A Surface Crack in a Graded Coating Bonded to a Homogeneous Substrate under Thermal Loading

The elastostatic problem of a surface crack in a graded coating bonded to a homogeneous substrate under steady-state heat flux is considered. The coating is graded along the thickness direction and modeled as a nonhomogeneous medium with an isotropic stress-strain law. The problem is solved under the assumption of plane strain or generalized plane stress conditions. The resulting crack problem is of mode I because the orientations of the crack axis, the material gradient and the heat-flux are all parallel. The equivalent crack surface tractions are first obtained and substituted in the plane elasticity equations which are then converted analytically into a singular integral equation. The resulting equation is solved numerically using orthogonal Jacobi polynomials to yield the Mode I stress intensity factor. The main objective of the article is to study the effect of the layer thickness and nonhomogeneity parameters on the crack tip stress intensity factor for the purpose of gaining better understanding on the behavior of graded coatings under thermal loading.     

A Surface Crack in a Graded Coating Bonded to a Homogeneous Substrate under Transient Thermal Loading

The elastodynamic problem of a surface crack in a graded coating bonded to a homogeneous substrate under transient heat flux is considered. The coating is graded along the thickness direction and modelled as a nonhomogeneous medium with an isotropic stress-strain law. The problem is solved under the assumption of plane strain or generalized plane stress conditions. The resulting crack problem is of mode I because the orientations of the crack axis, the material gradient and the heat-flux are all parallel. The equivalent crack surface tractions are first obtained and substituted in the plane elasticity equations which are then converted analytically using appropriate integral transforms into a singular integral equation. The resulting equation is solved numerically using orthogonal Jacobi polynomials to yield the Mode I stress intensity factor. The main objective of the research is to study the effect of the layer thickness and nonhomogeneity parameters on the dynamic crack tip stress intensity factor for the purpose of gaining better understanding on the behavior of graded coatings under transient thermal loading.     

An axisymmetric crack in a functionally graded thermal barrier coating bonded to a homogeneous elastic substrate under transient thermal loading

Abstract

In this paper, the fracture problem of an axisymmetric crack in a functionally graded thermal barrier coating (FGTBC) bonded to a homogeneous substrate is considered. The problem is solved for the laminate that is suddenly heated from the upper surface of the FGTBC. The bottom surface of the homogeneous substrate is maintained at the initial temperature. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the interface. By using both the Laplace and Hankel transforms, the thermo-mechanical fracture problem is reduced to a singular integral equation and a system of singular integral equations which are solved numerically. The stress intensity factors of the crack are computed and presented as functions of the normalized time for various values of the nonhomogeneous and geometric parameters.     

The Influence of Graded Coatings on the Thermal Stress Intensity Factors of an Oblique Crack in a Semi-Infinite Substrate Subjected to Local Heating on the Boundary

Thermally induced singular behavior of an arbitrarily oriented crack in a homogeneous substrate overlaid with a functionally graded coating is considered, within the framework of linear plane thermoelasticity. It is assumed that the graded coating/substrate system is subjected to steady-state thermal loading applied over a finite region at the coating surface and the crack in the substrate is thermally insulated, disturbing the prescribed heat flow. Based on the method of Fourier integral transform and the coordinate transformations of basic field variables in thermoelasticity equations, formulation of the crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stresses in the coated medium. In the numerical results, the main emphasis is placed on the investigation of influences of loading, geometric, and material parameters of the coated system on the variations of mixed-mode thermal stress intensity factors. Further addressed are the probable cleavage angles for the incipient growth of the original crack and the corresponding values of effective tensile-mode stress intensity factors.     

EDGE CRACK PROBLEMS IN HOMOGENOUS AND FUNCTIONALLY GRADED MATERIAL THERMAL BARRIER COATINGS UNDER UNIFORM THERMAL LOADING

In this study the axisymmetric crack problem for thermal barrier coatings under a uniform temperature change is considered. Modes I and II stress intensity factors and the strain energy release rate are calculated for various sizes and locations of the crack. The main variables in the problem are the material inhomogeneity parameter of the functionally graded material coating, the size and the location of the crack, and the relative dimensions of the specimen. The effect of the temperature dependence of the material properties on the stress intensity factors and the strain energy release rate is also investigated. The finite element method is used to solve the problem. The material property grading is accounted for by developing special inhomogeneous elements and the stress intensity factors are calculated by using enriched crack tip elements.     

Thermal Stresses Around a Crack in a Non-Homogeneous Diffusion Layer Between a Coating Plate and an Elastic Half-Plane

ABSTRACT

This article proposes a method for determining the thermal stress field around a crack in a thin non homogeneous layer located between a ceramic plate and a metallic half-plane. For these calculations, the crack surfaces are assumed to be insulated and a uniform heat flux flows perpendicular to the crack. The material properties of the layer are assumed to vary continuously from those of the ceramic plate to those of the half-plane. The Fourier transform technique is employed to transform the problem into a set of integral equations. These equations are solved by expanding the differences in the crack surface temperature and the crack surface displacements in a series of functions that are automatically zero outside the crack. The Schmidt method is then used to determine the unknown coefficients in the series. Using this procedure, the stress intensity factors are calculated numerically for several ceramic plate thickness values.     

Thermal Stress Analysis in Magneto-Electro-Thermo-Elasticity with a Penny-Shaped Crack Under Uniform Heat Flow

ABSTRACT

The magnetoelectroelastic material possesses the dual feature that the application of magnetic field induces electric polarization and electric field induces magnetization. Piezoelectric-piezomagnetic materials exhibit magneto-electric effect. When magneto-electro-elastic materials are subjected to thermal flow, they can fracture prematurely due to their brittle behavior. Hence, it should be important to know the fracture behavior of magneto-electro- elastic materials. The penny-shaped crack problem in a medium possessing coupled electro-magneto-thermo-elastic is considered in this paper. It is assumed that the crack is isothermal. The analysis is an exact treatment of penny-shaped crack in a magneto-electroelastic solid subjected to uniform heat flow far away from the crack region. The governing equations of temperature, elastic displacements and electric potential as well as magnetic potential for an anisotropic magneto-electro-elastic medium are partial differential equations of second order, which are solved by means of the Hankel transform technique. Expressions for elastic displacements, thermal stresses, electric displacements and magnetic inductions are determined from the dual integral equation method. Exact thermal stress intensity factor of the problem is obtained, and the near crack tip solutions are provided.     

The Axisymmetric Problem of a Partially Insulated Mixed-Mode Crack Embedded in a Functionally Graded Pyro Magneto-Electro-Elastic Infinite Medium Subjected to Thermal Loading

This article describes our investigation of the influence of an axisymmetric partially insulated mixed-mode crack on the coupled response of a functionally graded magneto-electro-elastic material (FGMEEM) subjected to thermal loading. The crack is embedded at the center of an infinite medium, and the material is graded in the direction orthogonal to the crack plane and is modeled as a nonhomogeneous medium with anisotropic constitutive laws. The heat conduction equation is first solved using the Hankel transform to yield the temperature field in the medium. Using the same integral transform, the magneto-electro-elasticity equations are converted analytically into a system of four singular integral equations that are solved numerically to yield the crack-tip mode I and II stress intensity factors, the electric displacement intensity factor and the magnetic induction intensity factor. The main objective of this research is to study the influence of material nonhomogeneity on the fields’ intensity factors for the purpose of gaining better understanding on the behavior of graded pyro magneto-electro-elastic materials.     

THERMOELASTIC PROBLEM OF STEADY-STATE HEAT FLOW DISTURBED BY A CRACK PERPENDICULAR TO THE GRADED INTERFACIAL ZONE IN BONDED MATERIALS

The plane thermoelasticity equations are used to investigate the steady-state nonisothermal crack problem for bonded materials with a graded interfacial zone. The interfacial zone is modeled as a nonhomogeneous interlayer having continuously varying thermoelastic moduli in the exponential form between the dissimilar, homogeneous half-planes. A crack is assumed to exist in one of the half-planes oriented perpendicular to the nominal interface, disturbing a uniform heat flow. Based on the method of Fourier integral transform, formulation of the crack problem is reduced to solving two sets of Cauchy-type singular integral equations for temperature and thermal stress fields. The heat-flux intensity factors and the thermally induced mode II stress intensity factors are defined in order to characterize the singular behavior of temperature gradients and thermal stresses, respectively, in the vicinity of the crack tips. In the numerical results, the values of heat-flux and thermal-stress intensity factors are presented for various combinations of material and geometric parameters of the dissimilar media bonded through a thermoelastically graded interfacial zone. The influence of crack-surface partial conductance on the near-tip temperature and thermal stress fields is also addressed.     

The Crack Problem in Piezoelectric Strip Under Thermoelectric Loading

This paper investigates the thermoelectromechanical fracture behavior of a parallel crack in a piezoelectric strip under thermoelectric loading. The crack faces are supposed to be insulated thermally and electrically. By using the Fourier transform, the thermal and electromechanical problems are reduced to a system of singular integral equations, respectively, which are solved numerically. Numerical calculations are carried out, and the energy density factor as well as the stress and electric displacement intensity factors are presented for various values of dimensionless parameters representing the size and the location of the crack and the magnitude of the electric loading.     

Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure

An analysis of a coupled plane thermoelastic problem for a graded orthotropic coating-substrate structure is performed under thermomechanical loading conditions. The crack direction is parallel to the free surface. Applying the superposition principle and Fourier integral transform, the heat conduction and plane elasticity equations lends themselves to the derivation of two sets of Cauchy-type singular integral equations. The thermal stress intensity factors are defined and evaluated. In the numerical results, the effects of the orthotropy parameters, thermoelastic non-homogeneity parameters, and dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors (TSIFs) are studied. The obtained results can be used to design graded orthotropic coating-substrate structures under thermomechanical loading.     

Contact Zone Approach for an Electrically Impermeable Crack in Piezoelectric Materials Under Thermal-Mechanical Loading

A partial contact zone model is developed for the stress and electric displacement fields due to the obstruction of a uniform heat flux by an electrically impermeable crack in piezoelectric materials. Green's function method is used to reduce the problem to a set of singular integral equations that are solved in closed form. When the crack is assumed to be traction free, the crack opening displacement is found to be negative over one-half of the crack unless a sufficiently large far field tensile stress is superposed. The problem is reformulated assuming a contact zone at one crack tip. The extent of this zone, the stress and electric displacement intensity factors at each crack tip are obtained as functions of the applied mechanical stress and heat flux.     

Analysis of Thermoelastic Crack Problems Using Green–Lindsay Theory

A boundary element method using the Laplace transform in time domain is presented for the analysis of fracture mechanics under thermal shock using the Green and Lindsay (GL) theory of thermoelasticity. The dynamic thermoelastic model of Green and Lindsay is selected to show the effect of thermal wave propagation at finite speed on crack tip stress intensity factor evaluation. The singular behavior of the temperature and displacement fields in the vicinity of the crack tip is modeled by the quarter-point elements. Thermal dynamic stress intensity factor for mode I is evaluated from computed nodal values, using the well-known displacement and traction formulas. The accuracy of the method is investigated through comparison of the results with the available data in literature. Condition where the inertia term plays important role is discussed and variations of dynamic stress intensity factor is investigated. Different relaxation times are chosen to briefly show their effects on stress intensity factor in the Green and Lindsay theory.     

Dynamic analysis of cracks under thermal shock considering thermoelasticity without energy dissipation

This article reports a study of a cracked finite isotropic medium under nonclassic thermal shock based on thermoelasticity without energy dissipation. The time history of stress intensity factors as well as the temperature distribution around the crack tip is analyzed thoroughly. The fully coupled governing equations are discretized in the space by employing the extended finite-element method. The Newmark method is used as the time integration scheme to solve discretized equations. The stress intensity factors, which are extracted using the interaction integral method, are compared with other theories of thermoelasticity. The results of a cracked plate under temperature shock demonstrate that the stress intensity factors based on thermoelasticity without energy dissipation are significantly greater than those based on classic and Lord–Shulman models, whereas the peaks of stress intensity factors under heat flux shock are nearly equal for various theories of thermoelasticity. Furthermore, a mobile cold region is created along slanted crack in the temperature distribution, in which the temperature is less than the applied thermal boundary condition.     

Effects of Crack Surface Conductance on Intensity Factors for a Functionally Graded Piezoelectric Material Under Thermal Load

Effects of crack surface conductance on intensity factors for a functionally graded piezoelectric material under thermal load are investigated. The heat flux through the crack is assumed to be proportional to the local temperature difference. Moreover, two models for more realistic crack face electric boundary conditions are proposed. By using the Fourier transform, the thermal and electromechanical problems are reduced to a singular integral equation and a system of singular integral equations, respectively, which are solved numerically. Detailed results are presented to illustrate the influence of the thermal and electric conductance on the stress and electric displacement intensity factors.     

THERMAL STRESS IN AN ORTHOTROPIC PLATE CONTAINING A PAIR OF COPLANAR CENTRAL CRACKS

Abstract

The thermal stress problem for a pair of coplanar central cracks contained in an orthotropic plate is investigated using the techniques of Fourier transforms and finite Hilbert transforms. The crack surfaces are subjected to symmetrical thermal loadings. Exact expressions for the temperature field, the crack shapes, and the thermal stresses in the crack plane are obtained for the case of constant temperature. The opening-mode stress intensity factors at the inner and outer crack tips are also obtained in closed forms in terms of the material properties and the distance between the cracks. The properties of the stress intensity factors are shown to be different from the shear-mode stress intensity factors because of the disturbance of a uniform heat flow by a pair of central cracks.     

Transient Thermal Stress Analysis of Orthotropic Functionally Graded Materials with a Crack

The transient thermal fracture problem of a crack (perpendicular to the gradient direction) in a graded orthotropic strip is investigated. Most of the materials properties are assumed to vary as an exponential function of thickness direction. The transient two-dimensional temperature problem is analyzed by the methods of Laplace and Fourier transformations. A system of singular integral equations are obtained and solved numerically. Numerical results are figured out to show the variation of the temperature on the crack faces and extended line and stress intensity factors for different material parameters with dimensionless time.     

Evaluation of crack tip constraint using photoelasticity

The method of photoelasticity has been used extensively in the past for investigating elastic stresses in cracked specimens. However, previous studies concentrate predominantly on different methods for determining the stress intensity factors. Some of these methods make use of the higher order stress terms including the T-stress to achieve more accurate experimental results for stress intensity factors. Nevertheless, the effect of T-stress on the stress fields near the crack tip has received little attention in previous photoelastic studies. In this paper, a two-parameter formulation is used to study how the T-stress influences the isochromatic fringe patterns around the tip of a mode I crack. Theoretical and experimental results obtained in this research show that the isochromatic fringes near the crack tip rotate forward and backward for negative and positive values of T-stress, respectively. Therefore, the experimental technique of photoelasticity can be used to distinguish low constraint cracked components from high constraint ones.     

Transient Intensity Factors for a Parallel Crack in a Plate of a Functionally Graded Piezoelectric Material Under Thermal Shock Loading Conditions

A crack in a plate of a functionally graded piezoelectric material is studied under thermal shock loading conditions. The crack faces are supposed to be completely insulated. All material properties are assumed to be exponentially dependent on the distance from the crack line parallel to the boundaries of the plate. By using both the Laplace transform and Fourier transform, the thermal and electromechanical problems are reduced to a singular integral equation and a system of singular integral equations that are solved numerically. The stress and electric displacement intensity factors vs. time for various material constants and geometric parameters are calculated.     

THERMAL STRESS ANALYSIS OF A RECTANGULAR PLATE AND ITS THERMAL STRESS INTENSITY FACTOR FOR COMPRESSIVE STRESS FIELD

Abstract

In this study, a transient thermal stress problem of a rectangular plate due to a nonuniform heat supply is treated theoretically and, thereafter, fracture behaviors of the plate with a crack are examined for compressive stress states. Assuming that a crack located on an arbitrary position, with an arbitrary direction, is sufficiently small and is closed because of the compressive stress field, a temperature field, in a transient state, is analyzed by taking into account the effect of relative heat transfer on both surfaces of the plate. Thereafter, the corresponding thermal stress analysis is developed on the basis of the two-dimensional plane stress problem using Airy's stress function method, and the stress intensity factor is analyzed for the biaxial stress state. As an analytical model, we consider mechanical boundary conditions of prescribed displacement and estimate the stress intensity factor of a crack tip using parameters of the crack configuration such as the location, direction, length, and coefficient of friction. These numerical results are shown in graphical form.