High performance 0.1 μm gate-length p-type SiGe MODFET's andMOS-MODFET's

High performance p-type modulation-doped field-effect transistors (MODFET's) and metal-oxide-semiconductor MODFET (MOS-MODFET) with 0.1 μm gate-length have been fabricated on a high hole mobility SiGe-Si heterojunction grown by ultrahigh vacuum chemical vapor deposition. The MODFET devices exhibited an extrinsic transconductance (g_m) of 142 mS/mm, a unity current gain cut-off frequency (f_T) of 45 GHz and a maximum oscillation frequency (f_MAX) of 81 GHz, 5 nm-thick high quality jet-vapor-deposited (JVD) SiO₂ was utilized as gate dielectric for the MOS-MODFET's. The devices exhibited a lower gate leakage current (1 nA/μm at V_gs=6 V) and a wider gate operating voltage swing in comparison to the MODFET's. However, due to the larger gate-to-channel distance and the existence of a parasitic surface channel, MOS-MODFET's demonstrated a smaller peak g _m of 90 mS/mm, f_T of 38 GHz, and f_max of 64 GHz. The threshold voltage shifted from 0.45 V for MODFET's to 1.33 V for MOS-MODFET's. A minimum noise figure (NF_min) of 1.29 dB and an associated power gain (G_a) of 12.8 dB were measured at 2 GHz for MODFET's, while the MOS-MODFET's exhibited a NF _min of 0.92 dB and a G_a of 12 dB at 2 GHz. These DC, RF, and high frequency noise characteristics make SiGe/Si MODFET's and MOS-MODFET's excellent candidates for wireless communications     

Determination of carrier saturation velocity in short-gate-length modulation-doped FET'S

Based on a combined carrier saturation velocity/charge-control model, measured drain saturation current, small-signal transconductance and channel conductance data have been analyzed with consistency for the determination of the effective carrier saturation velocity using 1-µm gate-length MODFET's. The results demonstrate the validity of the model in the mid-range of gate bias voltage and indicate the extent of deviations that occur due to different physical processes in the lower and higher gate bias ranges.     

Highly doped InGaP/InGaAs/GaAs pseudomorphic HEMT's with 0.35 μmgates

We fabricated 0.35-μm gate-length pseudomorphic HEMT DCFL circuits using a highly doped thin InGaP layer as the electron supply layer. The InGaP/InGaAs/GaAs pseudomorphic HEMT grown by MOVPE is suitable for short gate-length devices with a low supply voltage since it does not show short channel effects even for gate length down to 0.35 μm. We obtained a K value of 555 mS/Vmm and a transconductance g_m of 380 mS/mm for an InGaP layer 18.5 nm thick. Fabricated 51-stage ring oscillators show the basic propagation delay of 11 ps and the power-delay product of 7.3 fJ at supply voltage of V_DD of 1 V, and 13.8 ps and 3.2 fJ at V_DD of 0.6 V for gates 10 μm wide     

Fabrication and characterization of a depletion-mode ZnS0.07Se0.93 MESFET

We report the fabrication and characterization of a depletion-mode n-channel ZnS_0.07Se_0.93 metal-semiconductor field effect transistor (MESFET). A ZnSSe FET could be a key element in opto-electronic integration consisting of light emitters, light receivers and MESFET pre-amplifiers. Mesa isolation, recess etching and self-alignment techniques were adopted to optimize the MESFET performance. Source and drain (S/D) ohmic contacts and gate Schottky contact were formed by Cr/In/Cr and Au deposition, respectively. Depletion mode FET's with varying gate width-to-length ratio of W/L=200 μm/20 μm, 200 μm/4 μm and 200 μm/2 μm were fabricated. A 2 μm FET was characterized as follows: the turn-on voltage, V_on≈1.75 V, the pinch-off voltage, V_p≈-13 V, the unit transconductance, g_m≈8.73 mS/mm, and the breakdown voltage with zero gate-source bias, BV≈28 V     

Demonstration of submicron depletion-mode GaAs MOSFETs withnegligible drain current drift and hysteresis

We successfully fabricated submicron depletion-mode GaAs MOSFETs with negligible hysteresis and drift in drain current using Ga₂ O₃(Gd₂O₃) as the gate oxide. The 0.8-μm gate-length device shows a maximum drain current density of 450 mA/mm and a peak extrinsic transconductance of 130 mS/mm. A short-circuit current gain cutoff frequency (f_T) of 17 GHz and a maximum oscillation frequency (f_max) of 60 GHz were obtained from the 0.8 μm×60 μm device. The absence of drain current drift and hysteresis along with excellent characteristics in the submicron devices is a significant advance toward the manufacture of commercially useful GaAs MOSFETs     

Utilization of an electron beam resist process to examine theeffects of asymmetric gate recess on the device characteristics ofAlGaAs/InGaAs PHEMTs

The DC and microwave characteristics of two sets of AlGaAs/InGaAs PHEMTs having a gate length of 0.2 μm are compared. The first set is composed of devices fabricated using a trilayer electron beam resist process for T-gate recess and metallization. The second set is composed of devices fabricated using a new four-layer electron beam resist process which enables the asymmetric placement of a T-gate in a wide recess trench. Devices fabricated using the four-layer resist process showed improved breakdown voltage, lower gate-drain feedback capacitance, lower output conductance, and higher f_max with only slight reduction of drain current and transconductance. For example, the off-state drain-source breakdown voltage increased from 5.2 to 12.5 V, and the f_max, increased from 133 to 158 GHz as the drain side cap recess, L_ud, was increased from 0 to 0.55 μm     

Fabrication of depletion-mode GaAs MOSFET with a selectiveoxidation process by using metal as the mask

The n-channel depletion-mode GaAs MOSFETs with a selective liquid phase chemical-enhanced oxidation method at low temperature by using metal as the mask (M-SLPCEO) are demonstrated. The proposed process can simplify one mask to fabricate GaAs MOSFET and grow reliable gate oxide films as well as side-wall passivation layers at the same time. The 1 μm gate-length MOSFET with a gate oxide thickness of 35 nm shows a transconductance of 90 mS/mm and a maximum drain current density larger than 350 mA/mm. In addition, a short-circuit current gain cutoff frequency f_T of 6.5 GHz and a maximum oscillation frequency f _max of 18.3 GHz have been achieved from the 1 μm×100 μm GaAs MOSFET     

0.3-μm gate-length enhancement mode InAlAs/InGaAs/InPhigh-electron mobility transistor

The fabrication and performance of ultra-high-speed 0.3-μm gate-length enhancement-mode high-electron-mobility transistors (E-HEMT's) are reported. By using a buried platinum-gate technology and incorporating an etch-stop layer in the heterostructure design, submicron E-HEMT devices exhibiting both high-threshold voltages and excellent threshold voltage uniformity have been achieved. The devices demonstrate a threshold voltage of +171 mV with a standard deviation of only 9 mV. In addition, a maximum DC extrinsic transconductance of 697 mS/mm is measured at room temperature. The output conductance is 22 mS/mm, which results in a maximum voltage gain (g_m/g₀ ) of 32. The devices show excellent RF performance, with a unity current-gain cutoff frequency (f_t) of 116 GHz and a maximum frequency of oscillation (f_max) of 229 GHz. To the best of the authors' knowledge, these are the highest reported frequencies for lattice-matched E-HEMT's on InP     

Two-dimensional metal-semiconductor field effect transistor forultra low power circuit applications

We describe a novel 2-dimensional metal-semiconductor field effect transistor (2-D MESFET) in which opposing Schottky side gates formed on the sidewall of a modulation-doped AlGaAs-InGaAs heterostructure modulate the channel width and the drain current. The drain current ranged from 0 to 210 μA and the maximum measured transconductance was 212 μS (212 mS/mm) at room temperature for a 1×1 micron channel. The threshold voltage was -0.45 V and the subthreshold ideality factor was 1.30. The estimated gate capacitance was 0.8 fF/μm, or about half the equivalent capacitance of conventional HFET's. The cutoff frequency f_T was estimated to be 21 GHz. The narrow channel effect, which limits the minimum power consumption in conventional FET's, is practically eliminated in this device     

Microwave performance of ion-implanted InP JFETs

These devices have a planar structure with the channel and gate regions formed by the selective implantation of silicon and beryllium into an Fe-doped semi-insulating InP substrate. The nominal gate length is 2 μm with a channel doping of 10¹⁷ cm^-3 and thickness of 0.2 μm. The measured values of f_T and f_max are 10 and 23 GHz, respectively. Examination of the equivalent circuit parameters and their variation with bias led to the following conclusions: (a) a relatively gradual channel profile results in lower than desired transconductance, but also lower gate-to-channel capacitance; (b) although for the present devices, the gate length and transconductance are the primary performance-limiting parameters, the gate contact resistance also reduces the power gain significantly; (c) the output resistance appears lower than that of an equivalent GaAs MESFET, and requires a larger V_DS to reach its maximum value; and (d) a dipole layer forms and decouples the gate from the drain with a strength that falls between that of previously reported GaAs MESFETs and InP MESFETs     

GaAs-MISFETs with insulating gate films formed by direct oxidation and by oxinitridation of recessed GaAs surfaces

Direct oxidation by an ultraviolet (UV) and ozone process and oxinitridation (plasma nitridation after oxidation) of GaAs surfaces were used to form nanometer-scale gate insulating layers for depletion-type recessed gate GaAs-MISFETs. The drain current-drain voltage characteristics of the oxide gate devices exhibit lower transconductance (max. 40 mS/mm), lower breakdown voltage and smaller gate capacitance than the oxinitrided gate devices. The presence of hysteresis in the oxide gate devices is also apparent. The maximum transconductance of the oxinitrided gate devices is 110 mS/mm and they have a sharper pinch-off, compared to the oxide gate devices. In addition, no hysteresis is observed in their current voltage curves. The current gain cutoff frequency of 1.4 /spl mu/m gate-length FETs for both types is 6 GHz. These results correspond well with results obtained from characterization of these insulating films.     

GaAs MOSFETs fabrication with a selective liquid phase oxidizedgate

The N-channel depletion-mode GaAs MOSFETs with a liquid phase chemical enhanced selective gate oxide grown at low temperature are demonstrated. The proposed selective oxidation method makes the fabrication process of GaAs MOSFETs more reliable and self side-wall passivation possible. The fabricated GaAs MOSFETs exhibit current-voltage characteristics with complete pinch-off and saturation characteristics. The 2 μm gate-length MOSFETs with a gate oxide thickness of 35 nm show transconductance larger than 80 mS/mm and maximum drain current density of 380 mA/mm. In addition, microwave characteristics with f_T of 1.8 GHz and f_max of 5.2 GHz have been achieved from the 3 μm×60 μm GaAs MOSFETs     

Short channel AlGaN/GaN MODFET's with 50-GHz fT and1.7-W/mm output-power at 10 GHz

A thin barrier-donor layer of 200 Å was used to increase the active input capacitance and improve the extrinsic current-gain cutoff frequency (f_t) of short-gate-length AlGaN/GaN MODFETs. 0.2-μm gate-length devices fabricated on such an epi-structure with sheet carrier density of ~8×10¹² cm^-2 and mobility of 1200 cm²/Vs showed a record f_t of 50 GHz for GaN based FETs. High channel saturation current and transconductance of 800 mA/mm and 240 mS/mm respectively were also achieved along with breakdown voltages of 80 V per μm gate-drain spacing. These excellent characteristics translated into a CW output power density of 1.7 W/mm at 10 GHz, exceeding previous record for a solid-state HEMT     

Scaled GaAs MESFET's with gate length down to 100 nm

Fully ion-implanted GaAs depletion MESFET's with gate lengths from 1 µm down to 0.1 µm and with closely spaced source and drain contacts have been fabricated with electron-beam lithography. Gate-length dependence of transconductance, capacitance, output conductance, and threshold voltage is presented. Maximum transconductance obtained was 370 mS/mm for 0.1-µm gate length. The experimental data indicate that shallow implants do indeed result in better devices, but further vertical scaling of the devices is mandatory.     

Reduced short-channel effects in submicron N-HIGFET technologyusing sidewalls

In this letter, 0.35 μm gate length pseudomorphic AlGaAs/InGaAs/GaAs heterostructure insulated-gate field-effect-transistors (HIGFETs) have been fabricated on GaAs. The short-channel effects have been reduced by using a sidewall technology. A high current density and a high transconductance were obtained, reflectively, 510 mA/mm and 550 mS/mm, in addition to a high value of extrinsic current gain cutoff frequency F_T=44 GHz. The dependencies of subthreshold current, threshold voltage, and output conductance on gate length have been emphasised     

High-performance 0.10-μm CMOS devices operating at roomtemperature

The authors have fabricated 0.10-μm gate-length CMOS devices that operate with high speed at room temperature. Electron-beam lithography was used to define 0.10-μm polysilicon gate patterns. Surface-channel type p- and n-channel MOSFETs were fabricated using an LDD structure combined with a self-aligned TiSi₂ process. Channel doping was optimized so as to suppress punchthrough as well as to realize high transconductance and low drain junction capacitance. The fabricated 0.10-μm CMOS devices have exhibited high transconductance as well as a well-suppressed band-to-band tunneling current, although the short-channel effect occurred somewhat. The operation of a 0.10-μm gate-length CMOS ring oscillator has been demonstrated. The operation speed was 27.7 ps/gate for 2.5 V at room temperature, which is the fastest CMOS switching ever reported     

High-Performance Inversion-Type Enhancement-Mode InGaAs MOSFET With Maximum Drain Current Exceeding 1 A/mm

High-performance inversion-type enhancement- mode (E-mode) n-channel In_0.65Ga_0.35As MOSFETs with atomic-layer-deposited Al₂O₃ as gate dielectric are demonstrated. A 0.4-mum gate-length MOSFET with an Al₂O₃ gate oxide thickness of 10 nm shows a gate leakage current that is less than 5 times 10^-6 A/cm² at 4.0-V gate bias, a threshold voltage of 0.4 V, a maximum drain current of 1.05 A/mm, and a transconductance of 350 mS/mm at drain voltage of 2.0 V. The maximum drain current and transconductance scale linearly from 40 mum to 0.7 mum. The peak effective mobility is ~1550 cm²/V ldr s at 0.3 MV/cm and decreases to ~650 cm²/V ldr s at 0.9 MV/cm. The obtained maximum drain current and transconductance are all record-high values in 40 years of E-mode III-V MOSFET research.     

Subthreshold Performance of Dual-Material Gate CMOS Devices and Circuits for Ultralow Power Analog/Mixed-Signal Applications

Analog circuits based on the subthreshold operation of CMOS devices are very attractive for ultralow power, high gain, and moderate frequency applications. In this paper, the analog performance of 100 nm dual-material gate (DMG) CMOS devices in the subthreshold regime of operation is reported for the first time. The analog performance parameters, namely drain-current (I_d), transconductance (g_m), transconductance generation factor (g_m/I_d), early voltage (V_A), output resistance (R_o) and intrinsic gain for the DMG n-MOS devices, and and for the DMG p-MOS devices are systematically investigated with the help of extensive device simulations. The effects of different capacitances on the unity-gain frequency are also studied. The DMG CMOS devices are found to have significantly better performance as compared to their single-material gate (SMG) counterpart. More than 70% improvement in the voltage gain is observed for the CMOS amplifiers when dual-material gates, instead of single-material gates, are used in both the n- and p-channel devices.     

High-linearity high-current-drivabilityGa0.51In0.49P/GaAs MISFET usingGa0.51In0.49P airbridge gate structure grown byGSMBE

A novel structure Ga_0.51In_0.49P/GaAs MISFET with an undoped Ga_0.51In_0.49P layer serving as the airbridge between active region and gate pad was first designed and fabricated. Wide and flat characteristics of g_m and f_max versus drain current or gate voltage were achieved. The device also showed a very high maximum current density (610 mA/mm) and a very high gate-to-drain breakdown voltage (25 V). Parasitic capacitances and leakage currents were minimized by the airbridge gate structure and thus high f_T of 22 GHz and high f_max of 40 GHz for 1 μm gate length devices were attained. To our knowledge, both were the best reported values for 1 μm gate GaAs channel FET's     

AlSb/InAs HEMT's for low-voltage, high-speed applications

The design, fabrication, and characterization of 0.1 μm AlSb/InAs HEMT's are reported. These devices have an In_0.4Al _0.6As/AlSb composite barrier above the InAs channel and a p ⁺ GaSb layer within the AlSb buffer layer. The HEMT's exhibit a transconductance of 600 mS/mm and an f_T of 120 GHz at V_Ds=0.6 V. An intrinsic f_T of 160 GHz is obtained after the gate bonding pad capacitance is removed from an equivalent circuit. The present HEMT's have a noise figure of 1 dB with 14 dB associated gain at 4 GHz and V_Ds=0.4 V. Noise equivalent circuit simulation indicates that this noise figure is primarily limited by gate leakage current and that a noise figure of 0.3 dB at 4 GHz is achievable with expected technological improvements. HEMT's with a 0.5 μm gate length on the same wafer exhibit a transconductance of 1 S/mm and an intrinsic f_TL_g, product of 50 GHz-μm