非平衡磁控溅射无氢DLC增透膜的研制

非平衡磁控溅射(UBMS)技术近年来得到了广泛地应用.采用该技术制备的类金刚石薄膜(DLC)具有许多独特的性质.本文利用正交实验方法,对非平衡磁控溅射技术制备无氢DLC膜增透膜进行了研究,得到了影响薄膜光学性能的主要因素和最佳的制备工艺.结果表明,非平衡磁控溅射制备的无氢DLC膜具有较宽的光谱透明区,锗基底单面沉积DLC膜,其峰值透射率达到61.4%,接近理论值.     

射频与直流磁控溅射制备DLC薄膜的工艺研究及特性对比

采用直流与射频磁控溅射技术,用高纯石墨在单晶硅(100)表面制备了类金刚石薄膜(DLC).采用拉曼光谱、扫描电镜分析了薄膜的结构、表面和截面形貌,以及与溅射工艺的关系,并且对溅射过程中粒子输运机理进行了解释.结果表明,2种溅射方法制备的薄膜均含有相当的sp3杂化碳原子.射频磁控溅射沉积的DLC薄膜所含sp3杂化碳原子的量要高于直流磁控溅射沉积的DLC薄膜,且薄膜质量优于直流磁控溅射沉积的DLC薄膜.     

非平衡磁控溅射技术制备用于红外减反射的无氢碳膜

红外减反射保护膜具有特定的厚度要求,如能进一步减小无氢类金刚石膜(DLC)的光学吸收,就能使其在较大厚度时不过分损失光通量而得以广泛应用.从这点来讲,无氢类金刚石膜是一种极具开发潜力的材料.本文采用非平衡磁控溅射技术(UBMS)制备了无氢类金刚石膜,并研究了其厚度均匀性.研究结果表明:该非平衡磁控溅射装置有能力获得大于φ150 mm的均匀性范围.对DLC膜红外透射谱的分析表明,分别在Si和Ge基底表面单面制备的DLC薄膜,其峰值透射率在波数2983/cm时分别为68.83%和63.05%,这一结果接近无吸收碳材料理论上所能达到的值.同时,在5000到800/cm范围内,未发现明显的吸收峰.这些优良的光学特性表明,采用非平衡磁控溅射技术制备的无氢DLC膜可以作为窗口的红外增透保护膜使用.     

GCr15钢领基体磁控溅射类金刚石薄膜的工艺

为了提高钢领表面耐磨性,采用中频非平衡磁控溅射法在经热处理的GCr15钢领上制备了类金刚石(DLC)薄膜,并对不同磁控溅射功率、负偏压下制备的DLC薄膜进行了组织结构分析和摩擦磨损性能测试。结果表明:随着溅射功率、负偏压增加,DLC薄膜的Raman谱G峰位置和ID/IG值均整体上呈增加趋势,sp3键含量减少,石墨化程度增加;负偏压恒定为100 V时功率为8 k W以及功率恒定为5 k W时负偏压120 V,制备的DLC薄膜具有较小的摩擦系数和稳定的抗磨损性能。     

不同技术制备DLC膜的激光损伤特性研究

随着高能量大功率激光器的发展和激光元件的广泛应用,用于红外窗口表面增透保护的类金刚石薄膜(DLC)的抗激光损伤特性成为评价薄膜质量优劣的一个重要指标。然而,不同的制备方法和技术沉积的DLC薄膜具有各异的微观结构,从而具有不同的抗激光损伤特性。本文采用脉冲真空电弧(PVAD)和非平衡磁控溅射(UBMS)技术沉积了DLC膜,对两种DLC膜抗激光损伤特性进行了研究,测试结果表明,两种技术沉积的DLC薄膜激光损伤阈值分别0.6 J/cm2和0.3 J/cm2,PVAD技术比UBMS技术沉积的DLC薄膜具有更高的抗激光损伤阈值。基于实验研究了薄膜光学常数和表面形态,分析了两种技术制备DLC膜激光损伤特性差异的主要原因。结果表明,采用UBMS技术沉积的DLC膜具有较小的折射率和较大的消光系数,薄膜表面存在较多的疵病和缺陷,这些是其激光损伤阈值较低的主要原因。     

磁控溅射技术新进展及应用

主要简介了磁控溅射技术的基本原理、基本装置、近年来出现的新技术(多靶磁控溅射技术、磁场扫描法、非平衡磁控溅射、脉冲磁控溅射技术、磁控溅射技术与其它成膜技术相结合等),以及国内外利用磁控溅射技术在多层膜和化合物薄膜制备方面取得的一些成果.     

非平衡磁控溅射类金刚石碳膜的性能

用非平衡磁控溅射的方法在室温下制备了光滑、均匀、致密的类金刚石(DLC)薄膜,分析和研究了DLC膜的形貌、结构和摩擦特性.结果表明,靶工作电流对DLC膜的沉积有重要的影响.随着工作电流的增大,薄膜的沉积速率增大,薄膜中sp3键的含量增加.薄膜的摩擦系数随着工作电流的增加略有增大,在摩擦的初始阶段,摩擦系数较高,随着摩擦循环次数的增加,摩擦系数逐渐减小,并逐渐趋于稳定.     

电压对中频脉冲非平衡磁控溅射类金刚石薄膜结构与性能的影响

制备参数对类金刚石(DLC)薄膜的性能和结构有显著影响。利用中频脉冲非平衡磁控溅射新技术制备了DLC薄膜,采用Raman光谱、X射线光电子能谱仪、纳米压痕仪、光谱型椭偏仪研究了溅射电压对DLC薄膜微观结构、力学性能和光学性能的影响。结果表明:当溅射电压由550 V增加到750 V时,DLC薄膜中sp3杂化碳含量随溅射电压的增加而增加,当溅射电压超过750 V时,薄膜中sp3杂化碳含量随溅射电压的增加而减少;DLC薄膜的纳米硬度、折射率均随溅射电压的增加先增加而后减小,溅射电压为750 V时制备薄膜的纳米硬度及折射率最大。     

溅射沉积技术的发展及其现状

论述了溅射沉积薄膜技术的发展历程及其目前的研究应用状况.二极溅射应用于薄膜制备,揭开了溅射沉积技术的序幕,磁控溅射促使溅射沉积技术进入实质的工业化应用,并通过控制磁控靶磁场的分布方式和增加磁控靶数量,进一步发展为非平衡磁控溅射、多靶闭合式非平衡磁控溅射等,拓宽了应用范围.射频、脉冲电源尤其是脉冲电源在溅射技术中的使用极大地延伸了溅射沉积技术的应用范围.     

中频磁控溅射沉积DLC/TiAlN复合薄膜的结构与性能研究

采用中频非平衡磁控溅射沉积工艺,并施加霍尔离子源辅助沉积,在高速钢W18Cr4V及单晶硅基体上制备了梯度过渡的DIE/TiAlN复合薄膜.利用扫描电镜(SEM)、X射线光电子能谱仪(XPS)、显微硬度计、摩擦磨损仪等分析检测仪器对DLC/TiAlN复合薄膜的表面形貌、晶体结构、显微硬度、耐磨性等性能进行了检测分析.实验及分析结果表明:DLC/TrAlN薄膜平均膜厚为1.1μm,由于薄膜中的Al含量较多,使得复合薄膜的表面比DLC薄膜的表面要粗糙一些;通过对复合薄膜表层的XPS分析可知,ID/IG为2.63.由XPS深层剖析可知,DLC/TiAlN薄膜表层结构与DLC薄膜基本相同,里层则与TiAlN薄膜相似.在梯度过渡膜中,复合膜层之间的界面呈现为渐变过程,结合的非常好.DLC/TiAlN薄膜的显微硬度为2030 HV左右.与DLC薄膜显微硬度接近,低于TiAlN薄膜的显微硬度.但是DLC/TiAlN薄膜的耐磨性要好于TiAlN薄膜和DLC薄膜;DLC/TiAlN薄膜的耐腐蚀性能略好于DLC薄膜.     

Si-N-O薄膜结构对薄膜血液相容性的影响

采用非平衡磁控溅射(UBMS450)法在(100)单晶硅表面制备Si-N-O薄膜.利用X射线光电子能谱(XPS)表征薄膜的成分结构;用血小板粘附试验表征薄膜结构对薄膜血液相容性的影响.研究结果表明,以无机Si为主的Si-N-O薄膜,其血液相容性较差;键合少量O的Si3N4薄膜,其血液相容性较佳.Si-N-O薄膜中N含量和O含量的变化,是导致薄膜结构变化的重要因素.     

Optimisation of diamond-like carbon films by unbalanced magnetron sputtering for infrared transmission enhancement

Diamond-like carbon (DLC) films have potential applications in infrared transmission enhancement. Reducing or eliminating mechanical stress and optical absorption of DLC is important in such applications because relatively thick films are necessary. In this work, DLC was deposited in an unbalanced magnetron sputtering (UBMS) system. Mechanical and optical properties of the DLC films were analysed. Thick DLC films were deposited which satisfied applications for the infrared windows at 3–5 and 8–10 μm. At optimised conditions, the stress in the DLC films decreased with increasing thickness, approaching 1 GPa. For single side DLC coated silicon substrate, about 69% transmittance was achieved at wavelengths near 5 μm, close to the theoretical value for non-absorbing DLC material. Other properties such as surface roughness, wetting angle, and stability were also studied, which showed that the DLC films produced in the UBMS system were excellent for infrared transmission enhancement applications in tough environments.     

The high power impulse magnetron sputtering discharge as an ionized physical vapor deposition tool

Various magnetron sputtering tools have been developed that provide a high degree of ionization of the sputtered vapor referred to as ionized physical vapor deposition (IPVD). The ions can be controlled with respect to energy and direction as they arrive to the growth surface which allows for increased control of film properties during growth. Here, the design parameters for IPVD systems are briefly reviewed. The first sputter based IPVD systems utilized a secondary plasma source between the target and the substrate in order to generate a highly ionized sputtered vapor. High power impulse magnetron sputtering (HiPIMS) is a recent sputtering technique that utilizes IPVD where a high density plasma is created by applying high power pulses at low frequency and low duty cycle to a magnetron sputtering device. A summary of the key experimental findings for the HiPIMS discharge is given. Measurements of the temporal and spatial behavior of the plasma parameters indicate electron density peak, that expands from the target with a fixed velocity. The discharge develops from an inert sputtering gas dominated to a sputtered vapor dominated during the pulse. The high electron density results in a high degree of ionization of the deposition material.     

Fabrication of high frequency ZnO thin film SAW devices on silicon substrate with a diamond-like carbon buffer layer using RF magnetron sputtering

Diamond-like carbon (DLC) film is a promising candidate for surface acoustic wave (SAW) device applications because of its higher acoustic velocity. A zinc oxide (ZnO) thin film has been deposited on DLC film/Si substrate by RF magnetron sputtering; the optimized parameters for the ZnO sputtering are RF power density of 0.55 W/cm², substrate temperature of 380 °C, gas flow ratio (Ar/O₂) of 5/1 and total sputter pressure of 1.33 Pa. The results showed that when the thickness of the ZnO thin films was decreased, the phase velocity of the SAW devices increased significantly.     

H13钢离子渗氮(PN)与类金刚石(DLC)复合处理的摩擦磨损性能研究

采用阳极层流离子源与非平衡磁控溅射结合的沉积方法在H13钢基体表面沉积出类金刚石膜(DLC),并对H13钢经不同表面预处理对后沉积的DLC膜的摩擦学性能进行了对比研究.结果表明:DLC膜结构致密,且DLC膜与梯度过渡层及基体三者之间结合牢固;H13钢经离子氮化后,梯度过渡层与氮化层间结合紧密,提高了膜与基体的承载能力;在保持相同摩擦速率的条件下,摩擦系数随着载荷的增加先增大后减小;H13钢离子渗氮处理后沉积的DLC膜其摩擦系数远小于未采用离子渗氮处理沉积的DLC薄膜.     

微波ECR等离子体源增强非平衡磁控溅射DLC膜的制备与表征

介绍了微波ECR等离子体源增强非平衡磁控溅射设备的结构和工作原理,详细叙述了利用该设备制备类金刚石膜的过程。Raman光谱证实了薄膜的类金刚石特性;采用原子力显微镜(AFM)观察薄膜的微观表面形貌,均方根粗糙度大约为1．9nm,结果表明薄膜表面非常光滑;利用CERT微摩擦计进行摩擦、磨损和划痕实验,薄膜的平均摩擦系数较小,大约为0．175;DLC膜和Si衬底磨损情况的扫描电镜图片相对比,可以看到DLC膜的磨痕小的多,说明薄膜有较好的耐磨性能;划痕测试结果表明制备薄膜临界载荷大约为40mN。