A Surface Crack in a Graded Coating Bonded to a Homogeneous Substrate under Thermal Loading

The elastostatic problem of a surface crack in a graded coating bonded to a homogeneous substrate under steady-state heat flux is considered. The coating is graded along the thickness direction and modeled as a nonhomogeneous medium with an isotropic stress-strain law. The problem is solved under the assumption of plane strain or generalized plane stress conditions. The resulting crack problem is of mode I because the orientations of the crack axis, the material gradient and the heat-flux are all parallel. The equivalent crack surface tractions are first obtained and substituted in the plane elasticity equations which are then converted analytically into a singular integral equation. The resulting equation is solved numerically using orthogonal Jacobi polynomials to yield the Mode I stress intensity factor. The main objective of the article is to study the effect of the layer thickness and nonhomogeneity parameters on the crack tip stress intensity factor for the purpose of gaining better understanding on the behavior of graded coatings under thermal loading.     

Thermoelasticity problem for a multilayer coating/half-space assembly with undercoat crack subjected to convective thermal loading

The transient thermal stress crack problem for a half-space with a multilayer coating under thermal surface loading containing an undercoat crack, perpendicular to the interface, is considered. The problem is solved using the principle of superposition and uncoupled quasi-static thermoelasticity. Transient temperature distribution and corresponding thermal stresses for the uncracked multilayer assembly are obtained in a closed analytical form using the model with generalized thermal boundary conditions of heat exchange of a half-space with ambient media via the coating. The crack problem is formulated as a perturbation mixed boundary value problem, in which the crack surface loading should be equal and opposite to the thermal stresses obtained for the uncracked medium, and is reduced to a singular integral equation and solved numerically. Numerical computations are performed for the analysis of influence of the coating upon thermal stresses and thermal stress intensity factor.     

An Embedded Crack in a Graded Coating Bonded to a Homogeneous Substrate Under Thermo-Mechanical Loading

ABSTRACT

The problem of an embedded partially insulated crack in a graded coating bonded to a homogeneous substrate under thermal and mechanical loading is considered. The heat conduction and the plane elasticity equations are converted into singular integral equations which are solved to yield the temperature and the displacement fields in the medium as well as the crack tip stress intensity factors. A crack-closure algorithm is applied to avoid interpenetration. The main objective of the paper is to study the effect of the coating nonhomogeneity parameters, partial insulation of the crack surfaces and crack-closure on the crack tip stress intensity factors for the purpose of gaining better understanding of the thermo-mechanical behavior of graded coatings.     

THERMAL SHOCK FRACTURE IN A W-Cu DIVERTOR PLATE WITH A FUNCTIONALLY GRADED NONHOMOGENEOUS INTERFACE

The plane elasticity solution is presented in this article for the crack problem of a W-Cu divertor plate under thermal shock. The material is made of a graded layer with exponentially varying thermomechanical properties bonded between a homogeneous substrate and a homogeneous coating and is subjected to a cycle of heating and cooling on the coating surface of the material. The surface layer contains an embedded or a surface crack perpendicular to the boundaries. Using superposition the problem is reduced to a perturbation problem in which the crack surface tractions are only external forces. The dimensions, geometry, and loading conditions of the original problem are such that the perturbation problem may be approximated by a plane strain mode I crack problem for an infinite divertor plate. Fourier transforms are used to formulate the crack problem in terms of a singular integral equation. After giving some sample results regarding the distribution of thermal stresses, stress intensity factors for embedded and surface cracks are presented. Also included are the results for a crack/contact problem in a divertor plate that is under compression near and at the surface and tension in the interior region.     

The Axisymmetric Problem of a Partially Insulated Mixed-Mode Crack Embedded in a Functionally Graded Pyro Magneto-Electro-Elastic Infinite Medium Subjected to Thermal Loading

This article describes our investigation of the influence of an axisymmetric partially insulated mixed-mode crack on the coupled response of a functionally graded magneto-electro-elastic material (FGMEEM) subjected to thermal loading. The crack is embedded at the center of an infinite medium, and the material is graded in the direction orthogonal to the crack plane and is modeled as a nonhomogeneous medium with anisotropic constitutive laws. The heat conduction equation is first solved using the Hankel transform to yield the temperature field in the medium. Using the same integral transform, the magneto-electro-elasticity equations are converted analytically into a system of four singular integral equations that are solved numerically to yield the crack-tip mode I and II stress intensity factors, the electric displacement intensity factor and the magnetic induction intensity factor. The main objective of this research is to study the influence of material nonhomogeneity on the fields’ intensity factors for the purpose of gaining better understanding on the behavior of graded pyro magneto-electro-elastic materials.     

Infinite Row of Parallel Cracks in a Functionally Graded Piezoelectric Material Strip Under Mechanical and Transient Thermal Loading Conditions

In this paper, the problem of an infinite row of parallel cracks in a functionally graded piezoelectric material strip (FGPM strip) is analyzed under static mechanical and transient thermal loading conditions. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the bottom surface. By using the Laplace and Fourier transforms, the thermoelectromechanical problem is reduced to a singular integral equation, which is solved numerically. The stress intensity factors for both the embedded and edge cracks are computed. The results for the crack contact problem are also included.     

An axisymmetric crack in a functionally graded thermal barrier coating bonded to a homogeneous elastic substrate under transient thermal loading

Abstract

In this paper, the fracture problem of an axisymmetric crack in a functionally graded thermal barrier coating (FGTBC) bonded to a homogeneous substrate is considered. The problem is solved for the laminate that is suddenly heated from the upper surface of the FGTBC. The bottom surface of the homogeneous substrate is maintained at the initial temperature. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the interface. By using both the Laplace and Hankel transforms, the thermo-mechanical fracture problem is reduced to a singular integral equation and a system of singular integral equations which are solved numerically. The stress intensity factors of the crack are computed and presented as functions of the normalized time for various values of the nonhomogeneous and geometric parameters.     

An Annular Crack in a Functionally Graded Piezoelectric Strip Under Thermoelectric Loadings

A thermoelectroelastic problem of a functionally graded piezoelectric material (FGPM) strip containing an annular crack is solved. It is assumed that the thermoelectroelastic properties of the strip vary continuously along the thickness of the strip, and that the strip is under the thermoelectric loadings. The crack faces are supposed to be insulated thermally and electrically. Using integral transform techniques, the problem is reduced to that of solving a singular integral equation and a system of singular integral equations. Numerical calculations are carried out, and the variations of the stress and electric displacement intensity factors are plotted against the geometric parameters for some values of the material non-homogeneity parameters.     

Transient Thermal Stress Analysis of Orthotropic Functionally Graded Materials with a Crack

The transient thermal fracture problem of a crack (perpendicular to the gradient direction) in a graded orthotropic strip is investigated. Most of the materials properties are assumed to vary as an exponential function of thickness direction. The transient two-dimensional temperature problem is analyzed by the methods of Laplace and Fourier transformations. A system of singular integral equations are obtained and solved numerically. Numerical results are figured out to show the variation of the temperature on the crack faces and extended line and stress intensity factors for different material parameters with dimensionless time.     

THERMAL SHOCK FRACTURE IN AN EDGE-CRACKED PLATE

In this paper the transient thermal stress problem for an elastic strip with an edge crack is investigated. The elastic medium is assumed to be insulated on one face and cooled by surface convection on the face contaning the edge crack. Using the principle of superposition, the formulation results in a mixed boundary value problem, with the thermal stresses calculated from the thermoelasticity solution for an uncracked strip utilized as the necessary crack surface tractions. The resulting singular integral equation is of a well-known type and is solved numerically. In this paper, inertia effects are assumed negligible and possible temperature dependence of thermoelastic constants is not considered. The numerical results presented, include the stress intensity factor as a function of nondimensional time (Fourier number) and crack length, for various values of the dimensionless Biot number. The temperature distribution and the thermal stresses in the uncracked strip are also included. The time lag, which occurs between the time at which the stress on the surface of the strip is a maximum and the time when a maximum occurs in the stress intensity factor, is clearly shown to be a function of the Biot number for any given ratio of crack length to strip thickness. A result of particular interest is the degree with which the maximum stress intensity factor decreases, as a function of crack length, for decreasing values of the Biot number.     

TRANSIENT STRESS INTENSITY FACTORS FOR PERIODIC ARRAY OF CRACKS IN A HALF-PLANE DUE TO CONVECTIVE COOLING

The problem of periodic cracks perpendicular to the boundary of a half-plane under transient thermal loading is investigated. The thermal stresses are generated as a result of convective cooling on the boundary of the plane. The problem is solved using the superposition technique. The perturbation problem is formulated using the thermal stresses obtained from the uncracked problem with the opposite sign as the only external load. The formulation results in a singular integral equation of Cauchy type that is solved numerically. Numerical results are obtained for the stress intensity factors as a function of time, crack length, location of the crack, and periodic crack spacing.     

The Influence of Graded Coatings on the Thermal Stress Intensity Factors of an Oblique Crack in a Semi-Infinite Substrate Subjected to Local Heating on the Boundary

Thermally induced singular behavior of an arbitrarily oriented crack in a homogeneous substrate overlaid with a functionally graded coating is considered, within the framework of linear plane thermoelasticity. It is assumed that the graded coating/substrate system is subjected to steady-state thermal loading applied over a finite region at the coating surface and the crack in the substrate is thermally insulated, disturbing the prescribed heat flow. Based on the method of Fourier integral transform and the coordinate transformations of basic field variables in thermoelasticity equations, formulation of the crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stresses in the coated medium. In the numerical results, the main emphasis is placed on the investigation of influences of loading, geometric, and material parameters of the coated system on the variations of mixed-mode thermal stress intensity factors. Further addressed are the probable cleavage angles for the incipient growth of the original crack and the corresponding values of effective tensile-mode stress intensity factors.     

Transient Thermoelastic Analysis of a Solid Cylinder Containing a Circumferential Crack Using the C–V Heat Conduction Model

This article presents the transient thermoelastic analysis in a long solid cylinder with a circumferential crack using the C–V heat conduction theory. The outer surface of the cylinder is subjected to a sudden temperature change. The Laplace transform technique is adopted to solve the one-dimensional hyperbolic heat conduction equation, and the axial thermal stress is obtained for the un-cracked cylinder in the Laplace domain. Then this axial thermal stress with a minus sign is applied to the crack surface to form a mixed boundary value problem in the cylindrical coordinate system. A singular integral equation is derived by applying the Fourier and Hankel transforms to solve the mode I crack problem. The transient thermal stress intensity factors are obtained by solving the singular integral equation numerically. The influences of thermal relaxation time, crack geometry, and Biot's number upon transient temperature distributions, axial stress fields, and stress intensity factors are analyzed.     

TWO CRACK GROWTHS IN A FUNCTIONALLY GRADED PLATE UNDER THERMAL SHOCK

This article examines the problem of two thermal cracks under a transient temperature field in a ceramic/metal functionally graded plate. When the functionally graded plate is subjected to thermal shock, multiple cracks often occur on the ceramic surface. It is shown that the crack paths are influenced by interaction between multiple cracks and a compositional profile of the functionally graded plate. Transient thermal stresses are treated as a linear quasi-static thermoelastic problem for a plane strain state. The crack paths of two cracks are obtained using the finite element method with mode I and mode II stress intensity factors.     

Thermoelectromechanical Response of a Center Crack in a Symmetrical Functionally Graded Piezoelectric Strip

The thermoelectromechanical fracture problem for a symmetrical functionally graded piezoelectric strip containing a center crack parallel to the free boundaries is considered in this study. It is assumed that the thermoelectroelastic properties of the medium vary continuously in the thickness direction, and that the strip is under thermomechanical loadings. The crack faces are supposed to be insulated thermally and electrically. By using the Fourier transform, the thermal and electromechanical problems are reduced to singular integral equations, respectively, which are solved numerically. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the crack length and the material nonhomogeneity on the temperature-stress distributions and the stress intensity factor.     

Thermal Stress Analysis of an Embedded Crack in a Graded Orthotropic Coating-Substrate Structure

An analysis of a coupled plane thermoelastic problem for a graded orthotropic coating-substrate structure is performed under thermomechanical loading conditions. The crack direction is parallel to the free surface. Applying the superposition principle and Fourier integral transform, the heat conduction and plane elasticity equations lends themselves to the derivation of two sets of Cauchy-type singular integral equations. The thermal stress intensity factors are defined and evaluated. In the numerical results, the effects of the orthotropy parameters, thermoelastic non-homogeneity parameters, and dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors (TSIFs) are studied. The obtained results can be used to design graded orthotropic coating-substrate structures under thermomechanical loading.     

Effects of Crack Surface Conductance on Intensity Factors for a Functionally Graded Piezoelectric Material Under Thermal Load

Effects of crack surface conductance on intensity factors for a functionally graded piezoelectric material under thermal load are investigated. The heat flux through the crack is assumed to be proportional to the local temperature difference. Moreover, two models for more realistic crack face electric boundary conditions are proposed. By using the Fourier transform, the thermal and electromechanical problems are reduced to a singular integral equation and a system of singular integral equations, respectively, which are solved numerically. Detailed results are presented to illustrate the influence of the thermal and electric conductance on the stress and electric displacement intensity factors.     

The effect of a stiffener on a cracked plate under bending

In this study the problem of a stiffened plate containing a through-crack under uniform bending load is analyzed. The problem is formulated for a specially orthotropic material by using Reissner's plate theory. By using the Fourier integral transform technique the problem is reduced to a singular integral equation. This singular integral equation is then solved numerically by using Gȧuss-Chebyshev and Gauss-Jacobi quadrature formulas. The special case of the problem in which the crack tip terminates at the stiffener is also analyzed in order to assess the crack arrest effectiveness of the stiffener. The asymptotic stress state near the crack tip terminating at the stiffener is examined, and normalized Mode I stress intensity factors are tabulated. The results also include the effect of Poisson's ratio, stiffness constants and material orthotropy for specially orthotropic materials on the stress intensity factors.     

Transient thermal response of a functionally graded piezoelectric laminate with a crack normal to the bimaterial interface

In this article, the problem of a functionally graded piezoelectric material strip (FGPM strip) containing a crack perpendicular to the interface between the FGPM strip and a homogeneous layer is analyzed under transient thermal loading condition. The crack faces are supposed to be completely insulated. Material properties are assumed to be exponentially dependent on the distance from the interface. Using the Laplace and Fourier transforms, the thermoelectromechanical problem is reduced to a singular integral equation, which is solved numerically. The stress intensity factors of embedded and edge cracks are computed. The results for the crack contact problem are also included.     

THERMALLY INDUCED FRACTURE OF A FUNCTIONALLY GRADED PIEZOELECTRIC LAYER

The theoretical analysis of a thermoelectroelasticity problem is developed for a piezoelectric layer due to a thermal load under a uniform electric field and a fixed grip condition. The layer is assumed to be a functionally graded material, meaning that its thermoelectromechanical properties are assumed to be continuous functions of the thickness coordinate. The layer contains an embedded or an edge crack perpendicular to its boundaries. The Fourier transform technique is used to formulate the problem in terms of a singular integral equation. The singular integral equation is solved by using the Gauss–Jacobi integration formula. Numerical calculations are carried out, and the mode I energy density factors are presented for embedded as well as edge cracks for various values of dimensionless parameters representing the size and the location of the crack, the material nonhomogeneity, the surface temperatures, and the loading combinations.