A CMOS/SOS 4K static RAM

Discusses high density CMOS/SOS technology used to develop a fully static 4096-bit RAM with a five-transistor storage cell. Selection of a five-transistor memory cell has reduced the access to the flip-flop storage element to a single word line transistor and bit line. The word line transistor must be able to prevent data altering currents from entering the memory cell at all times except for the write operation. The write operation is enhanced by reducing the bias voltage across the memory cell, thereby making the current needed to alter the cell smaller. Through the use of a 5 /spl mu/m design rule, the memory cell occupies 2913 /spl mu/m/SUP 2/. The 4096-bit static CMOS/SOS RAM contains 22553 transistors in 20 mm/SUP 2/. Organised as 1024 4-bit words, the RAM has a read cycle time of 350 ns and standby power dissipation of 50 /spl mu/W at V/SUB cc/=5 V and temperature of 27/spl deg/C.     

A 1.5 V CMOS 4-bit microcomputer needs only 100 /spl mu/W

Describes a new 4-bit microcomputer fabricated using a low-power silicon gate CMOS process and working from a supply voltage down to 1.2 V. The /spl mu/C can directly drive up to seven 3:1 multiplexed LCD digits, scan up 48 keys, and perform 4-bit handshaking data transfer with external devices. 16-bit, single-word instructions and eight stack levels permit efficient use of the 640-word ROM. Operating from a 4.19 MHz crystal, the device has an instruction cycle time of 15 /spl mu/s. An operating power of 100 /spl mu/W at 1.5 W makes the chip ideal for performing control and timing functions in battery operated applications.     

DSA 4K static RAM

A high-performance diffusion self-aligned (DSA) 4K static RAM, which operates on a single power supply of 5 V without any clock input, has been fabricated. The RAM, composed of DSA MOSTs, depletion MOSTs, and high-impedance polysilicon load resistors, was designed using nonclocked static circuit techniques. The memory cell size and the chip size are 45/spl times/40 /spl mu/m and 3.88/spl times/3.45 mm, respectively. A typical access and cycle time of 76 ns is realized at a power dissipation of 500 mW. The RAM can retain data in a standby mode with a reduced supply voltage of 1.5 V, thereby decreasing the power dissipation to 60 mW. The active power dissipation can be decreased in a RAM fabricated with a lower ion-implantation dose to the depletion load MOSTs; thus the RAM may also be useful for memory applications where low power dissipation is of primary importance.     

A 64K/spl times/1 bit dynamic ED-MOS RAM

A 64K/spl times/1 bit dynamic RAM based on an innovative short channel ED-MOS process technology and an improved ED-MOS sense amplifier circuit has been realized. The RAM has been designed by using 2-3 /spl mu/m design rules and employing ED-MOS peripheral circuits capable of low supply voltage operation. As a result, dynamic memory operation has been demonstrated with an access time less than 140 ns and a cycle time of 350 ns, using a single 5 V power supply.     

A 64-kbit dynamic MOS RAM

A 64-kbit dynamic MOS RAM is developed by using 2 /spl mu/m rule VLSI fabrication technology and low power circuit technology. The 2 /spl mu/m rule VLSI fabrication technology is achieved by improving various aspects of the ultraviolet photolithographic, thin-gate oxidation, arsenic ion implantation, and multilevel interconnection processes. Microminiaturization of the device structure has made the voltage requirements for its MOST threshold voltage and DC supply voltages low. A highly sensitive and low power dissipating sense circuit has been developed for the VLSI RAM. A new level-detecting circuit with a logic threshold which is independent of MOST threshold voltage is proposed. A dynamic address-buffer circuit is also shown. The fabricated 64K RAM has 200 ns of access time, 370 ns of minimum cycle time, and 150 mW of power dissipation under typical supply voltage conditions of V/SUB DD/=7 V and V/SUB BB/=-2 V.     

An experimental 4-Mbit CMOS DRAM

A 4-Mb dynamic RAM has been designed and fabricated using 1.0-/spl mu/m twin-tub CMOS technology. The memory array consists of trenched n-channel depletion-type capacitor cells in a p-well. Very high /spl alpha/-particle immunity was achieved with this structure. One cell measures 3.0/spl times/5.8 /spl mu/m/SUP 2/ yielding a chip size of 7.84/spl times/17.48 mm/SUP 2/. An on-chip voltage converter circuit was implemented as a mask option to investigate a possible solution to the MOSFET reliability problem caused by hot carriers. An 8-bit parallel test mode was introduced to reduce the RAM test time. Metal mask options provide static-column-mode and fast-age-mode operation. The chip is usable as /spl times/1 or /spl times/4 organizations with a bonding option. Using an external 5-V power supply, the row-address-strobe access time is 80 ns at room temperature. The typical active current is 60 mA at a 220-ns cycle time with a standby current of 0.5 mA.     

High-performance low-power CMOS memories using silicon-on-sapphire technology

Complementary MOS silicon-on-sapphire inverters fabricated using silicon-gate technology and 5-/spl mu/m channel-length devices has achieved nanosecond propagation delays and picojoule dynamic power-x delay products. In addition to high switching speed and low dynamic power, inverters with low leakage currents and therefore low quiescent power have been obtained. Two complex CMOS/SOS memories that realize the performance attributes of the individual inverters have been fabricated. An aluminium-gate 256-bit fully decoded static random-access memory features a typical access time of 50 ns at 10 V with a power dissipation of 0.4 /spl mu/W/bit (quiescent) and 10 /spl mu/W/bit (dynamic). The access time at 5 V is typically 95 ns. A silicon-gate 256-bit dynamic shift register features operation at clock signals of 200 MHz at 10 V and 75 MHz at 5 V. The dynamic power dissipation at 50 MHz and 5 V is typically 90 /spl mu/W/bit.     

Low-voltage temperature sensor for micro-power harvesters in silicon-on-sapphire CMOS

A low-voltage temperature sensor designed for MEMS power harvesting systems is fabricated. The core of the sensor is a bandgap voltage reference circuit operating with a supply voltage in the range 1-1.5 V. The prototype was fabricated on a conventional 0.5 /spl mu/m silicon-on-sapphire (SOS) process. The sensor design consumes 15 /spl mu/A of current at 1 V. The internal reference voltage is 550 mV. The temperature sensor has a digital square wave output the frequency of which is proportional to temperature. A linear model of the dependency of output frequency with temperature has a conversion factor of 1.6 kHz//spl deg/C. The output is also independent of supply voltage in the range 1-1.5 V. Measured results and targeted applications for the proposed circuit are reported.     

HMOS-CMOS-a low-power high-performance technology

HMOS-CMOS, a new high-performance bulk CMOS technology, is described. This technology builds on HMOS II, and features high resistivity p-substrate, diffused n-well and scaled n- and p-channel devices of 2-/spl mu/m channel length and 400-/spl Aring/ gate oxide thickness. The aggressive scaling of n and p devices results in 350-ps minimum gate delay and 0.04-pJ power delay product. HMOS-CMOS is a single poly technology suitable for microprocessor and static RAM applications. A 4K static RAM test vehicle is described featuring fully CMOS six-transistor memory cell, a chip size of 19600 mil/SUP 2/, 75 /spl mu/W standby power, data retention down to a V/SUB cc/ voltage of 1.5 V and a minimum chip select and address access time of 25 ns.     

Single transistor MOS RAM using a short-channel MOS transistor

The relationship between sensitivity and other factors in the sense circuit of a single transistor MOS RAM has been investigated by computer simulation. An expression for sensitivity of the sense circuit has been derived. It suggests key points to increase the sensitivity of the sense circuit. A new sense circuit that defects a signal less than /spl plusmn/30 mV and has low power capability 50 /spl mu/W/circuit is realized by following the suggestions. The high performance of the proposed sense circuit has been verified through the fabrication of a 1K MOS RAM. Fine pattern technology, such as 2-/spl mu/m minimum pattern width and spacing and 500-/spl Aring/ gate oxide thickness, has been adopted. The threshold voltage of the MOS transistor is 0.8 V and dc supplies are 7 V and /spl plusmn/2 V. This 1K RAM has characteristics of 80-ns access time, 150-ns cycle time, and 30-mW power dissipation.     

A 1.8-/spl mu/W sigma-delta modulator for 8-bit digitization of cardiac signals in implantable pacemakers operating down to 1.8 V

Implantable biomedical devices can highly benefit from submicrometer CMOS technologies both in terms of duration-time increase and size shrinking. This work shows how design techniques for submicrometer CMOS technologies lead to improvements in the sensing stage of a cardiac implantable pacemaker. A sigma-delta modulator is presented for 8-bit quantization of the natural electrical activity of the heart, fabricated in a 0.8-/spl mu/m CMOS technology. The low-voltage, low-power design procedure employs switched-opamp and weak inversion CMOS circuits. Measurement results confirm a power dissipation of 1.8 /spl mu/W, a minimum supply voltage of 1.8 V, and more than 50 dB of dynamic range.     

A 25 ns 8K /spl times/ 8 static MTL/I/SUP 2/L RAM

An experimental 8K /spl times/ 8-bit static MTL RAM has been successfully fabricated in a standard bipolar manufacturing process with 2-/spl mu/m epitaxy and junction isolation, using design rules of 2.2 /spl mu/m minimum dimensions. Despite conservative processing and less aggressive photolithography compared to the most advanced static FET RAMs, a significantly better performance of 25-ns access has been achieved at a comparable bit density of 1730 bits/mm/SUP 2/. Another outstanding feature is the very low power dissipation of only 8 mW in standby and 270 mW at 50-ns or 150 mW at 100 ns-cycle operation. A holding power below 1/spl mu/W has been measured to retain the information in the complete cell array. A further significant advantage is the insensitivity to /spl alpha/-particle radiation which is a characteristic of the MTL structure.     

A low power 46 ns 256 kbit CMOS static RAM with dynamic double word line

A fast, low-power 32K/spl times/8-bit CMOS static RAM with a high-resistive polyload 4-transistor cell has been developed utilizing a dynamic double word line (DDWL) scheme. This scheme combines an automatic power down circuitry and double word line structure. The DDWL, together with bit line and sense line equilibration, reduces the core area delay time and operating power to about 1/2 and 1/15 that of a conventional device, respectively. A newly developed fault-tolerant circuitry improves fabrication yield without degrading the access time. As for a fabrication process, an advanced 1.2-/spl mu/m p-well CMOS technology is developed to realize the ULSI RAM, integrating 1,600,000 elements on a 6.68/spl times/8.86 mm/SUP 2/ chip. The RAM offers, typically, 46 ns access time, 10 mW operating power and 30 /spl mu/W standby power.     

A ternary content-addressable memory (TCAM) based on 4T static storage and including a current-race sensing scheme

A 256/spl times/144-bit TCAM is designed in 0.18-/spl mu/m CMOS. The proposed TCAM cell uses 4T static storage for increased density. The proposed match-line (ML) sense scheme reduces power consumption by minimizing switching activity of search-lines and limiting voltage swing of MLs. The scheme achieves a match-time of 3 ns and operates at a minimum supply voltage of 1.2 V.     

A 44-/spl mu/W 4.3-GHz injection-locked frequency divider with 2.3-GHz locking range

A microwatt frequency divider for the 2.5-GHz ISM band is proposed. This divider directly modulates the output in a ring oscillator by means of a switch and realizes low power consumption with low supply voltage and a wide locking range. It is fabricated using a five-layer-metal and 0.2-/spl mu/m-gate length CMOS process. The core size is 10.8/spl times/10.5 /spl mu/m/sup 2/, which is much smaller than that of a typical inductor-enhanced frequency divider. This divider operates with a supply voltage in the range from 1.8 to 0.7V, and attains minimum power consumption of 44 /spl mu/W, in which case the supply voltage is 0.7 V, the maximum operating frequency is 4.3 GHz, and the locking range is 2.3 GHz. A derivation of the frequency locking range of the divider is provided in the Appendix.     

A 32-bit PowerPC system-on-a-chip with support for dynamic voltage scaling and dynamic frequency scaling

A PowerPC system-on-a-chip processor which makes use of dynamic voltage scaling and on-the-fly frequency scaling to adapt to the dynamically changing performance demands and power consumption constraints of high-content, battery powered applications is described. The PowerPC core and caches achieve frequencies as high as 380 MHz at a supply of 1.8 V and active power consumption as low as 53 mW at a supply of 1.0 V. The system executes up to 500 MIPS and can achieve standby power as low as 54 /spl mu/W. Logic supply changes as fast as 10 mV//spl mu/s are supported. A low-voltage PLL supplied by an on-chip regulator, which isolates the clock generator from the variable logic supply, allows the SOC to operate continuously while the logic supply voltage is modified. Hardware accelerators for speech recognition, instruction-stream decompression and cryptography are included in the SOC. The SOC occupies 36 mm/sup 2/ in a 0.18 /spl mu/m, 1.8 V nominal supply, bulk CMOS process.     

A 1.0-ns 5-kbit ECL RAM

A bipolar 512/spl times/10-bit emitter-coupled logic (ECL) RAM with an access time of 1.0 ns and a power dissipation of 2.4 W, achieving an access-time power/bit product of 0.48 pJ/bit, has been developed. The RAM was fabricated using an advanced bipolar technology featuring poly-base self-alignment, poly-emitter shallow profile, and silicon-filled trench isolation with a minimum mask dimension of 1.2 /spl mu/m. A Schottky-clamped multiemitter cell with a cell size of 760 /spl mu/m/SUP 2/ is obtained as a result of compact cell layout and the use of 1.2-/spl mu/m trench isolation.     

A low-voltage micropower JFET/bipolar operational amplifier

A single cell supply (operable down to 1.2 V) micropower operational amplifier using compatible low pinchoff voltage JFET's (V/SUB p/=0.4 V) in conjunction with standard bipolar technology has been developed. The subvolt pinchoff JFET's have proved useful in the common-mode feedback-assisted biasing of a simple p-n-p input stage to permit single supply operation, the design of a low-voltage high-performance current mirror and a differential to single-ended converter. The amplifier exhibits excellent ac performance (unity gain slew rate=0.25 V//spl mu/s, unity gain bandwidth=850 kHz) with low power dissipation (245 /spl mu/W).     

A low voltage-power 13-bit 16 MSPS CMOS pipelined ADC

A low voltage-power, 13-bit and 16 MSPS analog-to-digital converter (ADC) was implemented in 0.25-/spl mu/m one-poly five-metal standard CMOS process with MIM capacitors. This ADC used a constant-gm switch to improve the nonlinear effect and a telescopic operational transconductance amplifier with a wide-swing biasing technique for power saving and low supply voltage operation. The converter achieved a peak SNDR of 59.2 dB with 16.384 MSPS, a low supply voltage of 1.3V, and Nyquist input frequency of 8.75 MHz. The static INL of /spl plusmn/2.0 LSB and DNL of /spl plusmn/0.5 LSB were obtained. The total power consumption of this converter was 78 mW. This chip occupied 3.4 mm /spl times/ 3.6 mm area.     

A low-power high-PSRR current-mode microphone preamplifier

Bionic implants for the deaf require wide-dynamic-range low-power microphone preamplifiers with good wide-band rejection of the supply noise. Widely used low-cost implementations of such preamplifiers typically use the buffered voltage output of an electret capacitor with a built-in JFET source follower. We describe a design in which the JFET microphone buffer's output current, rather than its output voltage, is transduced via a sense-amplifier topology allowing good in-band power-supply rejection. The design employs a low-frequency feedback loop to subtract the dc bias current of the microphone and prevent it from causing saturation. Wide-band power-supply rejection is achieved by integrating a novel filter on all current-source biasing. Our design exhibits 80 dB of dynamic range with less than 5 /spl mu/V/sub rms/ of input noise while operating from a 2.8 V supply. The power consumption is 96 /spl mu/W which includes 60 /spl mu/W for the microphone built-in buffer. The in-band power-supply rejection ratio varies from 50 to 90 dB while out-of-band supply attenuation is greater than 60 dB until 25 MHz. Fabrication was done in a 1.5-/spl mu/m CMOS process with gain programmability for both microphone and auxiliary channel inputs.