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Spark plasma sintering was used to fabricate Al/diamond composites.The effect of sintering temperature on the microstructure and thermal conductivity(TC) of the composites was investigated with the combination of experimental results and theoretical analysis.The composite sintered at 550℃shows high relative density and strong interfacial bonding,whereas the composites sintered at lower(520CC) and higher(580-600℃) temperatures indicate no interfacial bonding and poor interfacial bonding,respectively.High ...  相似文献   

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A series of samples of hexagonal boron nitride-aluminum nitride ceramic composites with different amounts of CaF2 as sintering aid were prepared by spark plasma sintered at 1700-1850 ℃ for 5 min.The addition of CaF2 effectively lowered the sintering temperature and promoted the densification of AlN-BN composites.With the increase of sintering temperature,the density increased,and the contiguity of AlN grains enhanced in AlN-BN composites.Thermal conductivity of AlN-BN composites increased with the increase in CaF2 content and sintering temperature,and there is a maximum value of 78.6 W·m^-1·K^-1 when the sample with 3wt% CaF2 sintered at 1800 ℃.  相似文献   

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Thermal conductivity model of filled polymer composites   总被引:1,自引:0,他引:1  
Theoretical and empirical models for predicting the thermal conductivity of polymer composites were summarized since the 1920s.The effects of particle shape,filler amount,dispersion state of fillers,and interracial thermal barrier on the thermal conductivity of filled polymer composites were investigated,and the agreement of experimental data with theoretical models in literatures was discussed.Silica with high thermal conductivity was chosen to mix with polyvinyl-acetate(EVA)copolymer to prepare SiO2/EVA co-films.Experimental data of the co-films' thermal conductivity were compared with some classical theoretical and empirical models.The results show that Agari's model,the mixed model,and the percolation model can predict well the thermal conductivity of SiO2/EVA co-films.  相似文献   

6.
Thermal conductivity (TC) of high density polyethylene/multiwall carbon nanotube (HDPE/MWCNT) composite films was measured by laser pulse method. It is found that the TC increased quickly with the increase of MWCNT fraction when the volume fraction of MWCNT was below 3.35%. However, as the volume fraction of MWCNT was over 3.35%, the increasing rate became slow. A new percolation model was proposed based on the effect of MWCNT network to simulate the TC of HDPE/MWCNT composite films. The simulation result was in good agreement the experimental data well. In addition, the relationship of TC with the increase of temperature was also discussed. Supported by the National Natural Science Foundation of China (Grant No. 90606008 and 50706057)  相似文献   

7.
采用非平衡分子动力学法(NEMD),利用Tersoff势能函数,通过固定边界模型和常热流法,模拟了金刚石薄膜的微尺度导热过程.根据薄膜内的温度梯度和通过薄膜的热流,采用Fourier定律计算某一给定状态下的薄膜热导率.计算结果表明:厚度在2~8 nm,温度在400 K状态下,金刚石薄膜的热导率与厚度成近似线性变化;薄膜厚度和热流一定,温度400~1 200 K时,金刚石薄膜的热导率随温度的升高,温度增至1200 K时热导率趋近于一个常数.  相似文献   

8.
Net-shape forming of composite packages with high thermal conductivity   总被引:1,自引:0,他引:1  
The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages. In recent years, several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys, such as SiCp/Al, SICp/Cu, diamond/Al and diamond/Cu. However, these materials with high content of reinforcements have not been widely used in packaging field because they are hard to be machined into complex-shaped parts due to their greater hardness and brittleness. So, it is necessary to explore a near-net shape forming technology for these composites. In this paper, a novel technology of powder injection molding-infiltration is introduced to realize the near-net shaped preparation of the composite packages with high thermal conductivity.  相似文献   

9.
受分子间作用力的影响,纳米颗粒表面附近的液体分子排列比较紧密,形成界面层。为了深入研究界面层对纳米流体热导率的影响,对比分析了考虑界面层效应的纳米流体热导率模型,讨论了界面层热导率、界面层厚度以及纳米颗粒尺寸对纳米流体热导率的影响。研究结果表明,界面层能够提高纳米流体的热导率,并且界面层热导率与厚度是影响纳米流体热导率的重要因素,尤其当纳米颗粒体积分数较高,纳米颗粒尺寸较小时,2种因素的影响更加明显。此外,受界面层厚度的影响,界面层热导率对纳米流体热导率的影响程度随着界面层厚度的增加而升高。  相似文献   

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用双热丝的瞬态热线法测量了HCFC-133a气相区和液相区的导热系数数据,利用所测数据拟合得到了气相区和液相区导热系数的公式,其平均误差和最大误差分别为0.293%和0.72%,1.21%和2.16%,所得数据可供HFC-134a的合成工艺设计和其它应用研究使用。  相似文献   

12.
The fabrication of copper (Cu) and copper matrix silicon carbide (Cu/SiCp) particulate composites via the sinter-forging process was investigated. Sintering and sinter-forging processes were performed under an inert Ar atmosphere. The influence of sinter-forging time, temperature, and compressive stress on the relative density and hardness of the prepared samples was systematically investigated and subsequently compared with that of the samples prepared by the conventional sintering process. The relative density and hardness of the composites were enhanced when they were prepared by the sinter-forging process. The relative density values of all Cu/SiCp composite samples were observed to decrease with the increase in SiC content.  相似文献   

13.
The mechanical, electrical, and thermal expansion properties of carbon nanotube(CNT)-based silver and silver–palladium(10:1, w/w) alloy nanocomposites are reported. To tailor the properties of silver, CNTs were incorporated into a silver matrix by a modified molecular level-mixing process. CNTs interact weakly with silver because of their non-reactive nature and lack of mutual solubility. Therefore, palladium was utilized as an alloying element to improve interfacial adhesion. Comparative microstructural characterizations and property evaluations of the nanocomposites were performed. The structural characterizations revealed that decorated type-CNTs were dispersed, embedded, and anchored into the silver matrix. The experimental results indicated that the modification of the silver and silver–palladium nanocomposite with CNT resulted in increases in the hardness and Young's modulus along with concomitant decreases in the electrical conductivity and the coefficient of thermal expansion(CTE). The hardness and Young's modulus of the nanocomposites were increased by 30%?40% whereas the CTE was decreased to 50%-60% of the CTE of silver. The significantly improved CTE and the mechanical properties of the CNT-reinforced silver and silver–palladium nanocomposites are correlated with the intriguing properties of CNTs and with good interfacial adhesion between the CNTs and silver as a result of the fabrication process and the contact action of palladium as an alloying element.  相似文献   

14.
瞬态热线法测量流体导热系数的实验研究   总被引:7,自引:1,他引:7  
建立了双热线瞬态热线法测量流体导热系数的实验装置,推导出了相应的工作方程。试验表明,新装置具有良好的可靠性和精度。  相似文献   

15.
The thermal conductivity of rock is an important parameter for the deep mine and the geothermal development. It is often not possible to measure the thermal conductivity of the rocks present in the deep strata, and the usual approach is to calculate thermal conductivity including mineralogy and porosity. The compositions of core samples from the MID01 borehole in the Bj?rk? area were determined, and the minera composition was classified. The calculation of the thermal conductivity of rock in the borehole was carried out, and the main factors for the thermal conductivity of rock were analyzed. The results show that the calculated thermal conductivity of rock is reliable and useful for the design and calculation of geothermal development in the Bj?rk? area. Foundation item: Project(50490274) supported by the National Natural Science Foundation of China; project supported by the Postdoctoral Science Foundation of China and Bj?rk? project supported by the Energy Agency of Sweden  相似文献   

16.
The thermal conductivity of rock is an important parameter for the deep mine and the geothermal development. It is often not possible to measure the thermal conductivity of the rocks present in the deep strata, and the usual approach is to calculate thermal conductivity including mineralogy and porosity. The compositions of core samples from the MID01 borehole in the Bjorko area were determined, and the mineral composition was classified. The calculation of the thermal conductivity of rock in the borehole was carried out, and the main factors for the thermal conductivity of rock were analyzed. The results show that the calculated thermal conductivity of rock is reliable and useful for the design and calculation of geothermal development in the Bjorko area.  相似文献   

17.
采用Stillinger-Webber势能函数描述硅锗超晶格结构原子间的相互作用,建立硅锗超晶格结构的热传导系统,利用非平衡分子动力学模拟方法计算了不同周期数、不同厚度、不同温度下的Si/Ge超晶格结构热导率.模拟结果表明:超晶格结构热导率随着周期长度和周期数的增加而逐渐增大.受界面热阻效应的影响,靠近高温热墙处导热层...  相似文献   

18.
It is very difficult to prepare full-densified aluminum nitride-boron nitride (AIN/BN) composite ceramics with homogeneous microstructure and high thermal conductivity. Spark plasma sintering (SPS) was used to fully densify the AIN/BN composites in this work. Microstructure, mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated. The results show that the microstructure of composites is fine and homogenous, and the AIN/BN composites exhibit high mechanical properties. To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites, a heat treating methodology was introduced through gas pressure sintering (GPS). This processing was significantly beneficial to enhancing the thermal conductivity of the specimen. The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.  相似文献   

19.
采用机械球磨加固相烧结法合成Mn3(Cu0.6Si0.15Ge0.25)N/Ag复合材料。在77K-300K温度范围内,分别研究了Mn3(Cu0.6Si0.15Ge0.25)N/Ag复合材料的热膨胀性能,电导性能和热导性能。当含Ag量分别为1,5,10和20 wt%时,所有样品在有效的温度区间205K-275K表现出负热膨胀。随着Ag含量的增加,有效温度区间向室温方向移动。另外,和Mn3(Cu0.6Si0.15Ge0.25)N材料相比,Mn3(Cu0.6Si0.15Ge0.25)N/Ag复合材料具有更高的电导率1?0-6(Ohm.m)-1和热导率10.5W/(mK)。  相似文献   

20.
1 IntroductionSiCp/Al composites have aroused considerable inter-ests in manyfields of industry due to their tailorable me-chanical and thermophysical properties .SiCp/Al compos-ites have been developed mainly as structural materials inapplicationfor automobile industries and aerospace indus-tries . However ,thermal management applicationsin elec-tronic packaging,such as substrates ,heat slugs and heatspreads have been focused on. Electronic componentsused in thermal management applications …  相似文献   

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