cantilever beam and mixed-mode bending tests of bi-material specimens, and mode-I and mode-II energy release rates are formulated including residual thermal stresses. The derived results are verified by the comparison to finite element analysis, and the effect of residual thermal stresses on the mode mixity of the double cantilever beam and mixed-mode bending tests is discussed.     

A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film

Adhesion of a pre-stressed silicone rubber film to a planar graphite surface was investigated by a new cylindrical punch method. A homemade apparatus was constructed to meet force and displacement resolutions of 0.1 μN and 10 nm. When the punch approached the intersurface force range across the punch-film gap, the film jumped into contact at “pull-in”. Upon unloading, once the tensile load reached a threshold, a spontaneous delamination occurred at “pull-off” with a non-zero contact circle. A theoretical model was constructed based a simple energy balance. The new method can be used to characterize an adhesion interface between a pre-stressed free-hanging film and a rigid substrate.     

Finite element analysis of bi-material interface notch crack behaviour

The finite element method is extended to the analysis of the behaviour of an interface crack in bi-material specimen with a central hole. First, only the notch effect is considered, the field of stress and variation of the stress concentration factor as a function of the Young’s modulus ratio are determined. Secondly, the notch interface crack behaviour is investigated, the variations of the stress intensity factor versus the Young’s modulus ratio and crack length are shown as well as the distribution of stresses in the plate and along the interface.     

The effect of moisture on buckle delamination of thin inorganic layers on a polymer substrate

Moisture-induced buckle delamination of thin inorganic layers on a polymer substrate was studied. Moisture has been found to have a significant effect on the failure mode. Experimentally, an increase in the buckle width, height and the total buckle delamination length with time and humidity was observed. Moreover, a transition from straight to telephone-cord buckle pattern was taken place in a humid environment. Applying only a uniaxial compressive strain on the thin layers did not result in the transition from straight to telephone-cord. For a compliant substrate the transition from straight to telephone-cord buckle occurred at significantly higher ratio of residual strain over critical buckling strain than for a rigid substrate. A simple model for buckling was applied. Using the energy release rate, the interfacial toughness was investigated as a function of relative humidity.     

Stress intensity factors of a surface crack near an interface end

Due to the singular behavior of the stress field near the interface edge of bonded dissimilar materials, fracture generally initiates near the interface edge, or just from the interface edge point. In this paper, an edge crack near the interface, which can be considered as being induced by the edge singularity and satisfying two conditions, is analyzed theoretically, based on the singular stress field near the interface edge and the superposition principle. It is found that the stress intensity factor can be expressed by the stress intensity coefficient of the edge singular stress field, the crack length, the distance between the interface and the crack, as well as the material combination. Boundary element method analysis is also carried out. It is found that the theoretical result coincides well with the numerical result when the crack length is small. Therefore, the theoretical representation obtained by this study can be used to simply evaluate the stress intensity factor of an edge singularity induced crack for this case. However, when the crack length becomes larger than a certain value, a significant difference appears, especially for the case with large edge singularity.