Post-annealing effects on the shallow-junction characteristics caused by high-fluence 77 keV BSi molecular ion implantations at room and liquid nitrogen temperatures

In this study, n-type <1 0 0> silicon specimens were liquid nitrogen temperature (LT) and room temperature (RT) implanted with 2 × 10¹⁵ cm⁻² 77 keV BSi molecular ions to produce shallow junctions. Post-annealing methods under investigation included furnace annealing (FA) at 550 °C for 0.5, 1, 2, 3 and 5 h and rapid thermal annealing (RTA) at 1050 °C for 25 s. Post-annealing effects on the shallow-junction characteristics were examined using one-step (FA) and two-step (FA + RTA) post-annealing treatments. Secondary ion mass spectrometry (SIMS), cross-sectional transmission electron microscopy (XTEM), a four-point probe and Raman scattering spectroscopy (RSS) were employed to analyze junction depths (x_j), damage microstructures, sheet resistance (R_s) and damage characteristics, respectively. The results revealed that the shallow-junction characteristics of the LT implant are better than those of the RT one when post-annealing time in FA exceeds 1 h. A post-annealing time of 3 h in FA is needed in order to obtain the optimal one- or two-step post-annealing effects on the shallow-junction characteristics in both the LT and RT implants.     

Microstructural investigation of alumina implanted with 30 keV nitrogen ions

Among ceramics, alumina is being widely used as biomaterials now these days. It is being used as hip joints, tooth roots etc. Ion implantation has been employed to modify its surface without changing it bulk properties. 30 keV nitrogen with varying ion dose ranging from 5 × 10¹⁵ ions/cm² to 5 × 10¹⁷ ions/cm² is implanted in alumina. Surface morphology has been studied with optical microscope and atomic force microscope (AFM). Improvement in brittleness has been observed with the increase in ion dose. Compound formation and changes in grain size have been studied using X-Ray diffraction (XRD). AlN compound formation is also observed by Fourier transform infrared spectroscopy (FTIR). The change in the grain size is related with the nanohardness and Hall-Petch relationship is verified.     

Implantation of anatase thin film with 100 keV Fe ions: Damage formation and magnetic behaviour

We have investigated the damage morphology and magnetic properties of titanium dioxide thin films following implantation with Fe ions. The titanium dioxide films, having a polycrystalline anatase structure, were implanted with 100 keV ⁵⁶Fe⁺ ions to a total fluence of 1.3 × 10¹⁶ ions/cm². The ion bombardment leads to an amorphized surface with no indication of the presence of secondary phases or Fe clusters. The ion-beam induced damage manifested itself by a marked change in surface morphology and film thickness. A room temperature ferromagnetic behaviour was observed by SQUID in the implanted sample. It is believed that the ion-beam induced damage and defects in the polycrystalline anatase film were partly responsible for the observed magnetic response.     

The influence of the microstructure evolution on the surface morphology in the annealing process of helium-implanted spinel

Single-crystalline spinel (MgAl₂O₄) specimens were implanted with helium ions of 100 keV at three successively increasing fluences of (0.5, 2.0 and 8.0) × 10¹⁶ ions/cm² at room temperature. The specimens were subsequently annealed in vacuum at different temperatures ranging from 500 to 1100 °C. Different techniques, including Fourier transformed infrared spectroscopy (FTIR), thermal desorption spectrometry (TDS), atomic force microscopy (AFM) and scanning electron microscopy (SEM) were used to investigate the specimens. It was found that the absorbance peak in the FTIR due to the stretching vibration of the Al-O bond shifts to smaller wave numbers with increasing fluence, shifting back to larger wave numbers with an increase of annealing temperature. The absorbance peak shift has a linear relationship with the fluence increase in the as-implanted state, while it does not have a linear relationship with the fluence increase after the annealing process. Surface deformation occurred in the specimens implanted with fluences of 2.0 and 8.0 × 10¹⁶ ions/cm² in the annealing process. The phenomena described above can be attributed to differences in defect formation in the specimens.     

Post-annealing temperature dependence of blistering in high-fluence ion-implanted H in Si 〈1 0 0〉

This study examined the influence of post-annealing temperature on blister formation and growth in ion-implanted H in Si 〈1 0 0〉. Ion energy levels of 40 and 100 keV and fluences of 2 × 10¹⁶ and 5 × 10¹⁶ cm⁻² were investigated. Post-annealing treatments were performed using the furnace annealing (FA) method with temperatures ranging from 200 to 600 °C for a duration of 1 h. Raman scattering spectroscopy (RSS), optical microscopy (OM), secondary ion mass spectrometry (SIMS), atomic force microscopy (AFM), and cross-sectional transmission electron microscopy (XTEM) were employed to explore the mechanisms behind the smart cut technique. The results revealed that variations among the transformation of the VH₃ (or V₂H₆) defect complex phase into the Si(1 0 0):H bonding configuration phase (RSS results), the appearance of optically detectable blisters and craters (OM results), the average depth of craters (AFM results), the trapping of hydrogen atoms and gettering of oxygen atoms (SIMS results), and the damaged microstructures (XTEM results) against post-annealing temperature were in close correspondence. It was also found that the optimal post-annealing temperature for blister formation and growth was 550 °C.     

Temperature dependence of lattice disorder in Ar-irradiated (1 0 0), (1 1 0) and (1 1 1) MgO single crystals

To better appreciate dynamic annealing processes in ion irradiated MgO single crystals of three low-index crystallographic orientations, lattice damage variation with irradiation temperature was investigated. Irradiations were performed with 100 keV Ar ions to a fluence of 1 × 10¹⁵ Ar/cm² in a temperature interval from −150 to 1100 °C. Rutherford backscattering spectroscopy combined with ion channeling was used to analyze lattice damage. Damage recovery with increasing irradiation temperature proceeded via two characteristic stages separated by 200 °C. Strong radiation damage anisotropy was observed at temperatures below 200 °C, with (1 1 0) MgO being the most radiation damage tolerant. Above 200 °C damage recovery was isotropic and almost complete recovery was reached at 1100 °C. We attributed this orientation dependence to a variation of dynamic annealing mechanisms with irradiation temperature.     

Sputtering and surface state evolution of Bi under oblique incidence of 120 keV Ar ions

The sputtering and surface state evolution of Bi/Si targets under oblique incidence of 120 keV Ar⁺ ions have been investigated over the range of incidence angles 0° ? θ_i ? 60°. Increasing erosion of irradiated samples (whose surface thickness reduced by ∼3% at normal incidence up to ∼8% at θ = 60°) and their surface smoothing with reducing grain sizing were pointed out using Rutherford backscattering (RBS), atomic force (AFM) and X-ray diffraction (XRD) techniques. Measured sputtering yield data versus θ_i with fixed ion fluence to ∼1.5 × 10¹⁵ cm⁻² are well described by Yamamura et al. semi-empirical formula and Monte Carlo (MC) simulation using the SRIM-2008 computer code. The observed increase in sputter yield versus incidence angle is closely correlated to Bi surface topography and crystalline structure changes under ion irradiation.     

Study of surface activation of PET by low energy (keV) Ni and N ion implantation

Polyethyleneterephthalate (PET) has been modified by 100 keV Ni⁺ and N⁺ ions using metal ion from volatile compound (MIVOC) ion source to fluence ranging from 1 × 10¹⁴ to 1 × 10¹⁶ ions/cm². The increasing application of polymeric material in technological and scientific field has motivated the use of surface treatment to modify the physical and chemical properties of polymer surfaces. When a material is exposed to ionization radiation, it suffers damage leading to surface activation depending on the type. The surface morphology was observed by atomic force microscopy (AFM). That show the roughness increases with fluence in both the cases. The Ni particles as precipitation in PET were observed by cross-section transmission electron microscopy (XTEM). The optical band gap (E_g) deduced from absorption spectra; was calculated by Tau’c relation. Raman spectroscopy shows quantitatively the chemical nature at the damage caused by the Ni⁺ and N⁺ bombardment. The ration of I_D/I_G shows graphite-like structure is formed on the surface. A layer of hydrogenated amorphous carbon is formed on the surface, which has confirmed by XPS results also.     

Nonlinear optical properties of MeV and keV ion beam synthesized Ag nanoclusters

Ag nanoclusters embedded in silica glass matrix have been synthesized by high fluence ion implantation using both keV and MeV ion beams. In keV implantation case, optical absorption shows an intense surface plasmon resonance (SPR) peak corresponding to the Ag clusters formed in the matrix. Transmission electron microscopy (TEM) measurements carried out on identically implanted SiO₂ thin films on a TEM catcher grid shows the presence of Ag nanoclusters of size around 4 nm in the matrix. However, for the MeV implantation case, the SPR peak appears in the optical absorption spectra only after air annealing the sample at 500 °C for one hour. For the annealed samples, TEM measurements show the presence of 6 nm sized Ag nanoclusters. On the other hand the as-implanted sample shows smaller nanoclusters with a lower particle density in the matrix. Interestingly, open aperture z-scan measurements carried out on keV implanted samples did not show any nonlinear absorption, while the MeV as-implanted as well as annealed samples showed nonlinear absorption. The nonlinear absorption coefficient of the MeV annealed sample is extracted from a fit to the z-scan data considering a three photon like absorption process.     

Defect characterization in boron implanted silicon after flash annealing

Flash-assisted rapid thermal processing (fRTP) has gained considerable interests for fabrication of ultra-shallow junction in silicon. fRTP can significantly reduce boron diffusion, while attaining boron activation at levels beyond the limits of traditional rapid thermal annealing. The efficiency of fRTP for defect annealing, however, needs to be systematically explored. In this study, a (1 0 0) silicon wafer was implanted with 500 eV boron ions to a fluence of 1 × 10¹⁵ cm⁻². fRTP was performed with peak temperatures ranging from 1100 °C to 1300 °C for approximately one milli-second. High resolution transmission electron microscopy and secondary ion mass spectrometry were performed to characterize as-implanted and annealed samples. The study shows that fRTP at 1250 °C can effectively anneal defects without causing boron tail diffusion.     

Structural and optical properties of 6H-SiC helium-implanted at 600 K

Single crystals of 6H-SiC were implanted at 600 K with 100 keV He ions to three successively fluences and subsequently annealed at different temperatures ranging from 873 to 1473 K in vacuum. The recovery of lattice damage was investigated by different techniques including Rutherford backscattering spectrometry in channeling geometry, Raman spectroscopy and Fourier transform infrared spectroscopy. All three techniques showed that the damage induced by helium ion implantation in the lattice is closely related to the fluence. Rutherford backscattering spectrometry/channeling data on high temperature implantations suggest that for a fluence of 3 × 10¹⁶ He⁺/cm², extended defects are created by thermal annealing to 1473 K. Apart from a well-known intensity decrease of scattering peaks in Raman spectroscopy it was found that the absorbance peak in Fourier transform infrared spectroscopy due to the stretching vibration of Si-C bond shifted to smaller wave numbers with increasing fluence, shifting back to larger wave numbers with increasing annealing temperature. These phenomena are attributed to different lattice damage behavior induced by the hot implantation process, in which simultaneous recovery was prevailing.     

Influence of post-annealing time on blistering evolution in Si 〈1 0 0〉 implanted with high-fluence H ions

The influence of post-annealing time on blistering characteristics induced by 5 × 10¹⁶ cm⁻² ion-implanted H in Si <1 0 0> was studied in terms of the formation and growth of blisters. Ion energies consisted of 40 and 100 keV. Post-annealing treatments were carried out using furnace annealing (FA) at 400 and 500 °C for a duration of 0.25-3 h in a nitrogen ambient. Raman scattering spectroscopy (RSS), optical microscopy (OM), atomic force microscopy (AFM), and secondary ion mass spectrometry (SIMS) were utilized to analyze the defect complex phases, the appearance of optically-detectable blisters and craters, the average depth of craters, and the hydrogen and oxygen depth profiles in the implanted layer, respectively. Furthermore, a characteristic time for the growth of optically-detectable blisters which was determined from the blister-covered fractions for various post-annealing times is proposed and used as a criterion to identify the effectiveness in the formation and growth of optically-detectable blisters. The results revealed that the characteristic time for the 400 °C-annealed specimens in the 40 keV implant is much shorter than it is in the 100 keV one. However, the characteristic time for the 500 °C-annealed specimens in the 40 keV implant is slightly longer than it is in the 100 keV implant. In addition, both the characteristic times for the 500 °C-annealed specimens are much shorter than those for the 400 °C ones. The above-mentioned phenomena hold true for craters.     

Dynamic annealing study of SiC epilayers implanted with Ni ions at different temperatures

SiC epilayers grown on 4H-SiC single crystals were implanted with 850 keV Ni⁺ ions with fluences in the 0.5-9 × 10¹⁶ Ni⁺/cm² range. Most of the samples were implanted at 450 °C, but for comparison some implantations were performed at room temperature (RT). In addition, a post-implantation annealing was performed in N₂ at 1100 °C in order to recover the implantation-induced structural damage. The disorder produced by the implantation at 450 °C and the effect of the post-implantation annealing on the recrystallization of the substrates have been studied as a function of the fluence by Backscattering Spectrometry in channeling geometry (BS/C) with a 3.45 MeV He²⁺ beam. RT as-implanted samples showed a completely amorphous region which extends until the surface when irradiated with the highest dose, whereas in the case of 450 °C implantation amorphization does not occur. In general, partial recovery of the crystal lattice quality was found for the less damaged samples, and the dynamic recovery of the crystalline structure increases with the irradiation temperature.     

Formation of dislocation loops in silicon by ion irradiation for silicon light emitting diodes

We have studied the influence of the ion species, ion energy, fluence, irradiation temperature and post-implantation annealing on the formation of shallow dislocation loops in silicon, for fabrication of silicon light emitting diodes. The substrates used were (1 0 0) Si, implanted with 20-80 keV boron at room temperature and 75-175 keV silicon at 100 and 200 °C. The implanted fluences were from 5 × 10¹⁴ to 1 × 10¹⁵ ions/cm². After irradiation the samples were processed for 15 s to 20 min at 950 °C by rapid thermal annealing. Structural analysis of the samples was done by transmission electron microscopy and Rutherford backscattering spectrometry. In all irradiations the silicon substrates were not amorphized, and that resulted in the formation of extrinsic perfect and faulted dislocation loops with Burgers vectors a/2〈1 1 0〉 and a/3〈1 1 1〉, respectively, sitting in {1 1 1} habit planes. It was demonstrated that by varying the ion implantation parameters and post-irradiation annealing, it is possible to form various shapes, concentration and distribution of dislocation loops in silicon.     

Cell patterning on a glass surface by a mask-assisted ion implantation

A simple patterning method of cells on a glass has been developed by using ion implantation. The glass was implanted through a pattern mask with 150 keV Ar ions in the absence or presence of oxygen. Surface properties of the ion-implanted glass were investigated by means of X-ray photoelectron spectroscopy, contact angle measurement and cell culture test. The results showed that more hydrophilic groups were formed on the glass surface implanted in the presence of oxygen. Thus, the glass surface implanted in the presence of oxygen showed lower contact angle compared with the glass surface implanted in the absence of oxygen. The cells were strongly adhered to and proliferated on the ion-implanted regions of the glass. The cell population was found to be the highest on the glass implanted at a fluence of 1 × 10¹⁶ ions/cm² in the presence of oxygen.     

Implantation effects of low energy H and D ions in germanium at −120 °C and room temperature

Germanium was implanted with 5 keV H and D ions at −120 °C or room temperature and thermally annealed in several steps. The samples were analysed at various stages by atomic force microscopy, ion channeling and Raman spectroscopy of Ge-H/D local vibration modes. The results are discussed in comparison with those in the well studied silicon. In general, the evolution of the different types of defects, in germanium at a given temperature, tends to be similar to that of the corresponding defects in silicon at 100-300 °C higher temperature. However, the behaviour of the defects detected by ion channeling (interstitials, lattice distortions) often appears unrelated to the chemical evolution measured by Raman scattering and to the temperature and isotope dependence of blistering.     

Tailoring optical and electrical properties of MgO thin films by 1.5 MeV H implantation to fluences

Thin films of magnesia (MgO) with (1 0 0) dominant orientations were implanted with 1.5 MeV H⁺ ions at room temperature to various fluences of 10¹³, 10¹⁴ and 10¹⁵ ions/cm². X-ray analysis unambiguously showed crystallinity even after a peak damage fluence of 10¹⁵ ions/cm². Rutherford backscattering spectrometry combined with ion channeling (RBS/C) was used to analyze radiation damages and defect distributions. Optical absorption band observed at 5.7 eV in implanted films was assigned to the anion vacancies and the defect was completely disappeared on annealing at 450 °C. Number of F-type defects estimated was 9.42 × 10¹⁵ cm⁻² for the film implanted with 10¹⁵ ions/cm². DC electrical conductivity of 4.02 × 10⁻⁴ S cm⁻¹ was observed in the implanted region which was three orders higher than the as-deposited films. In unison, film surface was modified as a result of the formation of aggregates caused by the atomic mixing of native matrix atoms (Mg and O) and precipitated hydrogen.     

Temperature-dependent surface modification of InSb(0 0 1) crystal by low-energy ion bombardment

Structural and compositional modification of InSb(0 0 1) single crystal surfaces induced by oblique incidence 2-5 keV Ar and Xe ion irradiation have been investigated by means of scanning tunneling and atomic force microscopies, and time-of-flight mass spectroscopy of secondary ion emission. In general, ion-induced patterns (networks of nanowires, or ripples) are angle of incidence- and fluence-dependent. Temperature dependences (from 300 to 600 K) of the RMS roughness and of the ripple wavelength have been determined for the samples bombarded with various fluences. Secondary ion emission from an InSb(0 0 1) surface exposed to 4.5 keV Ar⁺ ions has been investigated with a linear TOF spectrometer working in a static mode. Mass spectra of the sputtered In⁺, Sb⁺ and In₂⁺ secondary ions have been measured both for the non-bombarded (0 0 1) surface and for the surface previously exposed to a fluence of 10¹⁶ ions/cm². In⁺ and In₂⁺ intensities for the irradiated sample are much higher in comparison to the non-bombarded one, whereas Sb⁺ ions show a reversed tendency. This behavior suggests a significant In-enrichment at the InSb(0 0 1) surface caused by the ion bombardment.     

Ion beam modification of strained InGaAs/InP characterized by HRXRD, PL and AFM

Highly tensile strained InGaAs/InP multi quantum wells have been grown by the LP-MOVPE technique. Such samples were subjected to irradiation with 100 MeV Au⁸⁺ ions. These were studied as a function of fluence, then the irradiated samples were annealed by rapid thermal annealing at 700 °C for 60 s in nitrogen atmosphere. We used high resolution X-ray diffraction (HRXRD), photoluminescence (PL) and atomic force microscopy (AFM) characterization techniques to study the interfacial induced changes, band gap modifications and surface morphology. Multi quantum wells were then studied before and after irradiation.     

The interdiffusion and solid-state reaction of low-energy copper ions implanted in silicon

At room temperature, single-crystal silicon was implanted with Cu⁺ ions at an energy of 80 keV using two doses of 5 × 10¹⁵ and 1 × 10¹⁷ Cu⁺ cm⁻². The samples were heat treated by conventional thermal annealing at different temperatures: 200 °C, 230 °C, 350 °C, 450 °C and 500 °C. The interdiffusion and solid-state reactions between the as-implanted samples and the as-annealed samples were investigated by means of Rutherford backscattering spectrometry (RBS) and X-ray diffraction (XRD). After annealing at 230 °C, the XRD results of the samples (subject to two different doses) showed formation of Cu₃Si. According to RBS, the interdiffusion between Cu and Si atoms after annealing was very insignificant. The reason may be that the formation of Cu₃Si after annealing at 230 °C suppressed further interdiffusion between Si and Cu atoms.