Comparison of InGaN-Based LEDs Grown on Conventional Sapphire and Cone-Shape-Patterned Sapphire Substrate

To improve the external quantum efficiency, a high-quality InGaN/GaN film was grown on a cone-shape-patterned sapphire substrate (CSPSS) by using metal-organic chemical vapor deposition. The surface pattern of the CSPSS seems to be more helpful for the accommodative relaxation of compressive strain related to the lattice mismatch between GaN and a sapphire substrate because the growth mode of GaN on the CSPSS was similar to that of the epitaxial lateral overgrowth. The output power of a light-emitting diode (LED) grown on the CSPSS was estimated to be 16.5 mW at a forward current of 20 mA, which is improved by 35% compared to that of a LED grown on a conventional sapphire substrate. The significant enhancement in output power is attributed to both the increase of the extraction efficiency, resulted from the increase in photon escaping probability due to enhanced light scattering at the CSPSS, and the improvement of the crystal quality due to the reduction of dislocation.     

表面处理对蓝宝石衬底的影响

采用熔融的KOH溶液腐蚀蓝宝石衬底,获得具有三角形图案的腐蚀坑形貌,并对腐蚀坑的三角形形状给出了理论解释。在不同温度和不同的腐蚀时间进行对比结果分析,发现在280℃下腐蚀60 min左右,显示的位错清晰、准确,且最适合随后的横向外延生长。采用高分辨率双晶X线衍射(DCXRD)测试分析,结果表明,预处理对蓝宝石衬底的晶体质量和折射率色散关系几乎没影响,所以,预处理获得一定图案的蓝宝石可作为GaN横向外延的衬底,为降低GaN薄膜的位错密度,获得高质量的GaN薄膜提供有利的保障。     

蓝宝石上生长高质量InN单晶薄膜的研究发展

通过介绍蓝宝石衬底上生长氮化铟(InN)单晶薄膜的发展历程,阐述了生长该单晶薄膜的几种方法及生长过程中存在的一些问题和改进措施,说明了生长高质量InN单晶薄膜的有效途径,为InN的生长及应用提供了理论与技术指导。     

蓝宝石衬底上生长的铝镓氮外延膜的应变分析

采用金属有机化学气相沉积(MOCVD)方法制备了不同Al组分含量的2μm厚AlxGg1-xN外延膜,通过透射电镜定性分析了外延膜中的位错和缺陷,通过高分辨X射线衍射试验对AlxGa1-xN外延膜进行ω/2θ扫描,结果显示外延膜为六方晶系纤锌矿结构,通过对对称面和非对称面的晶面间距进行修正精确计算了外延膜晶格常数,并由此对应变进行定量分析,四个不同Al组分的AlxGa1-xN外延膜样品的四方畸变值随Al含量的增大而逐渐减小,并且均小于零,在水平方向上均处于压应变状态.     

蓝宝石衬底上AIGaN／GaN HEMT自热效应研究

建立了包含“自热效应”的AIGaN／GaN HEMT（高电子迁移率晶体管）直流I-V特性解析模型。从理论的角度分析了自热效应对AlGaN／GaN HEMT器件的影响，并同已有的实验结果进行了对比，符合较好。证明基于这种模型的理论分析适于AIGaN／GaN HEMT器件测试及应用的实际情况。     

蓝宝石衬底上AlGaN/GaN HEMT自热效应研究

建立了包含“自热效应”的A lG aN/G aN HEM T(高电子迁移率晶体管)直流I-V特性解析模型。从理论的角度分析了自热效应对A lG aN/G aN HEM T器件的影响,并同已有的实验结果进行了对比,符合较好。证明基于这种模型的理论分析适于A lG aN/G aN HEM T器件测试及应用的实际情况。     

掺In半绝缘GaAs衬底上外延GaAs的晶格失配研究

本文报道了在掺In半绝缘GaAs衬底上的液相和汽相外延生长,并用x射线双晶衍射和光学显微等方法研究外延层和衬底之间的晶格失配.结果表明,当衬底中In组分x<0.004时,外延层失配应力主要由弹性形变调节,不出现失配位错,并可得到很好的表面形貌;当x≥0.006时,外延层产生失配位错,失配应力主要由失配位错调节,液相外延层表面出现沿[110]和[110]方向的十字网络.当外延层产生范性形变时衬底中的临界In组分x_c在0.004和0.006之间.     

蓝宝石衬底表面粗糙度的研究

简述了纳米级超光滑蓝宝石衬底的用途及发展前景,以SiO2为磨料并且加入了表面活性剂和螯合剂的碱性抛光液做了抛光实验。分析了表面粗糙度与抛光液pH值的关系,比较了不同压力对粗糙度的影响,研究了粗糙度随流量的变化规律;以原子力显微镜为主要检测工具,找到了制备超光滑蓝宝石衬底最佳CMP工艺,在保证抛光速率的同时使表面质量达到超光滑表面的要求,有效地降低了成本。     

改变衬底表面的晶向对非平面LPE生长结构的影响

改变衬底(100)面向[011]方向倾斜的角度α,可以得到不同的波导结构。     

4 W/mm蓝宝石衬底AlGaN/GaN HEMT

报道了利用南京电子器件研究所生长的蓝宝石衬底AlGaN/GaN异质结材料制作的HEMT,器件功率输出密度达4W/mm。通过材料结构及生长条件的优化,利用MOCVD技术获得了二维电子气(2DEG)面密度为0.97×1013cm-2、迁移率为1000cm2/Vs的AlGaN/GaN异质结构材料,用此材料完成了栅长1μm、栅宽200μm AlGaN/GaN HEMT器件的研制。小信号测试表明器件的fT为17GHz、最高振荡频率fmax为40GHz;负载牵引测试得到2GHz下器件的饱和输出功率密度为4.04W/mm。     

蓝宝石衬底上HVPE-GaN表面形貌研究

通过研究蓝宝石衬底上HVPE-GaN的表面形貌,指导HVPE-GaN工艺.工艺是在自制的立式HVPE设备上进行的,通过显微镜观察了各种不同工艺条件下的GaN表面形貌.发现不采用成核层直接生长的GaN表面粗糙为多晶,而采用低温成核层所得到的GaN表面随着Ⅴ/Ⅲ比由大到小,从包状表面向坑状表面过渡,通过选择合适的Ⅴ/Ⅲ,可以得到表面光滑、无色透明的GaN.其XRD摇摆曲线半高宽为450 arcs,表面粗糙度为0.9 mm.     

氮化对蓝宝石衬底上AlGaN/GaN异质结

研究了不同氮化条件对蓝宝石衬底上生长的AlGaN/GaN异质结材料特性的影响。研究表明,随着氮化过程NH₃流量的增大,GaN外延层的晶体质量得到了改善,GaN内应力释放,但是AlGaN/GaN异质结构中二维电子气的迁移率有所恶化。讨论了上述现象出现的原因。     

460-nm InGaN-Based LEDs Grown on Fully Inclined Hemisphere-Shape-Patterned Sapphire Substrate With Submicrometer Spacing

This letter investigates 460-nm InGaN-based light-emitting diodes (LEDs) grown on a hemisphere-shape- patterned sapphire substrate (HPSS) with submicrometer spacing. The full-width at half-maximum of the (102) plane rocking curves for GaN layer grown on a conventional sapphire substrate (CSS) and HPSS are 480 and 262 arcsec, respectively. Such improvement is due to the reduction of the pure edge threading dislocations. At the forward current of 20 mA, the light output power of the LEDs grown on CSS and HPSS were 4.05 and 5.86 mW, respectively. This improvement of 44% light-output power can be attributed to the improved quality of the material and the increase of the light extraction by the fully inclined facets of the HPSS.     

蓝宝石/SiO2/AlN/GaN多层结构表面热应力仿真分析

为了研究蓝宝石/SiO2/AlN/GaN光阴极组件外延片热应力分布及影响因素,以直径d为φ40 mm的GaN外延片为研究对象,利用有限元分析法对其表面热应力分布进行了理论计算和仿真,验证了仿真模型的合理性.分析了外延片径向和厚度方向的应力分布,结果显示:在1200℃的生长温度下,径向区域内的热应力分布比较均匀,热应力变化范围为±1.38%;生长温度在400℃到1200℃范围内,外延层表面应力与生长温度呈近似正比关系.分析了外延片生长温度、蓝宝石衬底和SiO2、AlN过渡层厚度对表面热应力的影响.研究成果可为该类外延片生长工艺研究和低应力外延片的筛选标准制定提供借鉴.     

Study of GaN-Based Light-Emitting Diodes Grown on Chemical Wet-Etching-Patterned Sapphire Substrate With V-Shaped Pits Roughening Surfaces

We investigate the mechanism responding for performance enhancement of gallium nitride (GaN)-based light-emitting diode (LED) grown on chemical wet-etching-patterned sapphire substrate (CWE-PSS) with V-Shaped pit features on the top surface. According to temperature-dependent photoluminescence (PL) measurement and the measured external quantum efficiency, the structure can simultaneously enhance both internal quantum efficiency and light extraction efficiency. Comparing to devices grown on planar sapphire substrate, the threading dislocation defects of LED grown on CWE-PSS are reduced from 1.28 times 10⁹/cm² to 3.62 times 10⁸/cm², leading to a 12.5% enhancement in internal quantum efficiency. In terms of the theoretical computing of radiation patterns, the V-Shaped pits roughening surface can be thought of as a strong diffuser with paraboloidal autocorrelation function, increasing the escape probability of trapped photons and achieving a 20% enhancement in light extraction efficiency. Moreover, according to the measurement of optical diffraction power, CWE-PSS demonstrated superior guided light extraction efficiency than that of planar sapphire substrate, thus an extra 7.8% enhancement in light extraction efficiency was obtained. Therefore, comparing to the conventional LED, an overall 45% enhancement in integrated output power was achieved.     

Unambiguously Enhanced Ultraviolet Luminescence of AlGaN Wavy Quantum Well Structures Grown on Large Misoriented Sapphire Substrate

High‐quality epitaxy consisting of Al_1?xGa_xN/Al_1?yGayN multiple quantum wells (MQWs) with sharp interfaces and emitting at ≈280 nm is successfully grown on sapphire with a misorientation angle as large as 4°. Wavy MQWs are observed due to step bunching formed at the step edges. A thicker QW width accompanied by a greater accumulation of gallium near the macrostep edge than that on the flat‐terrace is observed on 4° misoriented sapphire, leading to the generation of potential minima with respect to their neighboring QWs. Consequently, a significantly enhanced photoluminescence intensity (at least ten times higher), improved internal quantum efficiency (six times higher at low excitation laser power), and a much longer carrier lifetime are achieved. Importantly, the wafer‐level output‐power of the ultraviolet light emitting diodes on 4° misoriented substrate is nearly increased by 2–3 times. This gain is attributed to the introduction of compositional inhomogeneities in AlGaN alloys induced by gallium accumulation at the step‐bunched region thus forming a lateral potential well for carrier localization. The experimental results are further confirmed by a numerical modeling in which a 3D carrier confinement mechanism is proposed. Herein, the compositional modulation in active region arising from the substrate misorientation provides a promising approach in the pursuit of high‐efficient ultraviolet emitters.     

加热器结构及工艺对蓝宝石衬底应力的影响研究

为了研究真空系统中被加热的蓝宝石衬底应力的变化,利用有限元分析方法,借助ANSYSWorkbench软件仿真了温度场以及应力场,对两种不同结构的加热器及加热工艺参数进行了分析.用多圈钨丝螺旋结构外加抛物面釜的加热器,并改变工作电流,将200℃下温度差异由41.13℃降低至2.33℃,使厚度为2mm、直径40mm的蓝宝石衬底整个圆面内的应力差异由2.11MPa减小为1.56 MPa,应力差异减小了26.1％.结果表明,采用多圈钨丝螺旋结构外加抛物面釜可获得高均匀性的加热器温度场,且当工作电流为12A时,加热的蓝宝石衬底整个表面应力分布均匀.并采用蓝宝石衬底的应力检测结果进行了验证.研究结果对真空系统中被加热的其它材料如GaAs、InGaAs、GaN、Si、石英玻璃等应力分析研究具有一定的借鉴意义.     

蓝宝石衬底上氮化镓薄膜的声表面波特性研究(英文)

研究了蓝宝石上非掺杂GaN,p型GaN和p-GaN/n-GaN 3种薄膜材料的声表面波特性。在p型GaN薄膜中观测到中心频率分别为255MHz和460MHz的Rayleigh模和Sezawa模,插入损耗为-42dB。研究了退火工艺的影响。在N2中800K温度下退火,Rayleigh模和Sezawa模的旁带抑制比分别提高了5.5dB和10.2dB。结果表明具有高阻、足够厚度和高表面质量的GaN薄膜在射频单片集成滤波器领域具有广阔的应用前景。     

Si衬底GaN外延材料六角形缺陷分析

通过改变AlN形核层的生长温度分别在Si(111)衬底上生长了两个GaN样品,并对GaN外延材料表面的六角形缺陷进行了分析研究。通过显微镜和扫描电镜(SEM)观测发现,AlN形核层在高温下生长时,GaN材料表面会产生大量六角形缺陷。通过电子能谱(EDS)分析得出GaN六角形缺陷中含有大量的Si元素以及少量的Ga和Al元素,其中Si元素从Si衬底中高温扩散而来。在降低AlN形核层的生长温度后,GaN材料表面的六角形缺陷随之消失。表明AlN形核层在较低的温度下生长时可以有效地抑制Si衬底表面Si原子的扩散,减少外延层中由于衬底Si反扩散引起的缺陷。