Precise Modeling Framework for Short-Channel Double-Gate and Gate-All-Around MOSFETs

A precise modeling framework for short-channel nanoscale double-gate (DG) and gate-all-around (GAA) MOSFETs is presented. For the DG MOSFET, the modeling is based on a conformal mapping analysis of the potential distribution in the device body arising from the interelectrode capacitive coupling, combined with a self-consistent procedure to include the effects of the inversion charge. The DG interelectrode coupling, which dominates the subthreshold behavior of the device, can also be applied with a high degree of precision to the cylindrical GAA MOSFET by performing a simple geometric scaling transformation to account for the difference in gate control in the two devices. Near threshold, self-consistent procedures invoking Poisson's equation in combination with boundary conditions and suitable modeling expressions for the potential are applied to the two devices. In strong inversion, these solutions converge to those of the respective long-channel devices. The drain current is calculated as part of the self-consistent treatment. The results for both the electrostatics and the current are in excellent agreement with numerical simulations.     

DICE: A Beneficial Short-Channel Effect in Nanoscale Double-Gate MOSFETs

Physics-based compact modeling, supported by numerical simulations, is used to show the significance of "drain-induced charge enhancement" (DICE) in nanoscale double-gate (DG) MOSFETs. DICE, which is the strong-inversion counterpart of drain-induced barrier lowering (DIBL), is shown to significantly benefit drive current, without affecting the gate capacitance much, and hence can improve nanoscale DG CMOS speed substantially.     

Semianalytical Modeling of Short-Channel Effects in Lightly Doped Silicon Trigate MOSFETs

A simple analytical expression of the 3-D potential distribution along the channel of lightly doped silicon trigate MOSFETs in weak inversion is derived, based on a perimeter-weighted approach of symmetric and asymmetric double-gate MOSFETs. The analytical solution is compared with the numerical solution of the 3-D Poisson's equation in the cases where the ratios of channel length/silicon thickness and channel length/channel width are ges 2. Good agreement is achieved at different positions within the channel. The perimeter-weighted approach fails at the corner regions of the silicon body; however, by using corner rounding and undoped channel to avoid corner effects in simulations, the agreement between model and simulation results is improved. By using the extra potential induced in the silicon film due to short-channel effects, the subthreshold drain current is determined in a semianalytical way, from which the subthreshold slope, the drain-induced barrier lowering, and the threshold voltage are extracted.     

Compact Subthreshold Current Modeling of Short-Channel Nanoscale Double-Gate MOSFET

A physics-based compact subthreshold current model for short-channel nanoscale double-gate MOSFETs is presented. The potential is modeled using conformal mapping techniques in combination with parabolic approximations. For subthreshold conditions, we have assumed that the electrostatics is dominated by capacitive coupling between the body electrodes. Hence, the potential is obtained as an analytical solution of the 2-D Laplace equation. The current modeling is based on drift-diffusion theory. The modeling results are in good agreement with those of numerical simulations without the use of adjustable parameters.     

A Quasi-Two-Dimensional Compact Drain–Current Model for Undoped Symmetric Double-Gate MOSFETs Including Short-Channel Effects

A drain-current model for undoped symmetric double-gate MOSFETs is proposed. Channel-length modulation and drain-induced barrier lowering are modeled by using an approximate solution of the 2D Poisson equation. The new model is valid and continuous in linear and saturation regimes, as well as in weak and strong inversions. Excellent agreement was found with Silvaco-ATLAS simulations.     

对称三材料双栅应变硅MOSFET亚阈值电流与亚阈值斜率解析模型

基于泊松方程和边界条件,推导了对称三材料双栅应变硅金属氧化物半导体场效应晶体管（MOSFET：metal oxide semiconductor field effect transistor）的表面势解析解.利用扩散-漂移理论,在亚阈值区电流密度方程的基础上,提出了亚阈值电流与亚阈值斜率二维解析模型.分析了沟道长度、功函数差、弛豫SiGe层的Ge组份、栅介质层的介电常数、应变硅沟道层厚度、栅介质高k层厚度和沟道掺杂浓度等参数对亚阈值性能的影响,并对亚阈值性能改进进行了分析研究.研究结果为优化器件参数提供了有意义的指导.模型解析结果与DESSIS仿真结果吻合较好.     

Si/Ge异质结双栅隧穿场效应晶体管TCAD仿真研究

Si/Ge异质结双栅隧穿场效应晶体管(DGTFET)较传统硅基DGTFET有更好的电学性能。文章基于Sentaurus TCAD仿真软件,构建了有/无Pocket两种结构的Si/Ge异质结DGTFET器件,定量研究了Pocket结构及Pocket区厚度、掺杂浓度等参数对器件开态电流、关态电流、亚阈值摆幅、截止频率和增益带宽积的影响。通过仿真实验和计算分析发现,Si/Ge异质结DGTFET的开态/关态电流、亚阈值摆幅、截止频率和增益带宽积随Pocket区掺杂浓度增大而增大,而Pocket区厚度对器件性能没有明显影响。研究结果为TFET器件的直流、频率特性优化提供了指导。     

Hot Carrier Effects in Wireless Communication Systems Built on Short-Channel MOSFETs

Phase noise is a critical factor that degrades the synchronization performance of a wireless communication receiver. Hot-carriers (HCs), found in the CMOS synchronization devices, are high-energy charge-carriers that can degrade the MOSFETs performance by damaging the internal device structure and lead to the phase noise increase therein. Such incremental phase noise can be related to the essential parameter, namely the MOSFET threshold voltage due to the HC effect, which is particularly evident in the short-channel MOSFET devices. In this letter, we analyze the impact of the phase noise arising from the HC effect on the wireless systems in terms of the bit-error-rate (BER) and the signal-to-interference-plus-noise ratio (SINR).     

Modeling of Short-Channel Effects in Organic Thin-Film Transistors

We propose a model for short-channel organic thin-film transistors, which accounts for Poole-Frenkel field-dependent mobility and space-charge-limited current effects. The model is developed for devices operating in the linear regime, as well as in depletion and saturation regimes. Super linear output curves for low drain voltages, as well as nonsaturating currents, can be adequately described. Experimental results for short-channel P3HT devices have been fitted, showing good agreement with the proposed model.     

Compact-Modeling Solutions For Nanoscale Double-Gate and Gate-All-Around MOSFETs

Compact-modeling principles and solutions for nanoscale double-gate and gate-all-around MOSFETs are explained. The main challenges of compact modeling for these devices are addressed, and different approaches for describing the electrostatics, the transport mechanisms, and the high-frequency behavior are explained. Several approximations used to derive analytical solutions of Poisson's equation for doped and undoped devices are discussed, and the need for self-consistency with SchrÖdinger's equation and with the current continuity equation resulting from the transport models is addressed. Several techniques to extend the compact modeling to the high-frequency regime and to study the RF performance, including noise, are presented and discussed.     

Explicit Continuous Models for Double-Gate and Surrounding-Gate MOSFETs

Explicit continuous models for both double-gate (DG) and surrounding-gate (SG) MOSFETs are presented. These models evolve from previous DG and SG MOSFETs models, which need to solve implicit equations for intermediate parameters by numerical iteration or the table lookup method. By developing approximate explicit solutions for the intermediate parameters, we can express the drain current, terminal charge, transconductance, and transcapacitance as explicit functions of applied voltages as well as the structural parameters. High accuracy and efficiency, combined with inherited favorable features from the previous models, make these new models suitable for circuit simulation programs.     

Explicit Analytical Charge and Capacitance Models of Undoped Double-Gate MOSFETs

An analytical, explicit, and continuous-charge model for undoped symmetrical double-gate (DG) MOSFETs is presented. This charge model allows obtaining analytical expressions of all total capacitances. The model is based on a unified-charge-control model derived from Poisson's equation and is valid from below to well above threshold, showing a smooth transition between the different regimes. The drain current, charge, and capacitances are written as continuous explicit functions of the applied bias. We obtained very good agreement between the calculated capacitance characteristics and 2-D numerical device simulations, for different silicon film thicknesses.     

双栅双应变沟道全耗尽SOI MOSFETs的特性分析

提出了一种全新的器件结构--双栅双应变沟道全耗尽SOI MOSFETs,模拟了沟道长度为25nm时器件的电学特性.工作在单栅模式下,应变沟道(Ge=0.3)驱动能力与体Si沟道相比,nMOS提高了43%,pMOS提高了67%;工作在双栅模式下,应变沟道(Ge=0.3)与体Si沟道相比较,驱动电流的提高nMOS为31%,pMOS为60%.仿真结果表明,双栅模式比单栅模式有更为陡直的亚阈值斜率,更高的跨导以及更强的抑制短沟道效应的能力.综合国内外相关报道,该结构可以在现今工艺条件下实现.     

双栅双应变沟道全耗尽SOI MOSFETs的特性分析

提出了一种全新的器件结构--双栅双应变沟道全耗尽SOI MOSFETs,模拟了沟道长度为25nm时器件的电学特性.工作在单栅模式下,应变沟道(Ge=0.3)驱动能力与体Si沟道相比,nMOS提高了43%,pMOS提高了67%;工作在双栅模式下,应变沟道(Ge=0.3)与体Si沟道相比较,驱动电流的提高nMOS为31%,pMOS为60%.仿真结果表明,双栅模式比单栅模式有更为陡直的亚阈值斜率,更高的跨导以及更强的抑制短沟道效应的能力.综合国内外相关报道,该结构可以在现今工艺条件下实现.     

Threshold Voltage Model of Short-Channel FD-SOI MOSFETs With Vertical Gaussian Profile

A novel approximation of 2-D potential function perpendicular to the channel for fully depleted (FD) silicon-on-insulator (SOI) MOSFETs on films with vertical Gaussian profile is proposed in the paper, then an analytical threshold voltage model is derived. The model agrees well with the MEDICI numerical simulation results. It represents a feasible way to find the threshold voltage and gives some reference points in developing new 2-D models for nonuniform FD-SOI devices.     

Experimental Evaluation of Circuit-Based Modeling of the NBTI Effects in Double-Gate FinFETs

In this work, an example of practical implementation of the auxiliary sub-circuit (ASC) for modeling of the NBTI effects in DG FinFETs is described. A good agreement between the simulated and measured electrical characteristics of p-type DG FinFETs fabricated in SOI technology has been obtained using the industry-standard BSIM-CMG model with ASC. The oxide and interface trap densities are extracted in Spice simulations by tuning the ASC trapped charge parameters to fit the NBTI experimental data. The increase of oxide and interface trapped charge in p-type DG FinFET device is found to follow the logarithmic dependence with NBTI stress time.     

Short-Channel Effects in Independent-Gate FinFETs

A physics-based model is used to examine short-channel effects (SCEs) in undoped nanoscale independent-gate FinFETs, e.g., the MIGFET (L. Mathew, , Proc. IEEE Internat. SOI Conf., p. 187, 2004). Predicted current-voltage characteristics of MIGFETs in the single-gate mode show that the SCEs (threshold-voltage rolloff, subthreshold-swing degradation, and drain-induced barrier lowering) are actually less severe than those of the device in the double-gate mode. Insightful explanations of the results are given     

A Review of Core Compact Models for Undoped Double-Gate SOI MOSFETs

In this paper, we review the compact-modeling framework for undoped double-gate (DG) silicon-on-insulator (SOI) MOSFETs. The use of multiple gates has emerged as a new technology to possibly replace the conventional planar MOSFET when its feature size is scaled to the sub-50-nm regime. MOSFET technology has been the choice for mainstream digital circuits for very large scale integration as well as for other high-frequency applications in the low-gigahertz range. But the continuing scaling of MOSFET presents many challenges, and multiple-gate, particularly DG, SOI devices seem to be attractive alternatives as they can effectively reduce the short-channel effects and yield higher current drive. Core compact models, including the analysis for surface potential and drain-current, for both the symmetric and asymmetric DG SOI MOSFETs, are discussed and compared. Numerical simulations are also included in order to assess the validity of the models reviewed     

对称薄膜双栅nMOSFET模型的研究

利用对称薄膜双栅MOSFET在阈值电压附近硅膜中的常电位近似,以硅膜达到体反型时的泊松方程为基础,得到一个有效的双栅nMOS器件模型.考虑到薄膜双栅SOI器件的体反型特性,阈值电压处的表面势不再受限于传统的强反型界限(指2倍费米势),并运用跨导最大变化(TC)法对此模型进行分析,得到阈值电压和阈值电压处表面势的详细表达式;另外,还演示了薄膜双栅MOSFET的近乎完美的亚阈值斜率特性,其数值模拟结果与文献实验结果吻合较好.