用原塑料制件为模芯电铸注塑模型腔工艺

本文详述了两种用原塑料制件为模芯电铸注塑模型腔的工艺,包括工艺过程,8种溶液配方与工作条件以及注意事项。由这些工艺制造的多种塑料模型腔,仿真度高,注塑件电镀后可与进口件比美,同时生产率高,大大缩短了制模周期。     

铝芯模电铸新工艺

通过改进铝芯模前处理工艺浸锌酸盐后 ,氰化镀铜改为交流氧化后电镀光亮铜 ,提高了芯模与镀铜层的结合力 ,消除了原工艺中经常出现的起泡、脱皮等现象 ,从而大大提高了电铸波导管的合格率 ,并且减轻了对环境的污染 ,实践证明 ,该工艺稳定、可靠。     

来复反射器注塑模具电铸工艺的研究

利用电铸镍工艺制造来复反射器的模具,其芯模多采用高机械强度及高耐蚀性的金属材料经过精密机械加工制成。为了降低成本,研究了以光学塑料注塑成型的来复反射器为芯模,经过一系列的前处理步骤,在低温低应力的化学镀镍溶液中制备了导电金属层,就可以在常规的电铸镍电解液中进行来复反射器模具的加工,这种工艺经进一步完善并应用于生产上必将大幅度地降低生产成本。     

用原塑料制件为模芯电铸注塑模型腔工艺

介绍了用原料塑料制件为模芯电铸注塑模腔的方法和工艺。用这种方法制造注塑模型腔，具有仿真度高，经济效益好，生产效率高的优点，是一种值得推广的制模方法。     

定向反射镜芯模电铸中的特殊性

采用电铸技术制造定向反射镜芯模，与精密机械加工方法相比，电铸法具有加工精度高，能完全复制形状复杂而且具有不同粗糙度的表面，加工成本低，适于大批量生产，介绍了电铸法制造定向反射镜芯模的表面准备以及电铸工艺中的一些特殊问题。     

全息图像压模电铸工艺

述说了用以复制全息图像的压模的电铸工艺流程，提供了有关溶液的配方。     

旋翼电铸片电镀工艺的研究

阐述了旋翼电铸片电镀工艺。通过对不同工艺的电铸片内应力、抗拉强度、硬度和延伸率的对比分析,选择了氨基磺酸盐电铸镍工艺,并对温度、电流密度、pH值和氯离子等影响应力的因素进行了研究。     

硅片图形电铸镍工艺研究

电铸能制造某些难以用机械加工方法制造的特殊形状的微型结构,对于硅片图形电铸镍工艺只需设计合理的电铸图形,即可实现零件的精密成型制造.在对硅片图形电铸镍工艺和设备结构研究的基础上,提出了电铸液组分、工铸条件、电铸夹具以及电铸槽结构等设计要求,以满足电铸镍层的均匀性要求.通过实验对电铸镍层的均匀性进行了验证,符合了硅片图形...     

电铸镍网工艺实践

介绍了纺织印染系统应用的多色电铸镍网圆筒的制作工艺流程、电铸铜及电铸镍溶液组成与操作条件。对电铸铜与电镀铜工艺、电铸镍与电镀镍工艺进行了比较。提出了工艺中需要注意的几个问题,包括：电铸铜时毛刺产生的原因及解决办法、氯离子的控制、镍珠和钛篮的使用、添加剂含量控制、电源选择等。     

电铸纳米晶材料的研究现状

综述了纳米晶材料电铸制备的原理及常用方法(包括脉冲电沉积,采用添加剂,复合电铸,喷射电铸等),介绍了电铸纳米晶材料的优势,指出其今后的研究方向。     

我国电铸技术的研究进展

阐述了近年来我国电铸技术的研究发展方向,分析了细化晶粒改善铸层质量的方式,包括改变电源、使用添加剂、采用射流等。介绍了电铸与其它工艺的结合,如电弧喷涂、连接技术、微机械技术、快速制模技术等。指出了我国电铸技术存在的问题是加工时间长、铸件均匀性差、铸层厚度有限、复杂形状铸件研究较少和光亮镀液维护困难等,并给出了解决思路。     

纸质原型的电铸预处理工艺

介绍了分层实体制造(LOM)原型的导电化前处理工艺及涂覆导电层、电弧喷涂与化学镀三种导电方法。比较了三种导电方法处理后原型的金属涂层厚度与导电性。得到了一套简单可行的LOM原型的电铸预处理工艺。     

Recovery of activated nickel from residues for electroforming applications

An electrochemical approach was made to recover the nickel from plating wastes in the form of activated nickel by incorporating additives such as thiourea, sodium metabisulfite and sodium thiosulfate in the electrolyte. The anodic behaviour of the nickel produced was studied for its suitability in a Watts nickel and chloride free sulfate baths. It was found that the activated nickel produced with sodium metabisulfite and thiourea additives performs similarly to commercially available activated nickel anodes.     

Ni-ZrO2纳米复合电铸层抗高温氧化性能的研究

通过间歇式抗高温氧化实验,建立了纯镍电铸层和N i-ZrO2纳米复合电铸层高温氧化动力学模型,分析了电铸层表面和横截面的形貌,测定了电铸层的组织结构。结果表明,N i-ZrO2纳米复合电铸层抗高温氧化性能明显优于纯镍铸层,复合电铸层表面生成的氧化膜晶粒细小且致密,并且该氧化膜较薄,产生的内应力较小,与复合电铸层的黏附性较好。     

避雷针电铸紫铜工艺的改进

介绍了传统的避雷针电铸紫铜生产工艺,并指出了其缺点。对传统工艺的横向挂镀方式进行改进,提出了一种基于横向滚镀方式的电铸铜工艺,并讨论了硫酸铜和硫酸含量、温度及阴极移动速度对极限电流密度的影响。改进后的工艺具有镀速快,装载量大,生产效率高,镀层厚度均匀,生产成本低等优点。     

Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate

Adhesion plays a critical role in the reliability of the micro devices in MEMS. However, the quality of the micro devices fabricated by electroforming technology is influenced by the poor adhesion performance. In order to improve the poor adhesion performance, from the view of the dislocation density, this paper investigates the effect of the current density on the adhesion originally. To research the effect of the dislocation density, electroforming experiments were processed under two different current densities. The dislocation density and the compressive stress of the electroforming layer was measured by XRD method. The dislocation was observed by TEM method. The adhesion strength was tested by scratch test. The experimental results show that the small current density reduces the dislocation density and the compressive stress, increases the adhesion. The mechanisms are that the small current density reduces the dislocation density. The low dislocation density can reduce the compressive stress and increase the adhesion. This work can improve the adhesion of the electroforming layer.     

A study of hardness and grain size in pulse current electroforming of nickel using different shaped waveforms

This paper describes an experimental and theoretical study of the effects of different types of waveform on the grain size and the hardness of nickel electroforms in pulse current electroforming. The highest hardness value and the finest grain size were obtained using a ramp-down waveform with relaxation time. The experimental results show that compared with the conventional rectangular waveform and with relaxation time, the hardness value can be improved by about 28% when a ramp-down waveform, also with relaxation time, is used. These results are supported by theoretical predictions and the study of the surface morphology of the electroforms by scanning electron microscopy.     

电铸铜制备小直径薄壁回转体零件

采用3D打印的圆柱体作为芯模电铸铜,得到小直径薄壁回转体零件。配方和工艺条件为:CuSO4·5H2O 200 g/L,浓硫酸60 g/L,Cl-0.05 g/L,pH 1,温度26℃,极间距3 cm,电流密度2~8 A/dm2,阴极表面线速率3.14~12.56 mm/s。研究了电流密度和阴极表面线速率对电铸铜表面形貌和显微硬度的影响。随电流密度或阴极表面线速率增大,电铸铜的晶粒得到有效细化,组织更均匀、致密,显微硬度先增大后减小。电流密度为4A/dm2,阴极表面线速率为9.42 mm/s时,电铸铜的表面形貌最好,显微硬度最高,所得回转体零件表面光滑、平整,厚度均匀。