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采用两步激光晶化方法制备了多晶硅薄膜,其晶粒尺寸为1.1μm,比用传统单步晶化制备的薄膜晶粒尺寸大,表明该方法法对扩大晶粒尺寸很有效。拉曼光谱分析表明0.30J/cm^2晶化的薄膜结晶程度已很高。 相似文献
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为了研究连续激光晶化非晶硅薄膜中激光功率密度对晶化效果的影响,利用磁控溅射法制备非晶硅薄膜,采用连续氩氪混合离子激光器对薄膜进行退火晶化,用显微喇曼光谱测试技术和场发射扫描电子显微镜研究了薄膜在5ms固定时间下不同激光功率密度对晶化效果的影响,并对比了普通玻璃片和石英玻璃两种衬底上薄膜晶化过程的差异。结果表明,在一定激光功率密度范围内(0kW/cm2~27.1kW/cm2),当激光功率密度大于15.1kW/cm2时,普通玻璃衬底沉积的非晶硅薄膜开始实现晶化;随着激光功率密度的增大,晶化效果先逐渐变好,之后变差;激光功率密度增大到24.9kW/cm2时,薄膜表面呈现大面积散落的苹果状多晶硅颗粒,晶粒截面尺寸高达478nm ;激光功率密度存在一个中间值,使得晶化效果达到最佳;石英衬底上沉积的非晶硅薄膜则呈现与前者不同的结晶生长过程,当激光功率密度为19.7kW/cm2时,薄膜表面呈现大晶粒尺寸的球形多晶硅颗粒,并且晶粒尺寸随着激光功率密度的增大而增大,在 27.1kW/cm2处晶粒尺寸达到最大5.38m。研究结果对用连续激光晶化法制备多晶硅薄膜的研究具有积极意义。 相似文献
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掺Rb纳米晶DyIG磁光薄膜研究 总被引:1,自引:0,他引:1
用热分解法制备的Bi,Al替DyIG磁光薄膜虽然是纳米晶,但由于其晶界分布不均匀、晶粒较大且均匀性差,当用于磁光记录时,晶界将产生较大的噪音。而掺Rb的Bi,Al替DyIG磁光薄膜不仅可以降低晶化温度,而且晶粒明显细化,最大晶粒尺寸从100nm下降到50nm左右,平均晶粒尺寸下降为30nm左右。并且晶粒的均匀性明显改善,掺入的Rb以Rb2O固溶体的形式存在于磁光薄膜表面,填补了薄膜表面的凹凸不平,使薄膜表面反射率增加,信噪比增大。因此掺Rb可使纳米晶Bi,Al替DyIG磁光薄膜的性能大大提高。 相似文献
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溅射法制备高取向Pt薄膜的工艺研究 总被引:6,自引:1,他引:5
采用射频磁控溅射工艺在SiO2/Si衬底上成功制备了适用于pZT铁电薄膜底电极的180nm厚、沿(111)晶向强烈取向的Pt薄膜。厚约50nm的Ti膜被用作过渡层,以增强Pt薄膜与衬底之间的黏着性。实验表明,在Pt薄膜的制备过程中,较高的衬底温度有利于薄膜晶化,促使Pt薄膜沿(111)晶向择优取向生长。而在薄膜沉积后加入适当的热处理工艺,能有效地提高Pt薄膜的择优取向性,同样可以得到沿(111)晶向强烈取向的Pt薄膜。原子力显微镜分析表明,制得的薄膜结构相对致密,结晶状况良好,晶粒尺寸约为50nm。 相似文献
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近年来研究表明,通过增大晶粒尺寸和减少晶界数量可以有效减小钙钛矿太阳能电池的漏电流和增大并联电阻,极大地增加其能量转化效率。溶剂热处理工艺是一种利用溶解再结晶的原理增大薄膜晶粒的实用工艺,可用于制备大晶粒高质量的多晶薄膜。本文制备了不同溶剂热处理时长的旋涂制备的钙钛矿CH3NH3PbI3薄膜,利用SEM和XRD分析了其形貌和晶体结构的变化,探索了薄膜晶粒形貌与电池性能的对应关系,应用优化后的溶剂热处理工艺成功制备出大晶粒、高性能的钙钛矿薄膜。实验表明,溶剂热处理法制备的钙钛矿CH3NH3PbI3薄膜平均晶粒尺寸接近3μm,较普通热处理方法制备的薄膜晶粒尺寸(约300 nm)有显著增大。 相似文献
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High-mobility poly-Si thin-film transistors (TFTs) were fabricated by a novel excimer laser crystallization method based on dual-beam irradiation. The new method can reduce the solidification velocity of the top Si layer by heating the bottom Si layer of the Si/SiO2/Si/glass substrate structure by means of laser irradiation not only from the front side but also from the back side. The grain size of poly-Si film was enlarged up to 2 μm. The field-effect mobilities of the TFT exceeded 380 cm2/V-s for electrons and 100 cm2/V-s for holes 相似文献
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Performance of poly-Si TFTs fabricated by SELAX 总被引:1,自引:0,他引:1
Tai M. Hatano M. Yamaguchi S. Noda T. Seong-Kee Park Shiba T. Ohkura M. 《Electron Devices, IEEE Transactions on》2004,51(6):934-939
Selectively enlarging laser crystallization (SELAX) has been proposed as a new crystallization process for use in the fabrication of thin-film transistors (TFTs). This method is capable of producing a large-grained and flat film of poly-Si. The average grain size is 0.3/spl times/5 /spl mu/m, and the surface roughness of the poly-Si layer is less than 5 nm. The TFTs fabricated with this method have better performance and are more uniform than those produced with the conventional excimer laser crystallization (ELC) method. The average values of field-effect mobility are 440 cm/sup 2//Vs (n-type), and 130 cm/sup 2//Vs (p-type). The subthreshold slope for both types is 0.20 V/dec. Values for standard deviation of threshold voltage are 0.03 V (n-type) and 0.20 V (p-type). The delay time of the CMOS-inverter of SELAX TFTs is less than half that of ELC TFTs. 相似文献
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Thin-film transistors (TFTs) have been fabricated using the nickel-seeded metal-induced lateral crystallization (MILC), in which an amorphous silicon is crystallized to form a large grain polysilicon film. Single crystal SOI, solid phase crystallization (SPC), and MILC TFTs were fabricated and the carrier mobilities extracted. Different types of devices have different variations in electrical properties. An empirical model based on the presence of the grain boundaries is proposed to explain the experimental results. The experimental data was used to extract the model parameters and the number of grains and grain size present in the device channel. The results can be further used to optimize the crystallization process and the device design. 相似文献
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ZENG Xiang-bin XU Zhong-yang DAI Yong-bin WANG Chang-an ZHOU Xue-mei ZHAO Bo-feng 《半导体光子学与技术》2000,6(2):96-99,104
A novel approach of two-step laser crystallization for the growth of poly-Si thin film on glass substrate is investigated. Using this approach, we fabricated poly-Si thin film transistors with electron mobility of 103 cm2/V·s and on/off current ratio of 1×10~7.They are better than those of the poly-Si TFTs fabricated by conventional single-step excimer laser crystallization. We also analyzed the structure of the laser crystallized poly-Si thin film by spectroscopic ellipsometry, and proposed the models to simulate the poly-Si thin film and calculated the ellipsometric spectra. The calculated results are in good agreement with the measured results. 相似文献
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A new process for solid phase crystallization (SPC) of amorphous silicon (a-Si) using thin film heater is reported. With this localized Ti silicide thin film heater, we successfully crystallized 500 Å-thick a-Si in a few minutes without any thermal deformation of glass substrate. The size of crystallized silicon grain was abnormally big (30-40 μm). Polycrystalline thin film transistors (TFT) fabricated using this unique thin film heater showed better mobility than those of conventional ones by furnace annealing. 相似文献
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采用溶胶-凝胶法(Sol-Gel)在Pt/Si衬底上制备了PbTiO3 (PT)薄膜和Pb (Zrx,Ti1-x)O3(PZT)薄膜,研究了退火温度以及PT种子层对PZT薄膜结晶及压电性能的影响。X射线衍射(XRD)结果表明,制备的PZT薄膜为纯钙钛矿结构的多晶薄膜,有PT种子层的PZT薄膜晶粒尺寸更大,(110)面取向度更高,结晶性能更好;原子力显微镜(AFM)结果表明,制备的薄膜表面形貌比较平整、均匀、无裂纹;压电力显微镜(PFM)结果表明,压电力显微镜(PFM)结果表明,有PT种子层时,PZT薄膜的平均压电系数d33为128~237 pm/V,无PT种子层时平均压电系数d33为21~29 pm/V。在升温速率为10 ℃/s的退火条件下保温10 min时,随着退火温度的升高,PZT薄膜晶粒尺寸增大,粗糙度增大,(110)面取向度升高,平均压电系数d33增大。PT种子层能够有效的改善PZT薄膜的结晶性能和压电性能。 相似文献
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Seong-Min Choe Jeong-Ah Ahn Ohyun Kim 《Electron Device Letters, IEEE》2001,22(3):121-123
Germanium is ion-implanted deeply into the bottom of a Si film before excimer laser annealing begins. During the solidification step, the implanted Ges form a high thermal resistive Si1-xGex alloy, which reduces the thermal extraction rate of laser energy and the grain growth rate. Laterally larger but double-stacked grains were achieved with a higher Ge implant dose and a slower grain growth. The performance of fabricated poly-TFTs has been enhanced with a Ge 5×1015/cm2 at 80 keV implant but deteriorated at a higher dose. We attribute this enhancement to a laterally enlarged grain and show that the performance of TFT is deteriorated more dominantly by other Ge-related factors than by surface roughening and Ge-induced defect creation 相似文献