硅PIN光电二极管光谱响应特性的数值模拟计算

对硅PIN光电二极管的光谱响应特性作了详细的分析计算,得到了硅PIN光电二极管光谱响应的计算公式;给出了器件光谱响应曲线的绘制方法.实测数据与公式计算结果吻合较好.讨论了器件工艺参数变化对光谱响应的影响.     

基于HV-CMOS工艺集成PIN光敏元的CMOS传感器设计

PIN光电二极管相对于pn结型光电二极管具有结电容小、量子效率高等优点,但采用标准低压CMOS(LV-CMOS)工艺研制的CMOS传感器只能实现基于n阱/p衬底的pn结光敏元与片上电路的集成,高压CMOS(HV-CMOS)工艺的发展为CMOS电路与PIN光敏元列阵的单片集成提供了可能。基于HV-CMOS工艺设计了一种集成PIN光敏元列阵的CMOS传感器,并对器件的光电响应进行了测试评估。结果表明,集成PIN光敏元的CMOS传感器具有更高的像素增益和量子效率,而暗电流、输出摆幅、线性度等特性保持良好。在500~900nm宽波段范围内,器件的量子效率均达到80%以上,在950nm附近的量子效率达到25%,优于采用其他工艺制作的CMOS传感器。     

基于PERL技术的硅基PIN光电二极管的设计与仿真

缺乏高质量的硅光电接受器件一直制约着全硅光电子回路的发展。分析讨论了PERL太阳能电池的高效光电特性技术,并将其应用于硅光电二极管,设计了一种高响应度,高截止频率的硅基PIN光电二极管的器件结构,说明了该结构的技术特点与制备工艺。使用SUPREM-IV仿真器对该器件进行了模拟仿真,讨论了I层的长度与厚度对器件性能的影响。     

Ⅰ—Ⅴ变换器在光电探测器件测试中的应用

一、引言目前对光电探测器件的光谱响应范围,响应度、量子效率、噪声电流、暗电流等参数的测试中,都遇到如何正确测试其器件“短路”电流的问题。不论是PIN二极管,还是APD二极管,本质上是一个电流源。为使器件产生的信号电流与入射光通量之间保持良好线性关系,其器件必须在低的阻抗线路中工作,最好是采用Ⅰ—Ⅴ变换器的方法。本文仅以Si—RAPD的响应度、响应范围为     

在半绝缘InP衬底上制作用于单片集成的InGaAs PIN光电二极管

用LPE方法在半绝缘InP衬底上制作适用于光电单片集成的InGaAs PIN光电二极管。这种光电二极管具有低的暗电流和高速响应的特点。这种光电二极管在-10V工作电压下,暗电流密度为2.5×10~(-6)A/cm~2。这个值是目前在这种材料系中所报导的最低值。在-5V工作电压下测得光电二极管的外量子效率在1.3μm波长处大于90%。在1.5μm波长处的外量子效率大于83%,这些器件的上升时间小于35PS,半峰值处全宽(FWHM)小于45PS。     

PIN结光电二极管的工艺原理和制造

PIN结构的二极管是一种特殊的电荷存储二极管,由于功耗小速度快等优点而被广泛应用.PIN结构的光电二极管是一种常用的光电探测器.本文阐述了PIN结构的光电二极管的器件特性和工艺制程,指出工艺过程中存在的问题.     

MBE生长的PIN结构碲镉汞红外雪崩光电二极管

对中波红外碲镉汞雪崩光电二极管(APD)特性进行理论计算,获得材料的能量散射因子及电离阈值能级与材料特性的相互关系,从而计算器件的理论雪崩增益与击穿电压.通过对材料特性(组分,外延厚度,掺杂浓度等)的优化,设计并生长了适合制备PIN结构红外雪崩光电二极管的碲镉汞材料,并进行了器件验证.结果显示,在10V反偏电压下,该器件电流增益可达335.     

应用于自由空间光通信的PIN激光信号阵列接收器

针对目前的自由空间光通信存在空间光-光纤难以 有效耦合这一问题,考虑到空间光耦合进入光纤后需要将光信号转换为电信号才能实现通信 ,为此本 文提出直接将空间光信号转换为电信号的思想,设计了一种应用于空间光通信的PIN光电二 极管阵列接收器,每一个PIN光电二极管可 以独立接收空间激光并将其转换为电信号,多个PIN光电二极管通过串联和并联将电信号汇 合以方便后续信号处理。对这一新的接收器进行理论分析和模拟实验的结果表明,新的接收 器能有效提高空间光的接收效率。     

In0.53Ga0.47As/InP高速光电二极管材料生长及光电性能

利用低压MOCVD技术制备PIN结构的InP基InGaAs外延材料。采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次Zn扩散、多层介质膜淀积、Au/Zn p型欧姆接触、Au/Ge/Ni n型欧姆接触等标准半导体平面工艺,设计制造正入射平面In_(0.53)Ga_(0.47)As/InP雪崩光电二极管器件。该器件采用与InP衬底晶格匹配的In_(0.53)Ga_(0.47)As材料做吸收层,InP材料做倍增层,同时引入InGaAsP梯度层。探测器件光敏面直径50μm,器件测试结果表明该器件光响应特性正常,击穿电压约43 V,在低于击穿电压3 V左右可以得到大约10 A/W的光响应度,在0 V到小于击穿电压1 V的偏压范围内,暗电流只有1 nA左右。光电二极管在8 GHz以下有平坦的增益,适用于5 Gbit/s光通信系统。     

用于位置检测的光电二极管参数分析

PIN型光电二极管由于响应速度快,暗电流低,噪声低等特点越来越多地被应用到位置检测中,如何根据设计需求对光电二极管进行选型很重要。通过分析光电二极管的光灵敏度、暗电流、噪声等效功率和响应速度性能参数,分解光电传感器位置检测系统的设计需求,提出了光电二极管的选择依据。     

Backside-illuminated lateral PIN photodiode for CMOS image sensor on SOS substrate

In this paper, we propose a method to design charge-sensing elements for CMOS image sensor pixels on a silicon-on-sapphire (SOS) substrate. To address the low quantum efficiency problem due to very thin active film used, a backside illuminated lateral PIN photodiode on an SOS substrate is proposed and developed. It has the advantages of higher photo response with a PIN structure and improved optical transmission with a backside illumination through a transparent sapphire substrate. An active pixel sensor (APS) based on the PIN and backside illumination has been implemented in a commercially available SOS CMOS process. Acceptable sensitivity in optical conversion from the APS can be achieved, even with the ultrathin silicon film. The APS is demonstrated to function at 1.2 V, giving a dynamic range of 51 dB.     

Development of an integrated high speed silicon PIN photodiodesensor

A silicon integrated PIN photodiode sensor, combined with a bipolar IC on same substrate (that is, a PIN photo integrated circuit sensor: PIN-PICS), was developed by employing a high resistive P^-- epitaxial layer on a P⁺ substrate for creating a high speed and high optical responsivity PIN photodiode. We fabricated this device based on two special techniques: (1) the PIN photodiode is formed on a P^--/P⁺ substrate structure and isolated from bipolar components by the combination of a P^--well and a trench isolation, and (2) bipolar components are formed by the doubly diffused buried layer of the P^--well and the N⁺ collector wall. All of these components, such as npn and pnp transistors, were arranged within the lightly doped P^--well regions. From several kinds of trial samples, the following results were obtained. The PIN photodiode with 0.145 mm² active area indicated 680 MHz for cutoff frequency at 10 V bias with 830 mn radiation. In the case of 20 V bias, this value exceeded 1.5 GHz. This PIN-PICS was applied to a 10 Mbit/s burst mode compatible optical monolithic receiver and a transimpedance amplifier, and it has shown the expected results     

An integrated PIN/MISS OEIC for high current photoreceiverapplications

A new PIN/MISS photoreceiver with very high output current has been developed by using the combination of an amorphous silicon germanium alloy PIN photodiode and a metal-insulator-semiconductor switch (MISS) device. The developed photoreceiver uses a PIN photodiode as the light absorption structure and light wavelength selector and the MISS device as an actuator to drive an electronic load. Based on the experimental results, the photoreceiver yields a very high output current of 3.2 mA at a voltage bias of 6 V under an incident light power of P_in=100 μW, and has a rise time of 465 μs with a load resistance of R=1 kΩ. The peak response wavelength of the PIN photodiode is at 905 nm, i.e., infrared light. Thus the high output current PIN/MISS photoreceiver is a good candidate for some specific applications     

氮化硅在触摸屏中的应用分析(英文)

研究了氮化硅材料在触摸屏领域中的应用,利用等离子体化学气相沉积技术,在一定厚度的玻璃表面沉积不同厚度的氮化硅薄膜。通过理论分析和试验测试的方法得到了氮化硅膜层厚度和折射率对触摸屏透过率以及表面宏观颜色的影响。分析结果表明,氮化硅膜层折射率对触摸屏的平均透过率影响明显,而膜层厚度对触摸屏的平均透过率影响很小,但是膜层厚度的改变对触摸屏特定波长处透过率和膜层宏观颜色影响很明显。在实际生产中可以通过改变沉积条件获得合适折射率及厚度的氮化硅薄膜材料。     

一种新型超宽带光电探测模块的研究

为了满足光电探测系统的高速应用,采用了一种新型超宽带光电检测模块的设计方法,即在传统的光电转换基础上联合现代微波集成电路技术,通过同时采集PIN光电二极管阴极和阳极光电流,用两组不同带宽范围的放大器放大,最后用连续通带的双工器将信号合并,得到一种超宽带(直流～4GHz)、高响应度(4900V/W)的光电探测模块.结果表明,该方法不但获得了超宽带宽的光电探测模块,还解决了常见高速光电检测模块无法检测直流甚至一些低频光信号的问题.     

A planar InGaAs PIN/JFET fiber-optic detector

A planar structure monolithic optoelectronic integrated circuit (OEIC), comprising an InGaAs PIN photodiode and an InGaAs junction field effect transistor (JFET), has been developed. A cutoff frequency of 1.3 GHz has been successfully obtained. A low dark-current characteristic has also been obtained by polyimide passivation. Design principle, fabrication procedures, and operation characteristics of the PIN/JFET are described.     

Measurement of very-high-speed photodetectors with picosecond InGaAsP film lasers

The impulse responses of very-high-speed photodiodes are determined using 5?15 ps pulses from optically pumped ultrashort-cavity film lasers operating between wavelengths of 1.15 ?m and 1.54 ?m. The measured response time (FWHM) for a back-illuminated InGaAs/InP punch-through PIN photodiode is 30 Ps.     

Improved resolution method to study at 3D the conduction phenomena inside GaAs PIN photodiode

GaAs PIN photodiodes are presently receiving much attention for low-noise photoreceivers. In this paper, specific feature of GaAs-based PIN photodiodes are given, in particular on the investigation of the GaAs properties. In order to show the potentialities of the GaAs PIN photodiode, a three-dimensional resolution and simulation are realized. The simulation adopted the drift-diffusion model applied to transport equations for semiconductor P⁺-ν-N⁺ structure under illumination. The generation term is the function of the incidental flow, reflection, and absorption coefficients. We developed subroutines in the simulation program (SIM 3D) attended for the simulation of the transport phenomena inside the PIN structure using the combined Newton-Gummel method, which uses the electrostatics potentials and the normal variables. These programs are implemented in the simulator to simulate the conduction inside the GaAs PIN photodiode. The model is applied on the carriers’ minority at high injection. The electric field and the photocurrent are then calculated. At the end we have characterized electrically the PIN photodiode from the results of the simulation, to show its band-width and then its domain of use.