Electromagnetic energy propagation in power electronic converters:toward future electromagnetic integration

Historically, it came about that the analysis and design of the power electronic converter center around currents and voltages in the circuits. During the last decade, the electromagnetic character of power electronic converters became more important due to the noise that the switches generate, and electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards have been put in place to control the electromagnetic noise levels. In this contribution, it is argued that coming to grips with the electromagnetic operation of switch-mode power conversion presents a barrier of knowledge that will have to be crossed in order to achieve future meaningful innovation in switch-mode power conversion. Rigorous electromagnetic analysis using realistic parameters are used to indicate important issues relating fundamental limits and technological paths for future generations of power electronic converters. Electromagnetic integration in three dimensions creates new possibilities to increase power densities     

Radiated emissions and immunity of microstrip transmission lines:theory and reverberation chamber measurements

The increasing complexity of electronic systems has introduced an increased potential for electromagnetic interference (EMI) between electronic systems. We analyze the radiation from a microstrip transmission line and calculate the total radiated power by numerical integration. Reverberation chamber methods for measuring radiated emissions and immunity are reviewed and applied to three microstrip configurations. Measurements from 200 to 2000 MHz are compared with theory, and excellent agreement is obtained for two configurations that minimize feed cable and finite ground plane effects. Emissions measurements are found to be more accurate than immunity measurements because the impedance mismatch of the receiving antenna cancels when the ratio of the microstrip and reference radiated power measurements is taken. The use of two different receiving antenna locations for emissions measurements illustrates good field uniformity within the chamber     

基于时频分析的电磁脉冲耦合效应研究*

为了解高功率电磁脉冲对电子系统的干扰与毁伤影响,利用基于Wigner鄄Ville 分布的时频分析方法对耦合进电子系统内部的电磁信号进行了特征分析。与单独的时域分析和频域分析相比,时频分析不仅能够得到信号的时域特征和频域特征,还能同时得到信号各频率分量随时间的变化情况。利用瞬态极化时频分析,进一步得到信号极化状态在时频域的分布。仿真结果表明,时频分析得到的结果更全面详细,可以根据时频分析得到的信号特征更加准确地指导电子系统的高功率电磁脉冲防护加固。     

电力电子系统集成化的前景概述

本文阐述通过先进的集成化改进功率处理技术的可能方向。其中心焦点是除了电力半导体开关组件的集成化外还应推动电磁功率无源元件、电磁干扰滤波器、和电力变换器中的控制、传感、互联结构等的集成化。文中将讨论电子功率处理的基本功能、材料、流程、划分与集成的途径以及将来的概念。     

Key technologies for system-integration in the automotive and Industrial Applications

System integration and high power density of monolithic and multichip designs are the driving force for the progress in power electronic systems. The whole system has to be considered and optimized to meet this target and to keep the overall ruggedness, sensitivity toward electromagnetic interference and long term reliability, Silicon utilization system reliability and power units miniaturization are the key factors. In this paper new technologies, advanced devices concepts and future system aspect for system-integration in the automotive and industrial segments are discussed. In both fields of applications these are huge requirements toward system dynamic characteristic, overload capability, ruggedness behavior and reliability. In the automotive segment technologies working at high operating temperatures are required and in the industrial are high blocking voltage capabilities are needed.     

Technology trends toward a system-in-a-module in power electronics

Currently, assemblies of power semiconductor switches and their associated drive circuitry are available in modules. From a few 100 watts downward, one finds silicon monolithic technology as the integration vehicle, while upward into the multi-kilowatt range, mixed mode module construction is used. This incorporates monolithic, hybrid, surface mount and wirebond technology. However, a close examination of the applications in motor drives and power supplies indicates that there has been no dramatic volume reduction of the subsystem. The power semiconductor modules have shrunk the power switching part of the converter, but the bulk of the subsystem volume still comprises the associated control, sensing, electromagnetic power passives and interconnect structures. The paper addresses the improvement of power processing technology through advanced integration of power electronics. The goal of a subsystem in a module necessitates this advanced integration. The central philosophy of this technology development research is to advance the state of the art by providing the concept of integrated power electronics modules (IPEMs). The technology underpinning such an IPEM approach is discussed. The fundamental functions in electronic power processing, the materials, processes and integration approaches and future concepts are explained.     

An approach to deal with packaging in power electronics

Current packaging technology in power electronics is based on assembling pre-manufactured discrete components. Each component consists of a number of parts, manufactured in a variety of manufacturing processes. This has resulted in a diversity of construction parts and mutually incompatible manufacturing processes in a typical power electronic converter and has brought power electronics to the edge where it becomes extremely difficult to reduce the cost and size of power electronic converters. This also makes integration of power electronic converters difficult. In this paper, we present a way to improve the physical construction of power electronic converters by increasing level of integration and using multifunctional construction parts. integration and packaging are two important aspects of physical construction of power electronic converters. Both of them and their mutual relationship are discussed in the paper. Three quantities intended to evaluate integration level and volumetric utilization namely functional elements integration level, K/sub I/; packaging elements integration level K/sub P/; and volumetric packaging efficiency /spl eta//sub v/ are introduced. Based on these values, a number of techniques to increase the integration level are presented. A design process in the form of a flowchart intended to implement these techniques in concrete design cases is presented.     

非磁性小粒子散射的磁偶极贡献

采用磁偶极子和电四极子模型下的静场近似方法 ,得到了球形小粒子电磁散射场的两个高阶项 ,其大小正比于粒子半径的五次方 ,它和Mie级数解中对应的两项近似结果完全一致 ,从而可以将Mie级数解中这两项解释为磁偶极和电四极项散射的贡献。该方法仅要求粒子的几何尺寸的平方远小于波长的平方 ,在该条件下可将这种方法推广应用到非球形粒子 ,并给出了椭球和矩形两种非球形小粒子磁偶极散射贡献的理论计算公式 ,其结果与FDTD数值模拟结果有很好的一致性。     

Scaling laws for coupling quantities on EMP

A set of scaling laws relating three-potential electromagnetic coupling quantities to three electromagnetic pulse (EMP) characteristics is derived. The electromagnetic coupling quantities are an attempt to characterize, in a very rough sense, the ability of an electromagnetic wave to induce an electronic upset in an electric circuit. The coupling quantities used are chosen based on voltage transients, power transients, and energy-induced overload as mechanisms for electronic upset. The independent quantities in the scaling laws are chosen to be the pulse rise time, peak field, and total energy density     

Power electronic drives for magnetically triggered gels

Properly fabricated polymer gels exhibit an abrupt change in volume in response to a small change in an environmental parameter, such as temperature. The authors have developed gels that change in volume in response to an applied alternating magnetic field, and are working to apply these gels as actuators. This paper describes power electronic circuits suitable for electromagnetic activation of these polymer gels. Issues in the selection of circuit topologies for this application are discussed. Experimental results are presented, which demonstrate the magnetic activation of gels using prototype power electronic drives     

用频装备带内双频窄谱电磁辐射阻塞干扰效应预测模型

针对传统单频连续波电磁辐射敏感度试验方法无法满足用频装备多辐射源共同作用下复杂电磁环境适应性评估的技术需求，本着有限目标的原则，对用频装备在带内双频窄谱电磁辐射作用下的阻塞干扰效应预测问题进行了研究.从用频装备单频和调幅连续波敏感度试验数据出发，基于用频装备带内电磁能量耦合及共性干扰、损伤作用机理分析，研究了有效值敏感和峰值敏感两类用频装备带内双频窄谱电磁辐射阻塞干扰效应预测模型并提出了预测方法，给出了受试用频装备适用预测模型的判定方法，并以某型超短波通信电台为受试对象，试验验证了模型及方法的有效性.研究结果表明:本文提出的模型和方法可有效应用于用频装备在带内双频电磁辐射作用下的阻塞干扰效应预测和评估.     

基于大功率电子器件的冷控系统设计

随着电子元器件的集成化程度越来越高,散热问题已经成为制约电子技术发展的主要因素之一.有效解决电子元器件的散热问题已经成为当前研究的热点问题.传统的风冷系统已经很难满足其散热要求.为此,以电子设备的水冷系统为研究对象,以ATmega 1280微处理器作为基础,设计了一款低成本、高效率的大功率电子器件的水冷控制系统,对系统各关键硬件模块做了详细的介绍,并采用模块化的方法给出了系统的软件架构.综合实验结果表明该系统操作方便、可靠性好、电磁兼容性强,具有较高的实用价值.     

Progress in the methodologies for the electrical modeling ofinterconnects and electronic packages

The rapid growth of the electrical modeling and analysis of the interconnect structure, both at the electronic chip and package level, can be attributed to the increasing importance of the electromagnetic properties of the interconnect circuit on the overall electrical performance of state-of-the-art very large scale integration (VLSI) systems. With switching speeds well below 1 ns in today's gigahertz processors, and VLSI circuit complexity exceeding the 100 million transistors per chip mark, power and signal distribution is characterized by multigigahertz bandwidth pulses propagating through a tightly coupled three-dimensional wiring structure that exhibits resonant behavior at the upper part of the spectrum. Consequently, in addition to the inductive and capacitive coupling, present between adjacent wires across the entire frequency bandwidth, distributed electromagnetic effects, manifested as interconnect-induced delay, reflection, radiation, and long-range nonlocal coupling, become prominent at high frequencies, with a decisive impact of overall system performance. The electromagnetic nature of such high-frequency effects, combined with the geometric complexity of the interconnect structure, make the electrical design of today's performance-driven systems extremely challenging. Its success is heavily dependent on the availability of sophisticated electromagnetic modeling methodologies and computer-aided design tools. This paper presents an overview of the different approaches employed today for the development of an electromagnetic modeling and simulation framework that can effectively tackle the complexity of the interconnect circuit and facilitate its design. In addition to identifying the current state of the art, an assessment is given of the challenges that lie ahead in the signal integrity-driven electrical design of tomorrow's performance- and/or portability-driven, multifunctional ULSI systems     

Comprehensive Electromagnetic Modeling of On-Chip Switching Noise Generation and Coupling

A comprehensive modeling methodology is presented for the investigation of on-chip noise generation and coupling due to power switching. The backbone of the methodology is an electromagnetic model for the on-chip portion of the power grid. This allows for the impact of the displacement current density and, hence, electromagnetic retardation, to be taken into account in the accurate modeling of the power grid behavior at picosecond switching speeds. In this manner, and through the interfacing of this model with an electromagnetic model for the package portion of the power grid, which is described in terms of a multiport rational matrix transfer function, the impact of package-chip electrical interactions on switching noise can be modeled with electromagnetic accuracy. The electromagnetic model for the power grid is complemented by a resistance-capacitance model for the semiconductor substrate, which is capable of modeling local substrate induced noise coupling between neighboring circuits. Finally, distributed resistance, inductance, capacitance and conductance circuits for signal wires are extracted and used to provide for a transmission line-based modeling of crosstalk and power grid induced signal degradation. Transient simulations using the proposed comprehensive model are carried out using a hybrid time-domain integration scheme which combines a SPICE-like engine for the analysis of all circuit netlists and the nonlinear drivers incorporated in the model with a numerical integration algorithm suitable for the expedient update of the state variables in the discrete electromagnetic model for the power grid.      

电子式电流互感器采样电路的计算与测试

电力系统中一个非常重要的高压设备就是电流互感器,在测量电流与继电保护中经常需要使用到电流互感器.传统的电磁式电流互感器虽然具有较高的可靠性、稳定性、丰富的运行经验且原理简单,可是,伴随着电力系统电压等级的不断提高,人们对大容量、远距离互联电网及输电线路也提出了越来越高的要求,电磁式电流互感器已经无法满足人们的需求,此时电子式电流互感器便应运而生了.本文对电子式电流互感器采样电路的计算与测试进行了探讨,可供参考.     

超短波通信干扰站空间电磁兼容性分析

针对超短波通信干扰站存在非作战方向对己方友邻电子设备无意干扰的问题,采用HFSS软件与空间功率合成理论相结合的方法计算干扰天线空域远场辐射特性,依据电磁干扰预测方程得到了友邻电子设备接收机灵敏度同不受干扰时放置距离的关系,为电子对抗装备作战使用提供了理论依据。     

开关电源的电磁兼容设计

近年来,电磁兼容技术已成为现代电子系统工程设计中的重要组成部分。开关电源是电子系统中主要干扰源之一,如何提高它的电磁兼容性问题显得越来越突出。本文主要从几个方面讨论了开关电源电磁兼容设计要注意的问题。     

Integrating active, passive and EMI-filter functions in power electronics systems:a case study of some technologies

Assemblies of power semiconductor switches and their associated drive circuits are at present available in modules. Upward into the multi-kilowatt range, mixed mode module construction is used. This incorporates monolithic, hybrid, surface mount, and wirebond technology. However, a close examination of the applications in motor drives and power supplies indicates that there has been no dramatic volume reduction of the subsystem. The power semiconductor modules have shrunk the power switching part of the converter, but the bulk of the subsystem volume still comprises the associated control, sensing, electromagnetic power passives (inductors, transformers, capacitors) and interconnects. This paper addresses the improvement of power processing technology through advanced integration of power electronics. The goal of a subsystem in a module necessitates this advanced integration, incorporating active switching stages, electromagnetic interference (EMI) filters, and electromagnetic power passives into modules by integration technology. The central philosophy of the technology development research in the National Science Foundation Engineering Research Center for Power Electronic Systems is to advance the state of the art by providing the concept of integrated power electronics modules (IPEMs) for all these functions. The technology underpinning such an IPEM approach is discussed.     

高功率微波及核电磁脉冲的防护问题

本文扼要地介绍了两种应引起广泛注意的人为高频电磁干扰源——高功率微波(HPM)及核电磁脉冲(NEMP),讨论了它们产生的机制、主要特性、对电子电力系统的效应以及防护的原则.这是目前国外积极发展地区性强大破坏力武器的趋向,因此必须引起严重注意,了解其特性,加以防范.但对于大面积范围的高频、高功率电磁干扰的防护非常复杂,涉及的面很广,是电磁干扰防护和电磁兼容研究的新课题,本文对此进行了初步的探讨.     

开关电源EMI滤波器设计与验证

开关电源已广泛应用于电力电子设备中,作为一种EMI源,在设计电源电路中需前置EMI滤波器抑制传导干扰。CE102作为检测电源线传导干扰的一项电磁兼容性试验,成为电子设备尤其是军用电子设备的必测项目,测试超标即意味着设计的失败。设计了一个EMI滤波器,通过CE102测试和分析发现并解决设计存在的问题,并通过整改后的试验验证,证明设计的有效性。