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在自动楔焊键合中,要提高键合引线的抗拉强度,最重要的一点就是要减小第一键合点跟部的损伤。文章简述了自动楔焊键合的工艺过程,分析了在自动楔焊过程中造成第一键合点跟部损伤的主要原因:劈刀本身结构会对键合引线造成一定的摩擦损伤,劈刀在键合第一点后垂直上升所产生的应力会对第一键合点根部造成损伤,键合引线在拉弧过程中也会造成键合引线摩擦受损,送线系统的张力也会对第一键合点根部造成一定的损伤。文中还讨论了如何尽量减小摩擦和应力对第一键合点跟部所造成的损伤。 相似文献
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对混合PiN/Schottky二极管(MPS)进行研究,首先对MPS二极管的工作原理进行了分析,通过对MPS二极管、肖特基二极管、PIN二极管的伏安特性进行模拟,结果表明MPS二极管正向压降小,电流密度大,反向漏电流小,是一种具有肖特基正向特性和PN结反向特性的新型整流器。可以通过改变肖特基和PN结的面积比来调整MPS二极管的性能,与肖特基二极管和PIN二极管相比具有明显的优势,是功率系统不可或缺的功率整流管。 相似文献
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表面钝化是半导体器件制造过程中的重要工艺环节之一,对器件的电学特性和可靠性有重要影响。微波PIN二极管器件的可靠性与钝化技术密不可分,结合高温干氧和等离子体化学气相沉积(PECVD)工艺制备了微波PIN二极管的复合介质表面钝化膜。通过对膜厚、折射率、表面方块电阻、正向电阻和二极管结电容等参数的测试和分析,对工艺条件进行了优化,获得了致密性好和绝缘强度高的表面钝化膜,提升了微波PIN二极管器件的可靠性和环境适应性。 相似文献
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《今日电子》2000,(2):14-16
介绍 图1所示的采用并联一串联结构PIN二极管的发送/接收开关已经有好几年的应用历史了。与只使用串行二极管的开关结构相比,它具有如下几个优点:首先,偏置电路简单,只要一条控制线;其次,这种开关只在发送情况下需要偏置;第三,在功率放大器(PA)输出功率的同时,两个二极管都将被偏置。这三个优点在高频应用中尤其重要,因为处于“off”状态的PIN二极管通常会由于本身电容的调制效应或者由于对发送信号进行整流产生的自偏置而使它成为产生谐波的器件。频率提高时,这种情况将会恶化。另一方面,处于“on”状态的PIN二极管产生的谐波失真将随着频率的增大而减小。 相似文献
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微波PIN二极管倍频器研究 总被引:2,自引:0,他引:2
用理想的开关模型对反向并联PIN二极管对的输出频谱和倍频损耗进行分析,与混频二极管倍频器和变容二极管倍频器进行了比较,分析了PIN二极管的倍频机理。对微波PIN二极管倍频器进行了实验研究,得出了有益的结论。研制的S波段和C波段五倍频器倍频损耗分别达到15.4 dB和10.6 dB,而S波段的倍频源相位噪声达到—136 dBc/Hz@10 kHz,具有低噪声性能。 相似文献
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Tomohiro Uno 《Microelectronics Reliability》2011,51(1):148-156
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Conventional bare Cu bonding wires, in general, are severely limited in their use compared to Au wires. A coated Cu bonding wire (EX1) has been developed for LSI application. EX1 is a Pd-coated Cu wire to enhance the bondability.Bond reliability at a Cu wire bond under a humid environment is a major concern in replacing Au wires. The bond reliability of EX1 and bare Cu was compared in the reliability testing of PCT and UHAST (Unbiased HAST). The lifetimes for EX1 and the bare Cu in PCT testing were over 800 h and 250 h, respectively. Humidity reliability was significantly greater for EX1. Continuous cracking was formed at the bond interface for the bare Cu wire. Corrosion-induced deterioration would be the root cause of failure for bare Cu wires. The corrosion was a chemical reaction of Cu-Al IMC (InterMetallic Compound) and halogens (Cl, Br) from molding resins. EX1 improves the bond reliability by controlling diffusion and IMC formation at the bond interface. The excellent humidity reliability of the coated Cu wire, EX1 is suitable for LSI application. 相似文献
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介绍一种在封装工艺中可用于替代昂贵金丝的抗腐蚀高可靠性银合金丝。利用表面钝化和固溶合金、二次中频合金熔炼和定向连续拉铸工艺,分别从成分和工艺方面提高了银合金丝的机械性能、抗腐蚀性、可靠性等一系列键合性能,解决了普通银丝在使用过程中存在的电子迁移问题,推动了键合银合金丝的广泛使用。 相似文献
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微波控制电路中PIN管的引线互连技术 总被引:1,自引:1,他引:0
说明了对微波器件"PIN管"在引线互连方面的特殊要求,即键合两根"交叉线"所获得的微波性能大大优于键合单根引线,达到了低插损、低驻波、高隔离度的指标要求,使微波控制电路的高频性能更加优良;简要介绍了"键合交叉线"工艺技术的改进与优化,并且详细叙述了"交叉线"键合工艺的具体操作方法. 相似文献
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键合是SMD封装中的一道重要工序,F&K 6400键合机是德国F&K公司专门面向细铝丝键合的设备,采用超声作为键合能量。在键合工艺中不同材质的金属管座会形成不同的冶金系统,有些情况下会造成接触面腐蚀或者柯肯德尔空洞,并最终影响产品的可靠性。键合时采用的超声功率、键合时间、键合压力、键合方式等工艺参数直接影响到产品的产量和性能。在批量生产的基础上,作者分析了适合F&K 6400键合机在生产中采用的键合材料及工艺参数,并列出了生产过程中设备常见的故障及可能原因。 相似文献
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《Microelectronics Reliability》2014,54(9-10):2006-2012
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, begin-force, end-force and touch-down steps (pre-compression) with 5 levels. The bond signals of ultrasonic generator were collected during bonding in order to obtain prior quality information of bonded wires. 3D X-ray tomography was then used to evaluate bond quality during passive thermal cycling between −55 °C and 125 °C. Tomography datasets were obtained from the as-bonded condition and during cycling. The results clearly show ultrasonic power, appropriate levels of begin-force and touch-down steps are all important for achieving a well attached and reliable bond. Analysis of the virtual cross-sections indicates a good correlation between the bond signal (i.e. the initial bond quality) and wire bond damage/degradation rate. An improved understanding of the wire bonding process was achieved by observing the effect of the complex interaction of bonding parameters on the ultrasonic generator signals and degradation rate under thermal cycling. 相似文献
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通过调节微合金元素的含量获得3种具有不同力学性能的银键合丝.利用拉伸试验、键合试验、焊线挑断力、焊球推力测试等手段,研究了银键合丝力学性能对键合质量的影响.结果表明,在延伸率相同的条件下,随着微合金元素含量的降低,3种键合丝的断裂负荷降低,初始模量先减小后增大,键合后焊线挑断力和焊球推力均降低,电极金挤出率先减小后增大.银键合丝初始模量较低时在超声和压力的作用下易于变形,焊线内残余应力较低且第二焊点与引线框架结合较好,因此挑断测试时第二焊点与框架材料界面处不易发生脱离,有利于获得更高的键合成功率. 相似文献
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In the microelectronics assembly and packaging industry, the wire bonding has become an important process to connect lead frames and pads. In the past, gold and copper were the main materials of wire bonding. However, the cost of gold wires is getting higher nowadays and yet wire bonding cannot be wholly replaced by copper wire; thus silver wires become a novel bonding material in recent years. The reliability test of wires was a static method; this study leads electrical current into the wires to estimate the structural changing and interface properties of Al pads (positive and negative pad). After leading 90% critical fusing current density (CFCD) into a 23 μm silver wire, some grains of silver wire had grown up and formed into equal-diameter grains (EDG). After the current test, the fracture position of bonded wires moved from heat affect zone (HAZ) of electric flame-off (EFO) to the neck of HAZ. Otherwise, the current test would reduce the tensile strength of wire. The bonding strength of the positive pad was lower than that of the negative pad. The intermetallic compound (IMC) of bonding interface was AgAl2. 相似文献
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The semiconductor packaging industry is undergoing a step-change transition from gold to copper wire bonding brought on by a quadrupling of gold cost over the last 8 years. The transition has been exceptionally rapid over the last 3 years and virtually all companies in the industry now have significant copper wire bonding production. Among the challenges to copper wire bonding is the damage to bond pads that had been engineered for wire bonding with the softer gold wire. This paper presents an extensive evaluation of electroless NiPd and NiPdAu bond pads that offer a much more robust alternative to the standard Al pad finish. These NiPd(Au) bond are shown to outperform Al in virtually all respects: bond strength, bond parameter window, lack of pad damage and reliability. 相似文献