High efficiency screen printed bifacial solar cells on monocrystalline CZ silicon

We present industrialized bifacial solar cells on large area (149 cm²) 2 cm CZ monocrystalline silicon wafers processed with industrially relevant techniques such as liquid source BBr₃ and POCl₃ open‐tube furnace diffusions, plasma enhanced chemical vapor deposition (PECVD) SiN_x deposition, and screen printed contacts. The fundamental analysis of the paste using at boron‐diffused surface and the bifacial solar cell firing cycle has been investigated. The resulting solar cells have front and rear efficiencies of 16.6 and 12.8%, respectively. The ratio of the rear J_SC to front J_SC is 76.8%. It increases the bifacial power by 15.4% over a conventional solar cell at 20% of 1‐sun rear illumination, which equals to the power of a conventional solar cell with 19.2% efficiency. We also present a bifacial glass–glass photovoltaic (PV) module with 30 bifacial cells with the electrical characteristics. Copyright © 2010 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.     

Autodiffusion: a novel method for emitter formation in crystalline silicon thin‐film solar cells

The in situ formation of an emitter in monocrystalline silicon thin‐film solar cells by solid‐state diffusion of dopants from the growth substrate during epitaxy is demonstrated. This approach, that we denote autodiffusion, combines the epitaxy and the diffusion into one single process. Layer‐transfer with porous silicon (PSI process) is used to fabricate n‐type silicon thin‐film solar cells. The cells feature a boron emitter on the cell rear side that is formed by autodiffusion. The sheet resistance of this autodiffused emitter is 330 Ω/□. An independently confirmed conversion efficiency of (14·5 ± 0·4)% with a high short circuit current density of (33·3 ± 0·8) mA/cm² is achieved for a 2 × 2 cm² large cell with a thickness of (24 ± 1) µm. Transferred n‐type silicon thin films made from the same run as the cells show effective carrier lifetimes exceeding 13 µs. From these samples a bulk diffusion length L > 111 µm is deduced. Amorphous silicon is used to passivate the rear surface of these samples after the layer‐transfer resulting in a surface recombination velocity lower than 38 cm/s. Copyright © 2006 John Wiley & Sons, Ltd.     

High efficiency large area n‐type front junction silicon solar cells with boron emitter formed by screen printing technology

In this paper, we report on commercially viable screen printing (SP) technology to form boron emitters. A screen‐printed boron emitter and ion‐implanted phosphorus back surface field were formed simultaneously by a co‐annealing process. Front and back surfaces were passivated by chemically grown oxide capped with plasma‐enhanced chemical vapor deposition silicon nitride stack. Front and back contacts were formed by traditional SP and firing processes with silver/aluminum grid on front and local silver back contacts on the rear. This resulted in 19.6% efficient large area (239 cm²) n‐type solar cells with an open‐circuit voltage V_oc of 645 mV, short‐circuit current density J_sc of 38.6 mA/cm², and fill factor of 78.6%. This demonstrates the potential of this novel technology for production of low‐cost high‐efficiency n‐type silicon solar cells. Copyright © 2014 John Wiley & Sons, Ltd.     

Screen‐print selective diffusions for high‐efficiency industrial silicon solar cells

Screen‐print diffusion pastes present an industrially applicable alternative to conventional techniques of dopant deposition. Several commercially available screen‐print dopant pastes are assessed for their suitability in forming heavy selective diffusions for use under metal contacts in silicon solar cells. Pastes are assessed in terms of their ease of application, their ability to form heavy diffusions with low sheet resistances, and their ability to maintain high post‐diffusion wafer lifetimes. Potential for the use of dopant pastes in high‐efficiency solar cell devices is investigated using photoconductance (PC) measurements and photoluminescence (PL) images. It is found that under certain conditions, screen‐print dopant pastes, particularly phosphorus paste, have potential to form effective selective diffusions without significantly compromising performance in high‐efficiency solar cells. Copyright © 2007 John Wiley & Sons, Ltd.     

Process development and comparison of various boron emitter technologies for high‐efficiency (~21%) n‐type silicon solar cells

This paper shows for the first time a comparison of commercial‐ready n‐type passivated emitter , rear totally diffused solar cells with boron (B) emitters formed by spin‐on coating, screen printing, ion implantation, and atmospheric pressure chemical vapor deposition. All the B emitter technologies show nearly same efficiency of ~20%. The optimum front grid design (5 busbars and 100 gridlines), calculated by an analytical modeling, raised the baseline cell efficiency up to 20.5% because of reduced series resistance. Along with the five busbars, rear point contacts formed by laser ablation of dielectric and physical vapor deposition Al metallization resulted in another 0.4% improvement in efficiency. As a result, 20.9% efficient n‐type passivated emitter, rear totally diffused cell was achieved in this paper. Copyright © 2016 John Wiley & Sons, Ltd.     

Influence of temperature during phosphorus emitter diffusion from a spray‐on source in multicrystalline silicon solar cell processing

We have investigated the influence of diffusion temperature during phosphorus emitter diffusion from a spray‐on source on the performance of screen‐printed multicrystalline silicon solar cells. Because of the dual diffusion mechanism present at high concentration in‐diffusion of phosphorus in silicon, applying lower diffusion temperatures for a longer duration results in significantly enhanced penetration of the low concentration tail relative to the high concentration region. Moreover, we show that the sheet resistance of in‐diffused emitters from a high concentration source depends primarily on the extension of the high concentration region, thus significantly different emitter profiles can be manufactured without altering the sheet resistance considerably. Because of the enhanced tail penetration, emitters of a specified sheet resistance diffused at reduced temperatures can result in higher fill factors of screen‐printed solar cells due to diminution of Schottky type shunts. Furthermore, emitters diffused at lower temperatures for longer durations can yield a higher gettering efficiency, resulting in increased bulk recombination lifetime, and thus a higher internal quantum efficiency at long wavelengths. The deeper tail extension of low temperature emitters, however, causes increased absorption within the highly recombinative emitter, resulting in current losses due to a lower internal quantum efficiency at short wavelengths. Copyright © 2006 John Wiley & Sons, Ltd.     

Add‐on laser tailored selective emitter solar cells

An elegant laser tailoring add‐on process for silicon solar cells, leading to selectively doped emitters increases their efficiency η by Δη = 0.5% absolute. Our patented, scanned laser doping add‐on process locally increases the doping under the front side metallization, thus allowing for shallow doping and less Auger recombination between the contacts. The selective laser add‐on process modifies the emitter profile from a shallow error‐function type to Gaussian type and enables excellent contact formation by screen printing, normally difficult to achieve for shallow diffused emitters. The significantly deeper doping profile of the laser irradiated samples widens the process window for the firing of screen printed contacts and avoids metal spiking through the pn‐junction. Copyright © 2010 John Wiley & Sons, Ltd.     

Electrochemical nature of contact firing reactions for screen‐printed silicon solar cells: origin of “gray finger” phenomenon

Fire‐through Ag thick‐film metallization of crystalline Si (c‐Si) solar cells often yields macroscopically non‐uniform contact quality over the cell area, degrading the cell performance and causing cell‐to‐cell variations of the conversion efficiency in a cell production line. This study analyzes the root cause of the “gray finger” phenomenon, in which part of the fire‐through Ag contact gridlines of a c‐Si solar cell appears in gray or dark contrast in the electroluminescence images owing to high contact resistance. Few Ag crystallites were formed on the corrugated emitter surface at the contact interfaces underneath the gray fingers. The present results revealed that the gray finger phenomenon was caused by a short‐circuit spot that formed between the Ag gridlines and underlying Si emitter during contact firing. The electrochemical reactions involved in fire‐through Ag contact formation established a potential difference between the sintered Ag gridlines and Si emitter separated by molten glass. The molten glass acted as an electrolyte containing mobile Ag⁺ and O²⁻ ions during contact firing. Therefore, the short‐circuiting between the sintered Ag gridlines and Si emitter produced a galvanic cell during contact firing, which inhibited Ag crystallite formation at the contact interface along the gridlines in a short circuit and produced the gray fingers. The firing reactions in Ag thick‐film contact formation could be interpreted in terms of the mixed potential theory of corrosion. The degradation of cell performance because of the gray finger phenomenon was also evaluated for 6‐in. screen‐printed c‐Si solar cells. Copyright © 2016 John Wiley & Sons, Ltd.     

Sensitivity of state‐of‐the‐art and high efficiency crystalline silicon solar cells to metal impurities

For the first time, the sensitivity to impurities of the solar cell conversion efficiency is reported for a state‐of‐the‐art (i.e., 18%) and advanced device architecture (i.e., 23%). The data are based on the experimental results obtained in the CrystalClear project for the state‐of‐the‐art cell process and extrapolated to a device with excellent front and rear surface passivation. Both device structures are not assumed to work in low injection level as several studies assumed before, but real operating conditions are considered. This is a fundamental difference with the past and required for modeling future high efficiency devices. The impurity with highest impact is Ti, followed by Cu, Cr, Ni and Fe, which form together a group two order of magnitude less sensitive than the former. In high efficiency devices, a large reduction of the impurity impact is visible for impurities with large capture cross‐section ratio like Fe, which reduces its relative difference in comparison with, for example, Cr, which has a small capture cross‐section ratio. In general, advanced devices will be more sensitive to the impurity content than the state‐of‐the‐art cell design. This effect is partly compensated by a reduction of the substrate thickness. The impurity sensitivity as function of the substrate thickness is reported. Copyright © 2012 John Wiley & Sons, Ltd.     

Excellent boron emitter passivation for high‐efficiency Si wafer solar cells using AlOx/SiNx dielectric stacks deposited in an industrial inline plasma reactor

Excellent passivation of boron emitters is realised using AlO_x/SiN_x dielectric stacks deposited in an industrial inline plasma‐enhanced chemical vapour deposition reactor. Very low emitter saturation current density (J_0e) values of 10 and 45 fA/cm² are obtained for 180 and 30 Ω/sq planar p⁺ emitters, respectively. For textured p⁺ emitters, the J_0e was found to be 1.5–2 times higher compared with planar emitters. The required thermal activation of the AlO_x films is performed in a standard industrial fast‐firing furnace, making the developed passivation stack industrially viable. We also show that an AlO_x thickness of 5 nm in the AlO_x/SiN_x stack is sufficient for obtaining a J_0e of 18 fA/cm² for planar 80 Ω/sq p⁺ emitters, which corresponds to a 1‐sun open‐circuit voltage limit of the solar cell of 736 mV at 25 °C. Copyright © 2012 John Wiley & Sons, Ltd.     

Progress on large area n‐type silicon solar cells with front laser doping and a rear emitter

We report on the progress of imec's n‐type passivated emitter, rear totally diffused rear junction silicon solar cells. Selective laser doping has been introduced in the flow, allowing the implementation of a shallow diffused front surface field and a reduction of the recombination current in the contact area. Simplifications have been implemented towards a more industrial annealing sequence, by replacing expensive forming gas annealing steps with a belt furnace annealing. By applying these improvements, together with an advanced texturing process and emitter passivation by atomic layer deposition of Al₂O₃, 22.5% efficient cells (three busbars) have been realized on commercial 156 · 156 mm² Czochralski‐Si. This result has been independently confirmed by ISE CalLab. Copyright © 2016 John Wiley & Sons, Ltd.     

Screen‐printed Emitter‐Wrap‐Through solar cell with single step side selective emitter with 18.8% efficiency

A fabrication process for Emitter‐Wrap‐Through solar cells on monocrystalline material with high quality gap passivation by wet thermal silicon dioxide is investigated. Masking and structuring steps are performed by screen‐printing technology. Via‐holes are created by an industrially applicable high‐speed laser drilling process. The cell structure features a selective emitter structure fabricated in a single high temperature step: a highly doped emitter at the via‐holes and the rear side, allowing for a low via‐hole resistivity as well as a low resistivity contact to screen‐printed pastes, and a moderately doped front side emitter exhibiting high quantum efficiency in the low wavelength range. Therefore a novel approach is applied depositing either doped or undoped PECVD silicon dioxide layers on the front side. It is shown that doping profiles advantageous for the EWT‐cell structure can be achieved. The screen‐printed aluminum paste is found to penetrate the underlying thermal dioxide layer at appropriate contact firing conditions leading to a zone of high recombination in the overlap region of aluminum and silicon dioxide. It is shown that conventional PECVD‐anti‐reflection silicon nitride acts as effective protection layer reducing the recombination in this region. Designated area conversion efficiencies up to 18.8% on FZ material are obtained applying the single step side selective emitter fabrication technique. Copyright © 2010 John Wiley & Sons, Ltd.     

Large‐area epitaxial silicon solar cells based on industrial screen‐printing processes

Thin‐film epitaxial silicon solar cells are an attractive future alternative for bulk silicon solar cells incorporating many of the process advantages of the latter, but on a potentially cheap substrate. Several challenges have to be tackled before this potential can be successfully exploited on a large scale. This paper describes the points of interest and how IMEC aims to solve them. It presents a new step forward towards our final objective: the development of an industrial cell process based on screen‐printing for > 15% efficient epitaxial silicon solar cells on a low‐cost substrate. Included in the discussion are the substrates onto which the epitaxial deposition is done and how work is progressing in several research institutes and universities on the topic of a high‐throughput epitaxial reactor. The industrial screen‐printing process sequence developed at IMEC for these epitaxial silicon solar cells is presented, with emphasis on plasma texturing and improvement of the quality of the epitaxial layer. Efficiencies between 12 and 13% are presented for large‐area (98 cm²) epitaxial layers on highly doped UMG‐Si, off‐spec and reclaim material. Finally, the need for an internal reflection scheme is explained. A realistically achievable internal reflection at the epi/substrate interface of 70% will result in a calculated increase of 3 mA/cm² in short‐circuit current. An interfacial stack of porous silicon layers (Bragg reflectors) is chosen as a promising candidate and the challenges facing its incorporation between the epitaxial layer and the substrate are presented. Experimental work on this topic is reported and concentrates on the extraction of the internal reflection at the epi/substrate interface from reflectance measurements. Initial results show an internal reflectance between 30 and 60% with a four‐layer porous silicon stack. Resistance measurements for majority carrier flow through these porous silicon stacks are also included and show that no resistance increase is measurable for stacks up to four layers. Copyright © 2005 John Wiley & Sons, Ltd.     

High‐efficiency microcrystalline silicon single‐junction solar cells

This short communication highlights our latest results towards high‐efficiency microcrystalline silicon single‐junction solar cells. By combining adequate cell design with high‐quality material, a new world record efficiency was achieved for single‐junction microcrystalline silicon solar cell, with a conversion efficiency of 10.69%, independently confirmed at ISE CalLab PV Cells. Such significant conversion efficiency could be achieved with only 1.8 µm of Si. Copyright © 2013 John Wiley & Sons, Ltd.     

Industrially feasible,dopant‐free,carrier‐selective contacts for high‐efficiency silicon solar cells

Dopant‐free, carrier‐selective contacts (CSCs) on high efficiency silicon solar cells combine ease of deposition with potential optical benefits. Electron‐selective titanium dioxide (TiO₂) contacts, one of the most promising dopant‐free CSC technologies, have been successfully implemented into silicon solar cells with an efficiency over 21%. Here, we report further progress of TiO₂ contacts for silicon solar cells and present an assessment of their industrial feasibility. With improved TiO₂ contact quality and cell processing, a remarkable efficiency of 22.1% has been achieved using an n‐type silicon solar cell featuring a full‐area TiO₂ contact. Next, we demonstrate the compatibility of TiO₂ contacts with an industrial contact‐firing process, its low performance sensitivity to the wafer resistivity, its applicability to ultrathin substrates as well as its long‐term stability. Our findings underscore the great appeal of TiO₂ contacts for industrial implementation with their combination of high efficiency with robust fabrication at low cost. Copyright © 2017 John Wiley & Sons, Ltd.     

基于电致发光成像理论的硅太阳电池缺陷检测

基于半导体电致发光（EL）的基本理论,在理想P-N结模型条件下,定量计算正向偏压时硅太阳电池EL强度与少数载流子扩散长度的对应关系;分析了电池片中缺陷和扩散长度（EL强度）的关系,指出通过硅电池EL图像检测电池缺陷的可行性。搭建实验平台,分别拍摄单晶硅和多晶硅电池的EL图像,从中成功检测出各种缺陷;编写可视化裂纹自动检...     

High‐efficiency solar cells on phosphorus gettered multicrystalline silicon substrates

Measurements of the dislocation density are compared with locally resolved measurements of carrier lifetime for p‐type multicrystalline silicon. A correlation between dislocation density and carrier recombination was found: high carrier lifetimes (>100 µs) were only measured in areas with low dislocation density (<10⁵ cm⁻²), in areas of high dislocation density (>10⁶ cm⁻²) relatively low lifetimes (<20 µs) were observed. In order to remove mobile impurities from the silicon, a phosphorus diffusion gettering process was applied. An increase of the carrier lifetime by about a factor of three was observed in lowly dislocated regions whereas in highly dislocated areas no gettering efficiency was observed. To test the effectiveness of the gettering in a solar cell manufacturing process, five different multicrystalline silicon materials from four manufacturers were phosphorus gettered. Base resistivity varied between 0·5 and 5 Ω cm for the boron‐ and gallium‐doped p‐type wafers which were used in this study. The high‐efficiency solar cell structure, which has led to the highest conversion efficiencies of multicrystalline silicon solar cells to date, was used to fabricate numerous solar cells with aperture areas of 1 and 4 cm². Efficiencies in the 20% range were achieved for all materials with an average value of 18%. Best efficiencies for 1 cm² (20·3%) and 4 cm² (19·8%) cells were achieved on 0·6 and 1·5 Ω cm, respectively. This proves that multicrystalline silicon of very different material specification can yield very high efficiencies if an appropriate cell process is applied. Copyright © 2006 John Wiley & Sons, Ltd.     

High‐efficiency (19%) screen‐printed textured cells on low‐resistivity float‐zone silicon with high sheet‐resistance emitters

High‐efficiency 4 cm² screen‐printed (SP) textured cells were fabricated on 100 Ω/sq emitters using a rapid single‐step belt furnace firing process. The high contact quality resulted in a low series resistance of 0·79 Ωcm², high shunt resistance of 48 836 Ωcm², a low junction leakage current of 18·5 nA/cm² (n₂ = 2) yielding a high fill factor (FF) of 0·784 on 100 Ω/sq emitter. A low resistivity (0·6 Ωcm) FZ Si was used for the base to enhance the contribution of the high sheet‐resistance emitter without appreciably sacrificing the bulk lifetime. This resulted in a 19% efficient (confirmed at NREL) SP 4 cm² cell on textured FZ silicon with SP contacts and single‐layer antireflection coating. This is apparently higher in performance than any other previously reported cell using standard screen‐printing approaches (i.e., single‐step firing and grid metallization). Detailed cell characterization and device modeling were performed to extract all the important device parameters of this 19% SP Si cell and provide guidelines for achieving 20% SP Si cells. Copyright © 2005 John Wiley & Sons, Ltd.