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杨晓 《现代表面贴装资讯》2007,6(4):61-63
厚膜片式电阻器产品使用的电子浆料包括有:背电极浆料、面电极浆料、电阻浆料、一次玻璃浆料、二次保护浆料、标记浆料、端电极浆料。厚膜片式电阻器产品中的铅全部含在电子浆料中,而在所有膜层中,铅又主要含在电阻体的玻璃粉中。因此,厚膜电阻器产品中的铅适用欧盟豁免条款。
本文从材料成分及产品结构的氟度浅析了厚膜电阻器产品中的铅及如何降低产品中铅的含量。 相似文献
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国内厚膜电子浆料的发展与应用 总被引:7,自引:3,他引:4
介绍了厚膜电子浆料发展概况及主要厂家,列出了目前国内较流行的20种厚膜浆料产品的主要性能指标(如:RS、α、STOL、CRV、ESD、环境稳定性、激光稳定性等)、用途以及配套浆料。指出了国内厚膜电子浆料工业与国外的差距,提出了促进中国厚膜电子浆料工业发展的建议 相似文献
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制备了不同表面电阻率的Ru基厚膜应变电阻浆料,研究了厚膜应变电阻的表面电阻率与电阻应变系数之间的关系,并对其导电机理与特性进行了分析。 相似文献
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目前国内尚缺乏与LTCC相配套的厚膜电阻浆料。实验证明,厚膜电阻浆料的导电相、玻璃相及添加剂等对LTCC基板表面厚膜电阻在常温下的稳定性有一定影响。厚膜电阻浆料的膨胀系数随其导电相、玻璃相及添加剂的组分的变化而变化。当厚膜电阻浆料的热膨胀系数与LTCC基板的热膨胀系数之差异大到一定程度时,厚膜电阻在常温下的稳定性就会受到影响。X射线衍射图谱说明,厚膜电阻与LTCC基板之间生成的方石英相会降低厚膜电阻在常温下的稳定性。 相似文献
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氧化铍基板在大功率电路领域广泛应用。本文对氧化铝基板用厚膜多层浆料体系在氧化铍基板上的匹配性进行研究。重点对导体的附着力、焊接性能进行了对比实验。研究结果显示氧化铝基板用厚膜多层浆料体系适用于氧化铍基板上。 相似文献
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Selim Achmatowicz Konrad Kie?basiński El?bieta Zwierkowska Valentinas Baltrušaitis 《Microelectronics Reliability》2009,49(6):579-584
A new thick-film photoimageable platinum paste has been elaborated. The paste is less sensitive to the visible light. The resolution line/space 20/30 μm is achievable. The application of the elaborated paste to produce heaters is demonstrated. The stability of the heaters has been evaluated. 相似文献
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D. Ro
ak S. Ma
ek J. Sitek M. Hrovat K. Bukat Z. Drozd 《Microelectronics Reliability》2007,47(6):986-995
The results of the influence of lead-free solder paste, design and process parameters on the attachment reliability of chip surface-mounted components (SMCs) on thick-film conductor pads are presented. The purpose of the investigation was to compare the quality of the soldered joints made with new solder pastes that do not contain lead with joints soldered with standard SnPb solders. The miniature zero-ohm chip resistors were soldered with selected lead-free solder pastes. The visual appearance of the solder joint according to the standards of lead-free soldered components was compared with components soldered with SnPb solders. On the test sample with soldered chip resistors connected in series, the solder-joint resistance was measured before and after temperature cycling. On the same test sample the solder-joint resistance changes were measured with impedance spectroscopy. After temperature cycling the damaged samples were analysed with SEM and EDS. The reliability test results after temperature cycling indicate two lead-free solder pastes that are the most convenient for chip-component soldering on thick-film conductor pads with the reliability of the joints being equal or better than solder joints with Pb-containing solder paste. 相似文献
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This paper reports work done on developing binders for thick-film cathodes used in DC-type plasma display panels (PDP's). Instead of the conventional lead glass binder, this paper proposes a new liquid binder consisting of a liquid that can be mixed with a fine powder to form a paste. This paste can be baked in an irreversible process to form a solid that is highly resistant to both heating and reduction. Of the possible candidates, the partially hydrolyzed condensate of tetraethoxysilane (having an average degree of polymerization of 6) was selected to be used as a post-sintering binder for SiO2. By using this binder in the manufacture of thick-film Ca0.2La 0.8CrO3 cathodes, the deterioration of the electrical characteristics of the color PDP's and the changing composition of the gas will slow, leading to longer product lifetime. MgO, ITO, and SnO2 prepared using similar methods also produced potent binders. Thus some liquid binders are promising for application as the binder for thick-film cathodes used in DC-type PDP 相似文献
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Zhixiang Cai 《Microelectronic Engineering》2009,86(1):10-15
In this paper, laser sintering has been used to process thermal sensitive material deposited by micro-pen direct-write technology. Lines of thick-film PTC thermistor paste were deposited by micro-pen direct-write technology and irradiated by a continuous-wave laser with varied power density and scanning speed. Line widths, sheet resistivities and temperature coefficients of resistivity were measured as a function of laser power density, scanning speed, coating thickness and overlapped value. The mechanism of laser sintering thermistor paste was discussed. Laser sintering enabled finer thermistor lines to overcome the resolution limitation of micro-pen deposition without the use of any high temperature post processing. The thermistors exhibited excellent electrical performance and resistance tolerance equivalent to traditional oven-fired electronic paste. 相似文献
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采用铁氧体材料和多层厚膜印刷技术,把铁氧体膜片和导电浆料相间印刷、叠合起来,经过热压、切割,烧制成一体化的闭磁路螺旋管状磁芯线圈,具有矩形微型、封闭磁路、独石结构的特点。 相似文献
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This paper is focused on reliability tests of non-trimmed miniaturized thin-film and thick-film resistors. Thick-film resistors are screen printed by polymer paste on LTCC (Low Temperature Co-fired Ceramic) substrate by two different approaches. Nonstandard precise screen printing process provide tolerance of resistivity less than 5% and thus further trimming is not necessary. OhmegaPly material with Nickel Phosphorous (NiP) metal alloy is used for thin-film resistors fabricated by subtractive process. Miniaturized resistors have dimensions 0.5 × 0.5 mm, and thus 1 square, with thickness 1 μm for thin-film and 20 μm for thick-film resistors. Stability of miniaturized resistors were tested by humidity test, thermal shocks, long-term thermal ageing, direct current stress, current pulses and simulation of soldering process using VPS (Vapour Phase Soldering). Resistivity of resistors is measured by four wire method before and after each set of test and relative change of resistivity is plotted in graphs. Influence of every test on each type of resistor is analysed. 相似文献
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Ma?gorzata Jakubowska Mateusz Jarosz Konrad Kie?basinski Anna M?o?niak 《Microelectronics Reliability》2011,51(7):1235-1240
A new thick-film material for screen-printing technology, based on nanoscale silver powders with the particle size distribution 5-55 nm is presented. Silver nanopowder used for paste preparation was elaborated by the authors. The compatibility of investigated paste was proven with alumina, silicon, Kapton foil and glass. The main advantage of this paste is sinterability at much lower temperatures (around 300 °C) compared to pastes obtained from micro-powders (650-850 °C). The thicknesses of obtained layers are 2-3 μm. The elaborated layers are dense and well sintered, exhibit good adhesion to all above mentioned substrates and low resistivity as well as very good resistance to high power and elevated temperatures. The results of loading the layers deposited on alumina substrates with high current and exposed to high temperature are presented as well. 相似文献